CX6600 V800R010C10SPC500 Hardware Description

HUAWEI CX6608&CX6620 Metro Fabric Router
V800R010C10SPC500
Hardware Description
Issue 01
Date 2018-12-05
HUAWEI TECHNOLOGIES CO., LTD.

Copyright © Huawei Technologies Co., Ltd. 2018. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior written
consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and the
customer. All or part of the products, services and features described in this document may not be within the
purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information,
and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.

Address: Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website: http://www.huawei.com
Email: support@huawei.com
Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. i

Hardware Description Contents
Contents
1 About This Document.................................................................................................................. 1

2 Using the Hardware Tool.............................................................................................................4
3 Overview......................................................................................................................................... 5
4 Technical Specifications...............................................................................................................6
5 Product Compatibility.................................................................................................................. 9
6 Product Signal Flow Overview................................................................................................. 12
6.1 General Service Process Overview...............................................................................................................................12
6.2 Signal Flow on the Control Plane.................................................................................................................................14
6.3 Signal Flow on the Data Plane..................................................................................................................................... 16
6.4 Signal Flow on the Monitoring Plane...........................................................................................................................18
7 Chassis........................................................................................................................................... 20
7.1 CX6620 Chassis........................................................................................................................................................... 20
7.2 CX6608 Chassis........................................................................................................................................................... 29
8 Power..............................................................................................................................................36
8.1 CX6620 Power Supply System.................................................................................................................................... 36
8.1.1 Overview................................................................................................................................................................... 36
8.1.2 System Power Supply Architecture........................................................................................................................... 42
8.1.3 DC PM....................................................................................................................................................................... 43
8.1.4 DC PEM.................................................................................................................................................................... 46
8.1.5 3000 W AC&HVDC PM...........................................................................................................................................47
8.1.6 AC PEM.................................................................................................................................................................... 50
8.1.7 HVDC PEM...............................................................................................................................................................52
8.1.8 Switch........................................................................................................................................................................ 53
8.1.9 Power System Technical Specifications.................................................................................................................... 54
8.2 CX6608 Power Supply System.................................................................................................................................... 56
8.2.1 Overview................................................................................................................................................................... 56
8.2.2 System Power Supply Architecture........................................................................................................................... 62
8.2.3 DC PM....................................................................................................................................................................... 63
8.2.4 DC PEM.................................................................................................................................................................... 66
8.2.5 3000W AC&HVDC Power Module..........................................................................................................................67
Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. ii

8.2.6 AC PEM.................................................................................................................................................................... 70
8.2.7 AC&HVDC PEM...................................................................................................................................................... 71
8.2.8 Switch........................................................................................................................................................................ 72
8.2.9 Power System Technical Specifications.................................................................................................................... 73
9 Fan.................................................................................................................................................. 76
9.1 CX6620 Heat Dissipation System................................................................................................................................ 76
9.1.1 System Air Channel...................................................................................................................................................76
9.1.2 Rotational Speed Adjustment Policy......................................................................................................................... 78
9.1.3 Fan Tray Assembly 2.0..............................................................................................................................................79
9.1.4 SFU Fan Tray Assembly............................................................................................................................................80
9.1.5 Air Filter.................................................................................................................................................................... 82
9.2 CX6608 Heat Dissipation System................................................................................................................................ 83
9.2.1 System Air Channel...................................................................................................................................................83
9.2.2 Rotational Speed Adjustment Policy......................................................................................................................... 86
9.2.3 Fan-120 Fan Module 2.0........................................................................................................................................... 86
9.2.4 SFU Fan Tray Assembly............................................................................................................................................88
9.2.5 Air Filter.................................................................................................................................................................... 89
10 Boards.......................................................................................................................................... 91
10.1 Overview.................................................................................................................................................................... 91
10.1.1 Board Structure........................................................................................................................................................91
10.1.2 Bar Code for Boards................................................................................................................................................ 94
10.1.3 Board Indicators...................................................................................................................................................... 95
10.2 Control Plane.............................................................................................................................................................. 97
10.2.1 Main Processing Unit N1........................................................................................................................................ 97
10.2.2 Main Processing Unit P1....................................................................................................................................... 101
10.3 Switching Network................................................................................................................................................... 106
10.3.1 4Tbps Switch Fabric Unit B(SFUI-4T-B)............................................................................................................. 106
10.3.2 4Tbps Switch Fabric Unit A(SFUI-4T-A)............................................................................................................. 108
10.4 Monitoring Plane...................................................................................................................................................... 110
10.4.1 Centralized Monitoring Module............................................................................................................................ 110
10.5 1T Fixed Interface Board..........................................................................................................................................112
10.5.1 CX6600 60-Port 10GBase LAN/WAN-SFP+ Integrated Line Processing Unit Bundle....................................... 112
10.6.1 CX6600 16-Port 100GBase-CFP2 Integrated Line Processing Unit Bundle........................................................ 115
10.6.2 CX6600 20-Port 100GBase-QSFP28 Integrated Line Processing Unit CM Bundle (default 20*40G)................118
10.6.3 CX6600 20-Port 100GBase-QSFP28 Integrated Line Processing Unit Bundle....................................................122
10.6.4 CX6600 20-Port 100GBase-QSFP28 MACsec Integrated Line Processing Unit CM Bundle (default 20*100G)
.......................................................................................................................................................................................... 125
10.6.5 CX6600 20-Port 100GBase-QSFP28 MACsec Integrated Line Processing Unit Bundle.................................... 128
10.7.1 CX6600 40-Port 100GBase-QSFP28 Integrated Line Processing Unit CM Bundle (default 40*40G)................132
10.7.2 CX6600 40-Port 100GBase-QSFP28 Integrated Line Processing Unit Bundle....................................................135
Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. iii

11 Optical Module........................................................................................................................ 139

11.1 Instructions on How to Use an Optical Module....................................................................................................... 139
11.2 Configuring an Optical Attenuator........................................................................................................................... 144
11.3 10Gbps SFP+ Optical Module..................................................................................................................................145
11.3.1 10Gbps-SFP+-MMF-850nm-0.3km-commercial.................................................................................................. 146
11.3.2 10Gbps-SFP+-SMF-1310nm-10km-commercial.................................................................................................. 147
11.4 40Gbps QSFP+ Optical Module............................................................................................................................... 151
11.4.1 40Gbps(4*10.3)-QSFP+-SMF-1271~1331nm-10km-commercial........................................................................151
11.4.2 40Gbps(4*10.3)-QSFP+-MMF-850nm-0.1km-commercial................................................................................. 152
11.4.3 40Gbps(4*10.3)-QSFP+-SMF-1310nm-10km-commercial..................................................................................154
11.4.4 40Gbps(4*10.3)-QSFP+-SMF-1271~1331nm-40km-commercial........................................................................155
11.5 100Gbps QSFP28 Optical Module........................................................................................................................... 156
11.5.1 100Gbps(4*25.7)-QSFP28-SMF-1295.56~1309.14nm-10km-commercial..........................................................157
11.5.2 100Gbps(4*25.7)-QSFP28-MMF-850nm-0.1km-commercial..............................................................................158
11.5.3 100Gbps(4*25.7)-QSFP28-SMF-1271~1331nm-2km-commercial......................................................................160
11.5.4 100Gbps(4*25.7)-QSFP28-SMF-1310nm-30km(NO FEC)-40km(FEC)-commercial.........................................161
12 DPD125-12-24 DC Power Distribution Box........................................................................164

12.1 DPD125-12-24 Product Description........................................................................................................................ 164
12.2 Power Distribution Instance of the CX6620.............................................................................................................168
12.3 Power Distribution Instance of the CX6608.............................................................................................................170
13 Fiber Breakout.......................................................................................................................... 173

13.1 Breakout Fibers.........................................................................................................................................................173
13.2 Breakout Boxes.........................................................................................................................................................176
13.2.1 Product Overview.................................................................................................................................................. 176
13.2.2 10-Port-MPO-12-40-Port-LC-Breakout Box(single-mode).................................................................................. 177
14 Cable.......................................................................................................................................... 181
14.1 Power Cables............................................................................................................................................................ 181
14.1.1 DC Power Cables...................................................................................................................................................181
14.1.2 AC Power Cables...................................................................................................................................................184
14.1.3 240 V High-Voltage DC Power Cables................................................................................................................. 187
14.1.4 380 V High-Voltage DC Power Cables................................................................................................................. 189
14.1.5 DC Power Cables Connecting the PDF to the DPD125-12-24............................................................................. 190
14.1.6 DC Power Cables Connecting the DPD125-12-24 to the CX6608&CX6620...................................................... 193
14.2 Ground Cable............................................................................................................................................................195
14.2.1 Introduction to the Ground Cable.......................................................................................................................... 195
14.2.2 Structure.................................................................................................................................................................195
14.2.3 Technical Specifications........................................................................................................................................ 196
14.3 Console Cable...........................................................................................................................................................196
14.3.1 Introduction to the Console Cable......................................................................................................................... 196
Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. iv

14.3.2 Structure.................................................................................................................................................................196
14.4 Clock Cable.............................................................................................................................................................. 198
14.4.1 Introduction to the Clock Cable.............................................................................................................................198
14.4.2 Structure.................................................................................................................................................................198
14.5 Ethernet Cable.......................................................................................................................................................... 199
14.5.1 Introduction........................................................................................................................................................... 199
14.5.2 Structure.................................................................................................................................................................200
14.6 Fiber..........................................................................................................................................................................203
14.6.1 Introduction to the Fiber........................................................................................................................................ 203
14.6.2 Structure.................................................................................................................................................................205
Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. v

Hardware Description 1 About This Document
1 About This Document
Purpose
This document describes hardware features of the CX6608&CX6620, which helps intended
readers obtain detailed information about each chassis, board, and cable, and rapidly locate
specific information through lists of components.
NOTE
The pictures in this document are for your reference only, the hardware components please make the
object as the standard.
Related Version
The following table lists the product version related to this document.
Product Name Version
CX6608&CX6620 Series V800R010C10
U2000 V200R018C50
Intended Audience
This document is intended for:
l Network planning engineers
l Hardware installation engineers
l Commissioning engineers
l On-site maintenance engineers
l System maintenance engineers
Security Declaration
l Encryption algorithm declaration
The encryption algorithms DES/3DES/RSA (RSA-1024 or lower)/MD5 (in digital
signature scenarios and password encryption)/SHA1 (in digital signature scenarios) have
Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. 1

a low security, which may bring security risks. If protocols allowed, using more secure
encryption algorithms, such as AES/RSA (RSA-2048 or higher)/SHA2/HMAC-SHA2 is
recommended.
l Password configuration declaration
– Do not set both the start and end characters of a password to "%^%#". This causes
the password to be displayed directly in the configuration file.
– To further improve device security, periodically change the password.
l Personal data declaration
Your purchased products, services, or features may use users' some personal data during
service operation or fault locating. You must define user privacy policies in compliance
with local laws and take proper measures to fully protect personal data.
l Feature declaration
– The NetStream feature may be used to analyze the communication information of
terminal customers for network traffic statistics and management purposes. Before
enabling the NetStream feature, ensure that it is performed within the boundaries
permitted by applicable laws and regulations. Effective measures must be taken to
ensure that information is securely protected.
– The mirroring feature may be used to analyze the communication information of
terminal customers for a maintenance purpose. Before enabling the mirroring
function, ensure that it is performed within the boundaries permitted by applicable
laws and regulations. Effective measures must be taken to ensure that information is
securely protected.
– The packet header obtaining feature may be used to collect or store some
communication information about specific customers for transmission fault and
error detection purposes. Huawei cannot offer services to collect or store this
information unilaterally. Before enabling the function, ensure that it is performed
within the boundaries permitted by applicable laws and regulations. Effective
measures must be taken to ensure that information is securely protected.
l Reliability design declaration
Network planning and site design must comply with reliability design principles and
provide device- and solution-level protection. Device-level protection includes planning
principles of dual-network and inter-board dual-link to avoid single point or single link
of failure. Solution-level protection refers to a fast convergence mechanism, such as FRR
and VRRP.
Special Declaration
l This document serves only as a guide. The content is written based on device
information gathered under lab conditions. The content provided by this document is
intended to be taken as general guidance, and does not cover all scenarios. The content
provided by this document may be different from the information on user device
interfaces due to factors such as version upgrades and differences in device models,
board restrictions, and configuration files. The actual user device information takes
precedence over the content provided by this document. The preceding differences are
beyond the scope of this document.
l The maximum values provided in this document are obtained in specific lab
environments (for example, only a certain type of board or protocol is configured on a
tested device). The actually obtained maximum values may be different from the
maximum values provided in this document due to factors such as differences in
hardware configurations and carried services.

l Interface numbers used in this document are examples. Use the existing interface
numbers on devices for configuration.
l The pictures of hardware in this document are for reference only.
Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol Description
Indicates an imminently hazardous situation which, if not

avoided, will result in death or serious injury.
Indicates a potentially hazardous situation which, if not

avoided, could result in death or serious injury.

avoided, may result in minor or moderate injury.

avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to personal
injury.
Calls attention to important information, best practices and

tips.
NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.
Device Dimension Conventions

All device dimensions described in this document are designed dimensions and do not include
dimension tolerances. In the process of component manufacturing, the actual size is deviated
due to factors such as processing or measurement.
Change History
Updates between document issues are cumulative. Therefore, the latest document issue
contains all updates made in previous issues.
l Changes in Issue 01 (2018-12-05)
This issue is the first official release. The software version of this issue is
V800R010C10SPC500.

Hardware Description 2 Using the Hardware Tool
2 Using the Hardware Tool
This section describes how to use hardware query tool.
Hardware Query Tool

The following figure shows the window of the hardware query tool. The tool provides the
router hardware query function, through which you can quickly query desired information by
product, version, or keyword (BOM, official name, silkscreen, or description).
l Enterprise users
l Carrier users
Figure 2-1 Window of the hardware query tool

Hardware Description 3 Overview
3 Overview
The HUAWEI CX6600 Metro Core Fabric Router Product (CX6600) is a large-capacity and
high-performance router designed by Huawei to provide carrier-class reliability. Based on the
powerful versatile routing platform (VRP), the HUAWEI CX6600 provides strong switching
capabilities, dense ports, and high reliability. HUAWEI CX6600 mainly serve as super-core
nodes on carriers' backbone networks, core nodes on metropolitan area networks (MANs),
egresses in large-scale Internet Data Centers (IDCs), and core nodes on large-scale enterprise
networks.

Hardware Description 4 Technical Specifications
4 Technical Specifications
Item CX6608 CX6620
Dimensions (H x W 1016 mm x 442 mm x 945 mm 2200 mm x 600 mm x 1000 mm

x D) (40 in. x 17.4 in. x 37.2 in.) (86.61 in. x 23.62 in. x 39.4 in.)
Weight (empty) 159 kg (350.5 lb) 231 kg (509.3 lb)
Weight (integrated 181 kg (339.0 lb) 380 kg (837.8 lb)

chassis (cabinet +
power supply +
fan))
Cabinet installation Can be installed in an 1000 mm- The CX6620 chassis is

standard deep standard 19-inch cabinet integrated in a cabinet.
and is installed in a 2200 mm-
high Huawei N610E cabinet by
default.
Typical power 7.97kW (2 MPU + 8 SFU + 8 18.526KW (2 MPU + 8 SFU

consumption 20x100G QSFP28) + 20 20x100G QSFP28)
Typical heat 25858.0BTU (2 MPU + 8 SFU 60106.1BTU/hour (2 MPU + 8

dissipation + 8 20x100G QSFP28) SFU + 20 20x100G QSFP28)
DC input voltage l -40 V to -72 V (-48 V/-60 V) l -40 V to -72 V (-48 V/-60 V)
l 192 V to 400 V (240 V/380 l 192 V to 400 V (240 V/380
V) V)
AC input voltage 180 V to 264 V (200 V to 240 180 V to 264 V (200 V to 240
V) V)
MTBF 12.12 years 12.12 years
MTTR 0.5 hours 0.5 hours
Availability 99.999% 99.999%

Item CX6608 CX6620
Slot quantity 18 slots, including 2 MPU slots, 32 slots, including 2 MPU slots,
8 SFU slots, and 8 LPU slots. 8 SFU slots, 20 LPU slots, and 2
CMU slots.
Redundant MPUs 1:1 1:1
Redundant Switch 7+1 7+1

fabrics
Redundant fans The device has two fan There are three fan partitions on
partitions. The LPU area the device, with each having four
provides three fan modules in fan modules in 3+1 backup
2+1 backup mode. The SFU area mode.
provides two fan chassis in 1+1
backup mode.
Redundant power l [4T bundle] DC: 5+1 l [1T bundle] DC: 7+1
supply l [4T bundle] AC: 4+4 l [1T bundle] AC: 5+5
l [2T bundle] DC: 8+1
l [2T bundle] AC: 6+6
Forwarding 5120 Mpps(LPUI-1T) 12800 Mpps(LPUI-1T)

performance
Switching capacity 83.78 Tbps 209.45 Tbps
Operating l Long-term: 0 °C to 40 °C l Long-term: 0 °C to 40 °C

temperature l Short-term: -5 °C to +50 °C l Short-term: -5 °C to +50 °C
l Restriction on the l Restriction on the
temperature variation rate≤ temperature variation rate≤
30 °C/hour 30 °C/hour
Storage -40 °C to 70 °C (-40°F to 158°F) -40 °C to 70 °C (-40°F to 158°F)

temperature
Relative operating l Long term: 5% to 85% RH, l Long term: 5% to 85% RH,
humidity non-condensing non-condensing
l Short term: 5% to 95% RH, l Short term: 5% to 95% RH,
non-condensing non-condensing
Relative storage 5% to 95% RH, non-condensing 5% to 95% RH, non-condensing

humidity
Long-term ≤ 4000 m (If the altitude is ≤ 4000 m (If the altitude is

operating altitude between 1800 m and 4000 m, the between 1800 m and 4000 m, the
device operating temperature device operating temperature
must decrease by 1 ºC each time must decrease by 1 ºC each time
the altitude increases by 220 m.) the altitude increases by 220 m.)
Storage altitude Lower than 5000 m (16404 ft) Lower than 5000 m (16404 ft)

NOTE
1. In the physical dimensions shown in the table, the width (W) does not include the rack-mounting ears.
2. Temperature and humidity are measured at 1.5 m (4.92 ft.) above the floor and 0.4 m (1.31 ft.) in front of
the cabinet. There should be no protection board on the front or back of the cabinet.
3. "Short-term" refers to continuous working time that does not exceed 96 hours and accumulated working
time per year that does not exceed 15 days. If the working time exceeds either of these values, it is
considered "long-term".

