PCB Design Standards:

Comprehensive Guide to the IPC-2220

Family

Fahmi FERJANI
R&D Mechatronics Engineer
Introduction:

IPC-2221 is a standard published by the Association of Connecting Electronics Industries (IPC) that
offers comprehensive guidelines for the design of printed circuit boards (PCBs). Widely
acknowledged in the electronics industry, this standard serves as a reference for engineers and PCB
designers.

IPC-2221 encompasses numerous aspects of PCB design, including board thickness, layer count, trace
width and spacing, hole size, placement, creepage clearance, voltage clearance, insulation
requirements, and solder mask requirements. It also covers design considerations for compatibility
with automated assembly equipment and provides recommendations for testing and inspecting
completed boards.

Key Functions of IPC-2221:

 Guidance for Specific Applications: IPC-2221 provides design guidelines tailored to specific
applications, with various classes for different levels of requirements. For instance, IPC-2221
class 3 represents the most stringent level of PCB design requirements, suitable for aerospace,
military, and medical applications. By adhering to these guidelines, designers can ensure their
PCB designs meet application-specific requirements.
 Trace Width and Current Capacity: The standard offers guidance on trace width, clearance,
and current carrying capacity. This is crucial for determining appropriate trace dimensions,
spacing, and current handling capabilities, helping to prevent issues such as signal interference
and overheating.
 Spacing and Voltage Requirements: IPC-2221 includes guidelines for spacing and voltage
requirements to ensure safety and reliability. This helps prevent damage from high voltage or
excessive current.
 Component Placement: The standard provides recommendations on the placement of
integrated circuit components on PCBs, covering spacing, orientation, and overall layout.
 Thermal Management: IPC-2221 offers advice on managing a PCB's thermal performance,
including the use of heat sinks, strategic component placement to minimize heat buildup, and
thermal vias for heat dissipation.
 Material Selection: Guidance is provided on selecting materials for PCBs, including
recommendations on using specific materials in different applications, such as copper,
dielectric materials, and solder mask materials.
 Manufacturing Processes: IPC-2221 includes guidance on manufacturing processes for PCB
fabrication, such as surface mount technology (SMT), through-hole technology (THT), and
specialized manufacturing techniques for high-reliability applications.

Benefits of IPC-2221:
 Standards Compliance: Adhering to IPC-2221 helps ensure PCBs meet industry standards
for reliability and performance, reducing the risk of errors, defects, costly rework, or product
failure.
  Streamlined Communication: The standard facilitates effective communication and
collaboration among designers, manufacturers, and other stakeholders in the PCB supply
chain, streamlining design and production processes.

I- IPC-2221 Series Documents and their Application:

1-hierarchy:
The IPC-2221 standard and IPC-2222, IPC-2223, IPC-2224, IPC-2225 and IPC-2226 belong
to the IPC-2220 series. These documents provide guidelines and requirements for printed
circuit board (PCB) design. Below, we summarize the structure of each document, their
application, and the relationships among them.

IPC-2220: Standard for Printed Board Design:

IPC-2220 serves as a comprehensive standard for PCB design, encompassing all key aspects
such as design processes, component selection, layout, and fabrication. The standard guides
PCB designers, manufacturers, and assemblers in creating reliable PCBs that adhere to the
required specifications.

IPC-2221: PCB Design Guidelines:

IPC-2221 offers guidance and requirements for a wide range of PCB designs, including
single-sided, double-sided, and multilayer PCBs, as well as flex, rigid-flex, high-speed, and
high-frequency PCBs. This standard is used to ensure PCBs are designed according to
appropriate specifications and standards.
IPC-2222: Standard for Rigid Organic Printed Boards Design:
IPC-2222 is a standard providing guidelines for designing rigid organic printed boards. It
covers single-sided, double-sided, multilayer, and high-density interconnect (HDI) boards.
The document assists PCB designers, manufacturers, and assemblers in achieving reliable,
specification-compliant rigid organic printed boards. It specifies rules for component
placement, routing density, and optimal electrical performance. It complements IPC-2221 by
addressing standards for:

