Confidential

Machine to Machine Identity Modules

Full-M2M Quad
Marketing Product Overview

Last update : June 2014

www.gemalto.com
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Table of Contents

1. OVERVIEW .............................................................................................. 4

2. PHYSICAL CHARACTERISTICS ............................................................ 4

3. SECURITY ............................................................................................... 4

4. SOLDERING PROFILE ........................................................................... 4

5. STANDARDS COMPLIANCY .................................................................. 5

5.1. Standards related to physical, electrical and logical characteristics ..................... 5
5.2. Standards related to reliability ............................................................................. 5
5.3. Standards related to advanced features .............................................................. 5

6. M2M ENVIRONMENTAL CLASSES ....................................................... 6

7. PACKAGE, PACKAGING AND PERSONALIZATION ........................... 7

7.1. Graphical personalization ..................................................................................... 7
7.1. Package dimensions ............................................................................................. 7
7.2. Pin outline ............................................................................................................ 7
7.3. PCB layout example.............................................................................................. 8
7.4. Handling & Packing .............................................................................................. 8

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This specification is being provided to you strictly for informational purposes

solely for the purpose of M2M card specifications.
This specification is proprietary to Gemalto. Gemalto reserves the right to
withdraw, modify, or replace the specification at any time, without notice.
THE SPECIFICATION IS "AS IS", "WITH ALL FAULTS" AND GEMALTO
MAKES NO WARRANTIES AND DISCLAIMS ALL WARRANTIES,
EXPRESSED OR IMPLIED, OR STATUTORY RELATED TO THE
SPECIFICATIONS. GEMALTO IS NOT LIABLE FOR ANY
INCOMPLETENESSOR INACCURACIES. GEMALTO IS NOT LIABLE FOR
ANY CONSEQUENTIAL, INCIDENTAL OR INDIRECT DAMAGES
RELATING TO THE SPECIFICATIONS OR THEIR USE.
GEMALTO ALSO MAKES NO REPRESENTATIONS OR WARRANTIES AS TO:
(A) THE VALIDITY OR SCOPE OF ANY INTELLECTUAL PROPERTY THAT
MAY BE EMBODIED IN THE SPECIFICATION; (B) INFRINGEMENT OF ANY
PATENT OR COPYRIGHT BY THE SPECIFICATION OR THEIR USE; (C)
WHETHER THE SPECIFICATION MAY BE LEGALLY USED IN ALL
COUNTRIES THROUGHOUT THE WORLD.
TO THE EXTENT TRADEMARKS, BRAND AND/OR PRODUCT NAMES
APPEAR IN THE SPECIFICATION, THEY ARE THE SOLE PROPERTY OF
THEIR RESPECTIVE OWNERS. ALL RIGHTS RESERVED

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1. Overview
Full
M2M Quad is a Machine Identity Module (MIM) specifically designed for
M2M applications. The FullM2M Quad MIM combines traditional
smart card security and telecom features, a tailored OS for an
extended lifespan, and a robust & reliable silicon, embedded
into a standardized SMD package (MFF2).

2. Physical characteristics
Packaging ETSI MFF2 (also known as DFN8 / SON8 / VQFN-8)
Package size 6 mm x 5 mm (compliant with ETSI TS 102.671)
Robustness ETSI TS 102.671 + extended Jedec tests set
Classification RoHS, REACH
Operating temperature -40°C to + 105°C
Storage temperature -40°C to + 125°C
Networks compliancy 2G/3G/LTE
Supply Voltage Supply voltage ISO class A (5V), B (3V) & C (1.8V)
Communication ISO T=0, default speed: 223 200 bds, max. speed:
protocol 446 400 bds
OS features Javacard, eXtended-Life *, eUICC **
Available EEPROM sizes 64k, 110k, 128k (eUICC) or 200k (LTE version)
Hotspots cycling * 16M updates with XL-V1, >16M updates for XL-V2

* eXtended-Life operating system is a Gemalto’s M2M specific operating

system especially designed to maximize the lifespan of the memory chip,
making it more resistant to stress (erase/write cycles) and allowing to
have a very high level of reliability on the field. See also chapter 6

** eUICC is a new feature being implemented in Gemalto products.

eUICC transforms the traditional UICC into a Multiple Independant
Profile Areas UICC (MIPA concept) where different profiles from
different MNOs can securely cohabit in the same chip and can
remotely be administrated (download, activation, deletion).

3. Security
Authentication algorithms Comp128-v1, v2, v3, v4. Milenage
Symmetric algorithms DES, 3DES, AES
Hashing functions SHA-1, MD5
Single power attacks (SPA)
SW & HW Counter-measures Differential power attacks (DPA)
Fault attacks (FA)

4. Soldering Profile
 MSL3 package (Jedec J-STD-020)
 Ni/Pd/Au/Ag µPPF plating
 Package classification reflow temperature: 260°C

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5. Standards compliancy
5.1. Standards related to physical, electrical and logical characteristics
ETSI TS 102.671 Machine-to-machine UICC; Physical and logical characteristics
ETSI TS 102.221 UICC-Terminal interface : Physical and logical characteristics
ISO 7816 Integrated circuit(s) cards with contacts
ISO 7816-1 Physical characteristics.
ISO 7816-3 Electronic signals and transmission protocols
ISO 7816-4 Organization, Security and commands for interchange
Moisture/Reflow Sensitivity Classification for Non-hermetic Solid
Jedec J-STD020
State Surface Mount Devices