Hardware Description 5 Product Compatibility
5 Product Compatibility
The supported items of boards list in the Table 5-1 ("●" indicates supported items, "-"
indicates unsupported items).
Table 5-1 Mapping products and versions

BOM Module Description CX66-8 CX66-20
03057984 CX6D0MPUN1 10.2.1 Main - ●

A0 Processing
Unit N1
03057983 CX6D0MPUP1 10.2.2 Main ● -

A0 Processing
Unit P1
03057982 CX6DSFUIT4 10.3.1 4Tbps - ●

AB Switch Fabric
Unit
B(SFUI-4T-B)
03057981 CX6DSFUIT4 10.3.2 4Tbps ● -

AA Switch Fabric
Unit
A(SFUI-4T-A)
02312AGK CX6P01TRTU 10.5.1 CX6600 ● ●

A0 60-Port
10GBase LAN/
WAN-SFP+
Integrated
Line
Processing
Unit Bundle

02312AGL CX6P00DDNC 10.6.1 CX6600 ● ●

A0 16-Port
100GBase-
CFP2
Integrated
Line
Processing
Unit Bundle
02312AGM CX6P02TRTU 10.6.2 CX6600 ● ●

AP 20-Port
100GBase-
QSFP28
Integrated
Line
Processing
Unit CM
Bundle
(default
20*40G)
02312AGN CX6P02TRTU 10.6.3 CX6600 ● ●

A0 20-Port
100GBase-
QSFP28
Integrated
Line
Processing
Unit Bundle
02312AGP CX6P04TRTU 10.7.1 CX6600 ● ●

AP 40-Port
100GBase-
QSFP28
Integrated
Line
Processing
Unit CM
Bundle
(default
40*40G)
02312AGQ CX6P04TRTU 10.7.2 CX6600 ● ●

A0 40-Port
100GBase-
QSFP28
Integrated
Line
Processing
Unit Bundle

02312DRD CX6P02TMAC 10.6.4 CX6600 ● ●

AP 20-Port
100GBase-
QSFP28
MACsec
Integrated
Line
Processing
Unit CM
Bundle
(default
20*100G)
02312DRE CX6P02TMAC 10.6.5 CX6600 ● ●

A0 20-Port
100GBase-
QSFP28
MACsec
Integrated
Line
Processing
Unit Bundle

Hardware Description 6 Product Signal Flow Overview
6 Product Signal Flow Overview
About This Chapter
This section describes how component units on a device process and forward signal flows.
This section demonstrates how data packets enter a device and how the device forwards the
data packets.
6.1 General Service Process Overview
6.2 Signal Flow on the Control Plane
6.3 Signal Flow on the Data Plane
6.4 Signal Flow on the Monitoring Plane
6.1 General Service Process Overview

Concept Analogy
A router is a device that searches for paths to transmit IP packets on the Internet. The router
functions as a post office. IP packets are to the router as mails to the post office. The core
function of a router is addressing and forwarding.
A post office must meet the following conditions before mails can be properly delivered:
l Has a mail collection center that collects all mails.
l Has a mail query and distribution center that queries addresses of the mails and
distributes these mails to their addresses.
A mail collection center, similar to the data plane on a router, delivers mails. A mail query
and distribution center, similar to the control plane on the router, searches for paths and
forwards mails along the paths to various addresses.
Logical Architecture
A router consists of the data and control planes, which implements addressing and
forwarding. In addition, the router has a monitoring plane, which helps ensure stable
addressing and forwarding performance. The three planes provide the following functions:

l Data plane: Similar to a mail collection center, the data plane provides interfaces that
send and receive packets on a router, whereas processing the packets at a high speed and
switching data packets inside the router. The data plane encapsulates packets,
decapsulates packets, processes Ethernet, Multiprotocol Label Switching (MPLS), IPv4,
and IPv6 packets, implements quality of service (QoS), schedules packets, and provides
various statistics.
l Control plane: Similar to the mail query and distribution center, the control plane is the
central nervous system on a router. It uses system buses to control system units and
provide various functions. These functions allow the router to calculate routes, generate
LSPs, build multicast, unicast, and MPLS forwarding tables, processes protocols and
signalings, configure the routes, maintain the route status, monitor the system status, and
generate the system status report.
l Monitoring plane: monitors the system environment and helps the data and control plane
operate stably and securely. The monitoring plane measures the power voltage, controls
the system power-on and power-off, monitors temperatures, and controls fan modules. In
addition, the monitoring plane isolates a fault if a unit fails to prevent the fault from
affecting other units on the router.
Figure 6-1 illustrates the logical architecture of a router.
Figure 6-1 Logical architecture
NOTE
The arrow in the figure indicates the direction in which data flows are forwarded.
The CMU of the CX6608 is integrated on the main control board.
Physical Architecture
The physical architectures of the data, control, and monitoring planes on a router are as
follows:
l The data plane's forwarding function is implemented by the uplink and downlink line
processing units (LPUs) and a switch fabric unit (SFU) on the router.
l Control and monitoring plane functions are implemented by control units on the main
processing units (MPUs) and LPUs.

6.2 Signal Flow on the Control Plane

The control plane, functioning as the nerve center, integrates control and management
functions and uses buses to control system units.
The control plane consists of control units on MPUs and those on other boards. Each MPU is
comprised of the following three functional units:
l System management and control unit and system clock unit: work on the control plane.
l Monitoring unit: works on the monitoring plane. For more information, see section
"Signal Flow on the Monitoring Plane" in this document.
MPU units and board units communicate through system buses and the SFU.
Signal Flow on the Control Plane

Figure 6-2 illustrates the principles of signal flow transmission on the control plane.
Figure 6-2 Signal flow transmission on the control plane
The control plane processes the following signal flows:

l Singling signal flow and operation and maintenance signal flow: processed by the system
management and control unit.
l Clock signal flow: processed by the system clock unit.
The signal flow on the control plane is bidirectional.
l Signal flow contains host packets carrying signals, for example, routing protocols.
– Board-to-MPU signal flow: calculates data. Therefore, a board sends these packets
to the MPU, and the management and control unit on the MPU parses these packets.
Then the MPU delivers signaling to the data plane so that they can be identified by
the data plane.
– MPU-to-board signal flow: used to update entries in forwarding tables. After the
MPU delivers parsed data to a board, the board uses the data to forward packets on
the data plane.
In the following example, routing calculation is used. A packet arrives at an interface of
a board. The network processor (NP) on the board identifies the packet that needs to be
sent to the MPU. The NP sends the packet to the MPU. The MPU calculates the packet
and delivers the destination IP address and the next-hop IP address to the routing table
on the NP. The data plane forwards the packet to the next-hop address over a route to the
destination IP address.
l Operation and maintenance signal flow: Operation data includes configuration,
debugging, and query data. Maintenance data includes system-generating data, such as
logs and alarms.
– Board-to-MPU signal flow: contains maintenance signals. The system management
and control unit uses the system buses to collect maintenance information, such as
logs and alarms that are generated by modules and saves the information in an
information center. The maintenance data helps query and maintain the device.
For example, when a user wants to query active alarms, the user runs the display
alarm active command. The control plane parses this command and instructs the
information center to display all collected active alarms.
– MPU-to-board signal flow: contains operation signals. The control plane provides
software interfaces to communicate with other devices, communication interfaces to
communicate with host software, and LAN switch interfaces to communicate with
other boards and modules. These interfaces form a logical network. Operation
commands are configured on the control plane. The control plane then sorts
information based on types and priorities and sends the information through
interfaces along various channels to various modules.
For example, a user runs the power off slot 1 command to power off a board in slot
1. The control plane parses the command and delivers the command through an
outband interface to the board in slot 1.
l Clock signal flow: contains synchronization Ethernet or 1588v2 (also called IEEE
Standard for a Precision Clock Synchronization Protocol for Networked Measurement
and Control Systems) signals.
– Board-to-MPU signal flow: used to obtain clock signals. An uplink board obtains
clock frequency signals from packets and sends them to the system clock unit on an
MPU. The system clock unit then selects a clock source.
– MPU-to-board signal flow: used to restore the system clock frequency and time.
After the MPU selects a clock source, it restores the synchronous system clock and
delivers it to all boards so that a device forwards packets all carrying the
synchronous signals to downstream devices through outbound interfaces.

Reliability
Both the MPUs and clocks are working in 1:1 redundancy mode. The master and slave MPUs
communicate and monitor each other's status. If the master MPU fails, the slave MPU
automatically takes over packets and becomes the new master MPU, which improves device
reliability.
6.3 Signal Flow on the Data Plane

The data plane processes and forwards data packets at a high speed. The signal flow in the
data plane is primarily service data signals.
Signals on the data plane flow through a physical link, an uplink board, an SFU, a downlink
board, and another physical link.
Figure 6-3 illustrates the processing and forwarding of a signal flow on the data plane.
Figure 6-3 Processing and forwarding of a signal flow on the data plane
NOTE
The processing and forwarding of a signal flow on the different uplink board and downlink board may differ.
For more information, see "Overall QoS Process" in the HUAWEI CX6608&CX6620 Metro Fabric Router
Feature Description - QoS.
The processing of an incoming signal flow is as follows:

1. An uplink physical interface card (PIC) provides an inbound interface for a signal flow.
Optical and electrical signals transmitted along a physical link enter the uplink PIC. The
PIC obtains the physical layer clock frequency and performs data layer link protocol
negotiation. Then the PIC encapsulates packets into Ethernet frames and sends the
frames to the uplink NP.
2. The uplink NP searches a forwarding table for an outbound interface for the signal flow.
The processing is as follows:
a. Inbound interface processing: Upon receipt of the signal flow, the inbound interface
of the NP parses the data link layer protocol carried in the packets and obtains the
packet types.
b. Traffic classification: The uplink NP prioritized packets, performs traffic
classification, and re-marks them.
c. Packet forwarding based on the forwarding table: The uplink NP searches for
forwarding entries based on destination MAC addresses, destination IP addresses,
and MPLS labels and obtains outbound interface names or next-hop IP addresses
contained in matching entries.
NOTE
Data packets are classified as Layer 2 MAC address-based packets, Layer 2.5 MPLS label-
based packets, and Layer 3 IP address-based packets. The processing module on the inbound
interface identifies packet types and searches forwarding tables based on these types so that
the outbound interface names or next-hop IP addresses for all types of packets can be found.
d. Traffic policing: The uplink NP limits the rate at which incoming packets are sent
based on the committed access rate (CAR) parameters configured on the inbound
interface or those configured in the incoming traffic classification profile. If the
forwarding behavior is to discard packets, the uplink NP discards them before
performing the CAR function.
3. The uplink traffic management (TM) chip processes the signal flow as follows:
– Congestion management and avoidance: The uplink TM monitors network resource
usage. If traffic congestion worsens, the uplink TM discards packets and adjusts
traffic to relieve network overload.
– Traffic shaping: If traffic congestion occurs, the uplink TM caches packets in
queues and uses a specific scheduling algorithm to prioritize packets before
forwarding them.
After the uplink TM processes packets using QoS functions, it sends them to the uplink
flexible interface card (FIC).
4. The uplink FIC fragments the signal flows. The SFU switches packets based on a fixed
cell length. Before packets are sent to the SFU, the uplink FIC fragments the packets that
are longer than the fixed cell length. The upstream FIC encapsulates the fragments into
cells before sending them to the SFU.
The SFU switches data between LPUs. Upon receipt of the cells, the SFU caches and
schedules them before sending them to the switching unit. The switching unit balances the
cells using multiple switching planes, which improves the fault tolerance capability. The
switching unit sends data packets through outbound interfaces to a downlink board.
The processing of an outgoing signal flow is as follows:

1. Switched network cell assembly on the downstream FIC: The downstream FIC
assembles switched network cells into packets after switched network cells flow from the
SFU to the downlink FIC.

2. Queuing and scheduling on the downlink TM: The downstream TM puts packets of the
signal flow in queues and schedules them based on the traffic shaping, policing,
congestion avoidance parameters. Then it sends the packets to the downstream NP.
NOTE
The downlink TM also replicates multicast packets before sending them through several outbound
interfaces.
3. Forwarding table lookup and data layer link information query: The downlink NP
obtains data link layer encapsulation information, processes packets using a signal flow
processing module and outbound interface-specific processing modules. The processing
is as follows:
a. The downstream NP obtains data link layer encapsulation information and
encapsulates packets. The encapsulation process varies according to packet types.
For example:
n For Layer 2 802.1q-in-802.1q (QinQ) packets, the downlink NP adds a virtual
local area network (VLAN) tag to each packet.
n For MPLS packets, the downlink NP adds an MPLS label to each packet.
n For IP packets, the downlink NP searches for Address Resolution Protocol
(ARP) entries and adds MAC addresses mapped to ARP entries to the packets.
b. The flow processing module performs traffic classification and re-marks packets
based on priorities configured on outbound interfaces.
c. The downstream NP limits the rate limit at which outgoing packets are sent based
on CAR parameters configured on the outbound interface or those in the outgoing
traffic classification profile.
d. Host packets destined for the MPU are sent to an MPU, and packets to be
forwarded are sent to the outbound interface-specific processing modules.
NOTE
Due to limited CPU processing capability on an MPU, the limit on packets destined for the
CPU must be configured. This prevents attack or defective packets from being sent to the
MPU and causing high CPU usage, which improves device security. The packets are
verified, and only valid packets are sent to the CPU at a specified rate, which defends against
attacks on the CPU.
e. The outbound interface-specific processing module adds a Layer 2 header to each
packet and forwards the packets to the downlink PIC.
4. The downlink PIC converts data packets into optical and electrical signals and forwards
them through outbound interfaces connected to physical links.
6.4 Signal Flow on the Monitoring Plane

The monitoring plane monitors the system environment. If a fault occurs on a unit, the
monitoring plane isolates the fault to prevent it from affecting other units on the device. The
control and monitoring planes are working together to support the operation and maintenance
of a device and improve performance stability.
Both the control plane and monitoring plane consist of the system operation and maintenance
unit and the monitoring units on CMUs and an SFU. Inter-board communication is
implemented using the system backplane.
NOTE
The CMU of the CX6608 is integrated on the main control board.

Figure 6-4 illustrates the principles of signal flow transmission on the monitoring plane.
Figure 6-4 Signal flow transmission on the monitoring plane
The monitoring plane, like the control plane, supports bidirectional signal flows.
l Board-to-CMU signal flow: implements monitoring. The system maintenance unit on
each CMU uses a MonitorBus to collect operating information on system units and
generates control information based on the unit-specific operating status.
l CMU-to-board signal flow: implements control. An CMU delivers control information to
modules to monitor board information, such as the installation and operating status and
fan speed. The CMU also loads a bus to locally or remotely test or upgrade system units.

Hardware Description 7 Chassis
7 Chassis
About This Chapter
7.1 CX6620 Chassis

7.2 CX6608 Chassis
7.1 CX6620 Chassis

Overview
Table 7-1 Device attributes

Product Type Description BOM Model Earliest
Software
Version
CX6620 CX6620 02351PYL CX6B0BKP20 V800R010C00

Integrated DC A0
Chassis(Includi
ng Fan Tray)
CX6620 CX6620 02351PYM CX6B0BKP20 V800R010C00

Integrated AC A1
Chassis(Includi
ng Fan Tray)
CX6620 CX6620 02351PYN CX6B0BKP20 V800R010C00

Integrated A2
AC&HVDC
Chassis(Includi
ng Fan Tray)

Appearance


Components
Figure 7-1 Components of an CX6620 (front view)

Figure 7-2 Components of an CX6620 (rear view)
No. Component Quantity
1 Front cabinet door 1
2 PM slot 24

3 Switch slot 2
4 CMU slot 2
5 Overhead cable tray 1
6 LPU slot 20
8 MPU slot 2
9 SFU slot 8
10 Front ESD jack 2 (with 1 jack being on the power

chassis)
11 Bottom cable tray 1
12 Ground terminal 1
13 PEM slot 6
14 120 mm fan module 8
15 Advanced cabinet door 2
16 Rear ESD jack 2
17 80 mm fan module 4

Slot Layout
Figure 7-3 Slot layout
PM PM PM PM PEM
PM PM PM PM PEM
PM PM PM PM PEM
PM PM PM PM PEM
PM PM PM PM PEM
PM PM PM PM PEM
CMU1 CMU2
FAN 1 FAN 2 FAN 3 FAN 4

) ) ) ) ) ) ) ) ) )
U U U U U U U U U U
P P P P P P P P P P
L L L L L L L L L L
(
( ( ( ( ( ( ( ( ( 0
1 2 3 4 5 6 7 8 9 1
21( MPU)
23(SFU)
24(SFU) FAN FAN
25(SFU) 9 10
26(SFU)
27(SFU)
28(SFU)
FAN FAN
29(SFU)
11 12
30(SFU)
22( MPU)
) ) ) ) ) ) ) ) ) )
U U U U U U U U U U
P P P P P P P P P P
L
( L
( L
( L
( L
( L
( L
( L
( L
( L
(
1
1 2
1 3
1 4
1 5
1 6
1 7
1 8
1 9
1 0
2 FAN 5 FAN 6 FAN 7 FAN 8
Table 7-2 Description of slot layout
Slot Name Slot Quantity Slot ID Remarks
Service processing 20 1-20 -

board
Main control unit 2 21-22 -
Switch fabric unit 8 23-30 -
Central monitoring 2 CMU1-2 -

unit

Interface Numbering
A port is numbered in the format of slot ID/card number/port number.
NOTE
Slot number:the slot number ranges from 1 to 20. Slots are numbered in left-right and top-down order.
The slot number is marked on the slots.
Card number:
l Upper chassis
l Cards are numbered from 0 in top-down and right-left order. If a board has no card installed,
the card number is 0.
l Lower chassis
l Cards are numbered from 0 in down-top and left-right order. If a board has no card installed,
the card number is 0.
Port number:
l Upper chassis
l Ports are numbered from 0 in left-right and top-down order.
l Lower chassis
l Ports are numbered from 0 in right-left and down-top order.
Technical Specifications
Item Specification
Dimensions (H x W x D) 2200 mm x 600 mm x 1000 mm (86.61 in. x 23.62 in.

x 39.4 in.)
Weight (empty) 231 kg (509.3 lb)
Weight (integrated chassis 380 kg (837.8 lb)

(cabinet + power supply + fan))
Cabinet installation standard The CX6620 chassis is integrated in a cabinet.
Typical power consumption 18.526KW (2 MPU + 8 SFU + 20 20x100G QSFP28)
Typical heat dissipation 60106.1BTU/hour (2 MPU + 8 SFU + 20 20x100G

QSFP28)
DC input voltage l -40 V to -72 V (-48 V/-60 V)

l 192 V to 400 V (240 V/380 V)
AC input voltage 180 V to 264 V (200 V to 240 V)
MTBF 12.12 years
MTTR 0.5 hours
Availability 99.999%
Slot quantity 32 slots, including 2 MPU slots, 8 SFU slots, 20 LPU

slots, and 2 CMU slots.
Redundant MPUs 1:1

Item Specification
Redundant Switch fabrics 7+1
Redundant fans There are three fan partitions on the device, with each
having four fan modules in 3+1 backup mode.
Redundant power supply l [1T bundle] DC: 7+1

Forwarding performance 12800 Mpps(LPUI-1T)
Switching capacity 209.45 Tbps
Operating temperature l Long-term: 0 °C to 40 °C

l Short-term: -5 °C to +50 °C
l Restriction on the temperature variation rate≤
30 °C/hour
Storage temperature -40 °C to 70 °C (-40°F to 158°F)
Relative operating humidity l Long term: 5% to 85% RH, non-condensing

l Short term: 5% to 95% RH, non-condensing
Relative storage humidity 5% to 95% RH, non-condensing
Long-term operating altitude ≤ 4000 m (If the altitude is between 1800 m and 4000
m, the device operating temperature must decrease by
1 ºC each time the altitude increases by 220 m.)
Storage altitude Lower than 5000 m (16404 ft)

7.2 CX6608 Chassis

Overview
Table 7-3 Device attributes

Product Type Description BOM Model Earliest
Software
Version
CX6608 CX6608 02351PYF CX6B0BKP08 V800R010C00

Integrated A0
Chassis DC
Components(In
cluding Fan
Tray)
CX6608 CX6608 02351PYG CX6B0BKP08 V800R010C00

Integrated A1
Chassis AC
Components(In
cluding Fan
Tray)
CX6608 CX6608 02351PYH CX6B0BKP08 V800R010C00

Integrated A2
Chassis
AC&HVDC
Components(In
cluding Fan
Tray)

Appearance

Components
Figure 7-4 Components of an CX6608 (front view)

Figure 7-5 Components of an CX6608 (rear view)
1 PM slot 12
2 Switch slot 2
3 Cable tray 1
4 MPU slot 2
5 LPU slot 8
6 SFU slot 8
7 Front ESD jack 2
8 PEM slot 3

9 Noise reduction module 1 (The LPU area is equipped with three

fan modules, which are located at the
inner side of the noise reduction module.)
10 Air exhaust vent of the LPU -

area
11 Air exhaust vent of the SFU -

area
12 Handle 5
13 Ground terminal 1
14 Rear ESD jack 1
15 SFU fan module 2
Slot Layout
Figure 7-6 Slot layout
Table 7-4 Description of slot layout
Service processing 8 1-8 These slots are used

board to hold LPUs.

Main control unit 2 9-10 These slots can hold

MPUs that work in
1:1 backup mode.
Switch fabric unit 8 11-18 These slots can hold

SFUs that work in
7+1 backup mode.
Interface Numbering
A port is numbered in the format of slot ID/card number/port number.
NOTE
Slot number:The slot number ranges from 1 to 8. Slots are numbered in left-right. The slot number is
marked on the slots.
Card number:Cards are numbered from 0 in top-down and right-left order. If a board has no card
installed, the card number is 0.
Port number:Ports are numbered from 0 in left-right and top-down order.
Item Specification
Dimensions (H x W x D) 1016 mm x 442 mm x 945 mm (40 in. x 17.4 in. x 37.2

in.)
Weight (empty) 159 kg (350.5 lb)
Weight (integrated chassis 181 kg (339.0 lb)

(cabinet + power supply + fan))
Cabinet installation standard Can be installed in an 1000 mm-deep standard 19-inch

cabinet and is installed in a 2200 mm-high Huawei
N610E cabinet by default.
Typical power consumption 7.97kW (2 MPU + 8 SFU + 8 20x100G QSFP28)
Typical heat dissipation 25858.0BTU (2 MPU + 8 SFU + 8 20x100G QSFP28)
DC input voltage l -40 V to -72 V (-48 V/-60 V)

l 192 V to 400 V (240 V/380 V)
AC input voltage 180 V to 264 V (200 V to 240 V)
MTBF 12.12 years
MTTR 0.5 hours
Availability 99.999%
Slot quantity 18 slots, including 2 MPU slots, 8 SFU slots, and 8

LPU slots.