 Holes and interconnections

 Dielectric spacing
 Material selection
 Routing parameters
 Board thickness tolerance
 Mechanical specifications

IPC-2223: Standard for Flexible Printed Boards Design:

IPC-2223 provides guidelines for designing flexible printed boards, including single-sided,
double-sided, multilayer, and rigid-flex boards. The document aids PCB designers,
manufacturers, and assemblers in creating flexible printed boards that meet specifications and
are reliable. It outlines key design considerations such as:

 Material selection and construction

 Selective plating
 Minimum bend radius
 Controlled impedance
 Unsupported edge conductor design
 Via filling
 Pad placement

IPC-2224: Standard for Organic Multichip Modules (MCM-L) Design:

IPC-2224 outlines guidelines for designing organic multichip modules (MCM-L), including
the design process, layout, fabrication, and assembly. It helps PCB designers, manufacturers,
and assemblers ensure that MCM-Ls meet specifications and maintain reliability. This
standard guides the design of PC cards and the placement of passive and active components,
including through-hole, fine-pitch BGAs, unpackaged bare die, array mount, and surface
mount devices. It addresses performance in physical, thermal, and electrical aspects for
different board types:

 Type I: Single-sided circuit board

 Type II: Double-sided circuit board
 Type III: Multilayer board without blind or buried vias
 Type IV: Multilayer board with blind or buried vias
 Type V: Multilayer metal core board without blind or buried vias
 Type VI: Multilayer board with metal core and blind or buried vias

IPC-2225: Standard for Organic Land Grid Array (LGA) Design:

IPC-2225 sets guidelines for designing organic land grid array (LGA) packages. Covering the
design process, layout, fabrication, and assembly, it assists PCB designers, manufacturers, and
assemblers in ensuring reliable LGAs that meet required specifications. The standard focuses
on design and assembly aspects of bare chips on substrates, including information on
adhesives, die attachment, and microvia materials.

IPC-2226: Standard for High Density Interconnect (HDI) Boards Design:

IPC-2226 provides guidelines for the design of high density interconnect (HDI) boards,
covering design process, layout, fabrication, and assembly. This standard helps PCB
designers, manufacturers, and assemblers ensure HDI boards meet required specifications and
achieve reliability. The standard addresses design considerations for HDI structures, including
power, ground, signal, and combined layer details, as well as dielectric separation and via
formation.

HDI boards are classified into six categories based on circuit layer count, location, and
connection to the substrate:

 Type I (1 [C] 0 and 1 [C] 1): Through vias connecting outer layers.
 Type II (1 [C] 0 or 1 [C] 1): Buried vias in the core with potential through vias
connecting outer layers.
 Type III (≥2 [C] ≥0): Core may contain buried or through vias connecting outer layers.
 Type IV (≥1 [P] ≥0): Passive substrate without electrical connection.
 Type V: Structures without a core.
 Type VI: Other configurations.

The IPC-2221 standard is interrelated and complements the IPC-2222, IPC-2223, IPC-2224,
IPC-2225, and IPC-2226 documents. By understanding the specific needs of your application,
you can select the most suitable IPC design standard to guide your project effectively.

2- IPC-2221B in High-Voltage Design:

IPC-2221B provides essential design requirements for high-voltage PCBs, particularly
addressing conductor clearances. This aims to manage the risk of dielectric or corona
breakdown and anodic filamentation (also known as dendritic growth). Proper spacing,
material selection, and cleanliness can help prevent or suppress these risks.

IPC-2221 outlines the minimum conductor spacing required as a function of voltage between
conductors, with specific values for peak DC or AC voltage up to 500V. For voltages above
500V, additional per-volt clearance values calculate the minimum conductor spacing.

3- IPC-9592B Standard on Power Conversion Devices:

IPC-9592B outlines requirements for power conversion devices and aligns with IPC-2221's
conductor spacing guidelines. The standard sets minimum trace spacing values based on peak
voltage, scaling spacing values with voltages below the 500V limit.

