os Senay ae ee‘The Premier Research & Development System ‘The 790 erie pform offers the lente michine fr tin fn research technolopes, such af inductively coupled plsama, ICR and plasma fenkanced chemical vapor deposition PECVD, are avalible as standard products. Minis loading ors he Aexibity to handle a varity of ‘As a rate of the wide range of ‘options 790 systems ae routinely ued ommerci esearch nd devlopmans. 790 SERIES 790 systems. The control system idizes software developed fo Mérosof Windows, proving saple plays of hey parameters system ‘Adlon the unt offer moduar Gig lot nw areal an oii ey aces for mancnance acts. ‘be highly elabl nal eld ppcatons Sree the 790 series systems ale the Bane proces tania ae ceca platforms, process transfer to a is deece and easy No shortcuts are with che same best of breed workmanship, and exacting umber of areas on all Phim Therm platforms. As 2 result customers that develop processes fon the 790 platform find that traraaring proces 6 prodocton occurs seamlessly and smoothy Sennen Banco Sortie ica rc ae Pee Seren ad Er ea eng ace eed ene es el Pena) ete Renee een S ny Provides Versatility See eae etryINDUCTIVELY COUPLED PLASHIA (CP) “This high density parma module offers { independene contol of the plasma enerason power and the wafer baz ‘As aresulhigh etch rates are walable Fat low wafer bis. This offers the researcher significant proces Alexi anda wide vary of options hen designing. new processes or extending existing ones. PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD) “Through appeation of power atthe top secwode and heating the lower lectrode 3 wide variey of insulator and earbon concanng fms can be deposited, Seress contol,» wide ‘airy of thicknesses, and overall fm ty are easy conraled through sariason of process chamisry. PLASMA ETCH (RIPE “This swechable confiurason offers ‘the researcher the abil trum ether reactive fon etch or plasma etch procestes.on the rime system. “his proven reactor Is based upon previous Plasma Therm Series 70 and 700 exch systems. RIE systems have ‘een used in ein fm processing for decades and offer the slots 3 wal understood, fully characterized puma system. Appleton: of this technology contin £0 expand into ew areas and are often applied in research activeThe Applications are Endless... tm infin number of development corel acteteeeed EX ‘ame pplicaons. ‘The flowing lat that hive bean run on these sates ‘Wi allofehe opciones on his ptr dhe at i constandygrowing 790 syste are the del RAD too sinc they provide sigan opsons for eamination of wie arly of ‘Adina the Meibe Windows ‘oftware, through invesnton of large numbers of hn ln processes, ivarket is endless and ince: > Gas Gate Recess Etching snd Mesa Deion >Typlel HOT Matera, > Graded Refractive ndox > Sion Niride and Sticon > Polyimide Etching > Quare Eeching proceres can be vet Membrane Appatons > Gch Deep Quare, PolytconPolymide > Low Temperature PECVD | |