APRIL 2024 | VOL. 4 NO.

CONTENTS
TECHNOLOGY
EDITOR
EDITORIAL
: Rahul Chopra
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 RESEARCH
& INNOVATION UPDATES

Lithium-metal batteries can double the EV range

Researchers at Stanford University
have developed lithium metal battery
technology, potentially doubling the
range of electric cars to 800 to 1130km
(500 to 700 miles) on a single charge.
Unlike lithium-ion batteries, which
use graphite anodes and lithium metal
oxide cathodes, lithium-metal batter-
ies employ electroplated lithium metal
for the anode, significantly boosting
energy storage capacity. However, these
batteries face a challenge: their energy
storage capacity rapidly declines after a
few charge-discharge cycles, primarily
due to forming a solid electrolyte inter-
phase (SEI) matrix that captures isolated
lithium metal fragments. The team dis-
covered a simple yet effective solution:
discharging the battery and letting it rest
for a few hours. This process allows the
SEI matrix to dissolve, reviving inactive
lithium fragments and enhancing battery
Stanford scientists have unveiled a breakthrough in lithium metal battery technology that could pave the performance without requiring expen-
way for cars to travel 800 to 1130km (500 to 700 miles) on a single charge (Credit: www.istockphoto.com) sive equipment or material changes.

Vision sensors with expanded field of view for robots and drones
Researchers at Beihang University in China have
developed a multi-camera differential binocular
vision sensor with an expanded field of view
(FOV). This new sensor is designed to improve
the accuracy of measurements for robots, drones,
autonomous vehicles, and other smart systems.
Traditional sensors often use single cameras,
which can limit their measurement precision due
to a restricted FOV. The innovative sensor consists
of a central primary camera surrounded by four
peripheral auxiliary cameras, creating four bin- Figure summarising the principle of the sensor (Credit: Yang et al)
ocular pairs for more precise three-dimensional
measurements. The sensor’s structure parameters have range, and accuracy, resulting in a much wider FOV than
been optimised for spatial arrangement, measurement conventional binocular cameras.