Pre-programmed online calculators can help determine these spacing values, allowing you to
integrate them into design rules. Different nets operating at various voltages can be adjusted
accordingly within the design rules, especially when a dense design requires closer spacing
between nets.
4- Failure in Metal Migration:

Among the spacing values for the electrical conductor defined in the IPC-2221, there are
some requirements that help in preventing failure in metal migration. When we talk of metal
migration, it is regarded as one of the failure mechanisms for the high voltage designs having
a high density for the conductors.

Furthermore, whenever the two conductors have a great and high potential, the metallic
dendrites’ electrochemical growth can happen whenever the conductors contains some
residues having water-soluble salts.

The metallic dendrites have the ability to short out the two points on the high density printed
circuit board (PCB). Actually, this is an effect of the electric field, this describes why a
minimum spacing requirement exists; increasing all the spacing present in-between the
conductors for a specific potential difference aids in reducing the field in-between the
conductors. This inhibits any dendrite growth.

II- IPC-2221 clearance standards defined for production:

1- Common clearance table:
IPC-2221 outlines a shared clearance table that specifies the minimum required distances
between conductive elements for different voltage levels and environmental conditions. These
clearances are critical to prevent arcing and electrical breakdown on the PCB. The table
includes minimum distances for air gaps, creepage, and clearance between conductors on the
same and adjacent layers.

Gap distance is measured in air between two conductors or solder joints. Creepage, on the
other hand, refers to the distance along the PCB's surface between two conductive elements,
which is crucial for ensuring electrical safety, particularly in high-voltage applications. IPC-
2221 sets the necessary creepage distances based on various factors, such as voltage levels,
pollution degree, and PCB material.

Feature Clearance Requirement

Test probe sites 80% of component height (minimum 0.6 mm, maximum 5 mm)
Component leads 0.13 mm clearance (up to 50V)
Uncoated
conducting areas Maintain a clearance of 0.75 mm
PTH relief in heat Ensure 2.5 mm clearance beyond hole size (includes electrical
sink clearance and misregistration tolerance)
Mounting hardware Hardware should not extend more than 6.4 mm below PCB surface

The following table provides the clearance and dam values for different types of solder masks
according to the IPC-2221 standard:
 Mask Type Clearance Dam
Liquid Photoimageable (LPI) 0.051 mm 0.1 mm
Liquid Screenable 0.25 mm 0.25 mm
Dry Film Photoimageable (≤0.0635 mm) 0.051 mm 0.127 mm
Dry Film Photoimageable (0.066-0.1 mm) 0.051 mm 0.25 mm

2-PCB Track Thickness :

Printed IPC circuit boards (PCBs) serve as the foundation of modern electronics and consist
of a layer of copper traces on a substrate material. The thickness of the copper traces on a
PCB is crucial for the board's reliability and performance.
The thickness of PCB traces is measured in ounces (oz), indicating the weight of copper per
square foot of the board. For instance, a 1 oz PCB features a thickness of 1.4 mils (0.0356
mm), while a 2 oz PCB has a thickness of 2.8 mils (0.0711 mm).

Determining the appropriate thickness of PCB traces depends on factors such as current
capacity, voltage drop, and required impedance. For more in-depth information, you can
access a detailed PCB traces guide.

IPC-2221 provides specific guidelines for calculating the width and height of conductive
traces on a PCB. These dimensions are essential for establishing the current carrying capacity
and resistance of the conductive elements. IPC-2221 offers a formula for calculating the
necessary trace width based on current capacity, ambient temperature, and copper weight,
ensuring the trace can carry the required current without overheating or significant voltage
drop.

The formula is as follows:

Width [mil] = Area [mil²] / (Thickness [oz] × 1.378 [mil/oz])

In conclusion, IPC-2221 outlines critical clearance standards for PCB manufacturing,
including a common clearance table for minimum clearance distances, creepage requirements
for different voltage levels and environments, and guidance on calculating trace width and
height. By adhering to these guidelines, PCB designers and manufacturers can create safe and
reliable products suited to their intended applications.