Item Specification
Redundant MPUs 1:1
Redundant Switch fabrics 7+1
Redundant fans The device has two fan partitions. The LPU area
provides three fan modules in 2+1 backup mode. The
SFU area provides two fan chassis in 1+1 backup
mode.
Redundant power supply l [4T bundle] DC: 5+1

Forwarding performance 5120 Mpps(LPUI-1T)
Switching capacity 83.78 Tbps
Operating temperature l Long-term: 0 °C to 40 °C

l Short-term: -5 °C to +50 °C
l Restriction on the temperature variation rate≤
30 °C/hour
Storage temperature -40 °C to 70 °C (-40°F to 158°F)
Relative operating humidity l Long term: 5% to 85% RH, non-condensing

l Short term: 5% to 95% RH, non-condensing
Relative storage humidity 5% to 95% RH, non-condensing
Long-term operating altitude ≤ 4000 m (If the altitude is between 1800 m and 4000
m, the device operating temperature must decrease by
1 ºC each time the altitude increases by 220 m.)
Storage altitude Lower than 5000 m (16404 ft)

Hardware Description 8 Power
8 Power
About This Chapter
8.1 CX6620 Power Supply System

8.1.1 Overview
Introduction to Modules
As shown in Figure 8-1, the CX6620 power system is located at the top of the chassis. The
main components are the PMs, CMUs, and switches in the front of the chassis and the PEMs
at the rear of the chassis.
Figure 8-1 Main components of the power system

Table 8-1 Functions of main components of the CX6620 power system
Component Description
1 PM Converts the power supplied to the PEM and supplies power to

the entire device through the backplane.
2 CMU Provides device monitoring, management, and energy saving

functions for high reliability.
3 Switch Controls the power output of PMs. The two switches back up each
other. When one or two switches are in the ON state, the power
output of PMs is enabled.
4 PEM Connects to the external power supply system and supplies power
to the CX6620. The right and left parts of the PEM correspond to
power supply areas A and B, respectively.
Power supply areas A and B are two power supply systems with
different sources. The system connects to different power supply
systems, ensuring that the system remains powered-on if one
power supply system fails.
Power Module Mappings

The CX6620 supports multiple power supply scenarios, which vary in the installed PEMs and
PMs. Table 8-2 lists the mappings between power supply scenarios and PEMs/PMs.
Table 8-2 Mappings between power supply scenarios and PEMs/PMs on the CX6620
Power Supply Scenario PEM PM
-48 V DC power supply DC PEM DC PM

AC power supply AC PEM 3000 W AC&HVDC PM
240 V HVDC power supply HVDC PEM 3000 W AC&HVDC PM
The power system consists of 24 PMs that are working in N+M backup mode (N indicates the
number of working modules and M indicates the number of backup modules). The value M is
determined based on the PM model and version.
The inputs on areas A and B back up each other, and power module backup allows the system
to work properly even if some PMs become faulty. In the -48 V DC power supply system, a
PM has two channels of inputs. Therefore, the PM itself supports input backup of areas A and
B. In this case, only module backup needs to be configured. The minimum value of M is 1. In
the AC, 240 V HVDC, and 380 V HVDC power supply systems, a PM has only one channel
of input and can connect to only area A or B. Therefore, N PMs are required in each of area A
and area B to ensure the input backup of the two areas. In this case, M is equal to N, and the
number of backup modules is N.
l -48 V DC
The CX6620 has six PEMs. Each PEM has eight inputs. There are altogether 48 inputs
(24 inputs in each of area A and area B). Each PM has two inputs. The two inputs are
from power supply areas A and B, respectively. In this manner, power supply areas A
and B back up each other. A maximum of 24 PMs can be configured based on the N+1
backup mechanism. Figure 8-2 and Table 8-3 show the mappings between PEMs and
PMs
Figure 8-2 Connections between PEMs and PMs

Table 8-3 Mappings between PEMs and PMs

Name Location
PEM A1/B1 A2/B2 A3/B3 ...... A22/B2 A23/B2 A24/B2

2 3 4
PM 1 2 3 ...... 22 23 24
l AC/HVDC
The CX6620 supports N+N backup for PMs. The power supply system supports the
backup of power supply areas A and B on the user side. Every N power modules are
connected to one power supply area, ensuring that the entire system can work properly if
any power supply area fails.
The CX6620 has six PEMs. Each PEM has four inputs. The CX6620 provides 24 inputs
(12 inputs in each of area A and area B) to achieve a maximum of 12+12 backup. Figure
8-3 and Table 8-4 show the mappings between PEMs and PMs


Po Na Location
we me
r
Su
pp
ly
Ar
ea
A PE A1 A2 A3 A4 A5 A6 A7 A8 A9 A1 A1 A1
M 0 1 2
PM A1 A2 A3 A4 A5 A6 A7 A8 A9 A1 A1 A1
0 1 2
B PE B1 B2 B3 B4 B5 B6 B7 B8 B9 B1 B1 B1
M 0 1 2
PM B1 B2 B3 B4 B5 B6 B7 B8 B9 B1 B1 B1
0 1 2
Power Supply Principles

PEMs are integrated into the chassis and do not need to be configured onsite. Do not remove
and install PEMs onsite. PMs can be configured based on the overall power consumption of
the device to flexibly supply power.
l -48 V DC
A DC PM has output power of 2200 W. Use the N+1 PM backup mechanism as an
example. N+1 PMs are configured for power supply, with N being the number of PMs
required for the power consumption of the entire device. The value of N x 2200 W must
be greater than the overall power consumption of the entire device. Table 8-5 shows the
details.
NOTE
If PMs are not fully configured, power cables are routed only for the PEM interfaces whose
corresponding PMs are installed. To facilitate the deployment of new power cables during capacity
expansion of PMs, you are advised to configure the PMs from the top down and leave a filler
panel in the position where no PM is installed.
Table 8-5 Power supply examples
Overall Power PM Configuration PM Cabling N+1 Backup

Consumption
P<2200W 1,2 A1,B1,A2,B2 1+1
2200W=<P<4400 1,2,3 A1,B1,A2,B2,A3,B 2+1

W 3
4400W=<P<6600 1,2,3,4 A1,B1,A2,B2,A3,B 3+1

W 3,A4,B4

... ... ... ...
48400W=<P<5060 1,2,3,4,5,6,7,8,9,10 A1,B1,A2,B2,A3,B 23+1

0W , 3...A24,B24
11,12,13,14,15,16,
17,18,19,20,21,22,
23,24
l AC/HVDC
A DC PM has output power of 3000 W. PMs are configured based on the N+N backup
mechanism. To be specific, N (N>=1) PMs are configured for each of area A and area B
on the user side. The value of N x 3000 W must be greater than the power consumption
of the entire system. Table 8-6 shows the details.
NOTE
panel in the position where no PM is not installed.
Overall Power PM Configuration PEM Cabling N+N

Consumption Backup
P<3000W A1,B1 A1,B1 1+1
3000W=<P<6000 A1,B1,A2,B2 A1,B1,A2,B2 2+2

W
6000W=<P<9000 A1,B1,A2,B2,A3,B3 A1,B1,A2,B2,A3,B3 3+3

W
... ... ...
33000W=<P<360 A1,B1,A2,B2,A3,B3... A1,B1,A2,B2,A3,B3...A 12+12

00W A12,B12 12,B12
Table 8-7 describes recommended power supply configurations. You can choose the PM
configuration based on the actual platform.
Table 8-7 Recommended configurations
Power Supply -48 V DC AC power 240 V HVDC 380 V HVDC

Scenario power supply supply power supply power supply
1T Platform 7+1 5+5 5+5 5+5
2T Platform 8+1 6+6 6+6 6+6
4T Platform 8+1 6+6 6+6 6+6

8.1.2 System Power Supply Architecture

The CX6620 uses a flexible power supply architecture.
-48 V DC Power Supply

As shown in Figure 8-4, the CX6620 has six PEMs. Each PEM has eight inputs. There are
altogether 48 inputs (24 inputs on each of power supply source A and power supply source
B). Each PM has two inputs. The two inputs are from power supply power supply sources A
and B, respectively. The PM converts the power and outputs the power to the power supply
backplane. In this manner, power supply power supply sources A and B back up each other A
maximum of 24 PMs can be configured based on the N+M backup mechanism.
Figure 8-4 DC power supply

AC and HVDC Power Supply

As shown in Figure 8-5, after the external power is input to PMs through PEMs, the PMs
convert power and output the power to the power supply backplane. Each PEM provides four
channels of power inputs (with two partitioned into power supply source A and two
partitioned into power supply source B) for four PMs. There are 24 PMs on the device.
Figure 8-5 HVDC and AC power supply
8.1.3 DC PM
The external power is input to PMs through PEMs, the PMs perform current equalization and
regulation and output the power to the power supply backplane.

Overview
Table 8-8 Power attributes

Attribute Description
Description PM2200W DC Power Supply
BOM 02311CNP
Model PDC-2200WB

Product Earliest Software Version
CX6620 V800R010C00
CX6608 V800R010C00
Appearance
Figure 8-6 shows the appearance of a DC PM module.
Figure 8-6 Appearance of the DC PM module
Panel
Figure 8-7 Front panel of a PM module

Table 8-10 Indicators
Indicator Color Normal Abnormal Abnormal

Status Status Reason
Input Green On Blinking The input

voltage exceeds
the preset
operating
voltage range.
Off l No DC
input.
l Positive and
negative
terminals
are
connected to
each other.
Output Green On off l The power

module does
not have DC
output.
l Output
voltage is
too low.
Alarm Red Off On l Fans are

faulty.
l The device
is powered
off due to
overtempera
ture.
l The device
is powered
off due to
over-output-
voltage.
l The device
is powered
off due to
overcurrent
or short
circuit.
l The current
of modules
is seriously
imbalanced.

Item Specification
Dimensions (H x W x D) 41 mm x 106.5 mm x 485 mm(1.61 in x 4.19 in x 19.09

in)
Weight 2.4 kg(5.29 lb)
Rated input voltage -48 V/-60 V
Input voltage range -40 VDC to -72 VDC
Maximum input current 63 A
Maximum output power 2200 W
Conversion efficiency 0.94
8.1.4 DC PEM
DC power is input through DC PEMs. Each PEM provides eight channels of power input. The
four terminals on the right of a PEM connect to power supply area A, and the four terminals
on the left connect to power supply area B. DC PEMs are fully configured when a device is
delivered.
Appearance
Figure 8-8 shows the appearance of a DC PEM.
Figure 8-8 DC PEM
Panel
Table 8-11 Interface description
Interface Description Power Cable Terminal

Name
NEG(-) Input interface for l JG2-25mm2-M6-150A, applicable to 25mm2

–48 V power power cables
supply l JG2-34.3mm2-M6(1/4")-134A, applicable to
35mm2 power cables


Name
RTN(+) Input interface for

BGND power
supply
Input Requirements
l Protection components must be provided for PDFs to ensure that the rated current of
each channel is not less than 63 A.
Note the derating requirements of protection components when using protection

components such as fuses and circuit breakers. If the current of a PDF is less than 63 A,
it cannot supply power to the CX6608&CX6620. In this case, reconstruct power supply
in the equipment room.
l If the front-end PDF does not provide enough power inputs, configure a PDB that meets
the following requirements:
– The current of each channel output by the DC PDB is not less than 63 A.
– Double-channel backup is used.
– The input current is not less than the sum of current of its connected output lines.
8.1.5 3000 W AC&HVDC PM

The external power is input to PMs through PEMs, the PMs convert AC power into regulated
DC power and output the power to the power supply backplane.
Overview
Description 3000W AC&HVDC Power Module
BOM 02310VMA
Model PHD-3000WA
CX6620 V800R010C00

CX6608 V800R010C00
Appearance
Figure 8-9 shows the appearance of a PM module.
Figure 8-9 Appearance of the PM module
Panel


voltage exceeds
the preset
operating
voltage range.
Off No input.


Output Green On Off l The power

module does
not have
output.
l Output
voltage is
too low.

faulty
l The device
is powered
off due to
overtempera
ture.
l The device
is powered
off due to
over-output-
voltage.
l The device
is powered
off due to
overcurrent
or short
circuit.
l The current
of modules
is seriously
imbalanced.
Technical Specifications(AC)
Item Specification
Dimensions (H x W x D) 41.5 mm x 107 mm x 437 mm(1.63 in x 4.21 in x 17.2

in)
Rated input voltage 200 V AC to 240 V AC (220V)
Input voltage range 180 V AC to 264 V AC

Item Specification
Technical Specifications(HVDC)
Item Specification

in)
Rated input voltage 240V DC/380V DC
Input voltage range 192V DC to 400V DC
NOTE
The AC power system supports 200-240 V AC power. It supports 110 V dual-live-wire inputs but not
110 V AC single-phase inputs. If 110 V dual-live-wire inputs are used, the voltage must range from 180
V to 264 V.
8.1.6 AC PEM
AC power is input through AC PEMs. Each PEM provides four channels of power input. The
two terminals on the right of a PEM connect to power supply area A, and the two terminals on
the left connect to power supply area B. AC PEMs are fully configured when a device is
delivered.
Appearance
Figure 8-11 shows the appearance of a PEM.
Figure 8-11 AC PEM

Panel

Name
C20 AC Input interface for C19

socket 220 V AC power
supply
Input Requirements
l The 220 V AC input is supported. In the 110 V dual-live wire system, Figure 8-12
shows the connection.
Figure 8-12 110 V dual-live wire connection
l Protection components must be provided for PDFs to ensure that the rated AC current of

components such as fuses and circuit breakers.
NOTE
The input circuit breakers of a PDF must match the output circuit breakers.
– The current of each channel output by the AC PDB is not less than 16 A.

8.1.7 HVDC PEM

HVDC power is input through HVDC PEMs. Each PEM provides four channels of power
input. The two terminals on the right of a PEM connect to power supply area A, and the two
terminals on the left connect to power supply area B. HVDC PEMs are fully configured when
a device is delivered.
Appearance
Figure 8-13 shows the appearance of an HVDC PEM.
Figure 8-13 HVDC PEM
Panel

Name
Input 240V HVDC and HVDC dedicated terminal (240 V)

interface for 380 V HVDC HVDC dedicated terminal (380V)
power supply power input
interfaces
Input Requirements
l Protection components must be provided for PDFs to ensure that the rated HVDC
current of each channel is not less than 14 A.

NOTE
In HVDC application scenarios, ensure that the protection components meet HVDC certification
and the fuses and circuit breakers meet positive and negative pole protection.
– The current of each channel output by the HVDC PDB is not less than 14 A.

8.1.8 Switch
The switch controls the power output of PMs. The two switches back up each other. When
one or two switches are in the ON state, the power output of PMs is enabled.
Appearance
Figure 8-14 shows the appearance of a switch.
Panel
Table 8-17 Switch

Switch Name Description
OFF/ON Controls power-on or power-off of devices.
Function
When one or both switches are turned on, the PMs output power, and the device is powered
on. When both switches are turned off, the PMs do not output power, and the device is
powered off.

Ensure that both switches are turned on when the device is running for reliability purposes.
8.1.9 Power System Technical Specifications
-48 V DC
Table 8-18 -48 V DC power system specifications
Item Description
Number of power modules 24 (full configuration)
Input channels 48 (full configuration)
Maximum input diameter 35mm^2 per input
Input voltage -40 V to -72 V (rated voltage -48 V/-60 V)
Input current A maximum of 63 A for an input per

module
Front-end circuit breaker/fuse 2-channel 63 A per module

[1T bundle] DC device: 8 PMs, requiring 16
channels of 63 A
channels of 63 A
channels of 63 A
Output channels 24 (full configuration)
Output voltage 53.5 V DC
Output current 46 A per module
Output power 2200 W per module
Converting efficiency 0.94
AC
Table 8-19 AC power system specifications
Item Description

Item Description
Maximum input diameter Standard C19 cable
Input voltage 180 V to 264 V (rated voltage 200 V to 240

V)
Input current 16 A per module
Front-end circuit breaker/fuse 16 A per module

[1T bundle] AC device: 10 PMs, requiring
10 channels of 16 A
12 channels of 16 A
12 channels of 16 A
HVDC
Table 8-20 HVDC power system specifications

Item Description
Maximum input diameter 2.5mm^2
Input voltage 192 V to 400 V (rated voltage 240 V/380 V)

10 channels of 14 A
12 channels of 14 A
12 channels of 14 A

Item Description
8.2.1 Overview
Introduction to Modules
As shown in Figure 8-15, the CX6608 power system is located at the top of the chassis. The
main components are the PMs and switches in the front of the chassis and the PEMs at the
rear of the chassis. Table 8-21 describes the functions of each module.

Table 8-21 Functions of main components of the CX6608 power system

1 PM Converts the power supplied to the PEM and supplies power to

the entire device through the backplane.
2 Switch Controls the power output of PMs. The two switches back up each
other. When one or two switches are in the ON state, the power
output of PMs is enabled.

3 PEM Connects to the external power supply system and supplies power
to the CX6608. The right and left parts of the PEM correspond to
power supply areas A and B, respectively.
Power supply areas A and B are two power supply systems with
different sources. The system connects to different power supply
systems, ensuring that the system remains powered-on if one
power supply system fails.
Power Module Mappings

The CX6608 supports multiple power supply scenarios, which vary in the installed PEMs and
PMs. Table 8-22 lists the mappings between power supply scenarios and PEMs/PMs.
Table 8-22 Mappings between power supply scenarios and PEMs/PMs on the CX6608
-48 V DC power supply DC PEM DC PM
AC power supply AC PEM 3000 W AC&HVDC PM
The power system consists of 12 PMs that are working in N+M backup mode (N indicates the
number of working modules and M indicates the number of backup modules). The value M is
determined based on the PM model and version.
The inputs on areas A and B back up each other, and power module backup allows the system
to work properly even if some PMs become faulty. In the -48 V DC power supply system, a
PM has two channels of inputs. Therefore, the PM itself supports input backup of areas A and
B. In this case, only module backup needs to be configured. The minimum value of M is 1. In
the AC, 240 V HVDC, and 380 V HVDC power supply systems, a PM has only one channel
of input and can connect to only area A or B. Therefore, N PMs are required in each of area A
and area B to ensure the input backup of the two areas. In this case, M is equal to N, and the
number of backup modules is N.
l -48 V DC
The CX6608 has three PEMs. Each PEM has eight inputs. There are altogether 24 inputs
(12 inputs in each of area A and area B). Each PM has two inputs. The two inputs are
from power supply areas A and B, respectively. In this manner, power supply areas A
and B back up each other. A maximum of 12 PMs can be configured based on the N+1
backup mechanism. Figure 8-16 and Table 8-23 show the mappings between PEMs and
PMs


Name Location
PEM A1/B1 A2/B2 A3/B3 ...... A10/B1 A11/B1 A12/B1

0 1 2
PM 1 2 3 ...... 10 11 12
l AC/HVDC
The CX6608 supports N+N backup for PMs. The power supply system supports the
backup of power supply areas A and B on the user side. Every N power modules are
connected to one power supply area, ensuring that the entire system can work properly if
any power supply area fails.
The CX6608 has six PEMs. Each PEM has four inputs. The CX6608 provides 12 inputs
(six inputs in each of area A and area B) to achieve a maximum of 6+6 backup. Figure
8-17 and Table 8-24 show the mappings between PEMs and PMs


Power Name Location
Supply
Area
A PEM A1 A2 A3 A4 A5 A6
PM A1 A2 A3 A4 A5 A6
B PEM B1 B2 B3 B4 B5 B6
PM B1 B2 B3 B4 B5 B6
Power Supply Principles

PEMs are integrated into the chassis and do not need to be configured onsite. Do not remove
and install PEMs on site. PMs can be configured based on the overall power consumption of
the device to flexibly supply power.
l -48 V DC
A DC PM has output power of 2200 W. Use the N+1 PM backup mechanism as an
example. N+1 PMs are configured for power supply, with N being the number of PMs
required for the power consumption of the entire device. The value of N x 2200 W must
be greater than the overall power consumption of the entire device. Table 8-25 shows the
details.
NOTE


Overall Power PM Configuration PM Cabling N+1 Backup
Consumption
P < 2200 W 1,2 A1,B1,A2,B2 1+1
2200 W =< P < 1,2,3 A1,B1,A2,B2,A3,B 2+1

4400 W 3
4400 W =< P < 1,2,3,4 A1,B1,A2,B2,A3,B 3+1

6600 W 3,A4,B4
... ... ... ...
22000 W =< P < 1,2,3,4,5,6,7,8,9,10 A1,B1,A2,B2,A3,B 11+1

24200 W ,11,12 3...A12,B12
l AC/HVDC
A DC PM has output power of 3000 W. PMs are configured based on the N+N backup
mechanism. To be specific, N (N >= 1) PMs are configured for each of area A and area B
on the user side. The value of N x 3000 W must be greater than the power consumption
of the entire system. Table 8-26 shows the details.
NOTE

Overall Power PM Configuration PEM Cabling N+N
Consumption Backup
P < 3000 W A1,B1 A1,B1 1+1
3000 W =< P < A1,B1,A2,B2 A1,B1,A2,B2 2+2

6000 W
6000 W =< P < A1,B1,A2,B2,A3,B3 A1,B1,A2,B2,A3,B3 3+3

9000 W
... ... ... ...
15000 W =< P < A1,B1,A2,B2,A3,B3... A1,B1,A2,B2,A3,B3...A 6+6

18000 W A6,B6 6,B6
Table 8-27 describes recommended power supply configurations. You can choose the PM
configuration based on the actual platform.