5.2. Standards related to reliability

ETSI TS 102.671 Machine-to-machine UICC; Physical and logical characteristics

Jedec JESD22-A101
Jedec JESD22-A103
Jedec JESD22-A104
Jedec JESD22-A113
Jedec JESD22-A114
Jedec JESD22-A117
Jedec JESD22-B103
Jedec JESD22-B104
Jedec JESD22-C101
Temperature Humidity Bias Life Test
High temperature storage
Temperature cycling
Preconditioning of Non-hermetic Surface Mount Devices prior to
Reliability Testing
Electrostatic Discharge (ESD) – Human Body Model
NVM Endurance
Vibration, variable frequency
Mechanical shock
Electrostatic Discharge (ESD) – Charged Device Model

5.3. Standards related to advanced features

Following list is not exhaustive
Java Card Java Card™ 2.2.1 API Specification.
Java Card™ 2.2.1 Runtime Environment Specification.
Java Card™ 2.2.1 Virtual Machine Architecture Specification.
Global Platform GP 2.1.1 + GP 2.2 amendment B (http) for LTE products
ETSI TS 102.127 Transport protocol for CAT applications Stage 2
ETSI TS 102.223 Smart cards; Card Application Toolkit (CAT)
ETSI TS 102.241 UICC Application Programming Interface for Java Card™
3GPP TS 23.040 Technical realization of Short Message Service (SMS) Point-To-Point

3GPP TS 23.041 Technical realization of Short Message Service (SMS) Cell Broadcast

3GPP TS 23.048 Security Mechanisms for the SIM application toolkit; Stage 2
3GPP TS 31.101 UICC-Terminal Interface; Physical and Logical Characteristics
3GPP TS 31.102 Characteristics of the USIM Application
3GPP TS 31.111 USIM Application Toolkit (USAT)
3GPP TS 43.019 Specification of the SIM Application Programming Interface For Java Card
3GPP TS 51.011 Specification of the Subscriber Identity Module – Mobile Equipment (SIM-
ME) interface
3GPP TS 51.014 Specification of the SIM Application Toolkit for the Subscriber Identity
Module - Mobile Equipment (SIM ME) interface

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6. M2M Environmental Classes

TS 102.671 specification describes environmental classes a M2M UICC can support,
the following table gives an indication of the product compliancy to environmental
classes defined in TS 102.671 .
Full
M2M Quad
Physical characteristics TS 102.671 MFF2
T Operational and storage temperature Jedec JESD22-A104 TB
M Moisture/Reflow conditions Jedec J-STD 020 MA
H Humidity TS 102.221 / Jedec A101 HA
C Corrosion Jedec JESD22-A107 CC
V Vibration Jedec JESD22-B103 VA
S Shock Jedec JESD22-B104 SA
R Data Retention time TS 102.671 RA
2)
U Minimum Updates TS 102.671 > UC
note 2) : M2M eXtended-Life Operating System offers 1 Billion memory cycles dynamically distributed between
hostpot, resulting on several tens of millions updates possible on hotspot files, but also an important number of
updates on any other data, if necessary, as the distribution is dynamic

TS -25 to +85°C VA 20G, 20..2000Hz (Automotive vibration as per AEC-Q100)

TA -40 to +85°C SA 1500G (Automotive shock as per AEC-Q100)
TB -40 to +105°C RA 10 years
TC -40 to +125°C RB 12 years
MA 260°C; MS Level 3 RC 15 years
HA 85°C; 85% humidity; 1000h with bias UA 100k updates
CA Salt atmosphere at 35°C, 24h UB 500k updates
CB Salt atmosphere at 35°C, 48h UC 1M updates
CC Salt atmosphere at 35°C, 96h
CD Salt atmosphere at 35°C, 240h

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7. Package, Packaging and Personalization

7.1. Graphical personalization

Gemalto proposes to personalize characters thanks to laser technology on the

top of the FullM2M Quad package.

First line is reserved for silicon provider traceability

2 lines of 10 characters maximum for customer personalization

We strongly recommend printing a visual identifier (ICCID for
example).

1 line for MNO identifier (TRIGRAM).

7.1. Package dimensions

Package dimensions are compliant with ETSI TS 102.671 MFF2

Parameter Dimension (mm)

E 6,00 +/- 0.15
D 5,00 +/- 0.15
L 0,6 +/- 0.15
b 0,4 +/- 0.10
E2 3,40 +/- 0.15
D2 4,20 +/- 0.15
1,27
e for tolerances see
parameters bbb and ddd
The tolerance that controls the position of the
contact pattern with respect to the horizontal
package centreline. The centre of the tolerance
bbb zone for each contact is defined by basic
dimension e as related to the horizontal package
centreline.
The tolerance that controls the position of the
ccc contacts to each other. The centres of the profile
zones are defined by basic dimension e.

7.2. Pin outline

Pin configuration is compliant with MFF2 ETSI specifications (M2M UICC -
TS102.671).Cx is the corresponding contact reference on SIM module.
Pin #01(C5) = VSS
Pin #03 (C7) = I/O
Pin #06 (C3) = CLK
Pin #07 (C2) = RST
Pin #08 (C1) = VDD

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7.3. PCB layout example

7.4. Handling & Packing

 Package outline according to JEDEC MO-220

 Moisture sensitivity characterization: MSL level 3 (168h after bag
opening) with 220°C peak temperature
Volumes are delivered in tape-reel packing. Nevertheless, Gemalto is able to
deliver small quantities (less than 500 units) in tray packing.

Tape reel (small) Tape reel (big) Tray

1000 pces 3000 pce 490 pces
180mm 330mm 136x319mm

Reels (or trays) are packaged in anti-static moisture-barrier bags, vacuum

sealed and including 2 drying desiccant bags and a humidity indicator.

According to MSL3, once bags are sealed in Gemalto premises, they can be
kept a maximum of 12 months (at max 40°C/90%RH) before being opened,
and once opened, the parts has to be soldered in maximum 168h.

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