10 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS WWW.EFYMAG.COM

 RESEARCH & INNOVATION
Metamaterial enhances ultrasound
imaging and non-destructive testing
A research team at KIMM’s Department of Nano Devices &
Displays and SNU’s Department of Mechanical Engineering
has created a metamaterial capable of converting linear ul-
trasonic wave vibrations into circular vibrations, featuring
a three-dimensional microstructure. They discovered the
anisotropic properties of an ultrasonic medium enabling
this conversion and designed a metamaterial with three-
dimensional cylindrical holes to achieve it. This innovation
allows for the efficient generation of circular shear ultra-
sonic waves using simplified cylindrical microstructures
and low-loss metal materials. They have developed a new
ultrasonic mode that can enhance the defect detection
capability of existing ultrasonic technologies and apply this
technology in industrial ultrasonic non-destructive testing
and ultrasound imaging.
New technique enhances solar cell
efficiency by 1000 times
At Martin Luther University Halle-Wittenberg (MLU),
researchers developed a technique to enhance solar cell
efficiency by 1000 times. They created crystalline layers of
barium titanate, strontium titanate, and calcium titanate
stacked in a lattice
formation. Exposed
to laser light during
measurements,
the new material
showed a current
flow increase of
up to 1000 times
compared to pure
barium titanate of
For their new approach, the researchers
combined three crystal materials (Credit: Uni
similar thickness,
Halle/Yeseul Yun) despite reducing
the proportion of
barium titanate by nearly two-thirds. This could lead to
more efficient and cost-effective solar panels, requiring less
space and benefiting urban areas. The team’s work could
significantly boost solar energy adoption, reducing reliance
on fossil fuels and combating climate change.
Flexible, wireless and unbreakable
optical sensors
Researchers from the Osaka University have developed a
flexible, wireless optical sensor using carbon nanotubes
and organic transistors on a thin polymer film. Unlike tradi-
tional rigid optical sensors, this innovative sensor remains
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functional even when bent or crumpled. It detects both vis-
ible and infrared light by heating carbon nanotubes, which
then generate a voltage signal. The sensor’s sensitivity is
enhanced by doping the nanotubes with chemical carriers.
Integrated with wireless technology, organic transistors
on the polymer substrate convert the voltage signals into
an image signal, transmitted wirelessly to a computer via
Bluetooth. The prototype has successfully sensed heat from
various objects and the flow of glucose through tubes.
With its high sensitivity, durability, and wireless capabili-
ties, this sensor has potential applications in non-destruc-
tive imaging, wearable devices, and soft robotics, offering a
simpler way to evaluate liquid quality without sampling.
Inexpensive tag for identification
and security applications
MIT researchers have created a small security tag using
terahertz waves, which are quicker and smaller than radio
waves, offering better protection than traditional radio-
frequency identification (RFID) tags. To prevent counterfeit-
ing, they embed-
ded microscopic
metal particles
in the adhesive,
forming a unique
pattern that acts
like a fingerprint
when scanned with
terahertz waves. A
A cryptographic tag developed at MIT uses machine-learning
terahertz waves to authenticate items by
recognising the unique pattern of microscopic model accurately
metal particles that are mixed into the glue detects tampering
that sticks the tag to the item’s surface
(Credits: Image: Jose-Luis Olivares, MIT; Chip by comparing over
courtesy of the researchers) 99% accuracy of
glue patterns. This
inexpensive tag can be used in large supply chains and on
small items, such as medical devices. Despite challenges
like high transmission loss and a limited range of terahertz
waves, the team sees potential for their use in identifica-
tion and security applications.
Wearable technology for real-time
emotion recognition
Researchers at UNIST’s Department of Material Science and
Engineering have developed a real-time human emotion
recognition technology, poised to revolutionise industries,
particularly in wearable systems. Their multi-modal system
combines verbal and non-verbal data for accurate emotion
analysis. The core technology is the personalised skin-inte-
grated facial interface (PSiFI), a self-powered, flexible, and
ELECTRONICS FOR YOU EXPRESS | APRIL 2024 11
 RESEARCH & INNOVATION
transparent sensor that detects both facial muscle deforma-
tion and vocal cord vibrations. This innovation, coupled
with machine learning algorithms, enables precise emotion
recognition, even with masked individuals. The system has
been successfully implemented in a virtual reality digital
concierge application. It operates on friction charging, elim-
inating the need for external power sources. The team’s
semi-curing technique for transparent conductors and a
personalised mask created through multi-angle shooting
enhance the system’s customisation and effectiveness.
High-performance quantum computer
with tunable-coupler concept
IQM Quantum Computers has advanced its quantum
computing technology with a 20-qubit quantum computer
that incorporates quantum processing units (QPUs) based
on the tunable-coupler concept. This design achieves fast
two-qubit gate speed
and high fidelity, with a
median two-qubit gate
fidelity of 99.51% across
30 qubit pairs and a peak
fidelity of 99.8%. The
system’s benchmarks in-
clude a quantum volume
(Credit: https://thequantuminsider.com) (QV) of 32, measuring
both scale and qual-
ity, and a circuit layer operations per second (CLOPS) of
2600, indicating throughput speed. Additionally, the system
achieved a 20-qubit GHZ state with fidelity greater than 0.5,
demonstrating multiqubit entanglement, and a Q-score of
11, showing its ability to solve the max-cut combinatorial
optimisation task. IQM is currently working with prototype
systems up to 150 qubits, aiming to provide high-perfor-
mance systems for end-users.
Flexible, high-efficiency solar cells
for vertical installations
Scientists at Nagoya University in Japan have developed a
new material, fullerene indanone-based (FIDO), to enhance
the durability of next-
generation perovskite
solar cells. These cells
are known for their high
efficiency and flexibility,
making them suitable
for vertical installations
like windows and walls.
Amorphous solar cells with FIDO
technology are more efficient, stable, and Fullerenes, carbon-based
lightweight (Credit: Yutaka Matsuo) semiconductors with a
12 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS
unique shape, play a crucial role in these cells by channel-
ling electrons to generate power. The team used FIDO to
create an amorphous solar cell film, which differs from the
crystalline structure of traditional silicon solar cells. This
amorphous material is more efficient and stable than stand-
ard films, and its properties do not deteriorate over time.
The researchers believe their fullerene derivatives could
have broader applications in organic electronics, includ-
ing organic photodiodes and photodetectors, which could
improve the resolution of imaging sensors in cameras and
enable fingerprint authentication on smartphone displays.
Highly efficient solar cells designed
with a thin coating of tetracene
Physicists at Paderborn University have developed a highly
efficient solar cell design by coating silicon solar cells
with a thin layer of the organic compound tetracene, us-
ing advanced computer
simulations. This innova-
tive approach, detailed in
Physical Review Letters,
addresses the efficiency
limits of silicon solar cells,
which often waste energy
as heat. Professor Wolf
Physicists at Paderborn University Gero Schmidt highlights
have enhanced solar cell efficiency the vast potential of solar
significantly using tetracene,
an organic material, based on energy, explaining that the
complex computer simulations. tetracene layer converts
They discovered that defects at the
tetracene-silicon interface boost short-wave light into high-
energy transfer, promising a new energy excitations, increas-
solar cell design with drastically
improved performance ing electricity generation.
The research, conducted
with Dr Marvin Krenz and Prof. Dr Uwe Gerstmann, found
that specific defects at the interface between tetracene and
silicon accelerate exciton transfer, crucial for improved effi-
ciency. These findings pave the way for a new type of solar
cell with significantly enhanced performance, contributing
to cleaner and more renewable energy generation.
New 3D printer could drastically
reduce manufacturing costs and
waste
MIT researchers have developed a 3D printing technique
that enables the creation of high-performance solenoids,
key components in electronics, using a custom 3D printer.
This innovation could drastically reduce manufacturing
costs and waste, and potentially make vital equipment like
dialysis machines more accessible in remote or resource-
limited areas. The printer is modified to use multiple mate-
WWW.EFYMAG.COM
 RESEARCH & INNOVATION
rials, layering a dielectric
insulator, a conductive
coil, and a soft magnetic
core to produce sole-
noids. Challenges such
as material melting were
overcome by adding ven-
(Image: Courtesy of the researchers)
tilation and redesigning
the spool holder. The result is more compact devices with
stronger magnetic fields than other 3D-printed solenoids.
Although not as powerful as traditional solenoids, these
could be useful in small sensors or soft robots. The team
aims to enhance performance by exploring better materials
and refining temperature control to minimise defects.
Low-energy magnetic computing for
efficient processors and memories
MIT researchers have developed experimental computer
memories and processors using two-dimensional magnetic
materials, just a few atoms thick, that consume much less
energy than traditional silicon devices. The team dem-
onstrated precise
control of a van der
Waals magnet at
room temperature, a
significant achieve-
ment since these thin
magnetic materials
usually require low
This illustration shows electric current being temperatures for con-
pumped into platinum (the bottom slab),
which results in the creation of an electron trol. They achieved
spin current that switches the magnetic state room-temperature
of the 2D ferromagnet on top. The coloured
spheres represent the atoms in the 2D magnetic switching
material (Image: Courtesy of the researchers) using electrical cur-
rent pulses, crucial
for binary code representation and nonvolatile computer
memories. The material used, iron gallium telluride, retains
its magnetism at higher temperatures and requires lower
electrical current for switching, making it more energy-
efficient. Advancement for faster computers, nonvolatile
memories, and more efficient processors
Large-scale production of stable,
high-performance solar cells
Researchers at São Paulo State University (UNESP) in
Bauru, Brazil, have advanced the efficiency and stability
of perovskite solar cells by incorporating MXenes, a class
of two-dimensional materials similar to graphene. This in-
novation enhances the power conversion efficiency of the
cells from 19% to 22% and triples their stability. MXenes,
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composed of transition metals, carbon, nitrogen, and func-
tional groups like fluoride, oxygen, or hydroxyl, offer high
electrical conductivity and thermal stability. Initially aimed
at mitigating performance decline due to an insulating pas-
sivation layer, the study now opens avenues for large-scale
industrial production of stable, high-performance solar
cells. It outlines a viable method for mass production and
various characterisation techniques, marking a significant
step towards sustainability goals and positioning Brazil as a
leading solar cell manufacturer.
AI-driven efficiency in robotic
warehouses
MIT researchers have developed an AI-enhanced method
to improve efficiency in large robotic warehouses, where
hundreds of robots transport items for packing and shipping.
Using a deep-learning
model, they predict the
best areas to decongest
and divide robots into
smaller groups for faster
resolution, making their
method nearly four times
A group of MIT researchers who use AI to quicker than traditional
mitigate traffic congestion applied ideas approaches. The AI
from that domain to tackle the problem
of multiple robots in a warehouse setting model focuses on areas
(Credit: iStock) with the highest potential
to reduce total travel time
by analysing smaller groups of robots and predicting which
group’s coordination would most improve overall efficiency.
The neural network manages robot groups by understanding
their complex interactions, such as potential path crossings,
and simplifies computations by encoding constraints only
once. In simulations, this learning-based approach proved up
to four times faster than non-learning methods, even account-
ing for the neural network’s extra computational effort.
New wearable sensor enables
communication through hand and
finger movements
Researchers from Beijing Normal University, Sun Yat-sen
University, and Guilin University of Electronic Technol-
ogy have developed a new wearable sensor that enables
communication through hand and finger movements.
The sensor combines a flexible silicone elastomer, polydi-
methylsiloxane (PDMS), with an optical component called
a fibre Bragg grating (FBG) for accurate movement detec-
tion. Designed for comfort and long-term wear, the sensor
can be applied to various body parts and is adaptable to
individual users through precise calibration.
ELECTRONICS FOR YOU EXPRESS | APRIL 2024 13
 TRULY INNOVATIVE ELECTRONICS
Amongst numerous press releases of new products received by us, these are the ones
we found worthy of the title Truly Innovative Electronics
ML-acceleration
Grayskull development
board
Tenstorrent has launched its first Gray-
skull development board, which the
company claims to offer high-efficiency
machine learning (ML) acceleration.
The board’s processor is made up of a
grid of Tensix cores, each of which is
built from five process cores around the
RISC-V instruction set architecture. The
Grayskull e150 offers performance from
120 Tensix cores running at a higher
1.2GHz clock speed. These additional
cores mean a total of 120MB of SRAM,
though the board only offers the same
8GB of LPDDR4. They also result in
a higher power draw, with the card
pulling 200W at peak load. The board
is designed for those who want to ‘run
models right away,’ offering a top-down
approach that takes existing models
from frameworks like PyTorch and
TensorFlow and makes them executable
on the Grayskull hardware.
Tenstorrent
https://tenstorrent.com
MPU for vision AI and
real-time control
Renesas has launched the RZ/V2H,
which the company claims to offer high
performance within the family and
enables vision AI and real-time control
capabilities. The DRP-AI3 accelera-
tor’s pruning technology enhances AI
computing efficiency, increasing AI
inference performance up to 80 TOPS.
This allows engineers to process vision
14 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS
INNOVATION UPDATES
AI applications at the edge without
relying on cloud computing. The pro-
cessor includes four Arm Cortex-A55
CPU cores
at 1.8GHz
for Linux
applications,
two Cortex-
R8 cores at
800MHz for
real-time processing, and one Cortex-
M33 sub-core. This combination allows
the MPU to manage vision AI and real-
time control tasks, suitable for robotics
applications. Its power consumption
reduces the need for cooling fans and
components, enabling smaller, cost-
effective, and reliable system designs.
Renesas
https://www.renesas.com
3D lidar module for on-
chip dToF processing
STMicroelectronics’s VL53L9 is a direct
time-of-flight (dToF) 3D lidar module
with a 2.3k resolution, featuring dual-
scan flood illumination for object detec-
tion and capturing 2D infrared images
and 3D depth maps. It is a low-power
module that
comes ready to
use with on-chip
dToF processing
and requires no
additional exter-
nal components
or calibration.
The device also offers ranging perfor-
mance from 5cm to 10 metres. It enables
features such as laser autofocus, bokeh,
and cinematic effects for both still and
video at 60fps. Virtual reality systems can
use the sensor’s depth and 2D images
for improved spatial mapping, leading to
immersive gaming and VR experiences.
STMicroelectronics
https://www.st.com
Dual varistor for ADAS
in vehicles
TDK Corporation has launched the
AVRH16A2C270KT200NA8 for automo-
tive applications. The varistor meets the
electrostatic discharge (ESD) require-
ments for the operation of advanced
driver assistance systems (ADAS) in
vehicles. It sup-
ports electronics
on a CAN bus and
has a 2-in-1 array
structure, integrat-
ing the functions of
two varistors into
a single element. It is designed at the
1608 size (1.6mm x 0.8mm x 0.6mm)
and minimises the capacitance differ-
ence between channels with TDK’s
design technology. The main features of
the AVRH series varistors include ESD
resistance of 25kV, an operating temper-
ature range of up to 150°C, and compli-
ance with the AEC-Q200 standard. The
model has a 2-in-1 array structure that
provides dual varistor functionality and
minimises the capacitance difference
between channels to less than 1.0pF.
TDK
https://www.tdk.com
Industry-first 12-stack
HBM3E DRAM
Samsung Electronics has announced
the development of HBM3E 12H, the
first 12-stack HBM3E DRAM and the
highest-capacity HBM product so far. The
HBM3E 12H offers bandwidth of up to
1280GB/s and a capacity of 36GB, both
more than 50% higher than the 8-stack
HBM3 8H. This technology is expected
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to be beneficial, especially with higher
stacks, as it helps mitigate chip die warp-
ing associated with thinner die. It offers
over 20% enhanced vertical density
compared to its other product. Its per-
formance and capacity will enable more
flexible resource management and lower
data centre TCO. In AI applications, it
can boost AI training speed by 34% and
increase inference service users by over
11.5 times compared to HBM3 8H.
Samsung Electronics
https://www.samsung.com
Compact and versatile
wi-fi 6 module with
enhanced security
Recently, u-blox has launched the
NORA-W4 module, featuring wireless
technologies such as Wi-Fi 6, Bluetooth
LE 5.3, thread, and Zigbee. Its size
(10.4mm x 14.3mm x 1.9 mm) and cost
make it suitable for IoT applications
like home,
asset tracking,
healthcare, and
automation.
It allows IoT
nodes to con-
nect directly
to Wi-Fi, eliminating the need for a
Bluetooth gateway and reducing system
costs. This feature is beneficial for
wireless sensors. With Wi-Fi 6 technol-
ogy optimised for the IoT, the module
minimises congestion in settings such
as factories and warehouses, enhancing
throughput and reducing latency.
u-blox
https://www.u-blox.com
Analogue switches
to protect 1.8V
electronic systems
Nexperia has launched a new line of
4- and 8-channel analogue switches
designed for monitoring and protecting
1.8V electronic systems. The NMUX130X
series includes multiplexers with
AEC-Q100 qualified variants for auto-
motive use and standard versions for
applications such as sensor monitoring,
diagnostics, enterprise computing, and
WWW.EFYMAG.COM
TRULY INNOVATIVE: TECH
household appliances. The switches
have control pins that function inde-
pendently of their power supply voltage
range, eliminating the
need for extra compo-
nents for level-shifting.
The fail-safe logic
enables control pins to
be pre-biased before
system power-up and
maintain bias post-
power-down, eliminat-
ing the need for power sequencing with
the system MCU. The devices incorpo-
rate injection current control circuitry,
limiting active channel voltage shifts to
under 5mV during overvoltage events
on disabled channels, thereby remov-
ing the necessity for external diode and
resistor networks, saving board space,
and reducing costs.
Nexperia
https://www.nexperia.com
World’s smallest
low-power UWB SoC
Shenzhen Giant Microelectronics
Company Limited (GiantSemi) has
introduced the GT1500 ultra-wideband
(UWB) SoC, an industry-leading chip for
ranging, position-
ing, and wireless
connectivity. The
SoC stands out
for its low power
consumption and
high performance. It is the world’s
smallest UWB single-chip SoC, housed in
a compact package with a minimal foot-
print of 9mm². It integrates four receiver
channels, RF, analogue, and baseband
functions, along with an embedded MCU
for control and protocol processing, all in
one device. The SoC is suitable for wear-
able and IoT products due to its small
size, which reduces design complexity,
component count, and costs.
GiantSemi
https://www.giantsemi.com
World’s most advanced
5G modem-RF system
Qualcomm Technologies, Inc., has
announced the Snapdragon X80 5G
modem-RF system, its seventh genera-
ELECTRONICS FOR YOU EXPRESS | APRIL 2024
tion 5G modem-to-antenna solution.
It features a dedicated 5G AI processor
and is ready for 5G-advanced archi-
tecture, achieving several world-first
milestones such as integrated NB-NTN
satellite communications support, a
6-antenna architecture for smartphones,
6X carrier aggregation, and AI-based
mm wave range
extension for
fixed wireless
access customer
premise equip-
ment (CPE). The
Snapdragon X80 introduces AI innova-
tions that enhance data speeds, latency,
quality of service (QoS), coverage,
location accuracy, spectrum efficiency,
power efficiency, and multi-antenna
management. The 5G modem-RF
system empowers OEMs and operators
to create next-generation devices sup-
porting 5G Advanced, with unrivalled
capabilities and performance.
Qualcomm Technologies
https://www.qualcomm.com
Versatile 3D lidar sensor
for security purposes
Blickfeld has launched the ‘Blickfeld
QbProtect,’ a 3D lidar sensor for security
applications. It has on-device software
for monitoring zones, fences, and
facades, processing data on unauthor-
ised entry without extra computers
and providing results in common data
formats. The sensor ensures object
detection under various conditions,
with a low false alarm rate and security.
It can be installed, integrated into secu-
rity systems, and configured through
a graphical user interface. Through a
3D viewer in the web-based interface,
users can define security zones using
drag-and-drop and set the object size
for triggering alarms. This reduces false
alarms by excluding small animals or
vegetation from security warnings.
Blickfeld
https://www.blickfeld.com
15
 NEW PRODUCTS
COMPONENTS & CHIPS
System-in-package
for cellular IoT
Nordic Semiconductor is enhancing
its nRF91 series with the nRF9151 SiP
to cater to the growing cellular IoT
market. It provides a complete pack-
age of hardware,
software, tools, and
nRF cloud services,
simplifying IoT de-
vice development.
The compact, pre-
certified, integrated device includes
an SoC, power management, and an
RF front-end. With a 20% smaller
footprint than previous models, it is
ideal for space-constrained applica-
tions. The company highlights that
this advancement addresses market
demands by streamlining develop-
ment, reducing power consumption
and footprint, and enhancing their
cellular IoT portfolio.
Nordic Semiconductor
https://www.nordicsemi.com
Smaller MOSFETs with discrete
switching
Nexperia has launched MOSFETs to
enhance its discrete switching solu-
tions for various applications. The
release includes
100V ASFETs for
PoE, eFuse, and
relay replace-
ment, now in
a 60% smaller
DFN2020 package, offering improved
protection and efficiency. These AS-
FETs are also suitable for battery man-
agement, Wi-Fi hotspots, and CCTV.
Additionally, the company introduced
16 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS
TECHNOLOGY
40V NextPowerS3 MOSFETs with
enhanced EMC performance, ideal
for switching converters and motor
controllers.
Nexperia
https://www.nexperia.com
Efficient energy-saving MOSFETs
The STPOWER MDmesh DM9 AG se-
ries from STMicroelectronics features
600V/650V super-junction MOSFETs
are designed for onboard chargers
and DC/DC converters in complex
and soft-switching
topologies. These
silicon-based de-
vices balance low
RDS(on) and gate
charge for efficient
switching and ener-
gy savings. With a tighter gate-source
threshold voltage spread, they ensure
sharper switching, reducing turn-on
and turn-off losses. The improved
body-diode reverse recovery enhances
ruggedness, making them ideal for
phase-shift zero-voltage switching
topologies. They have AEC-Q101
qualification, low Qg and RDS(on),
fast recovery diode, and high dv/dt
and di/dt ruggedness.
STMicroelectronics
https://www.st.com
Half-bridge IGBT power
modules
Vishay Intertechnology, Inc. has
launched five new half-bridge IGBT
power modules in the updated INT-
A-PAK package, utilising Trench IGBT
technology. These modules cater to
different design needs, offering either
low VCE(ON) for reduced conduc-
tion losses or low Eoff for minimised
switching losses. Ideal for high-current
inverter stages
in transporta-
tion, energy,
and industrial
applications,
they feature
Trench IGBTs with Gen IV FRED Pt
anti-parallel diodes for soft reverse
recovery. The INT-A-PAK package is
compatible with the 34mm industry
standard, allowing easy replacement.
Vishay Intertechnology
https://www.vishay.com
DC/DC converters with
integrated inductors
RECOM’s new RPZ series of step-
down non-isolated DC/DC convert-
ers with integrated inductors are
designed for compact board spaces.
They fea-
ture flip-chip
technology,
up to 92%
efficiency, and
can operate at
high ambient temperatures, such as
125°C for the RPZ-1.0 with derating.
All models are protected against short
circuits, over-current, over-tempera-
ture, and input under-voltage. Typical
applications include imaging systems,
distributed power architectures, opti-
cal modules, and portable battery-
powered equipment in telecom and
industrial settings.
RECOM power
https://recom-power.com
RF fixed attenuators with
3.5mm connectors
Pasternack has launched its new RF
fixed attenuators with 3.5mm connec-
WWW.EFYMAG.COM