Table 8-27 Recommended configurations
Power Supply -48 V DC AC power 240 V HVDC 380 V HVDC

Scenario power supply supply power supply power supply
4T Platform 5+1 4+4 4+4 4+4
8.2.2 System Power Supply Architecture

The CX6608 uses a flexible power supply architecture.
-48 V DC Power Supply

As shown in Figure 8-18, the CX6608 has three PEMs. Each PEM has eight inputs. There are
altogether 24 inputs (12 inputs on each of power supply source A and power supply source
B). Each PM has two inputs. The two inputs are from power supply power supply sources A
and B, respectively. The PM converts the power and outputs the power to the power supply
backplane. In this manner, power supply power supply sources A and B back up each other A
maximum of 12 PMs can be configured based on the N+M backup mechanism.
Figure 8-18 DC power supply

Power supply source A
PM
P PM Power supply source B
E
PM Backplane power supply bus
M
PM
MPU
System Backplane
Power Backplane
PM
P PM
E LPU
M PM
PM
PM SFU
P PM
E
M PM FAN
PM
AC and HVDC Power Supply

As shown in Figure 8-19, after the external power is input to PMs through PEMs, the PMs
convert power and output the power to the power supply backplane. Each PEM provides four
channels of power inputs (with two partitioned into power supply source A and two
partitioned into power supply source B) for four PMs. There are 12 PMs on the device.

Figure 8-19 HVDC and AC power supply

Power supply source A
PM
P PM Power supply source B
E
M PM Backplane power supply bus
PM
MPU
System Backplane
Power Backplane
PM
P PM
E
M PM LPU
PM
PM SFU
P PM
E
M PM
PM FAN
8.2.3 DC PM
The external power is input to PMs through PEMs, the PMs perform current equalization and
regulation and output the power to the power supply backplane.
Overview

Description PM2200W DC Power Supply
BOM 02311CNP
Model PDC-2200WB

CX6620 V800R010C00
CX6608 V800R010C00
Appearance
Figure 8-20 shows the appearance of a DC PM module.

Figure 8-20 Appearance of the DC PM module
Panel


voltage exceeds
the preset
operating
voltage range.
Off l No DC
input.
l Positive and
negative
terminals
are
connected to
each other.


Output Green On off l The power

module does
not have DC
output.
l Output
voltage is
too low.

faulty.
l The device
is powered
off due to
overtempera
ture.
l The device
is powered
off due to
over-output-
voltage.
l The device
is powered
off due to
overcurrent
or short
circuit.
l The current
of modules
is seriously
imbalanced.
Item Specification
Dimensions (H x W x D) 41 mm x 106.5 mm x 485 mm(1.61 in x 4.19 in x 19.09

in)
Rated input voltage -48 V/-60 V
Input voltage range -40 VDC to -72 VDC

Item Specification
8.2.4 DC PEM
DC power is input through DC PEMs. Each PEM provides eight channels of power input. The
four terminals on the right of a PEM connect to power supply area A, and the four terminals
on the left connect to power supply area B. DC PEMs are fully configured when a device is
delivered.
Appearance
Figure 8-22 shows the appearance of a DC PEM.
Figure 8-22 DC PEM
Panel

Name
NEG(-) Input interface for l JG2-25mm2-M6-150A, applicable to 25mm2

–48 V power power cables
supply l JG2-34.3mm2-M6(1/4")-134A, applicable to
RTN(+) Input interface for 35mm2 power cables
BGND power
supply
Input Requirements
l Protection components must be provided for PDFs to ensure that the rated current of

components such as fuses and circuit breakers. If the current of a PDF is less than 63 A,
it cannot supply power to the CX6608&CX6620. In this case, reconstruct power supply
in the equipment room.

– The current of each channel output by the DC PDB is not less than 63 A.
8.2.5 3000W AC&HVDC Power Module

The external power is input to PMs through PEMs, the PMs convert AC power into regulated
DC power and output the power to the power supply backplane.
Overview

Description 3000W AC&HVDC Power Module
BOM 02310VMA
Model PHD-3000WA

CX6620 V800R010C00
CX6608 V800R010C00
Appearance
Figure 8-23 shows the appearance of a PM module.
Figure 8-23 Appearance of the PM module

Panel


voltage exceeds
the preset
operating
voltage range.
Off No input.
Output Green On Off l The power

module does
not have
output.
l Output
voltage is
too low.



faulty
l The device
is powered
off due to
overtempera
ture.
l The device
is powered
off due to
over-output-
voltage.
l The device
is powered
off due to
overcurrent
or short
circuit.
l The current
of modules
is seriously
imbalanced.
Technical Specifications(AC)
Item Specification

in)
Rated input voltage 200 V AC to 240 V AC (220V)
Input voltage range 180 V AC to 264 V AC

Technical Specifications(HVDC)
Item Specification

in)
Rated input voltage 240V DC/380V DC
Input voltage range 192V DC to 400V DC
NOTE
The AC power system supports 200-240 V AC power. It supports 110 V dual-live-wire inputs but not
110 V AC single-phase inputs. If 110 V dual-live-wire inputs are used, the voltage must range from 180
V to 264 V.
8.2.6 AC PEM
AC power is input through AC PEMs. Each PEM provides four channels of power input. The
two terminals on the right of a PEM connect to power supply area A, and the two terminals on
the left connect to power supply area B. AC PEMs are fully configured when a device is
delivered.
Appearance
Figure 8-25 shows the appearance of a PEM.
Figure 8-25 AC PEM
Panel

Name
C20 AC Input interface for C19

socket 220 V AC power
supply

Input Requirements
l The 220 V AC input is supported. In the 110 V dual-live wire system, Figure 8-26
shows the connection.
Figure 8-26 110 V dual-live wire connection
l Protection components must be provided for PDFs to ensure that the rated AC current of

NOTE
– The current of each channel output by the AC PDB is not less than 16 A.
8.2.7 AC&HVDC PEM

HVDC power is input through HVDC PEMs. Each PEM provides four channels of power
input. The two terminals on the right of a PEM connect to power supply area A, and the two
terminals on the left connect to power supply area B. HVDC PEMs are fully configured when
a device is delivered.
Appearance
Figure 8-27 shows the appearance of an HVDC PEM.

Figure 8-27 HVDC PEM
Panel

Name
Input 240V HVDC and HVDC dedicated terminal (240 V)

interface for 380 V HVDC HVDC dedicated terminal (380V)
power supply power input
interfaces
Input Requirements
l Protection components must be provided for PDFs to ensure that the rated HVDC
current of each channel is not less than 14 A.

NOTE
In HVDC application scenarios, ensure that the protection components meet HVDC certification
and the fuses and circuit breakers meet positive and negative pole protection.
– The current of each channel output by the HVDC PDB is not less than 14 A.
8.2.8 Switch
The switch controls the power output of PMs. The two switches back up each other. When
one or two switches are in the ON state, the power output of PMs is enabled.
Appearance
Figure 8-28 shows the appearance of a switch.

Panel
Table 8-37 Switch
Switch Name Description
OFF/ON Controls the device power connectivity.
Function
When one or both switches are turned on, the PMs output power, and the device is powered
on. When both switches are turned off, the PMs do not output power, and the device is
powered off.
Ensure that both switches are turned on when the device is running for reliability purposes.
8.2.9 Power System Technical Specifications

-48 V DC
Table 8-38 -48 V DC power system specifications
Item Description
Maximum input diameter 35mm^2 per input
Input voltage -40 V to -72 V (rated voltage -48 V/-60 V)
Input current A maximum of 63 A for an input per

module
Front-end circuit breaker/fuse 2-channel 63 A per module

channels of 63 A
AC
Table 8-39 AC power system specifications
Item Description
Maximum input diameter Standard C19 cable
Input voltage 180 V to 264 V (rated voltage 200 V to 240

V)

[4T bundle] AC device: 8 PMs, requiring 8
channels of 16 A

Item Description
HVDC
Table 8-40 HVDC power system specifications

Item Description
Maximum input diameter 2.5mm^2
Input voltage 192 V to 400 V (rated voltage 240 V/380 V)

[4T bundle] AC device: 8 PMs, requiring 8
channels of 14 A

Hardware Description 9 Fan
9 Fan
About This Chapter
This section describes the appearance, functions, and technical specifications of the fan
module.
9.1 CX6620 Heat Dissipation System
9.1.1 System Air Channel

This section describes the system air channel.
The CX6620 chassis is integrated in a cabinet, and the air filter is installed on the cabinet
front door.
Figure 9-1 shows the locations of the fan modules and air intake vents. Fan module 1
corresponds to heat dissipation area a, fan module 2 corresponds to heat dissipation area b,
and fan module 3 corresponds to heat dissipation area c.

Figure 9-1 Mapping relationships between fan modules and heat dissipation areas
PEM
RTN(+) NEG(-)
— -48V—-60V;63A
INPUT
---
PEM
RTN(+) NEG(-)
— -48V—-60V;63A
INPUT
---
PEM
RTN(+) NEG(-)
— -48V—-60V;63A
INPUT
---
PEM
RTN(+) NEG(-)
— -48V—-60V;63A
INPUT
---
PEM
RTN(+) NEG(-)
— -48V—-60V;63A
INPUT
Alarm
Input Output
---
Alarm
Input Output
Alarm
PEM
Input Output
RTN(+) NEG(-)
— -48V—-60V;63A
NEPS-2200-D
INPUT
Alarm
Input Output
NEPS-2200-D
CMU
---
ETH
NEPS-2200-D
ON
OFF ALM IN ACT
RS485 ALM
NEPS-2200-D
ON RUN
OFF
CMU
ETH
ALM IN ACT CMU 2

RS485 ALM
RUN
Power
STATUS
Switch 2
Power
Switch 1
STATUS
CMU 1
STATUS
STATUS
1
FAN
FAN
a
FAN
FAN
RST
CLK-INT
FSP
SMB
b
2
STATUS
STATUS
STATUS
STATUS
3
FAN
FAN
FAN
FAN
The CX6620 has three air channels, which draw air from the front and exhaust air from the
back. The system draws air for heat dissipation. Figure 9-2 shows the air flow in the chassis.

Figure 9-2 Air flow in the chassis
9.1.2 Rotational Speed Adjustment Policy

This section describes the policy of adjusting the fan rotational speed.
The fan rotational speeds are adjusted based on the temperatures reported by the sensors on
the LPUs, SFUs, and MPUs. The rules for adjusting the fan rotational speeds are as follows:
Ambient Rotational Noise/Heat Dissipation Standards

Temperat Speed
ure
-5°C to Low speed Fans rotate at a fixed low speed. Fan noise meets the
27°C ETSI standards, and heat dissipation meets the
requirements of typical configuration.
27°C to Linear and silent The fan rotation speeds are adjusted smoothly, and the
40°C speed adjustment fan noise does not change violently.
Higher High speed Fans rotate at a high speed to meet the heat dissipation
than 40°C requirements.

9.1.3 Fan Tray Assembly 2.0

The fan tray assembly of the CX6608&CX6620 is located on the LPU air exhaust vent. Each
fan module contains six fans. Supports hot swap. When a fan fails, the fan chassis still works
properly and other fans will make up for the airflow loss.
Overview
Table 9-1 Fan attributes

Description Fan Tray Assembly 2.0
BOM 02122111
Model CR9M000FBX63

CX6620 V800R010C00
CX6608 V800R010C00
Appearance

Indicators
Table 9-3 Description of indicators on the fan module

Item Status Description
STATUS Running status indicator

Green:
l If the indicator blinks once every two seconds (0.5 Hz), the
fan module is working properly.
l If the indicator blinks four times every second (4 Hz), the
fan module is registering.
Red:
fan module is faulty.
Orange:
l If the indicator is steady on, the fan module is faulty.
Table 9-4 Technical specifications

Item Specification
Dimensions (H x W x D) 131 mm x 440 mm x 122.5 mm (5.16 in. x

17.32 in. x 4.82 in.)
Weight 5.0 kg (11.0 lb.)
Fan quantity 6
Power consumption Maximum power consumption: 500 W

Power consumption at room temperature:
105 W
Noise 77.2 dBA (entire device), meeting the

NEBS requirements (<78dBA @ 27°C)
9.1.4 SFU Fan Tray Assembly

The fan module is located on the air exhaust vent. When a fan fails, the fan chassis still works

Overview

Description Fan Tray Assembly
BOM 02121223
Model CR9M000FBX61

CX6620 V800R010C00
Appearance

Indicators


Green:
Red:
Orange:

Item Specification
Dimensions (H x W x D) 224.5 mm x 87 mm x 134 mm (8.84 in. x

3.43 in. x 5.28 in.)
Fan quantity 2

Power consumption at room temperature: 27
W

9.1.5 Air Filter

The CX6620 chassis is integrated in a cabinet, and the air filter is installed on the cabinet
front door. Cleaning air filters once every three months is recommended.

Figure 9-3 Appearance of the air filter
9.2.1 System Air Channel

This section describes the system air channel.

Figure 9-4 shows the locations of the fan modules and air intake vents. Fan module 1
corresponds to heat dissipation area a and fan module 2 corresponds to heat dissipation area b.
Figure 9-4 Mapping relationships between fan modules and heat dissipation areas
The CX6608&CX6620 has three air channels, which draw air from the front and exhaust air
from the back. The system draws air for heat dissipation. Figure 9-5 shows the air flow in the
chassis.

Figure 9-5 Air flow in the chassis
63 PEM
,'4
26;
,'4
9,;

9.2.2 Rotational Speed Adjustment Policy

This section describes the policy of adjusting the fan rotational speed.
The fan rotational speeds are adjusted based on the temperatures reported by the sensors on
the LPUs, SFUs, and MPUs. The rules for adjusting the fan rotational speeds are as follows:
Ambient Rotational Noise/Heat Dissipation Standards

Temperat Speed
ure
-5°C to Low speed Fans rotate at a fixed low speed. Fan noise meets the
27°C NEBS standards, and heat dissipation meets the
requirements of typical configuration.
27°C to Linear and silent The fan rotation speeds are adjusted smoothly, and the
40°C speed adjustment fan noise does not change violently.
Higher High speed Fans rotate at a high speed to meet the heat dissipation
than 40°C requirements.
9.2.3 Fan-120 Fan Module 2.0

The fan tray assembly of the CX6608&CX6620 is located on the LPU air exhaust vent. Each
fan module contains six fans. Supports hot swap. When a fan fails, the fan chassis still works
Overview
Description Fan Tray Assembly 2.0
BOM 02122111
Model CR9M000FBX63
CX6620 V800R010C00
CX6608 V800R010C00

Appearance
Indicators

Green:
Red:
Orange:
Item Specification

17.32 in. x 4.82 in.)
Fan quantity 6

Power consumption at room temperature:
105 W

Item Specification

9.2.4 SFU Fan Tray Assembly

The fan tray assembly is located on the air exhaust vent. Supports hot swap. When a fan fails,
the fan chassis still works properly and other fans will make up for the airflow loss.
Overview

Description SFU Fan Tray Assembly
BOM 02121999
Model CR9M000FBX01

CX6608 V800R010C00
Appearance

Indicators


Green:
Red:

Item Specification

17.13 in. x 5.94in.)
Fan quantity 3

Power consumption at room temperature: 30
W

9.2.5 Air Filter

The air filters are installed on the PM cover and air filter door. Cleaning air filters once every
three months is recommended.

Figure 9-6 Appearance of the air filter

Hardware Description 10 Boards
10 Boards
About This Chapter
This chapter describes the boards of the device.
10.1 Overview
This chapter describes the appearance and structure of boards and subcards, filler panel, board
and subcard specifications, rules for numbering slots and interfaces.
10.2 Control Plane
10.3 Switching Network
10.4 Monitoring Plane
This section describes centralized monitor unit (CMU) specifications.
10.5 1T Fixed Interface Board
This section describes the specifications of a 1 Tbit/s fixed line processing unit (LPU).
This section describes the specifications of a 2T fixed line processing unit.
10.1 Overview
This chapter describes the appearance and structure of boards and subcards, filler panel, board
and subcard specifications, rules for numbering slots and interfaces.
10.1.1 Board Structure

This section describes the appearance and structure of boards and subcards.
l Structure of the integrated board
The integrated board on the CX6608&CX6620 is a plug-in board and consists of the
circuit board, connector, heat sinks, interface panel, ejector lever, and captive screws, as
shown in Figure 10-1.

Figure 10-1 Structure of the integrated board
1. Captive screw 2. Interfaces 3. Ejector lever 4. Protection cover
l Structure of the flexible board

A flexible board consists of two parts:
– Motherboard
– Flexible subcard
– Structure of the motherboard
The flexible board is a plug-in board and consists of the circuit board, connector,
heat sinks, interface panel, ejector lever, and captive screws, as shown in Figure
10-2.

Figure 10-2 Structure of the flexible board
1. Captive screw 2. Subcard slots 3. Ejector lever 4. Protection cover
– Flexible subcard
The flexible subcard is a plug-in board and consists of the circuit board, connector,
heat sinks, interface panel, ejector lever, and captive screws, as shown in Figure
10-3.
Figure 10-3 Structure of the flexible subcard
1. Captive screw 2. Ejector lever 3. Interfaces 4. Heat sinks 5. Connector 6. Circuit board

10.1.2 Bar Code for Boards

The bar code of a board is provided on the front panel of the board and contains the basic
information about the board, including the BOM code and delivery time.
The bar code of a board provides the feature information about the board and varies according
to boards. Figure 10-4 shows a bar code and Table 10-1 provides the description of the bar
code.
Figure 10-4 Bar code of a board
NOTE
The bar code in the figure is only an example and it may differ in practice.
Table 10-1 Description of the bar code of a board

Item Description
Type Code Indicates whether a board is a manufactured or finished board.

"02" indicates a manufactured board and "03" indicates a finished
board.
BOM Code Indicates the last four digits of the BOM code of a board.
Vendor Indicates the vendor of a board. "10" indicates Huawei.
Manufacture Year Indicates the last digit of the year when a board is manufactured.
For example, "4" indicates 2004. From 2010 onwards, a letter is
used to indicate the manufacture year. For example, the letter A
indicates 2010, the letter B indicates 2011, and so on.
Manufacture Month Indicates the month when a board is manufactured. The value is
expressed in hexadecimal format. For example, the letter B
indicates November.
Serial Number Indicates the production serial number of a board. The value
ranges from 000001 to 999999.
Environmental Indicates the environmental protection property of a board.

Protection Property
Board Name Indicates the name and associated information about a board.