III- Selecting PCB Materials According to IPC 2221 Standard:

Selecting suitable materials is a crucial part of printed circuit board (PCB) design. The IPC
2221 standard offers a framework for choosing PCB materials based on their key attributes
and properties.

When deciding on materials for PCB design, consider the following aspects:

• Dielectric Constant:
This measures a material’s ability to store electrical energy within an electric field. For high-
frequency applications, a low dielectric constant is preferred, whereas a higher dielectric
constant is suitable for lower frequency uses.
• Thermal Conductivity:

This indicates how effectively a material can dissipate heat. High thermal conductivity is
beneficial for applications that produce significant heat.

• Tensile Strength:
This represents the maximum stress a material can withstand without fracturing. High tensile
strength is essential for applications requiring mechanical stability and longevity.

• Coefficient of Thermal Expansion (CTE):

This measures the extent to which a material expands or contracts with temperature changes.
A low CTE helps minimize mechanical stress on the PCB.

• Moisture Absorption:

High moisture absorption can impact a material’s dielectric constant and other properties.
Low moisture absorption is preferred to maintain PCB stability.

Based on these attributes, IPC 2221 recommends several materials for different applications:
• FR-4: A versatile and cost-effective material with good electrical and mechanical properties,
suitable for various applications including high-frequency circuits.

• Polyimide: A high-temperature material with excellent electrical properties and high

reliability, ideal for demanding applications requiring stability.

• PTFE: A low-loss material with outstanding electrical properties and high-temperature

tolerance, commonly used in high-frequency and microwave applications.
• Ceramic: Known for high thermal conductivity and efficient heat dissipation, ceramic
materials are suitable for heat-intensive applications like power electronics.
Protective Coatings:

• Organic Coatings: These include acrylics, epoxies, and polyurethanes. Acrylics offer
excellent electrical insulation and resistance to moisture and chemicals. Epoxies provide
mechanical protection and heat resistance. Polyurethanes are flexible and suitable for
environments with vibration or movement.

• Semiconductive Coatings: The thickness of these coatings is critical for conductivity levels.
An overly thick coating can impair electrical properties, while a too-thin one may not offer
sufficient ESD protection.
selecting materials for PCB design requires careful consideration of characteristics like
dielectric constant, thermal conductivity, tensile strength, CTE, and moisture absorption.
Choosing the appropriate materials allows designers and manufacturers to create PCBs that
fulfill the specific electrical, mechanical, and thermal requirements of their applications.
IV- IPC-2221 Recommendations for Insulation Resistance:
Insulation resistance is an important consideration in the design and manufacturing of printed
circuit boards (PCBs). It is a measure of the ability of the PCB’s insulation to prevent current
leakage between different conductive elements, and is critical to ensuring the safe and reliable
operation of electronic devices.

The IPC-2221 standard outlines the necessary minimum insulation resistance for PCBs,
determined by the operating voltage and environmental conditions of the application. It
categorizes applications into various IPC PCB classes based on factors such as voltage levels,
pollution degree, and ambient temperature. Each class has specific minimum insulation
resistance requirements. For instance, Class 1 and IPC 600 Class 2 applications (low voltage,
clean settings) necessitate a minimum insulation resistance of 1 megohm at room temperature
and 500 kilohms at higher temperatures. For IPC Class 3 applications (high voltage, harsh
environments), the requirement is set at 100 megohms at room temperature and 50 megohms
at elevated temperatures.
To ensure that a PCB meets the required insulation resistance, designers and manufacturers
can take a number of steps. These include:

 Choosing materials with high dielectric strength and low moisture absorption, which
can help to minimize current leakage and increase insulation resistance.
 Ensuring that the spacing between conductive elements on the PCB meets the
minimum clearance requirements specified by IPC-2221, which can help to prevent
arcing and improve insulation resistance.
 Using conformal coatings or other protective measures to protect the PCB from
environmental factors that can degrade insulation resistance, such as humidity,
moisture, and contamination.
 Performing insulation resistance testing during the manufacturing process to verify
that the PCB meets the minimum requirements specified by IPC-2221.
IPC-2221 provides recommendations for minimum insulation resistance for PCBs, based on
the operating voltage and environmental conditions of the application. To ensure that a PCB
meets these requirements, designers and manufacturers can choose materials with high
dielectric strength and low moisture absorption, follow minimum clearance requirements, use
protective measures, and perform insulation resistance testing during manufacturing. By
following these guidelines, designers and manufacturers can create PCBs that are safe,
reliable, and meet the needs of their intended applications.