tors, designed to enhance RF signal
control in various applications. These
attenuators offer a wide attenuation
range from 0dB to 30dB, catering to
the demands of
modern RF systems
in telecommunica-
tions and aero-
space. With an op-
erational frequency
range up to 26GHz and capabilities
extending to 33GHz, they provide
unmatched accuracy and reliability
in high-frequency environments. Key
features include linear characterisation
for consistent amplitude and phase,
superior return loss performance for
reduced signal reflections, and en-
hanced system efficiency.
Pasternack
https://in.pasternack.com
Bluetooth LE-LR module
Infineon Technologies AG has unveiled
the CYW20822-P4TAI040, a Bluetooth
module designed for IoT and con-
sumer electronics. This cost-effective
module enhances
wireless connectiv-
ity with its support
for Bluetooth low
energy long range
(LE-LR), making
it suitable for a variety of applica-
tions including industrial IoT, smart
home devices, asset tracking, beacons,
sensors, and medical equipment. The
module offers features like Bluetooth
5.0 support, long-range connectiv-
ity, low power consumption, and a
compact size.
Infineon Technologies
https://www.infineon.com
WWW.EFYMAG.COM
NEW PRODUCTS
DC/DC modules with integrated
transformers
Texas Instruments has launched two
innovative power conversion de-
vice portfolios to enable engineers
to achieve higher power density in
compact spaces
while reduc-
ing costs. The
100V integrated
gallium nitride
(GaN) power stages feature thermally
enhanced dual-side cooled package
technology, providing industry-leading
power density exceeding 1.5kW/in³.
These 1.5W isolated DC/DC mod-
ules with integrated transformers set
industry standards as the smallest and
most power-dense solutions, signifi-
cantly reducing the size of isolated
bias power supplies in automotive and
industrial systems by over 89%.
Texas Instruments
https://www.ti.com
Fine-increment HF inductors
TDK Corporation has launched the
MHQ1005075HA series of inductors
for the automotive industry. These
inductors, designed for high-frequency
circuits in automotive applications,
feature a compact
size and a wide
range of inductance
values. Utilising the
company’s proprie-
tary design expertise,
the series employs a multilayer meth-
od for fine inductance increments and
offers a broad operating temperature
range. Meeting AEC-Q200 standards,
they ensure high reliability and safety
ELECTRONICS FOR YOU EXPRESS | APRIL 2024
in automotive environments. They
are ideal for high-frequency circuits
in automotive equipment, such as
telematics and V2X, as well as in radio
communications for smartphones,
tablets, and base stations.
TDK Corporation
https://www.tdk.com
Single-cell thermal printhead
ROHM’s KR2002-Q06N5AA thermal
printhead enables high-quality print-
ing with a single-cell Li-ion battery
(3.6V), reducing energy consumption
by 30%. This innovation meets the
growing demand
for efficient,
portable printers
in electronic
money transactions and mobile label-
ling. Unlike traditional 2-cell battery
printers, ROHM’s printhead offers
comparable print quality while being
more compact and energy-efficient. It
features a new design for optimised
heat element and protective film,
achieving 203 DPI resolution and
50mm/s printing speed with signifi-
cant energy savings.
ROHM
https://www.rohm.com
EMBEDDED
Development kit for RISC-V
Microchip Technology’s PolarFire SoC
Discovery Kit caters to the demand for
open source RISC-V architectures in the
embedded industry. It features a quad-
core RISC-V processor, 95k FPGA logic
elements, and multiple peripherals for
embedded processing and compute
acceleration. Supporting Linux and
17

real-time applications, the kit enables
firmware development, application
testing, and code programming and
debugging. The kit is based on the
PolarFire MPFS095T SoC FPGA, offer-
ing a 64-bit CPU
cluster, configu-
rable L2 memory,
AMP mode sup-
port, and various connectivity options
like MikroBUS, Raspberry Pi, and MIPI
video connectors. It also includes an
embedded FP5 programmer for FPGA
fabric programming and debugging.
Microchip Technology
https://www.microchip.com
Efficient edge computing FPGAs
AMD has introduced the Spartan Ul-
traScale+ FPGA family, enhancing its
FPGA and adaptive SoC range. These
devices, designed for edge applications,
offer an optimal I/O to logic cell ratio
for 28nm and smaller process tech-
nologies, ensuring cost and power ef-
ficiency. They feature
advanced security
measures, including
Post-Quantum Cryp-
tography, a physical
unclonable function,
and protection against differential pow-
er analysis, to safeguard against cyber
threats. With up to 572 I/Os, support
for voltages up to 3.3V, and compact
packaging options, these FPGAs are
ideal for edge sensing and control.
AMD
https://www.amd.com
SoC-powered SOM
MYIR has introduced the MYC-LT527
SoM, powered by the Allwinner T527
SoC, featuring an Octa-core ARM
Cortex-A55 CPU
(up to 1.8GHz),
a G57 MC1 GPU,
and a 2 TOPs
NPU for AI. It
includes 32kbit EEPROM, a PMIC, and
a 381-pin LGA interface. It supports
Android and is suitable for industrial
18 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS
NEW PRODUCTS
robots, energy systems, medical equip-
ment, etc. It also has a RISC-V CPU
(up to 200MHz). For evaluation, MYIR
offers the MYD-LT527 development
board with various interfaces for con-
nectivity and expansion.
MYIR
https://www.myirtech.com
Wi-Fi and Bluetooth
development board
The ADIY Ai WB2 12F dev-Kit is
designed for Wi-Fi and Bluetooth
modules, featuring a
BL602 chip that supports
Wi-Fi 802.11b/g/n and
BLE 5.0 protocols. With
276kB RAM and various
interfaces like SDIO and
UART, it is ideal for IoT,
mobile devices, and smart
homes. It offers security protocols like
WPA3, Bluetooth meh, and multiple
sleep modes for power management.
Suitable for IoT developers, educa-
tional institutions, and startups, it
supports universal AT commands and
integrates with Windows and Linux
environments.
ADIY
https://adiy.in
MANUFACTURING
EQUIPMENT
Piezo dispensing system
for biomolecules
VERMES Microdispensing has
launched the MDS 3080 series, a piezo
dispensing system for low to medium-
viscosity materials,
suitable for biomol-
ecules, 3D living
organ analogues,
protein solutions,
and DNA arrays.
It features micro-shot, contact-free jet
dispensing technology, a stable and
adjustable valve for precise handling,
interchangeable tappets for shot size
flexibility, and a modular design for
easy maintenance. The Bayonet fluid
box body design reduces downtime
during media changes. The highlight
of this system is its precision and ef-
ficiency for industrial production.
VERMES Microdispensing
https://www.vermes.com
TEST & MEASUREMENT
High-speed line inspection
system
Test Research, Inc. (TRI) intro-
duced the ultra-high-speed 3D AOI
TR7700QH SII, capable of inspecting
at speeds up to 80cm²/sec with excel-
lent Gauge R&R. This model features
AI-powered inspection algorithms,
metrology-grade
measurements,
and a 21MP
high-speed sen-
sor for imaging
resolution as fine as 15µm. It also
boasts multi-phase true-colour LED
lighting and quad digital fringe projec-
tors for 3D capabilities. Additionally,
TRI will present its multi-angle 3D
AOI TR7500QE Plus, designed to
detect hidden solder joint defects, the
enhanced 3D SPI TR7007Q SII, the
high-throughput 3D AXI TR7600 se-
ries, and the Multi-core ICT TR5001Q
SII INLINE.
Test Research, Inc. (TRI)
https://www.tri.com.tw/en
Digital storage oscilloscopes
The SIGLENT SDS3000X HD series
digital storage oscilloscopes offer
bandwidths up to 1GHz, with 12-bit
ADCs, and sampling rates up to
4GSa/s. They feature a maximum
record length of 400Mpts/ch, display-
ing up to 4 analogue channels and 16
digital channels.
Unique capabilities
include mixed signal
analysis, waveform
capture rates up to
200,000wfm/s, and a digital trigger
system with high sensitivity. The
series supports various measurement
WWW.EFYMAG.COM

