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FGPF4533 330V, PDP Trench IGBT

August 2010

FGPF4533
330V, PDP IGBT
Features General Description
• High current capability Using Novel Trench IGBT Technology, Fairchild’s new series of
• Low saturation voltage: VCE (sat) =1.55 V @ IC = 50 A trench IGBTs offer the optimum performance for PDP applica-
tions where low conduction and switching losses are essential.
• High input impedance
• Fast switching
• RoHS compliant

Applications
• PDP System

TO-220F
GC E (Retractable)

Absolute Maximum Ratings


Symbol Description Ratings Units
VCES Collector to Emitter Voltage 330 V
VGES Gate to Emitter Voltage ± 30 V

IC pulse(1)* Collector Current @ TC = 25oC 200 A

Maximum Power Dissipation @ TC = 25oC 28.4 W


PD
o
Maximum Power Dissipation @ TC = 100 C 11.4 W
o
TJ Operating Junction Temperature -55 to +150 C
o
Tstg Storage Temperature Range -55 to +150 C
Maximum Lead Temp. for soldering o
TL 300 C
Purposes, 1/8” from case for 5 seconds

Thermal Characteristics
Symbol Parameter Typ. Max. Units
o
RθJC(IGBT) Thermal Resistance, Junction to Case - 4.4 C/W
o
RθJA Thermal Resistance, Junction to Ambient - 62.5 C/W

Notes:
(1) Half Sine Wave, D < 0.01, pluse width < 5μsec
* Ic_pluse limited by max Tj

©2010 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com


FGPF4533 Rev. B
FGPF4533 330V, PDP Trench IGBT
Package Marking and Ordering Information
Packaging Max Qty
Device Marking Device Package Qty per Tube
Type per Box
FGPF4533 FGPF4533TU TO-220F Tube 50ea -

Electrical Characteristics of the IGBT TC = 25°C unless otherwise noted

Symbol Parameter Test Conditions Min. Typ. Max. Units

Off Characteristics
BVCES Collector to Emitter Breakdown Voltage VGE = 0V, IC = 250μA 330 - - V
ΔBVCES Temperature Coefficient of Breakdown
ΔTJ Voltage
VGE = 0V, IC = 250μA - 0.3 - V/oC

ICES Collector Cut-Off Current VCE = VCES, VGE = 0V - - 100 μA


IGES G-E Leakage Current VGE = VGES, VCE = 0V - - ±400 nA

On Characteristics
VGE(th) G-E Threshold Voltage IC = 250μA, VCE = VGE 2.4 3.3 4.0 V
IC = 20A, VGE = 15V - 1.15 - V
IC = 50A, VGE = 15V,
VCE(sat) Collector to Emitter - 1.55 1.8 V
TC = 25oC
Saturation Voltage
IC = 50A, VGE = 15V,
- 1.6 - V
TC = 125oC

Dynamic Characteristics
Cies Input Capacitance - 1294 - pF
Coes Output Capacitance VCE = 30V, VGE = 0V, - 57 - pF
f = 1MHz
Cres Reverse Transfer Capacitance - 41 - pF

Switching Characteristics
td(on) Turn-On Delay Time - 6 - ns
VCC = 200V, IC = 20A
tr Rise Time - 22 - ns
RG = 5Ω, VGE = 15V
td(off) Turn-Off Delay Time Resistive Load, TC = 25oC - 40 - ns
tf Fall Time - 220 - ns
td(on) Turn-On Delay Time - 6 - ns
VCC = 200V, IC = 20A,
tr Rise Time - 24 - ns
RG = 5Ω, VGE = 15V,
td(off) Turn-Off Delay Time Resistive Load, TC = 125oC - 42 - ns
tf Fall Time - 277 - ns
Qg Total Gate Charge - 44 - nC
VCE = 200V, IC = 20A
Qge Gate to Emitter Charge VGE = 15V - 6 - nC
Qgc Gate to Collector Charge - 14 - nC

FGPF4533 Rev. B 2 www.fairchildsemi.com


FGPF4533 330V, PDP Trench IGBT
Typical Performance Characteristics

Figure 1. Typical Output Characteristics Figure 2. Typical Output Characteristics


200 200
o
TC = 25 C 20V 12V o 20V
10V TC = 125 C 12V
15V
15V 10V

Collector Current, IC [A]