10.1.3 Board Indicators

Indicators are present on the front panel of each board. This section describes the common
indicators. For details about the indicators, see the corresponding board description page.
Table 10-2 Descriptions of MPU indicators

Indicat Name Color Status Description
or
OFL Offline Red On The board can be securely

indicato removed.
r
MST Cluster Green On The master chassis is working.

master/
slave Green Off The slave chassis is working.
status
indicato
r
RUN Runnin Green Blinking once The system is running properly.

g status every 2s (0.5 Hz)
indicato
r Green Blinking twice Before the board is powered on
every second (2 and registered
Hz)
ALM Alarm Red On Alarms have been generated.

indicato
r Red Off No alarms have been generated.
ACT Master/ Green On The master chassis is working.

slave
status Green Off The slave chassis is working.
indicato
r
Table 10-3 Descriptions of SFU indicators

or

indicato
r Green Blinking twice Before the board is powered on
every second (2 and registered
Hz)


or

indicato removed.
r
Table 10-4 Descriptions of LPU indicators

or

indicato removed.
r

indicato
r Green Blinking twice The system is registering.
every second (2
Hz)
Green Off or on The board has failed.


or
Breakou Breako Green On Breakout 0-X: breakout

t ut indicator. If breakout indicator X
indicato is on, the interface indicators are
r for showing the running status of
channel breakout channel X. For
s example, if breakout indicator 0
is on, interface indicators are
showing the running status of
breakout channel 0 (if an
interface indicator is blinking,
breakout channel 0 on this
interface is receiving and
transmitting data); if breakout
indicator 1 is on, interface
indicators are showing the
running status of breakout
channel 1.
If the board has breakout
interfaces, each breakout
indicator for channels 0 to X
turns on for 5s in sequence to
indicate the status of the
corresponding channel. To
rapidly identify the running
status of a specific breakout
channel, press the Breakout
button to switch to your desired
indicator. For example, if you
want to check the running status
of breakout channel 1 on each
interface, press the Breakout
button to have breakout indicator
1 turns on.
Green Off There is no breakout interface.
10.2 Control Plane

10.2.1 Main Processing Unit N1

Overview
Table 10-5 Board attributes

Board name silkscreen CX6600 MPUN1
Description Main Processing Unit N1
BOM 03057984
Model CX6D0MPUN1A0

CX6620 V800R010C00
Appearance
Panel
Table 10-7 Buttons

Name Description
OFL Before removing a board, press and hold the OFL button
for about 6 seconds until the OFL indicator comes on.
Then, you can remove the board.
NOTE
This button takes effect only on the slave MPU.
RESET When this button is pressed, the board will be reset.
USB OFL Reserved button for USB offline.


Name Description
OFL (red) Offline indicator

If the indicator is steady on, a board can be securely
removed.
MST (green) Cluster master/slave status indicator

If the indicator is steady on, the master chassis is working.
If the indicator is off, the slave chassis is working.
RUN (green) Running status indicator

Before the board is powered on and registered: The
indicator blinks twice every second (2 Hz).
After the board is powered on and registered: If the
indicator blinks once every two seconds (0.5 Hz), the
system is running properly.
ALM (red) Alarm indicator

If the indicator is steady on, alarms have been generated.
If the indicator is off, no alarms have been generated.
ACT (green) Master/slave status indicator

USB ACT Reserved ACT indicator
GE/10GE Reserved GE/10GE indicator
MGMT-ETH LINK (green) LINK status indicator

If the indicator is steady on, a link is Up.
If the indicator is steady off, a link is Down.
MGMT-ETH ACT (yellow) ACT indicator

If the indicator is blinking, data is being transmitted.
If the indicator is off, no data is being transmitted.
FSP Reserved FSP indicator
Table 10-9 Management interfaces

Interface Interface Connect Description Cable
Name Type or Type
GE/10GE GE/10GE SFP+ Reserved cascading interface Optical

fibers
USB USB USB Reserved USB interface -


Name Type or Type
SMB External SMB It connects to an external clock. 75-ohm

clock clock
interface cable
FSP Serial RJ45 Reserved. Functions as an 8-core

interface interface for fast chassis shielded
switchovers. cable
Console RS-232 RJ45 Baud rate: 9600 bit/s (default 8-core

serial value), which is configurable Data shielded
interface device type: Data circuit- cable
terminating equipment (DCE) It
connects to the console for onsite
system configuration.
AUX RS-232 RJ45 Reserved. Baud rate: 9600 bit/s 8-core

serial (default value), which is shielded
interface configurable Data device type: cable
Data terminal equipment (DTE) It
connects to the modem for remote
maintenance by means of dial-up.
CLK-INT External RJ45 Used to input or output 2 Mbit/s 120Ω

synchroniza clock signals, 2 MHz clock clock
tion signals, 1pps+ASCII time signals, shielded
interface or two channels of DCLS time cable
signals.
CLK External RJ45 Used to input or output 2 Mbit/s 120-ohm

tion signals, or 1 PPS signals. cable
interface
TOD External RJ45 Used to input or output 1pps 120-ohm

synchroniza +ASCII or DCLS time signals clock
tion cable
interface
MGMT- Ethernet RJ45 Connects to a network system Super

ETH interface station. category 5
(10M/ Shielded
100M/ Twisted
1000M Pair (STP)
Base-TX cables are
auto- recommen
sensing) ded.

Functional Specifications
Table 10-10 Functions and features

Functions and Features Remarks
Reliability and availability This board is responsible for system control and
management operations, including route calculation,
device management and maintenance, and device
monitoring. As a system synchronization unit, this board
provides high-precise and reliable clock and time signals.
1:1 backup mode.
Table 10-11 Board specifications

Item Specification
Dimensions (H x W x D) 42.7 mm x 467.2 mm x 533.4 mm (1.68 in. x 18.39 in. x 21

in.)
Typical power 175.0 W

consumption
Typical heat dissipation 567.8 BTU/hour
Weight 7.4 kg (16.32 lb)
Ambient temperature Long terms: 0 °C to 40 °C (32°F to 104°F) Short terms:

-5 °C to 50 °C (23°F to 122°F)
Processing unit Deca-core 2.4GHz
SDRAM 16 GB x 2
Flash 16 MB
Storage SSD card:32 GB
10.2.2 Main Processing Unit P1
Overview

Board name silkscreen CX6600 MPUP1

Description Main Processing Unit P1
BOM 03057983
Model CX6D0MPUP1A0

CX6608 V800R010C00
Appearance
Panel
Table 10-14 Buttons

Name Description
NOTE
This button takes effect only on the slave MPU.
RESET When this button is pressed, the board will be reset.
USB OFL Reserved button for USB offline.

Name Description
OFL (red) Offline indicator

removed.

Name Description
MST (green) Cluster master/slave status indicator


ALM (red) Alarm indicator

ACT (green) Master/slave status indicator

10GE Reserved 10GE indicator
MGMT-ETH LINK (green) LINK status indicator

MGMT-ETH ACT (yellow) ACT indicator

FSP Reserved FSP indicator
USB OFL (green) Reserved led for USB offline.

Name Type or Type
10GE 10GE SFP+ Reserved cascading interface Optical

fibers
USB USB USB Reserved USB interface -
SMB External SMB It connects to an external clock. 75-ohm

clock clock
interface cable


Name Type or Type
FSP Serial RJ45 Reserved. Functions as an 8-core

interface interface for fast chassis shielded
switchovers. cable
Console RS-232 RJ45 Baud rate: 9600 bit/s (default 8-core

serial value), which is configurable Data shielded
interface device type: Data circuit- cable
terminating equipment (DCE) It
connects to the console for onsite
system configuration.
AUX RS-232 RJ45 Reserved. Baud rate: 9600 bit/s 8-core

serial (default value), which is shielded
interface configurable Data device type: cable
Data terminal equipment (DTE) It
connects to the modem for remote
maintenance by means of dial-up.
CLK-INT External RJ45 Used to input or output 2 Mbit/s 120Ω

tion signals, 1pps+ASCII time signals, shielded
interface or two channels of DCLS time cable
signals.
CLK External RJ45 Used to input or output 2 Mbit/s 120-ohm

tion signals, or 1 PPS signals. cable
interface
TOD External RJ45 Used to input or output 1pps 120-ohm

synchroniza +ASCII or DCLS time signals clock
tion cable
interface
MGMT- Ethernet RJ45 Connects to a network system Super

ETH interface station. category 5
(10M/ Shielded
100M/ Twisted
1000M Pair (STP)
Base-TX cables are
auto- recommen
sensing) ded.
ALM IN ALM IN RJ45 Used for Boolean detection. 8-core

interface shielded
cable
ALM OUT ALM OUT RJ45 Used for Boolean detection. 8-core
interface shielded
cable


Name Type or Type
RS485 RS485 RJ45 RS485 monitoring interface 8-core

interface shielded
cable

Reliability and availability This board is responsible for system control and
management operations, including route calculation,
device management and maintenance, and device
monitoring. As a system synchronization unit, this board
provides high-precise and reliable clock and time signals.
1:1 backup mode.

Item Specification

in.)

consumption

-5 °C to 50 °C (23°F to 122°F)
Processing unit Octa-core 2.3GHz
SDRAM 32 GB x 1
Flash 16 MB
Storage SSD card:32 GB

10.3 Switching Network

10.3.1 4Tbps Switch Fabric Unit B(SFUI-4T-B)
Overview
Board name silkscreen CX6600 SFU4T-B
Description 4Tbps Switch Fabric Unit B(SFUI-4T-B)
BOM 03057982
Model CX6DSFUIT4AB
CX6620 V800R010C00
Appearance
Panel
Table 10-21 Buttons
Name Description


Name Description
OFL (red) Alarm indicator

removed.


Reliability and availability This board is responsible for cell transmission between
LPUs and implements Ethernet communications with the
MPU for centralized system control and management of
the MPU. In addition, this board supports board
temperature and voltage monitoring.
The eight SFUs work in 7+1 backup mode and load-
balance services at the same time. When one SFU is faulty
or replaced, the other seven SFUs automatically take over
its services to prevent service interruptions.

Item Specification

in.)

consumption

-5 °C to 50 °C (23°F to 122°F)

10.3.2 4Tbps Switch Fabric Unit A(SFUI-4T-A)
Overview

Board name silkscreen CX6600 SFU4T-A
Description 4Tbps Switch Fabric Unit A(SFUI-4T-A)
BOM 03057981
Model CX6DSFUIT4AA

CX6608 V800R010C00
Appearance
Panel
Table 10-27 Buttons

Name Description

Name Description

removed.

Reliability and availability This board is responsible for cell transmission between
LPUs and implements Ethernet communications with the
MPU for centralized system control and management of
the MPU. In addition, this board supports board
temperature and voltage monitoring.
The eight SFUs work in 7+1 backup mode and load-
balance services at the same time. When one SFU is faulty
or replaced, the other seven SFUs automatically take over
its services to prevent service interruptions.
Item Specification

in.)

consumption

Item Specification

-5 °C to 50 °C (23°F to 122°F)
10.4 Monitoring Plane

This section describes centralized monitor unit (CMU) specifications.
10.4.1 Centralized Monitoring Module
Overview

Board name silkscreen CMU
Description Centralized Monitoring Module
BOM 03031VED
Model CR9D000CMU60

CX6620 V800R010C00
Appearance

Panel

Name Description

If the indicator blinks once every 2s (0.5 Hz), the system
is running properly.
If the indicator blinks twice every second (2 Hz), the
system is registering.
If the indicator is steady on or off, a board has failed.
ACT (green) Running status indicator

If the indicator is steady on, the active CMU is working.
If the indicator is off, the standby CMU is working.
ALM (red) Running status indicator

ETH LINK (green) Running status indicator

MGMT-ETH ACT (yellow) Running status indicator


Name Type or Type
ETH Monitoring RJ45 Ethernet monitoring interface -

network
interface
RS485 RS485 RJ45 RS485 monitoring interface -

interface
ALM IN ALM IN RJ45 Used for Boolean detection. -

interface

Reliability and availability Performs near- or far-end testing or upgrades in-service

system units.
Provides high-reliability device monitoring, management,
and energy-saving functions.
Supports 1:1 hot backup, which improves system
reliability.
Item Specification
Dimensions (H x W x D) 30.0 mm x 150.9 mm x 500.0 mm (1.18 in. x 5.94 in. x 19.69

in.)

consumption
Ambient temperature Long terms: 0 °C to 45 °C (32°F to 113°F) Short terms: -5 °C

to 55 °C (23°F to 131°F)

This section describes the specifications of a 1 Tbit/s fixed line processing unit (LPU).
10.5.1 CX6600 60-Port 10GBase LAN/WAN-SFP+ Integrated Line

Processing Unit Bundle
Overview
Board name silkscreen 60x10GBase LAN/WAN-SFP+ CX6600 LPUI-1T

Description CX6600 60-Port 10GBase LAN/WAN-SFP+ Integrated

Line Processing Unit Bundle
BOM 02312AGK
Model CX6P01TRTUA0

CX6608 V800R010C00
CX6620 V800R010C00
Appearance
Panel
Table 10-39 Buttons

Name Description

Name Description

removed.

Name Description

0 to 59 (green) Running status indicator

0 to 59 (orange) Running status indicator

Table 10-41 Service interfaces

Name Type or Type
0 to 59 10 GE SFP+ Interface for inputting and Optical

outputting 10 GE optical signals fiber

Line-Rate capability By default, 60 x 10G of the CX6600 60-Port 10GBase

LAN/WAN-SFP+ Integrated Line Processing Unit Bundle
(including 03057990 and 82401055) is enabled.
03057990: 60-port 10GBase LAN/WAN-SFP+ line
process unit provides 60 10GE SFP+ interfaces on the line
side, with the rate of each interface being 10 Gbit/s. This
board supports the LAN and WAN mode.
82401055: CX6600 60*10G Right To Use License.
Reliability and availability Hot swappable

Table 10-43 Interface specifications

Optical type supported 10Gbps SFP+ Optical Module
Working mode Full-duplex
Compliant standard IEEE 802.3
Frame format Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Item Specification

in.)

consumption

-5 °C to 50 °C (23°F to 122°F)

10.6.1 CX6600 16-Port 100GBase-CFP2 Integrated Line Processing

Unit Bundle
Overview

Board name silkscreen 8x100G-CFP2/8x100G-CFP2 NE9000 LPUI-2T
Description CX6600 16-Port 100GBase-CFP2 Integrated Line

BOM 02312AGL

Model CX6P00DDNCA0

CX6608 V800R010C00
CX6620 V800R010C00
Appearance
Panel
Table 10-47 Buttons

Name Description

Name Description


Name Description

removed.
0 to 7 (green) If this indicator is steady on, the link is Up.

If this indicator is steady off, the link is Down.
If this indicator is blinking, data is being transmitted.

Name Type or Type
0/0 to 0/7 100GE CFP2 Interface for inputting and Optical

1/0 to 1/7 outputting 100 GE optical signals fiber

Line-Rate capability By default, 16 x 100G and DWDM function of the

CX6600 16-Port 100G ETH/DWDM-CFP2 Integrated
Line Processing Unit Bundle (including 03058009 and
82401056) are enabled.
03058009: 16-Port 100GBase-CFP2 Integrated Line
Process Unit, provides sixteen 100GE CFP2 interface on
the line side, with the rate of each being 100 Gbit/s. This
board supports the Ethernet and OTN modes.
82401056: CX6600 16*100G DWDM Right To Use
License
Restrictions and remarks Does not support 10x10G short transmission distance
optical module.
Does not support breakout function.
Does not support 1588 when using DWDM CFP2 optical
module.


Optical type supported 100Gbps CFP2 optical module

100Gbps CFP2 DWDM optical module
NOTE
10*10G CFP2 optical module of 02311LYG code not supported
Frame format Ethernet_II, Ethernet_SAP and Ethernet_SNAP

100GE(GMP)<->ODU4<->OTU4

Item Specification

in.)

consumption

-5 °C to 50 °C (23°F to 122°F)
10.6.2 CX6600 20-Port 100GBase-QSFP28 Integrated Line

Processing Unit CM Bundle (default 20*40G)
Overview

Board name silkscreen 10x100GBase-QSFP28/10x100GBase-QSFP28 CX6600

LPUI-2T
Description CX6600 20-Port 100GBase-QSFP28 Integrated Line


BOM 02312AGM
Model CX6P02TRTUAP

CX6608 V800R010C00
CX6620 V800R010C00
Appearance
Panel
Table 10-55 Buttons

Name Description
Breakout Interface splitting keyboard.

When you press the button, the Breakout indicators stop
status cycling and remain in the current status. Then, each
time you press the button, the Breakout indicators' status
switches. If you do not press the button in 60s, the
Breakout indicators automatically start status cycling.


Name Description


removed.
0 to 3 Breakout(green) Breakout 0-3: Breakout indicators. If Breakout indicator X

is on, the interface indicators are showing the running
status of Breakout channel X. For example, if Breakout
indicator 0 is on, interface indicators are showing the
running status of Breakout channel 0 (if an interface
indicator is blinking, Breakout channel 0 on this interface
is receiving and transmitting data); if Breakout indicator 1
is on, interface indicators are showing the running status
of Breakout channel 1.
If the board has Breakout interfaces, each Breakout
indicator for channels 0 to 3 turns on for 5s in sequence to
indicate the status of the corresponding channel. To
rapidly identify the running status of a specific Breakout
channel, press the Breakout button to switch to your
desired indicator. For example, if you want to check the
running status of Breakout channel 1 on each interface,
press the Breakout button to have Breakout indicator 1
turns on.


Name Type or Type
0/0 to 0/9 100GE/ QSFP28/ Interface for inputting and Optical

1/0 to 1/9 40GE QSFP+ outputting 100 GE/40 GE optical fiber
signals


Line-Rate capability By default, 20 x 40G of the CX6600 20-Port 100GBase-

QSFP28 Integrated Line Processing Unit CM Bundle
82401061-CX6600 Solar5.0 40G to 100G Upgrade
License (per 100G) can be purchased for required.
03057993: 20-Port 100GBase-QSFP28 Integrated Line
Process Unit, provides twenty 100GE QSFP28 interface
on the line side, with the rate of each being 100 Gbit/s.
82401057: CX6600 20*40G Right To Use License
Restrictions and remarks All the four 10GE interfaces split from one interface must
work in the same LAN or WAN mode.

Optical type supported 100Gbps QSFP28 optical module

40Gbps QSFP+ optical module

Item Specification

in.)

consumption

Item Specification

-5 °C to 50 °C (23°F to 122°F)

Overview

Board name silkscreen 10x100GBase-QSFP28/10x100GBase-QSFP28 CX6600

LPUI-2T

BOM 02312AGN
Model CX6P02TRTUA0

CX6608 V800R010C00
CX6620 V800R010C00
Appearance

Panel
Table 10-63 Buttons
Name Description

Name Description


removed.

turns on.

Name Description


Name Type or Type

signals

QSFP28 Integrated Line Processing Unit Bundle
Process Unit, provides twenty 100GE QSFP28 interface
on the line side, with the rate of each being 100 Gbit/s.



Item Specification

in.)

consumption

-5 °C to 50 °C (23°F to 122°F)
10.6.4 CX6600 20-Port 100GBase-QSFP28 MACsec Integrated Line

Overview

Board name silkscreen 10x100GBase-QSFP28-C/10x100GBase-QSFP28-C

CX6600 LPUI-2T
Description CX6600 20-Port 100GBase-QSFP28 MACsec Integrated

Line Processing Unit CM Bundle (default 20*100G)
BOM 02312DRD
Model CX6P02TMACAP

CX6608 V800R010C10
CX6620 V800R010C10

Appearance
Panel
Table 10-71 Buttons

Name Description


Name Description


removed.
0 to 9 (green) Interface status indicator


Name Description

turns on.

Name Type or Type

signals


QSFP28 MACsec Integrated Line Processing Unit CM
Bundle (including 03058190 and 82401058) is enabled.
03058190: 20-Port 100GBase-QSFP28 MACsec
Integrated Line Process Unit, provides twenty 100GE
QSFP28 interface on the line side, with the rate of each
being 100 Gbit/s.

work in the same LAN mode,WAN mode not supported.