and math functions, serial decoding,
and has a 25.7cm (10.1-inch) touch
screen for easy operation. Remote
control is possible via a built-in web
server.
SIGLENT
https://siglentna.com
12-bit vertical resolution
oscilloscope
Teledyne LeCroy has introduced the
WaveMaster 8000HD oscilloscope plat-
form, boasting bandwidths from 20 to
65GHz and 12-bit vertical resolution.
This platform enhances validation and
debug capabilities,
featuring the new
SDA Expert serial
data analysis soft-
ware for testing ad-
vanced serial data technologies. With
double the bandwidth and industry-
leading resolution and acquisition
memory, it is ideal for characterising
next-generation serial data technolo-
gies. Key features include doubling
bandwidth and sample rate, 12-bit res-
olution for PAM3 and PAM4 signals,
and 8Gpts of acquisition memory for
enhanced CrossSync PHY capabilities.
The SDA Expert software provides
comprehensive analysis for technolo-
gies like PCIe, USB, and DisplayPort,
along with QualiPHY test packages for
compliance testing.
Teledyne LeCroy
https://www.teledynelecroy.com
AI/ML data centre test platform
Keysight Technologies, Inc. has
launched the Keysight AI Data Centre
Test Platform to enhance innovation
in AI/ML network validation and op-
timisation. As AI usage grows across
industries, the demand for efficient
AI model training and delivery in-
creases, requiring high bandwidth and
computing performance. It addresses
this need by providing AI workload
emulation, benchmarking applica-
tions, and dataset analysis tools
to improve AI/ML cluster network
WWW.EFYMAG.COM
NEW PRODUCTS
fabric performance. It offers scalable
validation and experimentation for
data centre designs, supporting both
hardware load
appliances
and software
endpoints on
AI accel-
erators for benchmarking. It enables
sharing of AI/ML behavioural models
for reproducible experiments and
complements GPU testing for a more
robust AI testing platform.
Keysight Technologies
https://www.keysight.com/in
MISCELLANEOUS
Scalable RTLS for healthcare
CenTrak has introduced its BLE Mul-
ti-Mode Platform, a first-of-its-kind
scalable real-time loacting system
(RTLS) for healthcare organisations.
It combines BLE and clinical-grade
locating (CGL) for a versatile RTLS
infrastructure, enabling quick adop-
tion of services
like staff duress
and asset track-
ing. The platform
includes a du-
rable, long-lasting RTLS badge with
user notifications and customisable
buttons. Innovations in staff duress
feature a purpose-built badge with
real-time alerts and a ‘Follow’ func-
tion for location updates. The system
is easily implemented and maintained
through the ConnectRT platform.
These advancements in RTLS technol-
ogy enhance staff safety and patient
care in healthcare settings.
CenTrak
https://centrak.com
Autonomous machine/aerial
robot controller
The MRD5165 Eagle Kit from Mistral is
a controller platform for autonomous
machines and aerial robots. It features
an AI/ML processing engine, an
independent flight controller unit, and
ELECTRONICS FOR YOU EXPRESS | APRIL 2024
is equipped with a neural processing
unit (NPU), an image signal proces-
sor (ISP), a graphics processing unit
(GPU), and a low-power digital signal
processor (DSP). The
system supports com-
plex AI and deep learn-
ing applications with its
AI engine capable of 15
trillion operations per
second. It also includes
visual simultaneous localisation and
mapping (VSLAM) for environmental
mapping, computer vision capabilities,
and support for six concurrent cam-
eras. The platform offers multi-con-
nectivity and high-speed I/O options,
making it suitable for various robotics
and autonomous applications, all with
an energy-efficient design.
Mistral
https://mistral.ai
AI-powered PCB design tool
Flux has introduced the Flux Copilot,
AI-powered design assistant integrated
into a PCB design tool. This custom
trained LLM enhances the design
process by providing direct feedback,
advice, and analysis on hardware
designs. It under-
stands schematic
design intrica-
cies, including
component details and connections,
and uses conversational AI to assist
with part selection, compatibility,
schematic feedback, and design analy-
sis. It seamlessly integrates into the
design process, living in the comments
section of the project, making it a col-
laborative tool that reduces barriers to
entry for hardware designs. It enables
engineers to create higher-quality
hardware designs faster and more
cost-effectively. It offers educational
benefits for students and operations
engineers, enhancing productivity and
facilitating learning of circuit design
principles.
Flux
https://www.flux.ai/p
19
 TECH: MANUFACTURING

The Rise Of Advanced

PICK-AND-PLACE TECHNOLOGY
In Modern Manufacturing
From the integration of cutting-edge AI and IoT to innovations in miniaturisation and vision
systems, delve into the future where these machines streamline production processes and
redefine the efficiency and adaptability of assembly lines across industries

I
Written by EFY’s n the fast-paced world of manufacturing,
AKANKSHA SONDHI
GAUR, with inputs where efficiency and precision are para-
from SHAILENDRA mount, pick-and-place (PnP) machines
MATHUR, Business
Head - North & West, have emerged as the unsung heroes of the
and Product Manager assembly line. These sophisticated devices are
- Alternative Energy
Solutions, MaximSMT, instrumental in various industries, from elec-
and SHREYANSH tronics to food packaging, embodying the spirit
GUPTA, Manager -
Sales & Marketing, of innovation that drives modern production
DAIICHI JITSUGYO processes. But what makes these machines
India Pvt Ltd (DJK)
indispensable, and how are they evolving to
meet the demands of an increasingly complex
manufacturing landscape?
At the core of this evolution lies the chal-
lenge of miniaturisation and the ubiquitous
integration of electronics. As mentioned by
Shailendra Mathur, Business Head and Product
MaximSMT ASMPT X-Series, the benchmark wherever maximum speed and absolute
precision are required (Credit: https://www.maximsmt.com)
Manager (Alternative Energy Solutions),
MaximSMT, as components become smaller
and production demands soar, PnP ma-
chines are pushed to their limits, striving
for more incredible speed, accuracy, and
efficiency. But have you ever wondered how
these machines maintain such high preci-
sion in placing tiny components onto PCBs
or packing products with unerring accuracy?
The quest for optimal efficiency
A crucial aspect of enhancing production
efficiency is reducing setup and changeo-
ver times. These often-overlooked periods
can significantly impact a production line’s
overall efficiency. Every minute saved in
these processes translates into valuable
production time. But how are manufactur-
ers minimising these ‘hidden’ downtimes?
During a conversation with EFY’s
Akansha Sondhi Gaur, Shreyansh Gupta,
Manager and Sales Marketing, DJK empha-
sised that the verification process ensures
that every component is correctly placed,
aiming for zero wrong production. By
integrating advanced sensors and vision
systems, machines can automatically detect
and correct errors, significantly reducing
setup times. Even a tiny rejection rate can
have substantial financial implications in a
high-volume production.
How is the integration of IoT transform-
ing the way machines operate and com-
municate in the manufacturing ecosystem?
While hardware developments have their
limitations, software advancements are

20 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS WWW.EFYMAG.COM


revolutionising PnP technology.
Integrating artificial intelligence (AI)
and machine learning (ML) enables
machines to learn from patterns,
predict maintenance needs, and opti-
mise production processes. This shift
reduces downtime and enhances
overall equipment efficiency (OEE).
But what does the future hold for
AI and ML in manufacturing? The
move towards ‘black room technolo-
gy’—fully automated, robot-assisted
production lines—minimises human
error and increases efficiency. The
industry is shifting towards more ef-
ficient, error-free manufacturing by
relying on robotics. The integration
of Industry 4.0 standards is creating
an interconnected ecosystem where
machines communicate and make
data-driven decisions. How are these
advancements shaping the future of
manufacturing?
Critical advancements
Enhanced precision and speed. Mod- mounting capability with a maxi-
ern PnP machines have sophisticated
servo motors and control systems,
allowing for the precise placement of
tiny components at unprecedented
speeds. Companies like Yamaha
and Juki are at the forefront of this
technology. Yamaha Motor’s Z:TA-R
YSM40R and Juki Corp’s RX-8 are
both known for their high placement
JukiFast smart modular mounter (Credit: https://www.juki.co.jp)
22 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS
TECH: MANUFACTURING
Panasonic AM100 modular placement machine
(Credit: https://djkeurope.com/en)
rates and compact designs. Neodon’s
machine has repeat position ac-
curacy of ±0.01mm. ASMPT’s PNP
machine has a placement accuracy
of ±41μm/3σ. The Yamaha YSM20R
is a model that exemplifies this
advancement. It boasts a high-speed
mum speed of 90,000 CPH (compo-
nents per hour), making it one of the
fastest in its class. This is achieved
through innovations such as high-
speed rotary heads and optimised
motion algorithms.
Miniaturisation of PNP heads.
Efforts are being made to create
smaller and more efficient PNP
heads. This includes
experimentation with
different types of pumps
and suction mechanisms
to optimise the pick-
and-place process. For
example, using micro
blowers and adjustments
in the pick-up tool area
can enhance the ma-
chine’s ability to handle
different component
sizes and weights. The
Panasonic AM100 modu-
lar placement machine
stands out in the realm
of electronic component
placement technology, fea-
turing a cutting-edge super
multi-14-nozzle head. This
innovative design not only
emphasises productivity but
also versatility, allowing for
the efficient mounting of
components up to 14mm in
size at remarkable speeds.
Improved vision sys-
tems. Integrating advanced
vision systems has signifi-
cantly improved component
recognition and placement
accuracy. With real-time
adjustments based on vision
system feedback, machines
can now handle various
components. The Neoden 8 PnP
machine features innovative camera
systems for improved calibration
and accuracy, while the Mycronic
MY300 is noted for its intelligent
feeder solution that enhances ef-
ficiency and productivity
Increased flexibility. The modu-
lar designs and interchangeable tool
heads of modern PnP machines of-
fer unparalleled flexibility, allowing
for quick reconfiguration for differ-
ent tasks. This adaptability is crucial
for responding to changing market
demands. The ASM SIPLACE TX
series, for example, is designed for
extreme precision, catering to the
demands of industries like electron-
ics where component sizes continue
to shrink. These machines use mul-
tiple cameras and real-time feedback
systems to adjust placements in real
time, ensuring high accuracy.
Integration of artificial intelli-
gence. AI transforms PnP systems by
enabling them to learn and improve
over time. This self-improvement
capability marks a significant leap
forward in automation technology.
The Juki RS-1R incorporates AI to
automatically recognise components
and adjust its pick and place pa-
rameters in real time, which greatly
enhances the machine’s setup time
WWW.EFYMAG.COM