Collector Current, IC [A]

150 150

VGE = 8V
VGE = 8V
100 100

50 50

0 0
0 1 2 3 4 5 6 0 1 2 3 4 5 6
Collector-Emitter Voltage, VCE [V] Collector-Emitter Voltage, VCE [V]
Figure 3. Typical Saturation Voltage Figure 4. Transfer Characteristics
Characteristics
200 200
Common Emitter Common Emitter
VGE = 15V VCE = 10V
o o
Collector Current, IC [A]

TC = 25 C TC = 25 C
Collector Current, IC [A]

150 150 o
o TC = 125 C
TC = 125 C

100 100

50 50

0 0
0 1 2 3 4 5 0 2 4 6 8 10 12
Collector-Emitter Voltage, VCE [V] Gate-Emitter Voltage,VGE [V]

Figure 5. Saturation Voltage vs. Case Figure 6. Saturation Voltage vs. VGE
Temperature at Variant Current Level
1.7 20
Common Emitter Common Emitter
Collector-Emitter Voltage, VCE [V]
Collector-Emitter Voltage, VCE [V]

o
1.6 VGE = 15V TC = 25 C
16
1.5 50A

1.4 12
50A
1.3 30A
8
30A
1.2
IC = 20A
4
1.1 IC = 20A

1.0 0
0 20 40 60 80 100 120 140 0 4 8 12 16 20
o
Collector-EmitterCase Temperature, TC [ C] Gate-Emitter Voltage, VGE [V]

FGPF4533 Rev. B 3 www.fairchildsemi.com


FGPF4533 330V, PDP Trench IGBT
Typical Performance Characteristics

Figure 7. Saturation Voltage vs. VGE Figure 8. Capacitance Characteristics


20 2400
Common Emitter
o Common Emitter
TC = 125 C
Collector-Emitter Voltage, VCE [V]

VGE = 0V, f = 1MHz


16 2000
o
TC = 25 C

Capacitance [pF]
1600
12
Cies
50A 1200
8
30A 800

4 Coes
IC = 20A 400

Cres
0 0
0 4 8 12 16 20 0.1 1 10 30
Gate-Emitter Voltage, VGE [V] Collector-Emitter Voltage, VCE [V]

Figure 9. Gate charge Characteristics Figure 10. SOA Characteristics


15 500
Common Emitter
o
TC = 25 C 100 10μs
Gate-Emitter Voltage, VGE [V]

12
Collector Current, Ic [A]

100μs
1ms
VCC = 100V 10
10 ms
9
DC
200V
1
6
Single Nonrepetitive
Pulse TC = 25oC
3 0.1
Curves must be derated
linearly with increase
in temperature
0 0.01
0 15 30 45 0.1 1 10 100 1000
Gate Charge, Qg [nC] Collector-Emitter Voltage, VCE [V]

Figure 11. Turn-on Characteristics vs. Figure 12. Turn-off Characteristics vs.
Gate Resistance Gate Resistance
100 1000

tf
Switching Time [ns]
Switching Time [ns]

tr

10 100

td(on) Common Emitter Common Emitter


VCC = 200V, VGE = 15V td(off) VCC = 200V, VGE = 15V
IC = 20A IC = 20A
o o
TC = 25 C TC = 25 C
o o
TC = 125 C TC = 125 C
1 10
0 10 20 30 40 50 0 10 20 30 40 50
Gate Resistance, RG [Ω] Gate Resistance, RG [Ω ]

FGPF4533 Rev. B 4 www.fairchildsemi.com


FGPF4533 330V, PDP Trench IGBT
Typical Performance Characteristics

Figure 13. Turn-on Characteristics vs. Figure 14. Turn-off Characteristics vs.
Collector Current Collector Current
100 400

tr tf

Switching Time [ns]


Switching Time [ns]

100

10
td(on)

Common Emitter Common Emitter td(off)


VGE = 15V, RG = 5Ω VGE = 15V, RG = 5Ω
o o
TC = 25 C TC = 25 C
o o
TC = 125 C TC = 125 C
1 10
10 20 30 40 50 10 20 30 40 50
Collector Current, IC [A] Collector Current, IC [A]

Figure 15. Switching Loss vs. Gate Resistance Figure 16. Switching Loss vs. Collector Current
5000 1000
Common Emitter
VCC = 200V, VGE = 15V
IC = 20A
1000 o Eoff
TC = 25 C
Switching Loss [uJ]
Switching Loss [uJ]