Item Specification

in.)

consumption

-5 °C to 50 °C (23°F to 122°F)
10.6.5 CX6600 20-Port 100GBase-QSFP28 MACsec Integrated Line


Overview

Board name silkscreen 10x100GBase-QSFP28-C/10x100GBase-QSFP28-C

CX6600 LPUI-2T
Description CX6600 20-Port 100GBase-QSFP28 MACsec Integrated

Line Processing Unit Bundle
BOM 02312DRE
Model CX6P02TMACA0

CX6608 V800R010C10
CX6620 V800R010C10
Appearance
Panel
Table 10-79 Buttons

Name Description



Name Description


removed.
0 to 9 (green) Interface status indicator


turns on.

Name Type or Type

signals

Line-Rate capability By default, 20 x 100G and 20 x 100G MACsec Licenses

of the CX6600 20-Port 100GBase-QSFP28 MACsec
Integrated Line Processing Unit Bundle (including
03058190 and 82401058) are enabled.
03058190: 20-Port 100GBase-QSFP28 MACsec
Integrated Line Process Unit, provides twenty 100GE
QSFP28 interface on the line side, with the rate of each
being 100 Gbit/s.
82401058: CX6600 20*100G Right To Use License
82401107: CX6600 100G MACsec License (per 100G).
work in the same LAN mode,WAN mode not supported.

Item Specification

in.)

consumption

Item Specification

-5 °C to 50 °C (23°F to 122°F)


Overview
Board name silkscreen 40x100GBase-QSFP28 CX6600 LPUI-4T

BOM 02312AGP
Model CX6P04TRTUAP
CX6608 V800R010C00
CX6620 V800R010C00
Appearance

Panel
Table 10-87 Buttons
Name Description

Name Description


removed.

turns on.

Name Description


Name Type or Type

signals


82401061-CX6600 Solar5.0 40G to 100G Upgrade
License (per 100G) can be purchased for required.
Process Unit, provides forty 100GE QSFP28 interface on
the line side, with the rate of each being 100 Gbit/s.




Item Specification

in.)

consumption

-5 °C to 50 °C (23°F to 122°F)

Overview

Board name silkscreen 40x100GBase-QSFP28 CX6600 LPUI-4T

BOM 02312AGQ
Model CX6P04TRTUA0

CX6608 V800R010C00
CX6620 V800R010C00

Appearance
Panel
Table 10-95 Buttons

Name Description


Name Description


removed.

Name Description

turns on.


Name Type or Type

signals

Process Unit, provides forty 100GE QSFP28 interface on
the line side, with the rate of each being 100 Gbit/s.




Item Specification

in.)

consumption

-5 °C to 50 °C (23°F to 122°F)

Hardware Description 11 Optical Module
11 Optical Module
About This Chapter
This chapter presents the optical module.
11.1 Instructions on How to Use an Optical Module

This section describes instructions on how to use an optical module.
11.2 Configuring an Optical Attenuator
This section describes how to configure an optical attenuator.
11.3 10Gbps SFP+ Optical Module
11.4 40Gbps QSFP+ Optical Module
11.5 100Gbps QSFP28 Optical Module
11.1 Instructions on How to Use an Optical Module

This section describes instructions on how to use an optical module.
NOTE
Only optical modules matching Huawei products can be used. These optical modules are strictly tested by
Huawei. If non-matching optical modules are used, device requirements may fail to be met, and services may
fail to run properly. To replace optical modules, see Parts Replacement-Replacing an Optical Module.
ESD-preventive Measures
Before touching any optical module, wear an ESD wrist strap or ESD gloves. Take full ESD-
preventive measures when installing optical apparatus such as optical modules indoors or
outdoors.

Methods of wearing ESD gloves Methods of wearing ESD wrist strap
Placing Optical Apparatus and fibers

Do not touch pins or connecting fingers with bare hands. Handle the optical fibers gently. Use
two fingers to hold the fiber connector instead of grasping the fiber or the fiber cover.
Do not apply axial or lateral fiber wallop bumps on the fiber. Do not fold, twist, or crush the
tail fiber. Do not drag the tail fiber or press the coupling point of the tail fiber. Figure 11-1
shows how to properly place optical apparatus and fibers.
Figure 11-1 Methods of placing optical apparatus and fibers
NOTE
Install the fiber in circles with diameter longer than 6 cm ( 0.20 ft ).
Uninstalling Optical Apparatus

Open the buckle and slowly take out the optical apparatus. Do not drag the optical fiber to
forcibly take out the optical fiber. Ensure that the optical fiber is connected to and removed
from the interface horizontally.

Open the buckle before uninstalling the optical apparatus. Ensure that the optical fiber is
connected to and removed from the interface horizontally.
Precautions for the loosened optical module

l When installing an optical module, force it into position. If a click is heard or a slight
tremor is felt, it indicates that the latch is secured. When the latch is not secured, the
connecting finger is not properly connected to the connector on the board, and the link
may become Up. In the rare event where the optical module collides with another object
or is made to tremor, the optical module will be loosened or the optical signals will be
temporarily cut off.
l When inserting the optical module, make sure that the tab is closed. (At this time, the
latch locks the optical module.) After the optical module is inserted, try pulling it out to
see whether it is installed properly. If the optical module cannot be pulled out, it is
secured.
The tab is closed The tab is open
Precautions for receptacle contamination

l Clean tissues must be prepared for deployment on site. You need to clean the optical
connector before inserting it in the receptacle. This protects the receptacle against the
contamination.
NOTE
Use at least three cleaning tissues. Wipe the end of an optical connector horizontally in one direction,
and then move the connector end to the unused part of the cleaning tissue to continue. Generally, one
cleaning tissue is used for cleaning an optical connector.

l To prevent contamination, the optical module should be covered with either a dust cap or
an optical connector.
Cover an optical module with a dust cap
Cover an optical module with an optical connector
l Lay the optical fibers on the Optical-fiber Distribution Frame (ODF) or coil them up in a
fiber management tray. Make sure that the optical fibers are not squeezed.

l If a receptacle or an optical connector has not been used for a long time and has not been
covered with a dust cap, you should clean it before using it. A cotton swab is used to
clean a receptacle, and a cleaning tissue is used to clean an optical connector.
About optical connector cleanning please refer to Cleaning Fiber Connectors and
Cleaning MT Connectors (MTP/MTRJ) That Have Guide Pins.
NOTE
During the cleaning process, insert the cotton swab and turn it slowly in the receptacle. Do not use too
much force, because the receptacle may be damaged.
l If, for no apparent reason, optical signals are lost during the operation of a device, use
the preceding method to clean the receptacle or the optical connector. This will eliminate
contamination as the cause of the signal loss.
Precautions for the overload-caused burnt optical module

l When using an OTDR to test the connectivity or the attenuation of optical signals,
disconnect the optical connector from the optical module. Otherwise, the optical module
may be burnt.
l When performing a self-loop test, use an optical attenuator. Do not loosen the optical
connector.
l It is required that a long-distance optical module have an input optical power of less than
-7 dBm. If the input optical power is larger than -7 dBm, you need to add an optical
attenuator. For example, if the transmiting optical power is X dBm and the optical
attenuation is Y dB, the receiving optical power is X-Y, which must be smaller than
-7dBm (X-Y<-7 dBm).
Other precautions
l The optical connector should be horizontally inserted in the receptacle to avoid damages
to the receptacle.
l Mixed use of multi-mode and single-mode optical fibers is prohibited. Otherwise, faults
such as signal loss may occur.
Method of distinguishing optical modules in single mode and multi-mode.

Table 11-1 Method of distinguishing optical modules in single mode and multi-mode
Item Single mode Multi-mode
Transmission distance 10 km or longer Below 0.5 km
Wavelength Non-850 nm 850 nm
Information on the label SM MM
The CX6608&CX6620 uses a fixed optical module that does not involve power control
adjustments.
The CX6608&CX6620 uses an optical module for class 1, which does not involve a
nominal risk area.
11.2 Configuring an Optical Attenuator

This section describes how to configure an optical attenuator.
Calculating the Optical Attenuation

You can calculate the optical attenuation based on the actual optical power.
P(in)min: worst sensitivity, that is,

maximum value of the worst sensitivity.
P(in)max: maximum receive optical power,
that is, minimum overload point.
P(out)min: minimum transmit optical power.
P(out)max: maximum transmit optical
power.
S: transmission distance.
A: attenuation coefficient. Note that the
attenuation coefficient is related to optical
fiber types and wavelengths. By default, the
attenuation coefficient of a 1310-nm
wavelength in a G.652 fiber is 0.45 dBm/km
or 0.4 dBm/km; the attenuation coefficient
of a 1550-nm wavelength in a G.652 fiber is
0.235 dBm/km or 0.25 dBm/km.
The principle for determining whether an attenuator needs to be configured at a transmission

point is as follows:
If P(out)max – S x Attenuation coefficient > P(in)max, an attenuator needs to be configured.
The optical attenuation is calculated in the following formula: T= P(out)max - S x Attenuation
coefficient - P(in)max.

Table 11-2 Reference for configuring an attenuator

BOM Description P(out) P(out) P(in) P(in)
Num max min min max
ber
34060 eSFP, -8 dBm -15 dBm -31 dBm -8 dBm

276 1310nm,STM1,LC,S
M,15km
NOTE
If P(in)max of an optical module equals P(out)max, you do not need to configure an attenuator.
You can choose the 5 dBm and 10 dBm attenuators for optical modules on the device.
Optical attenuators can be used together.
BOM Number and Description of Attenuators
Table 11-3 BOM number and description of attenuators

BOM Description
Numb
er
450300 Fixed Optical Attenuator,1260nm~1620nm-5dB-LC/PC-45dB

21
450300 Fixed Optical Attenuator,1260nm~1620nm-10dB-LC/PC-45dB

22
NOTE
This table is for reference only. BOM numbers of attenuators vary with configuration documents.
11.3 10Gbps SFP+ Optical Module

Figure 11-2 10Gbps SFP+ Optical Module

11.3.1 10Gbps-SFP+-MMF-850nm-0.3km-commercial
Item Specification
BOM S4017482
Model OSX040N03
Encapsulation mode SFP+
Interface standard IEEE 802.3ae, 10GBASE-SR/SW
Bit Error Ratio (BER) <1x10E–12
Working case temperature (°C) 0 °C to 70 °C (32°F to 158°F)
Digital diagnosis SFF-8472
Environment standard RoHS
Security standard FCC class B, IEC 60825-1 Class 1
ESD(HBM1) (V) 500
Transmission rate (bit/s) 9.953G/10.3125G
Connector type LC
Transmission distance (km) 0.3(OM3)
Optical fiber type MMF
Center wavelength (nm) 850
Working wavelength range of the optical 840-860

transmitter (nm)
Maximum sending optical power (AVG) -1

(dBm)
Maximum sending optical power (OMA) -

(dBm)
Minimum sending optical power (AVG) -7.3

(dBm)
Minimum sending optical power (OMA) -

(dBm)

receiver (nm)
Receiving sensitivity (AVG) (dBm) -9.9
Receiving sensitivity (OMA) (dBm) -11.1

Item Specification
Saturated optical power (dBm) -1
Minimum extinction ratio (dB) 3
11.3.2 10Gbps-SFP+-SMF-1310nm-10km-commercial
Item Specification
BOM S4017483
Model OSX001002
Interface standard IEEE 802.3ae, 10GBASE-LR/LW
ESD(HBM1) (V) 500
Connector type LC
Transmission distance (km) 10
Optical fiber type SMF

transmitter (nm)
Maximum sending optical power (AVG) 0.5

(dBm)

(dBm)

(dBm)

(dBm)

Item Specification

receiver (nm)
Saturated optical power (dBm) 0.5
Minimum extinction ratio (dB) 3.5
Item Specification
BOM S4017484
Model OMXD30002
Interface standard IEEE 802.3ae, 10GBASE-ER/EW
ESD(HBM1) (V) 500
Connector type LC

transmitter (nm)
Maximum sending optical power (AVG) 4

(dBm)

Item Specification

(dBm)

(dBm)

(dBm)

receiver (nm)
Note Self-loop is not supported. An optical

attenuator must be added if self-loop is
required.
Item Specification
BOM 02310PVU
Model OSX080N04
Interface standard IEEE 802.3ae, 10GBASE-ZR/ZW
ESD(HBM1) (V) 500
Connector type LC

Item Specification

transmitter (nm)
Maximum sending optical power (AVG) 4

(dBm)

(dBm)
Minimum sending optical power (AVG) 0

(dBm)

(dBm)

receiver (nm)
Receiving sensitivity (AVG) (dBm) -24
Receiving sensitivity (OMA) (dBm) -
Note The interface standard is Huawei-specific.

Self-loop is not supported. An optical
attenuator must be added if self-loop is
required.

11.4 40Gbps QSFP+ Optical Module

Figure 11-3 40Gbps QSFP+ Optical Module
11.4.1 40Gbps(4*10.3)-QSFP+-SMF-1271~1331nm-10km-
commercial

Item Specification
BOM 02310WUT
Model OMXD30009
Encapsulation mode QSFP+
Interface standard IEEE 802.3ba, 40GBASE-LR4
ESD(HBM1) (V) 500
Transmission rate (bit/s) 41.25G
Connector type LC

Item Specification

1291
1311
1331
Working wavelength range of the optical 1264.5-1277.5

transmitter (nm) 1284.5-1297.5
1304.5-1317.5
1324.5-1337.5
Maximum sending optical power (AVG) per lane:2.3

(dBm)
Maximum sending optical power (OMA) per lane:3.5

(dBm)
Minimum sending optical power (AVG) per lane:-7

(dBm)
Minimum sending optical power (OMA) per lane:-4

(dBm)

receiver (nm) 1284.5-1297.5
1304.5-1317.5
1324.5-1337.5
Receiving sensitivity (AVG) (dBm) -
Receiving sensitivity (OMA) (dBm) per lane:-11.5
Saturated optical power (dBm) per lane:2.3
Note The optical power calculation is based on

the OMA value.
11.4.2 40Gbps(4*10.3)-QSFP+-MMF-850nm-0.1km-commercial
Item Specification
BOM 02310WUU
Model OMXD30010

Item Specification
Interface standard IEEE 802.3ba, 40GBASE-SR4
ESD(HBM1) (V) 500
Connector type MPO-12
Transmission distance (km) 0.1(OM3) 0.15(OM4)

transmitter (nm)

(dBm)
Maximum sending optical power (OMA) per lane:3

(dBm)
Minimum sending optical power (AVG) per lane:-7.6

(dBm)
Minimum sending optical power (OMA) per lane:-5.6

(dBm)

receiver (nm)

the OMA value.

11.4.3 40Gbps(4*10.3)-QSFP+-SMF-1310nm-10km-commercial
Item Specification
BOM 02311NUA
Model OSM010N11
ESD(HBM1) (V) 500
Transmission rate (bit/s) 4x9.95328G/4x10.3125G

transmitter (nm)

(dBm)

(dBm)

(dBm)

(dBm)

receiver (nm)

Item Specification
11.4.4 40Gbps(4*10.3)-QSFP+-SMF-1271~1331nm-40km-
commercial
Item Specification
BOM 02311LVJ
Model OSM040N01
Interface standard IEEE 802.3bm, 40GBASE-ER4
ESD(HBM1) (V) 500
Connector type LC

1291
1311
1331

1304.5-1317.5
1324.5-1337.5

(dBm)

Item Specification

(dBm)

(dBm)
Minimum sending optical power (OMA) per lane:0.3

(dBm)

receiver (nm) 1284.5-1297.5
1304.5-1317.5
1324.5-1337.5
Receiving sensitivity (OMA) (dBm) per lane:-19
Saturated optical power (dBm) per lane:-4.5

the OMA value.
11.5 100Gbps QSFP28 Optical Module

Figure 11-4 100Gbps QSFP28 Optical Module

11.5.1 100Gbps(4*25.7)-QSFP28-SMF-1295.56~1309.14nm-10km-
commercial
Item Specification
BOM 02312BSS
Model OSN010N24
Encapsulation mode QSFP28
ESD(HBM1) (V) 500
Connector type LC
Center wavelength (nm) 1295.56

1300.05
1304.58
1309.14

1303.54-1305.63
1308.09-1310.19

(dBm)

(dBm)

(dBm)

(dBm)

Item Specification

receiver (nm) 1299.02-1301.09
1303.54-1305.63
1308.09-1310.19

the OMA value.
11.5.2 100Gbps(4*25.7)-QSFP28-MMF-850nm-0.1km-commercial
Item Specification
BOM 02311NTY
Model OMND10N13
Interface standard IEEE 802.3bm, 100GBASE-SR4
ESD(HBM1) (V) 500
Transmission distance (km) 0.07(OM3)

0.1(OM4)

Item Specification

transmitter (nm)

(dBm)

(dBm)

(dBm)

(dBm)

receiver (nm)
Note 1.If the module needs to reach the nominal

data, the board FEC function must be
enabled. 2. The BER 5x10E - 5 is the data
that is not enabled by FEC, so that 1x10E -
12 can be reached after FEC . 3.The optical
power calculation is based on the OMA
value.
1.If the module needs to reach the nominal
value.
value.

11.5.3 100Gbps(4*25.7)-QSFP28-SMF-1271~1331nm-2km-
commercial
Item Specification
BOM 02311QDH
Model OSN020N15
Interface standard 100G CWDM4 MSA
ESD(HBM1) (V) 500
Connector type LC

1291
1311
1331

1304.5-1317.5
1324.5-1337.5

(dBm)

(dBm)

(dBm)

(dBm)

Item Specification

receiver (nm) 1284.5-1297.5
1304.5-1317.5
1324.5-1337.5
Note 1.If the module needs to reach the nominal

12 can be reached after FEC .
12 can be reached after FEC .
11.5.4 100Gbps(4*25.7)-QSFP28-SMF-1310nm-30km(NO
FEC)-40km(FEC)-commercial
Item Specification
BOM 02312AUE
Model OSN030N05
Interface standard IEEE 802.3ba, 100GBASE-ER4
ESD(HBM1) (V) 500

Item Specification
Connector type LC
Transmission distance (km) 40( FEC)
Center wavelength (nm) 1295.56

1300.05
1304.58
1309.14

1303.54-1305.63
1308.09-1310.19

(dBm)

(dBm)

(dBm)
Minimum sending optical power (OMA) per lane:0.5

(dBm)

receiver (nm) 1299.02-1301.09
1303.54-1305.63
1308.09-1310.19

Item Specification
Note 1.If the module needs to reach 40km, the

board FEC function must be enabled,
otherwise 30km. 2.The BER 5x10E - 5 is
the data that is not enabled by FEC, so that
1x10E - 12 can be reached after FEC . 3.As
a 30km application, the BER can reach
1x10E - 12 4.The optical power calculation
is based on the OMA value.
1.If the module needs to reach 40km, the

Hardware Description 12 DPD125-12-24 DC Power Distribution Box
12 DPD125-12-24 DC Power Distribution

Box
About This Chapter
This section describes the hardware features and installation and maintenance of the
DPD125-12-24 DC power distribution box.
12.1 DPD125-12-24 Product Description

This section describes the positioning, benefits, usage scenario, main components, physical
parameters, and circuit principle of the product.
12.2 Power Distribution Instance of the CX6620
This section describes the application instance of the product.
12.1 DPD125-12-24 Product Description

This section describes the positioning, benefits, usage scenario, main components, physical
parameters, and circuit principle of the product.
Positioning
This product is designed to power devices that need a large number of power lines. It can
convert input lines into more output lines so that a few input lines in the equipment room can
meet power requirement. Therefore, this product increases power distribution flexibility.
Benefits
l This product is a 4 U (177.8 mm) power distribution box that complies with the IEC297
standard.
l It can convert 12 DC input lines into 24 DC output lines.
l It includes A and B power distribution areas. Each area has 6 DC input lines and each
DC input line is converted into 2 output lines.

l It can be equipped with air breakers whose output current ranges from 60 A. Air breaker
ports are pluggable bolts and easy to replace.
l The grounding copper bar in the power distribution box can provide 6 input lines and 24
output lines.
Figure 12-1 DPD125-12-24 appearance
Usage Scenario
The power distribution box can convert 6 or 12 DC input lines into 24 output lines. It can be
used in an equipment room that cannot provide enough power lines.
Main Components
Figure 12-2 DPD125-12-24 components

NOTE
The fourth channel of the input terminal cannot be wiring.
Table 12-1 list the DPD125-12-24 components and quantities.
Table 12-1 Components and Quantities
1 Plastic panel 1
2 Circuit breaker 24
3 Handle 2
4 Mounting ear 2
5 Grounding terminal 1
6 Power input terminal 12
7 Power output terminal 24
8 Protective plate for power input terminals 4
9 Protective plate for power output terminals 6
Physical Parameters
Table 12-2 Physical parameters
Item Description
Dimensions (H x W x D) 175 mm x 442 mm x 740 mm(6.89 in x 17.4 in x 29.13

in)
Installation platform Huawei N68E and N610E cabinet

Item Description
Weight 30 kg(60.15 lb)
DC input Rated voltage -48 Vdc/-60 Vdc

voltage
Maximum -40 Vdc to -72 Vdc
voltage range
Input Maximum 6×125 A+6×125 A (no copper fitting)

current 3×250 A+3×250 A (with copper fitting)
Terminal M6 (no copper fitting)

M8 (with copper fitting)
Maximum 50 mm2 (no copper fitting)

cable
95 mm2 (with copper fitting)
diameter
Output Maximum 12×60 A+12×60 A

current
Terminal M6
Maximum 25 mm2
cable
diameter
Air breaker Changeable 60 A(default)
Ambient Long term 0°C–45°C

temperature
Short term -5°C–55°C
Storage temperature -40°C–70°C
Ambient Long term 5% RH to 85% RH, no condensing

humidity
Short term 5% RH to 95% RH, no condensing
Relative storage humidity 0% RH to 95% RH, no condensing
NOTE
l Temperature and humidity are measured at 1.5 m (4.92 ft.) above the floor and 0.4 m (1.31 ft.) in
front of the cabinet. There should be no protection board on the front or back of the cabinet.
l "Short-term" refers to continuous working time that does not exceed 96 hours and accumulated
working time per year that does not exceed 15 days. If the working time exceeds either of these
values, it is considered "long-term".