and flexibility for different produc-
tion jobs.
Collaborative robotics. The
emergence of collaborative robots
(cobots) has introduced a new
dimension to PnP technology,
enabling machines to work along-
side humans safely. This collabora-
tion opens up new possibilities for
custom packaging and small-batch
assembly. The UR5e by Univer-
sal Robots excels in various pick
and place tasks due to its medium
payload and long reach, offering
flexibility and precision. Techman
Robot’s TM5, featuring integrated
vision and easy programming, is
ideal for object recognition and
sorting in similar tasks. ABB’s YuMi,
targeting small parts assembly, has
dual arms that operate both together
and separately, ensuring high preci-
sion and safe human interaction.
Enhanced connectivity and IoT
integration. The integration of IoT
technology allows PnP machines to
communicate with other machines
and systems, improving process inte-
gration and data analytics. There’s a
trend towards using open source soft-
ware like OpenPNP to retrofit existing
PnP machines. This approach offers
greater flexibility and better software
support than proprietary systems.
However, this can sometimes come at
AM100 single-beam, single-head placement machine
(Credit: https://na.panasonic.com/us)
24 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS
TECH: MANUFACTURING
Maxim SMT SIPLACE SX1/SX2 (Credit: https://smt.asmpt.com/en)
the cost of reduced speed or precision, norm. This journey into the future
which highlights the importance of
optimising software settings for each
specific machine.
Sustainability. With a focus on
sustainability, newer PnP machines
are designed to be more energy-
efficient and reduce waste, aligning
with global environmental goals.
Redesign of component feeders.
Feeder design innovations enhance
PnP machines’ efficiency and
precision. For instance, redesigning
tape feeders to fit more tightly and
lock solidly has been a focus. This
includes using flexures to improve
the feeder’s functionality, espe-
cially when 3D-printed. The Maxim
SMT machine has feeder capacity
SIPLACE SX1/ SX2: 120 slots with
8mm X feeders.
The Panasonic AM100 comple-
ments its advanced nozzle technol-
ogy as the machine is equipped with
four feeder carts capable of
accommodating up to 160
feeders. This high feeder
capacity ensures that the
AM100 can handle various
component types and sizes,
making it an adaptable solu-
tion for various electronic
manufacturing needs.
The evolution of pick-and-
place machines is a testament
to the relentless pursuit of
efficiency and precision in
manufacturing. As we look
to the future, it is clear that
the integration of advanced
technologies like AI, ML, and
IoT will continue to
shape the landscape
of industrial produc-
tion. The convergence
of hardware and soft-
ware advancements
enhances produc-
tion capabilities and
paves the way for a
future where intel-
ligent factories are the
of manufacturing is not just about
adopting new technologies but re-
imagining what can be achieved on
the production floor. These advance-
ments indicate a move towards more
versatile, efficient, and user-friendly
PnP machines capable of adapting
to various production environments
and requirements.
The advancements in pick-and-
place machine technology signify
a leap forward in manufacturing
automation. High-speed operation,
enhanced precision, AI integra-
tion, improved user interfaces, and
robotic integration are just a few of
the developments that have made
these machines more efficient, flex-
ible, and indispensable to modern
production lines. Models such as the
Yamaha YSM20R, ASM SIPLACE TX
series, Juki RS-1R, Mycronic MY700,
and Universal Robots UR3e exempli-
fy these advancements, showcasing
what is possible when cutting-edge
technology is applied to solve tra-
ditional manufacturing challenges.
As technology continues to evolve,
we can expect further innovations
in pick-and-place machines that will
continue to push the boundaries
of what is possible in automated
manufacturing.
This article incorporating significant contribu-
tions from Shailendra Mathur of MaximSMT and
Shreyansh Gupta of DJK has been authored by
Akanksha Sondhi Gaur, a technophile at EFY having
a German patent. She has an interest in writing on
subjects concerning electronics, and has authored
an array of research papers
WWW.EFYMAG.COM
 TECH: CAREERS
ASSISTIVE AI: Semiconductor Design,
Manufacture, And Workforce
Together, human intelligence and AI create a powerful synergy, highlighting the vital lesson
for the semiconductor workforce: adapt to new technologies
Assistive AI refers to artificial
intelligence systems that
CHETAN ARVIND support and enhance human
PATIL, Senior capabilities, particularly in
Product Engineer
at NXP USA Inc. decision-making, problem-
solving, and efficiency
improvement tasks
AI transformation in
semiconductor industry also
offers a valuable takeaway for
the semiconductor workforce: the
importance of adapting to and
embracing new technologies
T
he relationship between semicon-
ductors and artificial intelligence
(AI) is symbiotic and transforma-
tive. Semiconductors, the backbone of
all modern electronics, have played a
crucial role in developing and proliferat-
ing AI technologies. At the same time,
AI has increasingly influenced how
semiconductor products are designed
and manufactured. This mutual growth
cycle promises to push the boundaries
of endless possibilities in technology,
WWW.EFYMAG.COM
Assistive AI can provide
the silicon design
team with a rich set of
information and assistance
that can greatly reduce
the time taken to complete
manufacturable designs
In semiconductor manufacaturing,
assistive AI will bring efficiency,
innovation, and precision by
further streamlining processes,
reducing errors, and accelerating
development cycles
leading to faster, more innovative, and
more efficient products.
Building on this foundation, out of
all the AI capabilities today, assistive
AI emerges as a pivotal solution for the
semiconductor industry, propelling it into
a new era of efficiency and innovation.
Also, as the complexity of semiconductor
product design manufacturing increases
further, with ever-smaller and ultra-
advanced technology process nodes,
traditional semiconductor design and
ELECTRONICS FOR YOU EXPRESS | APRIL 2024 25

manufacturing methodologies begin
to falter. It is where assistive AI
steps in to bridge this gap.
What is assistive AI
Assistive AI refers to artificial intel-
ligence systems that support and
enhance human capabilities, partic-
ularly in decision-making, problem-
solving, and efficiency improvement
tasks. Unlike fully autonomous
AI systems that operate indepen-
dently, assistive AI works alongside
humans, providing insights, recom-
mendations, and automation of
routine tasks to augment human
skills and expertise.
In various industries, specifically
in the semiconductor sector, assis-
tive AI can play a critical role by
analysing complex data sets, predict-
ing outcomes, optimising processes,
assisting in routine tasks, summa-
rising information, and identifying
potential issues before they become
problematic. This assistance can
range from offering silicon design
suggestions in the early stages of
semiconductor development to opti-
mising manufacturing processes and
improving quality control on the
production line. The opportunities
are unlimited.
Out of all the possible positive
impacts of assistive AI in semicon-
ductor product development, the
two that will stand out are:
Efficiency and productivity.
Assistive AI will enable semi-
conductor teams by offering novel
insights into different process steps.
During design, it could be about
capturing previously developed
silicon blocks, searching through
an extensive design database, and
then summarising or even creating
the new development blocks. After
this, an experienced silicon designer
can adapt, decide whether it meets
market/customer requirements, and
then enhance it accordingly.
Thus, overall, it will bring im-
26 APril 2024 | Electronics For You express
Tech: careerS
Strategic Description
Strategy Description
Embrace AI for • Learn and understand how assistive AI can help with complex simulations,
enhanced problem analyses, and other time-critical tasks
solving • Leveraging the ability of assistive AI to innovate can enable faster development
Upskill and reskill • Engage in continuous learning of assistive AI technologies and methodologies
• Acquire skills in assistive AI integration to guide design and manufacturing
processes
Augment creativity • Apply assistive AI to explore design/manufacturing possibilities
and innovation • Identify novel solutions, leading to breakthroughs in semiconductor technology
Improve efficiency • Use assistive AI to automate routine tasks
and productivity • Focus on utilising assistive AI-driven insights for faster, more informed techni-
cal decision-making
Hands-on AI pro- • Gain practical experience by working on assistive AI projects
ject experience • This could involve using assistive AI for design optimisation, process simula-
tion, or data analysis
Innovative busi- • Deploy assistive AI to identify and develop new business plans
ness models • Explore new services by brainstorming with the trillions of data points assistive
AI has access to
Adapting to • Be open to adapting existing workflows to incorporate assistive AI tools and
AI-enhanced methodologies
workflows • This may involve rethinking processes to take full advantage of assistive AI's
predictive analytics, automation capabilities, and decision support systems
Stay informed on • Regularly follow publications, journals, and news related to assistive AI
industry trends advancements and their applications in the semiconductor industry
• Staying informed helps in anticipating changes and identifying opportunities for
innovation
Promote an AI- • Advocate for a positive perception of assistive AI within the organisation
positive culture • Encourage discussions about assistive AI’s potential to enhance job perfor-
mance, not replace it, highlighting success stories and potential growth areas
Identify AI integra- • Analyse current engineering processes to identify areas where assistive AI can
tion points be integrated to improve efficiency, accuracy, or outcomes
• This strategic identification helps in prioritising assistive AI adoption areas for
maximum impact
proved efficiency and better produc- the queries, thus not only sav-
tivity by assisting experienced and ing time but also making it more
skilled engineers by routinely taking focused and domain-specific. Such
over mundane tasks. a learning process will be more
Learning and development. crucial for new hires who can on
There are always problems that the go also develop custom learn-
require revisiting the fundamen- ing programs based on the data
tals of design and manufacturing. presented.
Instead of searching through heaps Hence, it enables more helpful
of data, an assistive AI can speedily learning and development for semi-
enable domain-specific learning on conductor engineers.
the go.
Imagine a silicon designer work- Assistive AI workforce
ing on a next-gen AI SoC and need- Introducing assistive AI into the
ing to revisit some memory and semiconductor workforce can often
data pipeline fundamentals. Instead stir employee concerns about job
of going through the internet and security and the potential for AI
books, an assistive AI embedded to replace human roles. However,
inside the EDA tool can answer all when leveraged effectively, assis-
www.efymag.com
 TECH: CAREERS
tive AI can be a powerful tool for enhancing job
performance, creating new opportunities, and
augmenting workforce capabilities. By strategi-
cally integrating assistive AI into their workflow,
semiconductor engineers can improve their
productivity and innovation and carve out new
career opportunities for themselves.
How a semiconductor engineer can do it is
shown in the table.
This strategic approach can help semicon-
ductor engineers become assistive AI-ready,
enabling them to embrace AI as a tool for ad-
vancement rather than viewing it as a threat to
their careers.

Future of AI in semiconductor
In the semiconductor advancements landscape,
AI is transitioning from mere participant to a core
facilitator, heralding a new era of innovation and
efficiency. Assistive AI stands at the forefront of
this evolution, bridging the complexities of semi-
conductor design and the demands of modern
technology.
By integrating AI more deeply into semicon-
ductor processes, the semiconductor industry
can anticipate a significant acceleration in the
pace of development and a leap towards a more
intelligent, energy-efficient, and productive
way to develop next-gen silicon chips. As the
semiconductor industry stands on the cusp of
an AI-centered transformative phase, it is getting
evident that the future of AI in semiconduc-
tors is not just about enhancing capabilities but
about redefining the boundaries of what is pos-
sible, making the concept of assistive AI not just
an aspiration but a critical pathway to the next
semiconductor technology revolution.
This transformation also offers a valuable
takeaway for the semiconductor workforce: the
importance of adapting to and embracing new
technologies. As AI becomes more integrated
into semiconductor design and manufacturing
processes, professionals in the field must acquire
new skills and knowledge to work alongside
these advanced systems. This shift is not about
replacing human expertise but augmenting it,
ensuring that the workforce remains relevant and
can contribute to exciting advancements. The
synergy between human intelligence and assis-
tive AI holds the key to unlocking unprecedented
levels of efficiency, creativity, and growth in the
semiconductor industry.

WWW.EFYMAG.COM ELECTRONICS FOR YOU EXPRESS | APRIL 2024 27

 electroons 2.0
Janardhana Swamy

Do not you see? It is not just a robot’s problem, I am bald too!

I should not have blindly accepted when they

told me it is a job on cutting-edge technology!

Sir, the robot we sent to the Moon is now

refusing to come back!

No marks in this Digital Electronics class.

Either you PASS or FAIL!

I am confused about the creator. God created man, I now understand your rusting problem.
man created us, and we create God! You just need lots of iron supplements!

28 APril 2024 | Electronics For You express www.efymag.com

 Electroons 2.0

When I grow up, I want to become the Prime Minister!

True, I do not do any work. I just watch TV all
the time. Go talk to your son who programmed me!

I am a new python programmer in the town.

Yes, it is a self-driving car. I drive it myself!
How do you do?