Adjusting the IPC-2221 standard for high voltage circuits

The ipc-2221 voltage and spacing standards provide guidelines for the design of printed
circuit boards (PCBs), including the minimum clearances required between conductive
elements on the board to ensure safe and reliable operation. However, in the case of high-
voltage circuits, additional considerations may need to be taken into account to ensure that the
PCB can handle the high voltage levels without experiencing electrical breakdown or arcing.

 One of the key factors to consider when designing a PCB for high-voltage applications
is the minimum clearance distance between conductive elements. The IPC-2221
standard provides a table of minimum clearance distances based on the operating
 voltage and environmental conditions of the application. However, in the case of high-
voltage circuits, it may be necessary to increase the clearance distances to prevent
arcing or electrical breakdown.
 In general, the minimum clearance distance should be increased in proportion to the
operating voltage of the circuit. For example, if the standard calls for a minimum
clearance of 0.4 mm for a circuit operating at 300 volts, the clearance distance should
be increased to 1 mm or more for a circuit operating at 1000 volts or more.
 Another factor to consider in high voltage circuits is the selection of materials.
Materials with high dielectric strength and low moisture absorption should be used to
minimize current leakage and increase insulation resistance. It is also important to
ensure that the materials used are compatible with the environmental conditions of the
application, such as temperature and humidity.
 In addition to these considerations, it may be necessary to perform additional testing
and validation to ensure that the PCB can handle the high voltage levels. This may
include testing for insulation resistance, high voltage breakdown, and other factors.
In summary, when designing a PCB for high voltage circuits, the IPC-2221 standard should
be adjusted to increase the minimum clearance distances and select appropriate materials.
Additional testing and validation may also be necessary to ensure the safety and reliability of
the PCB. By following these guidelines, designers and manufacturers can create high voltage
PCBs that meet the needs of their intended applications and ensure safe and reliable operation.

The Difference between IPC-2581 And IPC-2221:

Understanding the difference between IPC-2581 and IPC-2221 is essential for professionals in
the electronics industry, especially those involved in the design and manufacturing of Printed
Circuit Boards (PCBs).

IPC-2221: This standard focuses on the generic design aspects of PCBs, offering guidelines
and rules related to mechanical, electrical, and thermal considerations. It encompasses design
elements such as layout, component placement, and trace routing, as well as recommendations
on material choices, via sizes, and board thicknesses. IPC-2221 is widely recognized in the
PCB industry and serves as a reference for many designers and manufacturers.

IPC-2581: IPC-2581 is a standard designed for seamless exchange of PCB design data
between different software tools and systems. It establishes a unified data format that
facilitates the transfer of PCB design information between various software applications and
manufacturing processes. This standard includes data about layer stackup, drill sizes, and
trace routing, along with information related to manufacturing processes and testing
requirements.

A major advantage of using IPC-2581 is its ability to consolidate design and manufacturing
data into a single, standardized format, reducing the risk of errors and inconsistencies caused
by multiple data formats or file conversions. This standard makes the data more accessible
and compatible across different systems.

In summary, while IPC-2221 provides design guidelines for PCBs, IPC-2581 standardizes
data exchange across different tools and systems. Both standards play a vital role in the PCB
industry and should be considered by anyone working in PCB design and manufacturing.
By keeping up with the latest standards and best practices, professionals can ensure their PCB
designs are accurate, consistent, and efficient. Staying informed about these standards is
crucial to producing high-quality PCBs that meet the needs of customers and end-users. If you
have any concerns about your PCB design, consider sending the relevant files for review.