Circuit Principle
NOTE
l You can change the power system of the product to 6-channel input and 24-channel output by copper
fitting NEG A1(-) and NEG A2(-), NEG A3(-) and NEG A4(-), NEG A5(-) and NEG A6(-), RTN
A1(+) and RTN A2(+), RTN A3(+) and RTN A4(+), RTN A5(+) and RTN A6(+), NEG B1(-) and
NEG B2(-), NEG B3(-) and NEG B4(-), NEG B5(-) and NEG B6(-), RTN A1(-) and RTN B1(+) and
RTN B2(+), RTN B3(+) and RTN B4(+), and RTN B5(+) and RTN B6(+).
l The changed output power must be larger than or equal to the rated power of the device that is
powered by the power distribution box.
Figure 12-3 Circuit principle


The CX6620 supports a maximum of 48-channel DC input, with 24 channels on each of A

and B planes. Two power distribution boxes are required.
NOTE
The number of each PEM module can be determined based on a product silkscreen and the primary and
secondary power supply diagram.
To ensure power supply redundancy, connect PEM-As to the OUTPUT A area in the power
distribution box, and connect PEM-Bs to the OUTPUT B area in the power distribution box.
Mappings Between DPD125-12-24 12-Channel Inputs and 24-Channel Outputs

The two power distribution boxes implement 24-channel input and 48-channel output.
Figure 12-4 Mappings between 12-channel inputs and 24-channel outputs

DPD125-12-24(1) PEM DPD125-12-24(2)
A1-1 A1 A13 A1-1
A1 A1
A1-2 A2 A14 A1-2
A2-1 A3 A15 A2-1
A2 A2
A2-2 A4 A16 A2-2
A A3-1 A5 A17 A3-1 A
a A3 A3 a
e
r A3-2 A6 A18 A3-2 e
r
A A
r A4-1 A7 A19 A4-1 r
e A4 A4 e
w A4-2 A8 A20 A4-2 w
o o
P A5-1 A9 A21 A5-1 P
A5 A5
A5-2 A10 A22 A5-2
A6-1 A11 A23 A6-1
A6 A6
A6-2 A12 A24 A6-2
B1-1 B1 B13 B1-1

B1 B1
B1-2 B2 B14 B1-2
B2-1 B3 B15 B2-1
B2 B2
B2-2 B4 B16 B2-2
B B3-1 B5 B17
B
B3-1 a
a B3 B3 e
e
r B3-2 B6 B18 B3-2 r
A A
r B4-1 B7 B19 B4-1 r
e B4 B4 e
w B4-2 B8 B20 B4-2 w
o o
P B5-1 B9 B21 B5-1 P
B5 B5
B5-2 B10 B22 B5-2
B6-1 B11 B23 B6-1
B6 B6
B6-2 B12 B24 B6-2


When the DPD125-12-24 input current (output current of each channel of the user-side power
distribution frame) reaches 250 A, the current of each input is demultiplexed into four
channels of output (DPD125-12-24 copper bar must be short-circuited) to implement 6-
channel input 24-channel output. The two power distribution boxes implement 12-channel
input and 48-channel output.

DPD125-12-24(1) PEM DPD125-12-24(2)
A1-1 A1 A13 A1-1
A1 A1
A1-2 A2 A14 A1-2
A2-1 A3 A15 A2-1
A2 A2
A A2-2 A4 A16 A2-2 A
a a
e
r A3-1 A5 A17 A3-1 e
A A3 A3 r
r A3-2 A6 A18 A3-2 A
e r
w A4-1 A7 A19 A4-1 e
o A4 A4 w
P A4-2 A8 A20 A4-2
o
P
A5-1 A9 A21 A5-1
A5 A5
A5-2 A10 A22 A5-2
A6-1 A11 A23 A6-1
A6 A6
A6-2 A12 A24 A6-2
B1-1 B1 B13 B1-1

B1 B1
B1-2 B2 B14 B1-2
B2-1 B3 B15 B2-1
B
B2 B2 B
B2-2 B4 B16 B2-2 a
a e
r
e
r B3-1 B5 B17 B3-1
A B3 B3 A
r B3-2 B6 B18 B3-2 r
e e
w B4-1 B7 B19 B4-1 w
o B4 B4
o
P B4-2 B8 B20 B4-2
P
B5-1 B9 B21 B5-1
B5 B5
B5-2 B10 B22 B5-2
B6-1 B11 B23 B6-1
B6 B6
B6-2 B12 B24 B6-2

NOTE
The number of each PEM module can be determined based on a product silkscreen and the primary and
secondary power supply diagram.

To ensure power supply redundancy, connect PEM-As to the OUTPUT A area in the power
distribution box, and connect PEM-Bs to the OUTPUT B area in the power distribution box.
DPD125-12-24 PEM PEM PEM

A1-1 A1
A1
A1-2 A2
A2-1 A3
A2
A2-2 A4
A3-1 A5
A3
A3-2 A6
Power A4-1 A7
Area A4
A4-2 A8
A
A5-1 A9
A5
A5-2 A10
A6-1 A11
A6
A6-2 A12
B1-1 B1
B1
B1-2 B2
B2-1 B3
B2
B2-2 B4
B3-1 B5
B3
B3-2 B6
Power
B4-1 B7
Area B4
B4-2 B8
B
B5-1 B9
B5
B5-2 B10
B6-1 B11
B6
B6-2 B12

When the DPD125-12-24 input current (output current of each channel of the user-side power
distribution frame) reaches 250 A, the current of each input is demultiplexed into four
channels of output (DPD125-12-24 copper bar must be short-circuited) to implement 6-
channel input 24-channel output.

DPD125-12-24 PEM PEM PEM

A1-1 A1
A1
A1-2 A2
A2-1 A3
A2
A2-2 A4
Power A3-1 A5
Area A3
A3-2 A6
A
A4-1 A7
A4
A4-2 A8
A5-1 A9
A5
A5-2 A10
A6-1 A11
A6
A6-2 A12
B1-1 B1
B1
B1-2 B2
B2-1 B3
B2
B2-2 B4
Power B3-1 B5
B3
Area B3-2 B6
B B4-1 B7
B4
B4-2 B8
B5-1 B9
B5
B5-2 B10
B6-1 B11
B6
B6-2 B12

Hardware Description 13 Fiber Breakout
13 Fiber Breakout
About This Chapter
This section describes breakout fibers, breakout boxes and maintenance of the breakout fibers
and boxes.
13.1 Breakout Fibers
This section describes the positioning, usage scenario, structure, and technical specifications
of breakout fibers.
13.2 Breakout Boxes
This section describes breakout boxes.
13.1 Breakout Fibers

This section describes the positioning, usage scenario, structure, and technical specifications
of breakout fibers.
Positioning
Breakout fibers are used to flexibly allocate bandwidth resources to routers. They cooperate
with a breakout optical module to convert an MPO interface into multiple LC interfaces to
facilitate fiber layout.
Usage Scenario
The breakout function applies to a scenario where bandwidth resources are unevenly allocated
between two routers at different levels. In comparison with breakout boxes, breakout fibers
implement the following functions:
l Loosen fiber layout.
l Extend the cabling distance.
Fiber Structure
To insert a breakout optical module (multimode and short transmission distance) into a board,
use an MPO-LC fiber to directly connect the board and the optical module.

Figure 13-1 MPO-LC fiber structure
NOTE
When using a breakout optical fiber, insert the X1 end into a 40GE QSFP+ optical module and the X2
end into four 10GE interfaces. If the 40GE interface is Down but the four 10GE interfaces are Up, check
the 40GE interface status.
l Check whether the 40GE interface supports the breakout function. If the 40GE interface does not
support the breakout function, replace it with another interface that supports the breakout function.
l Check whether the 40GE interface is in the breakout state. If the 40GE interface is not in the
breakout state, configure the 40GE interface to be in the breakout state.
Table 13-1 lists the breakout fibers supported by the CX6608&CX6620.
Table 13-1 Breakout fibers supported

Type BOM Number Official Name Mode
Optical Cable 14132538 MPO12-4DLC- Single mode

Assembly,MPO/ SM-15
APC,4*DLC/
PC,Singlemode,GJF
H 8G.
657A2(LSZH),15m,
3.5mm,8 Cores,
0m/1m,2mm

Type BOM Number Official Name Mode
Optical Cable 14132537 SS-OP- Multimode

Parts,MPO/PC, MPO12-4*DLC-
4DLC/PC,Multi- M-5
mode,5m,8 cores,
0/1m,GJFH-8A1a.
2(OM3),3.5mm,
2mm,LSZH,43mm
Short MPO,Bending
insensitive
Optical Cable 14132537-001 SS-OP- Multimode

4DLC/PC,Multi- M-100
mode,100m,8 cores,
0/1m,GJFH-8A1a.
2(OM3),3.5mm,
2mm,LSZH,43mm
Short MPO,Bending
insensitive

4DLC/PC,MULTI- M-15B
MODE,15m,8
CORES,
0/1m,GJFH-8A1A.
2(OM3),3.5mm,
2mm,LSZH,43MM
SHORT
MPO,BENDING
INSENSITIVE

4DLC/PC,MULTI- M-30
MODE,30m,8
CORES,
0/1m,GJFH-8A1A.
2(OM3),3.5MM,
2mm,LSZH,43MM
SHORT
MPO,BENDING
INSENSITIVE
Table 13-2 lists the optical modules and boards mapping breakout fibers.

Table 13-2 Optical modules and boards mapping breakout fibers

Breakout Fiber Optical Module Board
Optical Cable [02310WUU/OMXD30010]

Parts,MPO/PC,4DLC/ High Speed
PC,Multi-mode,5m,8 cores, Transceiver,QSFP+,850nm,
0/1m,GJFH-8A1a.2(OM3), 41.25Gbps,-7.6dBm,-1dBm,
3.5mm,2mm,LSZH,43mm -9.5dBm,MPO,MMF,
Short MPO,Bending 0.15km
insensitive
Optical Cable
Parts,MPO/PC,4DLC/
PC,Multi-mode,100m,8
cores,0/1m,GJFH-8A1a.
2(OM3),3.5mm,
2mm,LSZH,43mm Short
MPO,Bending insensitive
Optical Cable
Parts,MPO/PC,4DLC/
PC,MULTI-MODE,15m,8
CORES,0/1m,GJFH-8A1A.
2(OM3),3.5mm,
2mm,LSZH,43MM SHORT
MPO,BENDING
INSENSITIVE
Optical Cable
Parts,MPO/PC,4DLC/
PC,MULTI-MODE,30m,8
CORES,0/1m,GJFH-8A1A.
2(OM3),3.5MM,
2mm,LSZH,43MM SHORT
MPO,BENDING
INSENSITIVE
NOTE
Characters in the brackets indicate the BOM number and official name that are separated using a slash
("/") in the [BOM number/Official name] format.
13.2 Breakout Boxes

This section describes breakout boxes.
13.2.1 Product Overview

This section describes the positioning, features, and usage scenarios of breakout boxes.

Positioning
Breakout boxes are used to flexibly allocate bandwidth resources to routers. They cooperate
with a breakout optical module and optical jumper to convert an MPO interface into multiple
LC interfaces to facilitate fiber layout.
Product Features
l LC interfaces support automatic dust-proof covers, and MPO interfaces support dust-
proof plugs.
l In comparison with breakout fibers (MPO-LC fibers), breakout boxes feature more
flexible fiber layout.
l There is no restriction on the installation direction of breakout boxes, so that the
breakout boxes can be installed positively or negatively as needed.
Usage Scenario
The breakout function applies to a scenario where bandwidth resources are unevenly allocated
between two routers at different levels. In comparison with breakout fibers, breakout boxes
implement the following functions:
l Increase the density of fiber layout.
l Shorten the cabling distance.
Figure 13-2 Breakout box cabling
MPO-MPO jumper
MPO
adapter
Breakout box
LC
adapter
Router LC-LC jumper

Multi-Router
13.2.2 10-Port-MPO-12-40-Port-LC-Breakout Box(single-mode)

This section describes the appearance, components, MPO-12 jumper, and technical
specifications of this product.
Appearance
Figure 13-3 10-Port-MPO-12-40-Port-LC-Breakout Box(single-mode)

Components
Figure 13-4 10-Port-MPO-12-40-Port-LC-Breakout Box(single-mode)
1. MPO adapter 2. LC adapter 3. Mounting ear
MPO adapters map LC adapters according to their numbers displayed on the panel. Figure
13-5 shows the mapping between MPO and LC adapters.
Figure 13-5 Mapping between MPO and LC adapters
MPO-12 Jumper
The TYPE-B MPO jumper is used. The following figure shows the MPO-12 jumper structure
and line orders of X1 and X2 ports.

Table 13-3 describes the mappings between the lanes of the X1 and X2 ports.
Table 13-3 Mappings between the lanes of the X1 and X2 ports
Start End Start End
X1-1 X2-12 X1-7 /
X1-2 X2-11 X1-8 /
X1-3 X2-10 X1-9 X2-4
X1-4 X2-9 X1-10 X2-3
X1-5 / X1-11 X2-2
X1-6 / X1-12 X2-1
Table 13-4 Technical specifications of the 10-Port-MPO-12-40-Port-LC-Breakout

Box(single-mode)
Item Description
BOM Number 2082890
Official Name ODBS10040
Dimensions (H x W x D) 43.6 mm x 442 mm x 164 mm

Item Description
Mounting ear 19-inch supported
Weight 2.3 kg
Insertion loss ≤ 0.75 db
Return loss Single-mode: ≥ 30 db
Operating temperature –40°C to +65°C
Storage temperature –40°C to +70°C
Relative operating humidity l Long term: 5% RH to 85% RH, non-

condensing
l Short term: 5% RH to 95% RH, non-
condensing
Relative storage humidity 0% RH to 95% RH, non-condensing
Table 13-5 Optical modules, jumpers, and boards supported by the 10-Port-MPO-12-40-Port-
LC-Breakout Box(single-mode)
Optical Module MPO-MPO Fiber Board
l [02311NUA/ [14134759/MPO12- l [03057993/

OSM010N11] Function MPO12-SM-10] Optical CX6D00EENBA0] 20-
Module,OSM010N11,Hi Cable Parts,MPO/ Port 100GBase-QSFP28
gh Speed APC,MPO/APC,Single Integrated Line Process
Transceiver,QSFP+, mode,10m,8 Unit (LPUI-2T)
1310,41.25Gbps,-8.2dB cores,GJFH-8G. l [03058007/
m, 657A2,3.5mm,LSZH,43mm CX6D00EKNBA0] 40-
0.5dBm,-12.6dBm,MPO, Short MPO,Bending Port 100GBase QSFP28
SM,10km insensitive Integrated Line Process
Unit(LPUI-4T)

Hardware Description 14 Cable
14 Cable
About This Chapter
14.1 Power Cables

14.2 Ground Cable
14.3 Console Cable
14.4 Clock Cable
14.5 Ethernet Cable
Ethernet cables are classified into two types: straight-through cables and crossover cables.
14.6 Fiber
14.1 Power Cables
14.1.1 DC Power Cables

DC power cables can be used to connect a PDF on the user side to DC PEMs on the
CX6608&CX6620.
Appearance
Figure 14-1 DC power cables

Figure 14-2 Power cable terminals
Figure 14-3 Heat shrink tubing
Specifications
Install cables based on the actual power distribution distance between the CX6608&CX6620
and PDF. Table 14-1 shows the specifications of the DC power cables.

Table 14-1 Power cable specifications

Distance Item Specifications Remarks
from the
PDF to the
Device
Shorter than DC power Electronic|Electric Cable,450V/ Blue power cable

or equal to cable 750V,60227 IEC 02(RV),
25 m 25mm^2,Blue,112A,CCC,CE
Electronic|Electric Cable,450V/ Black power cable

750V,60227 IEC 02(RV),
25mm^2,Black,112A,CCC,CE
Electronic|Electric Cable,450V/ Red power cable

750V,60227 IEC 02(RV),
25mm^2,Red,112A,CCC,CE
Power Naked Crimping It is connected to the

cable Connector,JG2,25mm^2,M6,Tin device.
terminal Plating
Naked Crimping Terminal,OT, It is connected to the

25mm^2,M8,Tin Plating,Naked Ring PDF.
Terminal
Longer than DC power Electronic|Electric Cable,450V/ Blue power cable

25 m and cable 750V,60227 IEC 02(RV),
shorter than 35mm^2,Blue,138A,CCC,CE
or equal to
35 m Electronic|Electric Cable,450V/ Black power cable
750V,60227 IEC 02(RV),

750V,60227 IEC 02(RV),

cable Connector,JG2,34.3mm^2,M6(1/4"), device.
terminal Tin Plated,2AWG,Hole Center
Distance 15.875mm(5/8"),Short
Tube

Terminal,for 35mm^2~38mm^2
cable
Longer than A PDF or the EOS must be placed close to the device.
35 m

14.1.2 AC Power Cables

AC power cables can be used to connect a PDF on the user side to AC PEMs on the
CX6608&CX6620.
Appearance
The AC power cable connectors vary according to countries and regions. Select the
corresponding power cables based on the local standard. Figure 14-4 uses an AC power cable
of a Chinese standard as an example.
Figure 14-4 AC power cable (C19 straight female-PI straight male)
Specifications
When the AC power cable is used, the connectors at both ends of the power cable must match
the sockets on the CX6608&CX6620 and user-side PDF. The connector type of the AC power
cable on the device side is C19 straight female. The connector type of the AC power cable on
the PDF side varies in different countries and regions. Table 14-2 lists the specifications of
common power cables used by the CX6608&CX6620.