Getting married is an easy part. But who will Congratulation! The company now allows us to
be the husband and who will be the wife? Work From Home!

www.efymag.com Electronics For You express | April 2024 29

 STRATEGY

India’s Electronic Components’ Production Expected to Reach $18 Million by FY 2026

India’s current production of electronic components is valued at $11 billion and expected to reach $18 billion by FY26. The rollout of 5G networks and IoT,
along with initiatives like ‘Digital India’ and ‘Smart City’ projects, are driving the accelerated adoption of electronics. The overall electronics market is
valued at $155 billion, with domestic production accounting for 65%.
Uttar Pradesh
($230 bn)
Haryana
($110 bn)
Key Clusters/Hubs

1. NCR: Noida, Greater Noida,

Gurugram
Maharashtra ($400 bn)
2. Tamil Nadu: Sriperumbudur
Telangana
3. Andhra Pradesh: Tirupati, Kadapa ($140 bn)
4. Maharashtra: Pune
5. Karnataka: Bengaluru, Mysore
Andhra Pradesh
6. Telangana: Hyderabad ($150 bn)
Karnataka
($250 bn)

Tamil Nadu ($260 bn)

(Source: www.investindia.gov.in)

India Hearables’ Market Jumped by 34% in 2023
as Efficient Devices Became Affordable
India’s true wireless stereo (TWS) market grew by 34% YoY in 2023,
driven by ease of use, a wide range of options, and a 14% drop in the
average selling price to around `2000. boAt led the market, while
Noise and One Plus saw fastest growth. The domestic manufacturing
grabbed 62% of market share, with top brands focusing on local
production. Active noise cancellation based devices saw 76% growth,
becoming more accessible in entry-level brands.
India’s Online TV Shipment Rise to 44%
Amid Global Decline
In India, smart TV shipments grew in Q3 2023, with the online
channel’s share rising to 44%. Xiaomi led the market, followed
by Samsung and LG. The 81.3cm (32-inch) smart TV segment is
leading the market, but its share is declining. Larger screen sizes,
especially 140cm (55-inch) and above, share is growing. Globally,
TV shipments dropped by 3% in 2023, totaling 223 million units.
Premium TV shipments fell by 1% but increased their market share
to 10%, with significant growth in China, driven by a shift towards
MiniLED LCD TVs and aggressive pricing.

boAt
Others

Boult Mi

Noise LG

TCL
Oneplus
Hisense

MIVI
Samsung

(Source: Counterpoint Research) (Source: Counterpoint Research)

30 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS WWW.EFYMAG.COM

 STRATEGY

At-a-glance view of key industry trends that

can shape the future of your business…

India’s AI Market to Reach $17 billion by 2027 India RE Generation Rose by 15.5% in February,
India’s AI/ML job market grew by 15%, with AI Engineer positions $500 million Invested
increasing by 70%, last year. The Indian AI market is expected to reach In February 2024, renewable energy (RE) generation in India reached
$17 billion by 2027, with AI talent demand to grow at a 15% CAGR. 14,580 million units, a 15.5% increase from January 2024. The sector
Improved data engineering practices, powerful AI chips, optimised raised $500 million during the month. Solar and wind generation rose
algorithms, and user-friendly interfaces are driving this growth. India ranks by 17.7% and 16.9%, respectively. In January 2024, the country added
fifth globally in AI investments, receiving around $4 billion in 2022-23. 1020MW of solar capacity and 233MW of wind capacity. Solar energy
accounts for 41% of the country’s 182GW RE capacity, followed by large
hydro (26%) and wind (24%). Maharashtra led in solar installations with
25-35%
624MW, while Karnataka added the most wind capacity at 272MW.
CAGR

15-17%
23-25%
23-25% 18-20%
15-17% Solar
7-9%
10-12% 13-15%
9-11% 14-16%
8-10%
9-11% 11-13% 9-11%
Wind
2023 ($7-9 bn) 2027E ($17-22 bn)

BFSI Tech Services

Other
Tech (Products and Startups) Manufacturing RES
Others
Public Sector
Media

(Source: https://web-assets.bcg.com) (Source: JMK Research)

India’s Solar Capacity Installation Down by 44.1%, Delayed Projects to Add to 2024 Installations
In 2023, India’s solar capacity installations decreased by 44.1% to 7.5GW, with solar power contributing 48.5% to new power capacity additions. The
slowdown was due to project delays caused by land and transmission issues, leading to extensions for large-scale solar and hybrid power projects.
Module oversupply in China resulted in a decline in solar module prices. Large-scale solar installations dropped by 50.8% YoY to 5.8GW.

16,000 80,000
Annual Large-Scale Solar Installations (MW)
Annual Rooftop Solar Installations (MW)
Cumulative Solar Installations (MW)

0 0
2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023

(Source: Mercom India Research)

WWW.EFYMAG.COM ELECTRONICS FOR YOU EXPRESS | APRIL 2024 31


1 Tsuyo’s Innovative Motor Design
Revolutionises Conventional Methods
TSUYO’S INNOVATIVE MOTOR DESIGN
1 REVOLUTIONISES CONVENTIONAL METHODS
This startup’s motors utilise ferrite magnets instead of rare earth magnets. The aim is to partner
with at least 500 car companies over the next five years
E-axle
T
suyo Manufacturing, founded
in 2020 by three young entre-
preneurs (Vijay Kumar, Lalit
Baid, and Tripurari Kumar), is a
Greater Noida-based EV startup. The
founders are serial entrepreneurs
and successful professionals from
India’s top premier institutions like
NITs and IIMs/SPJain/IIFT.
The startup manufactures
electric motors and controllers for
electric vehicles, and they claim
to supply them to many OEMs in
three-wheeler (low speed and high
speed), four-wheeler, and off-road
vehicle segments. Within one-and-
a-half years of its establishment,
the startup has managed to receive
funding from Ramkrishna Forgings
of $12 million to support the next
five years of expansion and growth.
They have used numerous pat-
32 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS
STARTUPS
& INNOVATORS
2 Startup Karkhana IO Reinventing
The EMS Wheel In India
Off-Road EV motor
terns to design motors. For current
supplies, the company is engaged
in producing BLDC, PMSM, and AC
synchronous electric motors for vari-
ous applications as per customer
end usage and requirement. One
notable technology is the perma-
nent magnet-assisted synchronous
reluctance motors (PMaSynRM), as
well as ferrite-based and rare-earth
free magnet design. Additionally,
SRM-based and axial flux motors are
a few new technological frontiers
the company is working upon.
“Our designs incorporate new
processes and materials, replacing
conventional usage of BoM compo-
nents in the construction of motors
like Si-Fe-based motor lamination
and new impregnation techniques
and winding techniques. These
innovations have led to substantial
3 Datoms Revolutionising OEMs
With Smart And Connected Products
Smart Controller
enhancements in power and perfor-
mance. Moreover, advancement in
drive technology involves the imple-
mentation of various algorithms and
optimisation techniques, along with
controller strategies that improve
motor performance within an inte-
grated system,” shares Vijay Kumar,
Co-Founder of Tsuyo Manufacturing.
This startup also helps in vehicle
conversion. “The conversion process
extends the vehicle’s lifespan, as it
can be used beyond the typical 10
to 13 years and reduces emissions
by avoiding the purchase of a new
vehicle. We are involved in conver-
sion projects for commercial vehicles,
three-wheelers (such as those from
Bajaj, Tata, and Mahindra), and even
diesel forklifts. We also undertake
conversion projects for excavators
and smaller vehicles like skid steer
WWW.EFYMAG.COM

loaders, contributing to low carbon
footprint initiatives,” shares Kumar.
They convert vehicles by conducting
integration testing, validation, and
installation in their factory. After the
initial conversion, the interested party
takes the vehicle to government agen-
cies for licensing and approval.
Tsuyo also offers training and
guidelines for conversion to other
companies interested in this process.
“We also provide ongoing support
and guidance for any operational
challenges or further assistance
needed. Additionally, we arrange to
procure other components like batter-
ies and chargers from the market, ini-
tially integrating them into the vehicle
and later allowing the companies to
source these components from differ-
ent suppliers,” says Kumar.
They already claim to have two
manufacturing units in Greater
Noida, one focusing on motor wind-
ings and the other on assembly. They
are also establishing a third unit in
Karnataka, South India, which will
be operational by the end of Decem-
ber this year.
Interestingly, they are leveraging
partnerships with educational insti-
tutions too. With NIT Nagpur, they
Startup karkhana io Reinventing
2 The EMS Wheel In India
EMS is a capital-intensive industry, and hence, with the strongest clashes. Then how is a startup,
Karkhana IO, on its way to clock a revenue of `1 billion this fiscal? The founders explain!
R
einventing the wheel in
the EMS industry is rarely
discussed due to high capital
costs involved. Thanks to its unique
business model, Karkhana IO made
`200 million last fiscal and aims for
`1 billion this year. Sonam Motwani,
Founder, and Karthik MC, CRO,
Karkhana IO, told EFY’s Mukul
Yudhveer Singh that their electron-
34 APril 2024 | Electronics For You express
strategy: Innovators
Vijay Kumar, Co-Founder, Tsuyo Manufacturing
have collaborated on power electron-
ics projects under the mentorship of
Professor Kesari, supporting stu-
dents, interns, and PhD candidates
while contributing to new research
initiatives. They work with NIAMT
Ranchi to develop new materials for
motor components. Additionally,
Tsuyo has a three-year MoU with IIT
Delhi and is an industry partner in
a government-funded project there,
with a budget of 20 million rupees.
They are designing a complete indig-
enous motor with the IIT Delhi team
for this project, planning to launch it
in the market once completed.
ics manufacturing services (EMS)
startup aims to support medium and
small industries (MSMEs) and other
electronic product startups on the
supply side.
“By supply, we mean the supply
of manufactured electronics and so-
lutions. In India, the demand for fin-
ished electronic goods is more than
the supply of the same. This is what
Tsuyo Manufacturing is ex-
panding its product line to include
gearboxes and axles, complement-
ing its existing motor and controller
offerings. The company has formal-
ised the design for these products
and is preparing to launch produc-
tion through its investor partner’s
factories. Also, they claim to have
designed additional components,
such as display circuits. The com-
pany seeks a manufacturing partner
to produce this design as a package.
Tsuyo Manufacturing plans to offload
assembly and packaging to vendors
who supply the components for inte-
gration with their motors.
Overall, they reported a remark-
able 300% growth in the second year
of operations. For the immediate
future, “we remain optimistic about
achieving a growth rate of 50% this
year due to interim expansion and
many changeovers and transforma-
tion and gearing up for the bigger
leap in coming years. We focus on
automating production lines and
expanding our operations to enhance
efficiency. We aim to partner with
at least 500 car companies over the
next five years,” concludes Kumar.
—Nitisha Dubey
we aim to solve,” says Motwani.
Karkhana IO has partnered with
over 500 EMS companies. Simply
put, the startup connects these com-
panies with customers who have a
demand for custom-built solutions.
In the process, the responsibility of
quality and delivery of solutions is
completely that of the startup. How-
ever, it does not get involved in any
www.efymag.com
 strategy: Innovators

India’s

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Magazine
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Sonam Motwani and Karthik MC of Karkhana IO

product design level discussions. Increased demand for plug and

Electronics For You magazine is
available at all top news-stands/outlets
in India. But if you are facing problem in
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call Akhilesh Yadav on +91-8800295612 or
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“Though our contribution to the
customer is limited to manufactur-
ing, we do suggest design changes
when we think that the same will
lead to better manufacturing prow-
ess. We don’t take any onus on
selecting components. In case if a
few components are unavailable, we
do suggest the replacements for the
same. The decision-making lies with
the customer,” explains Karthik MC.
Having reported revenue figures
of `200 million last fiscal, the found-
ers of the company are positive that
Karkhana IO’s revenue this fiscal
will be in the vicinity of `1 billion.
For the next fiscal, which they have
started taking orders for, they are
targeting a pipeline of `3 billion. The
startup makes margins between the
prices it gets the products manufac-
tured at and at the prices it supplies
to the companies.
Battery packs, charging infra-
structure, IoT-based consumer elec-
tronics, medical electronics, drones
and aerospace components are the
categories that the startup says it is
the strongest in.
play solutions is the biggest trend
that the founders are witnessing in
India’s EMS space. “Initially, we saw
a lot of traction for sub-assemblies
and component level work. Things
are different now,” Motwani says.
For example, the startup is now
connecting companies, which earlier
partnered with it for battery cases
manufacturing, to do complete bat-
tery manufacturing.
Motwani adds, “In the four in-
dustries we spoke about earlier, we
are working with companies gener-
ating revenues in the `500 million
to `10 billion bracket. In terms of
age, we are working with startups,
and also working with companies
that are as young as 20 years. The
ratio is 45 for startups and 55 for
MSMEs.”
According to a report by Mordor
Intelligence, the global EMS mar-
ket size is estimated at US$580.52
billion in 2024, and is expected to
reach US$773.22 billion by 2029,
growing at a CAGR of 5.90% during
the forecast period (2024-2029).
—Mukul Yudhveer Singh