100
o
TC = 125 C Eoff

100 Eon
10 Common Emitter
Eon VGE = 15V, RG = 5Ω
o
TC = 25 C
o
TC = 125 C
10 1
0 10 20 30 40 50 10 20 30 40 50
Gate Resistance, RG [Ω] Collector Current, IC [A]

Figure 17. Turn off Switching SOA Characteristics


500

100
Collector Current, IC [A]

10

Safe Operating Area


o
VGE = 15V, TC = 125 C
0.1
1 10 100 500
Collector-Emitter Voltage, VCE [V]

FGPF4533 Rev. B 5 www.fairchildsemi.com


FGPF4533 330V, PDP Trench IGBT
Typical Performance Characteristics

Figure 18.Transient Thermal Impedance of IGBT


8

Thermal Response [Zthjc] 0.5

1 0.2
0.1
0.05
PDM
0.1 0.02
t1
0.01 t2
Duty Factor, D = t1/t2
single pulse
Peak Tj = Pdm x Zthjc + TC

0.01
1E-5 1E-4 1E-3 0.01 0.1 1 10 100
Rectangular Pulse Duration [sec]

FGPF4533 Rev. B 6 www.fairchildsemi.com


FGPF4533 330V, PDP Trench IGBT
Package Dimensions

TO-220F (Retractable)

* Front/Back Side Isolation Voltage : AC 2700V

Dimensions in Millimeters

FGPF4533 Rev. B 7 www.fairchildsemi.com


FGPF4533 330V, 50A PDP Trench IGBT
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
AccuPower™ F-PFS™ Power-SPM™ ®*
Auto-SPM™ FRFET® PowerTrench®
SM
Build it Now™ Global Power Resource PowerXS™ The Power Franchise®
CorePLUS™ Green FPS™ Programmable Active Droop™ ®

CorePOWER™ Green FPS™ e-Series™ QFET®


CROSSVOLT™ Gmax™ QS™
TinyBoost™
CTL™ GTO™ Quiet Series™
TinyBuck™
Current Transfer Logic™ IntelliMAX™ RapidConfigure™
TinyCalc™
DEUXPEED® ISOPLANAR™ ™ TinyLogic®
Dual Cool™ MegaBuck™
® TINYOPTO™
EcoSPARK MICROCOUPLER™ Saving our world, 1mW/W/kW at a time™
TinyPower™
EfficentMax™ MicroFET™ SignalWise™
TinyPWM™
ESBC™ MicroPak™ SmartMax™
TinyWire™
® MicroPak2™ SMART START™
TriFault Detect™
MillerDrive™ SPM®
TRUECURRENT™*
Fairchild® MotionMax™ STEALTH™
μSerDes™
Fairchild Semiconductor® Motion-SPM™ SuperFET™
FACT Quiet Series™ OptiHiT™ SuperSOT™-3
FACT® OPTOLOGIC® SuperSOT™-6
OPTOPLANAR® SuperSOT™-8 UHC®
FAST®
® SupreMOS™ Ultra FRFET™
FastvCore™
SyncFET™ UniFET™
FETBench™
Sync-Lock™ VCX™
FlashWriter® * PDP SPM™ VisualMax™
FPS™
XS™

*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.

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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used here in:
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intended for surgical implant into the body or (b) support or sustain life, system whose failure to perform can be reasonably expected to cause
and (c) whose failure to perform when properly used in accordance with the failure of the life support device or system, or to affect its safety or
instructions for use provided in the labeling, can be reasonably effectiveness.
expected to result in a significant injury of the user.

ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,
www.Fairchildsemi.com, under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
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PRODUCT STATUS DEFINITIONS


Definition of Terms
Datasheet Identification Product Status Definition
Datasheet contains the design specifications for product development. Specifications
Advance Information Formative / In Design
may change in any manner without notice.

Datasheet contains preliminary data; supplementary data will be published at a later


Preliminary First Production date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to


No Identification Needed Full Production
make changes at any time without notice to improve the design.

Datasheet contains specifications on a product that is discontinued by Fairchild


Obsolete Not In Production
Semiconductor. The datasheet is for reference information only.
Rev. I48
FGPF4533 Rev. B 8 www.fairchildsemi.com

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