Description Appearance of the Power Cable (Connector on the PDF Side –
Connector on the Device Side)
Power Cords
Cable,China
AC Power
250V16A,
3.0m,PIAM,
227IEC53-2.5^
2(3C),C19SF,Bl
ack


Power
cord,BS546
250V16A,
3.0m,PM-
IAM,H05VV-
F-1.5mm^2(3C)
,C19SF,250V,
16A,Black
Power Cords
Cable,Europe
AC Power
250V16A,
3.0m,PFAM,H0
5VVF-1.5^2(3C
),C19SF,Black
Power
cord,Japan AC
Power Cable,
3.0m,NEMA5-2
0PAM,HVCTF-
3.5mm^2(3C),C
19SF,125V,
20A,Black
Power Cords
Cable,North
America AC
Power
125V20A,
3.0m,NEMA5-2
0PAM,
12SJT(3C),C19
SF,Black
Power Cords
Cable,Australia
AC Power
250V16A,
3.0m,PISM,H0
5VVF-2.5^2(3C
),C19SF,Black


Power Cords
Cable,Brazil
AC Power
250V16A,
3.0m,PN-
ISM ,H05VVF-
1.5^2(3C),C19S
F,Black
Power Cords
Cable,Britain
AC Power
Cable,
250V13A,
3.0m,PG
AM,H05VV-
F-1.5mm^2(3C)
,C19 SF,Black
Power
cord,India AC
Power 250V
16A,3m,PM-
IIIAM,IS
694-1.5mm^2(3
C),C19SF,250V,
16A,Black
Power
cord,South
Africa AC
Power
250V16A,
3m,PMAM,H05
VV-
F-1.5mm^2(3C)
,C19SF,250V,
16A,Black


Power
cord,Switzerlan
d AC Power
Cable,3m,PJ-II
SM,H05VV-
F-1.5mm^2(3C)
,C19SF,250V,
16A
14.1.3 240 V High-Voltage DC Power Cables

Power cables can be used to connect a PDF to high-voltage DC PEMs on the
CX6608&CX6620 for power supply.
Appearance
Figure 14-5, Figure 14-6, and Figure 14-7 show the appearance of the 240 V high-voltage
DC power cables for the CX6608&CX6620. The HVDC 3-straight female connector is used
on the device side. Select the power cable based on the interface on the PDF.
Figure 14-5 240 V high-voltage DC power cable (HVDC 3-straight female--OT M8)
Figure 14-6 240 V high-voltage DC power cable (HVDC 3-straight female--PI angle male)

Figure 14-7 240 V high-voltage DC power cable (HVDC 3-straight female--C20 straight
male)
Specifications
Table 14-3 lists the specifications of the 240 V high-voltage DC power cable used by the
CX6608&CX6620.

Description Appearance of the Power Cable (Connector on the Device Side
– Connector on the PDF Side)
Power Cable,
3m,
3*1.5mm^2,HV
DC 3SF,
227IEC53-1.5^
2(3C),
3*OT1-8,380V
high voltage
DC PEM
dedicated
The mappings between terminals and core wires are as follows: (PE)-
yellow and green; (+)-brown; (-)-blue.


Power Cable,
2.5m,
3*1.5mm^2,HV
DC 3SF,
227IEC53-1.5^
2(3C),PIAM,Fo
r China
yellow and green-(E); (+)-blue-(N); (-)-brown-(L).
Power Cable,
2.5m,
3*1.5mm^2,HV
DC 3SF,
(H05VV-
F-1.5mm^2(3C)
+14SJT(3C)),C
20SM,PDU
yellow and green-(E); (+)-blue-(N); (-)-brown-(L).
14.1.4 380 V High-Voltage DC Power Cables

Power cables can be used to connect a PDF to high-voltage DC PEMs on the
CX6608&CX6620 for power supply.
Appearance
Figure 14-8 shows the appearance of the 380 V high-voltage DC power cable for the
CX6608&CX6620.

Figure 14-8 380 V high-voltage DC power cable (HVDC 3-straight female--OT M8)
Specifications
Table 14-4 lists the specifications of the 380 V high-voltage DC power cable used by the
CX6608&CX6620.

Power Cable,
3m,
3*1.5mm^2,HV
DC 3SF,
227IEC53-1.5^
2(3C),
3*OT1-8,380V
high voltage
DC PEM
dedicated
yellow and green; (+)-brown; (-)-blue.
14.1.5 DC Power Cables Connecting the PDF to the DPD125-12-24

This section describes the DC power cables connecting the PDF to the DPD125-12-24.

Appearance

Specifications
Table 14-5 shows the specifications of the DC power cables.

from the
PDF to the
Device

or equal to cable 750V,H07Z-K
25 m (no UL3386,50mm^2,Blue,209A,LSZH
copper Cable,VDE,UL
fitting)
750V,H07Z-K
UL3386,50mm^2,Black,209A,LSZH
Cable,VDE,UL

750V,H07Z-K
UL3386,50mm^2,Red,209A,LSZH
Cable,VDE,UL
Power Naked Crimping Connector,JG, It is connected to the

cable 50mm^2,M6,200A,Tin plating input terminal of the
terminal DPD125-12-24.
Naked Crimping Terminal,DT, It is connected to the

50mm^2,M12,200A,Tin Plating PDF.

25 m (with 95mm^2,Blue,258A,CCC,CE
copper
fitting) Electronic|Electric Cable,450V/ Black power cable
750V,60227 IEC 02(RV),

750V,60227 IEC 02(RV),
Power Naked Crimping Connector,JG, It is connected to the

cable 95mm^2,M8,250A,Tin plating input terminal of the
terminal DPD125-12-24.
Naked Crimping Terminal,JG, It is connected to the

95mm^2,M12,Tin Plating PDF.
Longer than A PDF or the EOS must be placed close to the device.
25 m

14.1.6 DC Power Cables Connecting the DPD125-12-24 to the

CX6608&CX6620
DC power cables can be used to connect the DPD125-12-24 to DC PEMs on the
CX6608&CX6620.
Appearance

Specifications
Install cables based on the actual power distribution distance between the CX6608&CX6620
and PDF. Table 14-6 shows the specifications of the DC power cables.

from the
PDF to the
Device

15 m 16mm^2,Blue,85A,CCC,CE

750V,60227 IEC 02(RV),

750V,60227 IEC 02(RV),

terminal Plating

Terminal
Longer than DC power Electronic|Electric Cable,450V/ Blue power cable

15 m and cable 750V,60227 IEC 02(RV),
shorter than 25mm^2,Blue,112A,CCC,CE
or equal to
25 m Electronic|Electric Cable,450V/ Black power cable
750V,60227 IEC 02(RV),


from the
PDF to the
Device

750V,60227 IEC 02(RV),

terminal Plating

25mm^2,M6,Tin Plating,Width Less PDF.
Than 12.4mm,For OEM
Longer than A DPD125-12-24 must be placed close to the device.

25 m
14.2 Ground Cable

This section describes the structure and technical specifications of the ground cable.
14.2.1 Introduction to the Ground Cable

A ground cable connects the ground terminal on the device and the ground bar in the
equipment room.
14.2.2 Structure
Figure 14-15 Ground cable

14.2.3 Technical Specifications
Table 14-7 Technical specifications of the device ground cable
Item Specifications Remarks
PGND Termi Naked Crimping Terminal,OT,25mm^2,M8,Tin It is connected to

cable nal Plating,Naked Ring Terminal the ground bar.
Naked Crimping It is connected to

Connector,JG2,25mm^2,M6,Tin Plating,For the device.
OEM
Cable Electronic|Electric Cable,450V/750V,60227 -

type IEC 02(RV),25mm^2,Yellow/Green,
112A,CCC,CE
Table 14-8 Technical specifications of the DPD125-12-24 ground cable
Item Specifications Remarks
PGND Termi Naked Crimping Terminal,JG, It is connected to

cable nal 50mm^2,M10,Tin Plating the ground bar.
Naked Crimping Connector,JG, It is connected to

50mm^2,M8,200A,Tin plating the DPD125-12-24.
Cable Electronic|Electric Cable,450V/750V,60227 -

type IEC 02(RV),50mm^2,Yellow/Green,
209A,CCC,CE
14.3 Console Cable

This section describes the structure and technical specifications of the Console cable.
14.3.1 Introduction to the Console Cable

The Console cable is used to connect the CX6608&CX6620 Console port to the serial port of
the Console device to transmit device configuration data.
The Console cable is an 8-core shielded cable. One end of the cable uses an RJ45 connector to
connect to the Console port of the MPU. The other end has two connectors, a DB9 and DB25
female. Choose the appropriate one to plug into the computer's serial port.
14.3.2 Structure
The Console cable is shown in Figure 14-16 and the pin assignments are shown in Table
14-9.

Figure 14-16 Console cable
1. Direction A 2. DB9 female 3. Label 4. Network interface RJ45
5. Direction B W communication cable
Table 14-9 Pin assignments of the Console cable

RJ45 Direction DB9 Signal
1 ---> 8 CTS (Clear to Send)
2 ---> 6 DSR (Data Set Ready)
3 ---> 2 RXD (Receive Data)
4 — 5 GND
5 — 5 GND
6 <--- 3 TXD(Transmit Data)
7 <--- 4 DTR (Data Terminal Ready)
8 <--- 7 RTS (Request to Send)


Table 14-10 lists the technical specifications of the Console cable.
Table 14-10 Technical specifications of the Console cable
Item Description
Connector Cable connector-D style-9PIN-female

X1
Connector Network interface connector-crystal connector-8PIN-8bit-shielded plug

X2
Cable type Twisted-Pair Cable,UL2464,0.32mm,28AWG,2 Pairs,PANTONE WARM

GRAY 1U,for OEM
Number of 4
cores
Fireproof VW-1
level
Available 3m
length
14.4 Clock Cable

This section describes the structure and technical specifications of the clock cable.
14.4.1 Introduction to the Clock Cable

The clock cable is used to connect the CX6608&CX6620 to the clock interface on the
external equipment. With this cable, the CX6608&CX6620 can receive two channels of 2.048
MHz or 2.048 Mbit/s synchronous clocks provided by the upstream device. It can also
provide two channels of 2.048 MHz or 2.048 Mbit/s synchronous clock signals for the
downstream device.
One end of the clock cable uses an SMB connector to connect to the clock interface on the
MPU, and the other end is connected to the external clock equipment. The connector must be
manufactured based on the actual situation.
NOTE
The wire sequence of the relay cable used as a clock cable is different from that used as a common
Ethernet cable.
14.4.2 Structure
120-ohm Relay Cable

Figure 14-17 shows the structure of the 120-ohm relay cable with an RJ45 connector.

Figure 14-17 Structure of the 120-ohm relay cable
Table 14-11 shows the pin assignments of the 120-ohm relay cable.
Table 14-11 Pin assignments of the 120-ohm relay cable

Connector X1 Connector X2 Mapping
X1.5 X2.2 Pair
X1.4 X2.1
X1.2 X2.5 Pair
X1.1 X2.4
X1.3 X2.6 -
X1.6 X2.3 -

Table 14-12 lists the technical specifications of the 120-ohm relay cable.
Table 14-12 Technical specifications of the 120-ohm relay cable

Item Description
120- Connector Network interface connector-8 PIN-8 bit-shielded-crystal

ohm model plug
cable
Cable type Cable,120ohm,1E1,0.4mm,MP8-II,
120CC4P0.4P430U(S),MP8-II,Expert 2.0
Available length 3 m (9.84 ft.), 15 m (49.21 ft.), 30 m (98.42 ft.), 60 m

(196.85 ft.), and 80 m(262.46 ft.)
14.5 Ethernet Cable

Ethernet cables are classified into two types: straight-through cables and crossover cables.
14.5.1 Introduction
Ethernet cable is of two types: the straight-through cable and the crossover cable.

Straight-through Cable
The straight-through cable is used to connect the Ethernet interfaces between the following
devices:
l A router device and a hub
l A router device and an Ethernet switch
l A computer and an Ethernet switch
l A computer and a hub
Crossover Cable
The crossover cable is used to connect the Ethernet interfaces between the following devices:
l A router device and a router device
l A router device and a computer
l A hub and a hub
l A hub and a switch
l A switch and a switch
l A computer and a computer
14.5.2 Structure
As shown in Figure 14-18, the straight-through cable and the crossover cable are standard
shielded network cables and, adopt an RJ45 connector shown in Figure 14-19.
Figure 14-18 Network cable

1. Connector - RJ45 2. Label 1 3. Main label 4. Label 2
Figure 14-19 RJ45 connector
Table 14-13 and Table 14-14 show the pin assignments of the straight-through cable and the
crossover cable respectively.
Table 14-13 Pin assignments of the straight-through cable
Connector X1 Connector X2 Color Relationship
X1.2 X2.2 Orange Twisted
X1.1 X2.1 White/orange
X1.6 X2.6 Green Twisted
X1.3 X2.3 White/green
X1.4 X2.4 Blue Twisted
X1.5 X2.5 White/blue
X1.8 X2.8 Brown Twisted
X1.7 X2.7 White/brown

Table 14-14 Pin assignments of the crossover cable
Connector X1 Connector X2 Color Relationship
X1.6 X2.2 Orange Twisted
X1.3 X2.1 White/orange
X1.2 X2.6 Green Twisted
X1.1 X2.3 White/green
X1.4 X2.4 Blue Twisted
X1.5 X2.5 White/blue
X1.8 X2.8 Brown Twisted
X1.7 X2.7 White/brown
Table 14-15 and Table 14-16 show the technical specifications of the straight-through cable
and crossover cable respectively.
Table 14-15 Technical specifications of the straight-through cable
Item Description
Connector X1/X2 Network port connector-crystal connector-8PIN-8bit-shield-

plug-24-26AWG-CAT 6/SFTP network cable
Cable type Communication cable-100±15ohm-shielded enhanced 5 types-

CAT5E SFTP 24AWG-8 core PANTONE 445U
Number of cores 8
Fireproof class CM
Available length 5 m (16.40 ft), 10 m (32.81 ft), 20 m (65.62 ft), and 30 m (98.42 ft)
Table 14-16 Technical specifications of the crossover cable
Item Description
Connector X1/X2 Network port connector-crystal connector-8PIN-8bit-shield-

plug-24~26AWG-CAT 6/SFTP network cable
Cable type Communication cable-100±15ohm-shielded enhanced 5 types-

CAT5E SFTP 24AWG-8 core PANTONE 646U
Number of cores 8

Item Description
Fireproof class CM
Available length 5 m (16.40 ft) and 30 m (98.42 ft)
14.6 Fiber
This section describes the structure and technical specifications of the fiber.
14.6.1 Introduction to the Fiber

Table 14-17 shows the types of fibers that the CX6608&CX6620 uses.
Table 14-17 Types of optical fibers

Num Cable and Use Local Remote Cable Mode
ber Connector Connector
1 Fiber connecting the LC/PC FC/PC Single-mode

local interface board to
the ODF
2 Fiber connecting the LC/PC LC/PC Single-mode/

local interface boards multi-mode
3 Fiber connecting the LC/PC LC/PC Single-mode/

local interface board to multi-mode
the other equipment
4 Fiber connecting the MPO/PC MPO/PC Multi-mode

local interface boards
NOTE
The optical transmission module of the multi-transverse mode needs to be connected to the multi-mode
fiber. The optical transmitting module of the single-longitudinal mode or multi-longitudinal mode needs
to be connected to the single-mode fiber.
The connectors at both ends are LC/PC-LC/PC, LC/PC-FC/PC, or FC/PC-SC/PC single-mode

fibers. Multi-core fibers (each with a total of eight cores that can be split into single fibers)
can be used on CX6608&CX6620s to increase the fiber placement efficiency.
Figure 14-20 shows the appearance of multi-core fibers.

Figure 14-20 Appearance of a multi-core fiber
When using multi-core fibers, pay attention to the following points:

l Split each multi-core fiber inside the cabinet into different single-core fibers at the cable
inlet.
l When splitting a multi-core fiber, hold both sides of the fiber with your hands and
gradually tear the fiber with force. Do not over-bend the fiber or tear the fiber from any
intermediate core.

l The eight fibers split from the same multi-core fiber can be installed on different boards.
However, installing the eight fibers in both the upper and lower chassis in the same
cabinet is not recommended.
14.6.2 Structure
The CX6608&CX6620 uses the following types of optical connectors:
l LC/PC and SC/PC optical connector
l FC/PC optical connector
l MPO/PC optical connector
The outlines of connectors as well as a brief description of how to plug and unplug them are
described in the following part.
LC/PC and SC/PC Optical Connector

Figure 14-21 shows the outline of the LC/PC optical connector.
Figure 14-21 LC/PC optical connector
Figure 14-22 shows the outline of the SC/PC optical connector.

Figure 14-22 SC/PC optical connector
FC/PC Optical Connector

Figure 14-23 shows the outline of the FC/PC optical connector.
Figure 14-23 FC/PC optical connector

The operation procedures and precautions are as follows:
l To insert, carefully align the head of the fiber jumper with the optical interface and push
in the fiber using appropriate force. After inserting the fiber, turn the screw clockwise to
secure the optical fiber.
l To remove, turn the screw anticlockwise, and pull the optical fiber out when the screw is
loose.
MPO/PC Optical Connector

Figure 14-24 shows the outline of the MPO/PC optical connector.
Figure 14-24 MPO/PC optical connector
The plugging/unplugging of MPO/PC optical interfaces only needs an axial operation, that is,
a push/pull in line with the cable, instead of a rotation. The operation procedures and
precautions are as follows:
l To insert, carefully align the head of the fiber jumper with the optical interface and push
in the fiber using appropriate force.
l To remove, press the clip and slightly push in the fiber connector, and then pull it out.

Table 14-18 and Table 14-19 show the technical specifications of the optical fiber.

Table 14-18 Technical specifications of the optical fiber

Item Description
Fiber Single-mode or multi-mode

transmission
mode
Fiber connector 1 LC/PC
Fiber connector 2 LC/PC, SC/PC, and FC/PC
Fiber outer 2 mm (0.08 in.)

diameter
Table 14-19 Technical specifications of the MPO optical fiber

Item Description
Fiber Multi-mode
transmission
mode
Fiber connector 1 MPO/PC
Fiber connector 2 MPO/PC
Fiber outer 3.5mm (0.14 in.) (8 cores) / 5.6mm (0.22 in.) (24 cores)
diameter

CX6600 V800R010C10SPC500 Hardware Description

Uploaded by

Copyright:

Available Formats

You might also like

CX6600 V800R010C10SPC500 Hardware Description

Uploaded by

Document Information

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

CX6600 V800R010C10SPC500 Hardware Description

Uploaded by

Copyright:

Available Formats

HUAWEI CX6608&CX6620 Metro Fabric Router

HUAWEI TECHNOLOGIES CO., LTD.

Trademarks and Permissions

Huawei Technologies Co., Ltd.

Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. i

1 About This Document.................................................................................................................. 1

Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. ii

Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. iii

11 Optical Module........................................................................................................................ 139

12 DPD125-12-24 DC Power Distribution Box........................................................................164

13 Fiber Breakout.......................................................................................................................... 173

Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. iv

Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. v

1 About This Document

Product Name Version

CX6608&CX6620 Series V800R010C10

Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. 1

Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. 2

Indicates an imminently hazardous situation which, if not

Indicates a potentially hazardous situation which, if not

Indicates a potentially hazardous situation which, if not

Indicates a potentially hazardous situation which, if not

Calls attention to important information, best practices and

Device Dimension Conventions

Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. 3

2 Using the Hardware Tool

This section describes how to use hardware query tool.

Hardware Query Tool

Figure 2-1 Window of the hardware query tool

Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. 4

Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. 5

Item CX6608 CX6620

Dimensions (H x W 1016 mm x 442 mm x 945 mm 2200 mm x 600 mm x 1000 mm

Weight (empty) 159 kg (350.5 lb) 231 kg (509.3 lb)

Weight (integrated 181 kg (339.0 lb) 380 kg (837.8 lb)

Cabinet installation Can be installed in an 1000 mm- The CX6620 chassis is

Typical power 7.97kW (2 MPU + 8 SFU + 8 18.526KW (2 MPU + 8 SFU

Typical heat 25858.0BTU (2 MPU + 8 SFU 60106.1BTU/hour (2 MPU + 8

MTBF 12.12 years 12.12 years

MTTR 0.5 hours 0.5 hours

Availability 99.999% 99.999%

Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. 6

Item CX6608 CX6620

Redundant MPUs 1:1 1:1

Redundant Switch 7+1 7+1

Forwarding 5120 Mpps(LPUI-1T) 12800 Mpps(LPUI-1T)

Switching capacity 83.78 Tbps 209.45 Tbps

Operating l Long-term: 0 °C to 40 °C l Long-term: 0 °C to 40 °C

Storage -40 °C to 70 °C (-40°F to 158°F) -40 °C to 70 °C (-40°F to 158°F)

Relative storage 5% to 95% RH, non-condensing 5% to 95% RH, non-condensing

Long-term ≤ 4000 m (If the altitude is ≤ 4000 m (If the altitude is

Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. 7

Issue 01 (2018-12-05) Copyright © Huawei Technologies Co., Ltd. 8

Table 5-1 Mapping products and versions

03057984 CX6D0MPUN1 10.2.1 Main - ●

03057983 CX6D0MPUP1 10.2.2 Main ● -

03057982 CX6DSFUIT4 10.3.1 4Tbps - ●

03057981 CX6DSFUIT4 10.3.2 4Tbps ● -

02312AGK CX6P01TRTU 10.5.1 CX6600 ● ●