36 APril 2024 | Electronics For You express www.efymag.com


Datoms Revolutionising OEMs
3 With Smart And Connected Products
Datoms, a deeptech IoT startup based in Bhubaneswar, enhances machines to make them smarter,
thereby improving customers’ lives and helping OEMs take their products to the next level
I
ndia has experienced significant
technological advancements in re-
cent years, with a notable rise in
the smartification of products ranging
from home appliances to vehicles.
Amiya Samantaray, the Co-founder,
and CEO of Datoms, recognised this
trend and established the startup in
Bhubaneswar with the goal of as-
sisting manufacturers in their digital
transformation efforts.
Started in 2021, Datoms was
conceived to support manufacturers
during Covid-19 by improving services
and warranty verification processes
through data accessibility. Initially, the
company focused on the power sector,
targeting generators and compressors,
and later expanded to solar, UPS, in-
verters, electric vehicles, and automo-
tive. With deployments across different
sites, Datoms provides real-time infor-
mation for manufacturers to better un-
derstand their customers and products.
Datoms offers software components
for OEMs to build connected products,
serving as a one-stop solution.
This startup offers products with
three key components. First, a hard-
ware device with connectivity options
like 4G LTE, NB IoT, or Wi-Fi is in-
stalled inside machines. It sends data
to the cloud via a SIM card, facilitat-
ing data capture. Second, the cloud
platform, an IoT software, analyses
the received data, providing end
customers with a dashboard view or
UC Analytics. The third component is
the business access layer, part of the
Datoms platform, dedicated to OEMs,
service partners, and leasing compa-
nies, helping them manage customers,
service results, and leasing.
“The subscription cost for access-
38 APril 2024 | Electronics For You express
strategy: Innovators
Amiya Samantaray, Co-founder and CEO, Datoms
ing Datoms’ services varies from 100
to 2000 rupees, depending on the
type and volume of the machine.
Monthly plans are available for
customers with over 1000 or 10,000
machines, while annual plans are
offered for others,” shares Amiya.
Datoms provides hardware for
EVs to connect to its platform,
enabling OEMs to offer smart, con-
nected products. They manage bat-
tery health, services, etc, across all
EVs and offer customisable software
features for different customer seg-
ments. Datoms enable bulk firm-
ware updates based on customer
use and provide a connected leasing
platform for businesses and indi-
viduals to start EV leasing services.
“We aim to accelerate EV adoption
by supporting OEMs and leasing
companies. We are also planning
to onboard charging stations and
battery/power backup system OEMs
within the next six months,” says
Amiya.
Datoms supports micro-entrepre-
neurs and midsize companies lacking
leasing technology, empowering more
players to offer services in various
cities and preventing monopolies by
democratising this technology.
If the company already has
hardware or a BMS, Datoms provides
software solutions, as its platform is
hardware-agnostic. This flexibility
allows companies to broadcast data
to Datoms’ platform and offer leasing
solutions or sell bikes through the
platform, says Amiya.
“For startups developing EVs
without telematics hardware, Datoms
can provide the necessary hardware.
This approach eliminates the need
for companies to invest in hardware
and software development, enabling
them to bring products to market
faster and with more control over
features,” adds Amiya.
The startup claims its products
are 100% made in India, although
some supply chains rely on China.
“The product is designed, its PCB
and core board are manufactured,
and the final assembly is conducted
in India. However, we depend on
China for some components, along
with Taiwan,” informs Amiya.
While discussing data security,
Amiya shares that it involves differ-
ent layers, including data in motion
(transmitting data) and data at rest
(stored data), which we secure using
end-to-end encryption.
The startup aims to achieve a rev-
enue of `500 million within the next
two years. They target IoT sensor and
gateway manufacturers and system
integrators capable of deploying the
solution on the customer side.
—Nitisha Dubey
www.efymag.com
 industry News industry Updates
Government approves three semiconductor plants;
investment pegged at `1260 billion
The Indian government has approved setting up
of three semiconductor plants in India with a total
investment of `1260 billion. Micron Technology’s
plant in Sanand, Gujarat, is expected to deliver its
first chip by December 2024. Tata Electronics Pvt Ltd
and Powerchip Semiconductor Manufacturing Corp
(PSMC) are setting up a fabrication unit in Dholera,
Gujarat. CG Power, Renesas Electronics Corporation,
and Stars Microelectronics are establishing an OSAT
facility in Sanand, Gujarat. All three units will start
construction within the next 100 days.
Cabinet approves `750 billion solar rooftop subsidy scheme
The Indian government launched the PM-Surya Ghar:
Mufti Bijli Yojana with a budget of `750 billion to sup-
port the installation of rooftop solar systems and provide
up to 300 units of free electricity monthly to 10 million
people (on the move)
Intel appoints Justin Hotard as Executive VP and gm of
Data Centre and AI Group
Intel Corporation has appointed Justin Hotard
as the Executive Vice President and General
Manager of its Data Centre and AI Group
(DCAI), effective February 1. With over 20
years of experience in the computing and data
centre businesses, Hotard will oversee Intel’s
data centre products, including the Intel Xeon
processor family, GPUs, and accelerators.
He joins Intel from Hewlett Packard Enterprise (HPE), where
he served as Executive vp and gm of High-Performance
Computing, AI, and Labs.
BluSmart appoints Aditi Shukla as President, Corporate
Development
BluSmart, an electric vehicle (EV) ride-hailing
service and EV charging infrastructure
network, has appointed Aditi Shukla as
President of Corporate Development.
Shukla will lead strategic initiatives,
including fundraising, partnerships, and
growth opportunities. With experience
from Rothschild Investment Banking, Cipla, and Google
India, she brings expertise in corporate strategy and business
development.
40 APril 2024 | Electronics For You express
Representational image
households. Government will cover 60% of the system
cost for 2kW systems and 40% for systems between
2kW and 3kW, with a cap of 3kW. It will create 1.7 mil-
lion direct jobs in various sectors.
Delvitech appoints Stilianos Pelagidis
as Sales Manager, EMEA Region
Delvitech, a provider of AI-driven solutions
for automated optical inspection of
electronic board assemblies (PCBs), has
appointed Stilianos Pelagidis as the lead
sales manager for the Europe, Middle
East, and Africa (EMEA) region. With over three decades of
expertise in the electronics manufacturing industry, Pelagidis
has a track record of successful national and international
clientele. His appointment is a strategic move towards
Delvitech’s market expansion in Europe, contributing to the
company’s transition from startup to industrial player.
Quantum Circuits appoints Ray Smets as CEO
Quantum Circuits, Inc. has appointed Ray Smets as its
President and Chief Executive Officer. With
over thirty years of experience in high-
tech executive business leadership, Ray
has a track record of building and leading
teams in computing, data centre, and
networking technologies. He holds over ten
international patents for mobile networking
technology. Ray has led large-scale
operations and driven growth at companies like Cisco, A10
Networks, Motorola, and AT&T.
www.efymag.com
 industry news
INTERNATIONAL news
Infineon Technologies sells manufacturing sites to ASE
Infineon Technologies has sold two of its backend manufactur-
ing sites in Cavite, Philippines, and Cheonan, South Korea, to
Advanced Semiconductor Engineering (ASE). The move aligns
with Infineon’s strategy to balance in-house and external manufac-
turing. ASE will retain current employees and expand services at
both sites, with long-term supply agreements ensuring Infineon’s
continued access to essential services. The transaction is expected
to close by the end of Q2 2024.
$1.5 billion funding to GlobalFoundries to boost
US semiconductor industry
The Biden administration awarded $1.5 billion to GlobalFoundries
for its semiconductor facility expansion in New York, supported by
the CHIPS and Science Act and New York Green CHIPS initiative.
The expansion aims to triple Malta campus’s capacity and increase
Essex Junction site’s gallium nitride semiconductor output, creat-
ing 1500 jobs.
Samsung could follow SK Hynix and adopt MUF chip
manufacturing method
Samsung Electronics plans to adopt the mass reflow moulded
underfill (MR-MUF) chip-making technology used by rival SK Hynix
to boost high bandwidth memory (HBM) chip production for AI ap-
plications. Samsung, traditionally using non-conductive film (NCF)
technology, aims to catch up in the AI chip race. The HBM chip
market is expected to double to nearly $9 billion this year, driven by
AI demand.
amsOSRAM to halt Micro LED in Apple Watches, reevaluates
strategy
amsOSRAM, a key supplier for Apple Watch, is reevaluating its
Micro LED strategy due to potential high costs, leading to possible
delays or cancellations in implementing Micro LED displays in
future Apple Watches. The high cost of Micro LED technology, over
twice as expensive as other Micro LED displays and thrice the cost
of current OLED technology, poses a dilemma for its economic
viability.
HP launches world’s first quantum attack resistant PCs
HP announced the world’s first business PCs designed to protect
firmware against quantum computer attacks. These PCs feature an
upgraded endpoint security controller (ESC) chip, offering security
against the rising threat of quantum computer attacks. By isolating
the chip from the processor and OS, ESC chip reduces the risk of
data breaches and prevents downtime.
Infineon Technologies announces major sales organisation
restructuring
Infineon Technologies AG is restructuring its sales organisation to
drive growth and enhance customer focus. Effective from 1 March,
the sales team will be organised into three segments: automotive,
industrial & infrastructure, and consumer, computing & communi-
cation, while the distribution & ems (DEM) sales organisation will
handle distributors and electronics manufacturing services (EMS).
Applied Ventures invests in Vvdn technologies
Applied Ventures, LLC, the venture capital arm of Applied Materials,
Inc., has made a growth equity investment in VVDN Technologies, an
India-based electronics product design, software, and manufacturing
company. This funding will enable VVDN to expand its R&D in next-
generation semiconductor technologies and electronic products.
www.efymag.com
Sony to collaborate with Seagate for HDDs
Sony is collaborating with Seagate Technology, a US-based
company, to ramp up the production of hard disk drives (HDDs)
Representational image
in response to the growing demand for AI. Sony Semiconduc-
tor Solutions is expected to start mass-producing lasers used in
these drives in May and plans to invest about 5 billion yen ($33
million) in new production lines.
Huawei launches Intelligent Distribution, reduces high
line losses
Huawei has unveiled its Intelligent Distribution Solution (IDS) to
address challenges in the electric power industry such as high
line losses, unreliable service, and managing new energy loads.
The solution incorporates an on-premises private cloud, wired
and wireless backhaul network solutions, and an innovative
edge computing unit (ECU). A key feature is the use of next-
generation high-speed power line carrier communication (HPLC)
technology for low-voltage communication, facilitating rapid data
collection and achieving a 99% data acquisition success rate.
GM, Magna, and Wipro team up to develop
B2B automotive software sales platform
General Motors, Magna, and Wipro Limited have collaborated to
create SDVerse, a B2B sales platform for the automotive indus-
try, aimed at transforming the way automotive software is bought
and sold. The digital marketplace will facilitate a more transpar-
ent and efficient connection between buyers and sellers, allow-
ing for direct transactions of embedded automotive software.
Prashant Gulati has been appointed as the CEO, bringing over
twenty years of experience in the automotive industry.
LONGi signs long-term silicon supply agreement
with Ferroglobe
LONGi, a solar technology company, has entered into a long-
term supply agreement with Ferroglobe PLC, a producer of sili-
con metal and ferro alloys, starting January 1, 2024. Ferroglobe
will supply high-quality quartzite and metallurgical grade silicon
(MGS) to LONGi, supporting its strategy to increase purchases
from leading Western suppliers of silicon materials.
Lenovo introduces certified refurbished products initiative
Lenovo has launched the ‘Certified Refurbished Products’ initia-
tive to offer affordable technology by selling refurbished comput-
ers and other hardware. The initiative aims to address electronic
waste, starting as a pilot in Denmark, France, Germany, the
United Kingdom, and Hong Kong. Devices sold through this
initiative will undergo comprehensive data cleansing and mainte-
nance, ensuring their good condition.
Electronics For You express | April 2024 41
 industry news
to create a computing infrastructure in
Calendar of Forthcoming Electronics public-private partnerships, providing
Fairs/Exhibitions/Seminars/Events 10,000 GPUs to startups and a market-
Event, Date and Venue Topics Contact for details place for AI compute as a service. It
EFY Expo Pune Electronics expo with conferences on automotive electronics, EVs, Website: https://www. will provide financing to AI startups,
May 16-18, 2024 and Industry 4.0 (IIoT). Covers a wide range of electronics-related efyexpo.com/PUNE/?
Auto Cluster Exhibition technologies, products, and topics, including electric drives, battery develop tools for safe and trusted AI,
Centre, Pune management systems, and IIoT solutions.
establish innovation centres, promote AI
Integrated Electronics Themes: Advanced semiconductor packaging and aerospace Website: https://www.ipc.
Manufacturing And and defence electronics. A networking platform for procurement org/ipc-india/iemi-2024- applications in critical sectors, and pro-
Interconnections 2024 and quality heads of OEMs, EMS, and semiconductor suppliers. bangalore vide AI training under the Skill Develop-
(IEMI) Features top officials from government-owned defence, aerospace,
July 29-30, 2024 and multinational corporations.
ment Kaushal Vikas Yojana. A unified
Bengaluru data platform, India AI, is proposed for
EFY Expo Delhi-NCR Major tech conference focusing on electronics, IoT, and AI. Website: https://www. making non-personal data available to
August 2024 Simplifies new product development and manufacturing challenges efyexpo.com/delhi-ncr/?
New Delhi in India. Offers assistance from leading suppliers, even for small India’s startups and researchers.
batch productions.
19th Everything About South Asia’s largest water and wastewater event showcasing the Website: https://www. Qualcomm doubles
Water Expo 2024
September 10-12, 2024
latest technologies and solutions in water and waste management,
endorsed by the Ministry of Jalshakti in India.
eawaterexpo.com investment in India, plans
IICC, New Delhi to invest a billion dollars
Open Source India 2024 Open Source For You magazine, in partnership with India’s open Website: https://www. Qualcomm is significantly increas-
October 23-24, 2024 source community and industry, brings various stakeholders under opensourceindia.in
Bengaluru one roof to accelerate development and deployment of open ing its investments in India, aiming
source in India, and beyond. to outpace rivals AMD and Micron,
India Electronics Week India’s No. 1 event for creators of smart electronics solutions to Website: www. with plans to spend over US$1 billion
February 26-28, 2025 discover latest techniques, best practices and technologies for indiaelectronicsweek.com
KTPO Expo Center, developing electronics better, cheaper and faster, and meet service this year. The company is discussing
Whitefield, Bengaluru providers, suppliers and partners who can enable growth of your collaborations with chip manufactur-
business.
ers and companies like Tata Group and
Since this information is subject to change, all those interested are advised to ascertain the details
from the organisers before making any commitment. HCL under the government’s semi-
conductor incentive scheme. It aims
Dixon, Samsung, and iPhone three-wheelers will also receive `5000 to develop new fabrication capabilities
makers to receive `44 billion per kWh, with a maximum subsidy of and ensure price competitiveness. The
Indian Smartphone PLI `50,000 per vehicle. The scheme aims company is aggressively hiring in India
to support around 372,000 electric and diversifying its focus to automo-
Dixon Technologies, Apple’s Indian vehicles. tive, PCs, AI, and IoT, with a particular
contract manufacturers (Foxconn, interest in hybrid AI, on-device AI, and
Wistron, and Pegatron), and Samsung UP approves Green the potential of the Metaverse and XR.
will receive `44 billion incentives Hydrogen Policy, `50.45
for FY23 under India’s Smartphone billion incentives introduced Tata Group on partnership
Production-Linked Incentive (PLI) The Uttar Pradesh government has lookout for Dholera plant,
scheme. Due to some companies not approved a green hydrogen policy could be UMC or PSMC
meeting their production targets, the with the aim of producing one mil- The Tata Group is exploring partner-
planned outlay of `65.04 bilion for lion metric tonnes of green hydrogen ships with either Powerchip Semicon-
FY24 will not be fully utilised. Com- per year by 2028. The government ductor Manufacturing Corporation
panies must invest at least `2.5 billion is offering incentives and subsidies (PSMC) or UMC Group, two major
in the first year and maintain similar worth `50.45 billion for businesses Taiwanese chipmakers, for its planned
investments over the following three setting up operations within the next chip fabrication plant in Dholera,
years to be eligible for benefits. five years. These incentives include Gujarat. The plant aims to start with
capital expenditure subsidies, a 100% manufacturing 65nm mature nodes,
New scheme to subsidise rebate on intrastate electricity charges, progressing to 48nm and then 28nm,
e2Ws, e3Ws post FAME II exemptions on transmission charges with an initial capacity of 25,000
expiry for interstate transactions, and a com- wafers per month.
The Ministry of Heavy Industries has plete waiver of electricity duty.
launched the Electric Mobility Pro- ASIP and South Korean
motion Scheme 2024 with a budget Union Cabinet approves semicon company to invest
of `5 billion to continue subsidies for `103.71 billion India Artificial in Hyderabad unit
electric two- and three-wheelers from Intelligence Mission The ASIP OSAT/ATMP Project, a joint
April 1 to July 31, 2024. Electric two- The Union Cabinet has approved the venture with a Korean partner, plans
wheelers will receive `5000 per kWh, India Artificial Intelligence Mission to invest `8.9 billion in establishing a
up to `10,000 per vehicle (`25,000 with a budget of `103.71 billion for semiconductor facility in Hyderabad.
for rickshaws and carts). L5 electric the next five years. The mission aims The facility, located at the Electron-

