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반공 8
반공 8
Microelectronic Fabrication
by
Richard C. Jaeger
Distinguished University Professor
ECE Department
Auburn University
Chapter 8
Packaging and Yield
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. For the exclusive use of adopters of the book
This material is protected under all copyright laws as they currently exist. No Introduction to Microelectronic Fabrication,
portion of this material may be reproduced, in any form or by any means, Second Edition by Richard C. Jaeger. ISBN0-201-
without permission in writing from the publisher. 44494-1.
Copyright Notice
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Processed Silicon Wafer
• 150-mm wafer ready
• Mounted on screen
ready for dicing saw
• Dice on wafer tested
by probing prior to
mounting
• Good dice will then be
packaged
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Bonding Pad Configurations
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
“TO-Style” and Inline
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Gold Wire Bonding
(a) (c)
Figure 8.3
(a) An SEM of gold ball bonding (b) SEM of
high density gold ball bonding (c) SEM of
bonded die. Courtesy of Kulicke and Soffa
Industries, Inc. (K&S).
(b)
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Themosonic Ball-Wedge Bonding
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Ultrasonic Bonding
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Pin Grid Array
Figure 8.7
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Leadless Chip Carriers
Figure 8.8
(a) Ceramic leadless chip carriers with top connections.
(b) LCC with edge connections in grooves on the side
of the package.
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Plastic Packaging
Gull wing J-lead surface
surface mount mount
Through hole
Surface Mount
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Solder Ball Formation
• Layers of chrome,
copper, lead and tin
are sequentially
deposited
• After heating for
reflow, the 5% tin -
95% lead solder ball
forms
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Solder Balls - Area Array
(a) (b)
Figure 8.10
(a) Cross section through a solder ball before and after reflowing. Copyright 1969
by International Business Machines Corporation. Reprinted with permission from
Ref. [4]. (b) Flip-chip Pb/Sn solder bumps in standard 250 mm pitch (right) and 50
mm. Courtesy of MCNC Optical and Electronic Packaging Group.
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Solder Bumps
Figure 8.11
Bumps formed by
modification of the wire-
bond process. Courtesy of
Kulicke and Soffa
Industiries, Inc. (K&S).
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Ball Grid Array
Figure 8.12
(a) Ball grid array cross section
(b) Intel microprocessor using
a BGA. Courtesy of Intel Corp.
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Gold Bumps on Aluminum
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Tape Automated Bonding
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Packaging
Chip Scale Packages
Figure 8.15
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Yield
Yield versus Area
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Yield Modeling
Possible Defect Distributions
f(D) probability density for D
¥
Yield : Y= ò exp(-DA) f (D)dD
0
Figure 8.17
(a) Impulse where every wafer has exactly the same number of defects (b) A triangular
approximation to a Gaussian density (c) A uniform density function
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Yield Modeling
Theory
¥
For more complicated probability distributions
Yield : Y= ò exp(-DA) f (D)dD
0 é D0 A ùa
Binomial/Gamma Distributions : Y = ê1 +
ë a úû
Impulse Distribution f (D) = d (D0 ) : Y = exp(-D0 A) a = clustering parameter (0.5 -10)
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
Yield Modeling
Yield Curves
• Theoretical yield curves versus
defect density - area product
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.
End of Chapter 8
Example 8.1
Problems
8.3
8.5
8.9
8.11
8.13
8.17
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. For the exclusive use of adopters of the book
This material is protected under all copyright laws as they currently exist. No Introduction to Microelectronic Fabrication,
portion of this material may be reproduced, in any form or by any means, Second Edition by Richard C. Jaeger. ISBN0-201-
without permission in writing from the publisher. 44494-1.
Packaging and Yield
References
© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This For the exclusive use of adopters of the book
material is protected under all copyright laws as they currently exist. No portion of this Introduction to Microelectronic Fabrication, Second
material may be reproduced, in any form or by any means, without permission in writing Edition by Richard C. Jaeger. ISBN0-201-44494-1.
from the publisher.