42 APril 2024 | Electronics For You express www.efymag.com


ics Manufacturing Cluster (EMC) in
Hyderabad, is set to start operations by
2025, aiming to meet domestic needs
and enhance the global supply chain.
CERC issues tariff regulations
for renewable energy
sources
The Central Electricity Regulatory Com-
mission (CERC) has issued regulations
for tariff determination from renewable
energy sources, effective from April
1, 2024 to March 31, 2027, for grid-
connected renewable energy projects,
including wind power, small hydro, bio-
mass, solar, and more. The regulations
establish a Control Period, procedures
for determining project-specific tariffs,
and norms for capital costs and capacity
utilisation factors. CERC will determine
generic tariffs annually, promoting
stability in the sector.
Samsung Semiconductor
India Research launches new
R&D facility in Bengaluru
Samsung Semiconductor India
Research (SSIR) has inaugurated a new
research and development (R&D) facil-
ity in Bengaluru to advance semicon-
ductor research and address the com-
pany’s need for advanced infrastruc-
ture. The facility, located in Bagmane
Capital Tech Park, spans 14,864.48
square metres and is designed to
accommodate around 1600 employ-
ees. It features a modern layout, over
sixty state-of-the-art meeting rooms, a
cafeteria, medical facilities, nap rooms,
and recreational areas.
Union Minister Ashwini
Vaishnaw commissions
Applied Materials India
Validation Centre at Bengaluru
Applied Materials has inaugurated
the ‘India Validation Centre’ (IVC)
at its Bengaluru facility, a significant
step in supporting the semiconductor
ecosystem in India. The centre, com-
missioned by Union Cabinet Minister
Ashwini Vaishnaw, will focus on
validation, process engineering, lab
management, and collaboration with
academia and suppliers. It has added
new capabilities for semiconductor
equipment design, characterisation,
www.efymag.com
industry news
snippets
• Rohde and Schwarz India expand with assembly unit in New Delhi
• DoT launches ‘Sangam: Digital Twin’ initiative to promote virtual replicas of physical
assets for real-time monitoring and analysis.
• Jakson Green signs first PPA with SECI; Set to power 100,000 households annually
• NTPC starts commercial operation of 70MW Chhattisgarh Solar Project
• Tata Group to build Europe’s largest EV battery factory in Somerset
• Elon Musk open sources its generative AI ChatGPT rival ‘Grok’
and qualification, and demonstrated design automation (EDA) tools from
the processing of 300mm wafers. Siemens EDA, Synopsys, and Cadence
at subsidised prices to prepare stu-
India to train tribal dents for the growing chip industry.
students in semiconductor The initiative is part of the Chips to
technology, boost internet Startups (C2S) programme, which
connectivity in remote areas aims to train 85,000 people in VLSI
Government, with the help of Indian and embedded system design over five
Institute of Science (IISc) and the years. It aims to encourage students
Indian Space Research Organisation to launch startups in the semiconduc-
(ISRO), will provide advanced train- tor field through collaborations with
ing in semiconductor technology to institutions like IITs and the IISCs.
tribal students and enhance mobile
and internet connectivity in remote AI and geospatial tech to boost
tribal villages. A training fab unit will MGNREGA management
be established at IISc to offer a course The Ministry of Rural Development
on semiconductor technology for 200 (MoRD) has signed an MoU with the
tribal students. There are plans to Indian Institute of Technology Delhi
establish V-SAT stations in 80 villages (IITD) to boost the management of
across Jharkhand, Madhya Pradesh, MGNREGA assets using geospatial and
Maharashtra, and Odisha, with plans artificial intelligence technologies under
to extend the project to other states. the BhuPRAHARI project. Executed by
IITD’s HydroSense lab, the project aims
C-DAC and IBM collaborate to leverage ground and space-based
to accelerate high- geospatial technologies along with AI
performance computing to monitor and manage MGNREGA
The Centre for Development of assets, improving transparency and
Advanced Computing (C-DAC) and operational efficiency.
IBM have signed an MoU to form a
joint working group to accelerate BIWIN and Lenovo
high-performance computing (HPC) collaborate to launch SSDs
in India. It will focus on processor in India
design, system design, firmware, and BIWIN has partnered with Lenovo to
application development, along with launch a new line of Lenovo-branded
contributions to open source initia- SSDs in India, combining BIWIN’s
tives. The HPC working group aims manufacturing expertise with Leno-
to address skilling, competency, and vo’s global brand recognition. The
ecosystem building in HPC design lineup includes the Lenovo LN960
research and provide guidance to M.2, the Lenovo LN940 M.2, and the
startups, co-development support, Lenovo LN560 6.3cm (2.5-inch) SSD.
and capacity-building workshops. Fortune Marketing Private Limited
has been appointed as the National
EDA tools to be equipped in Distributor for these products in India.
over 100 colleges in India The collaboration aims to meet the
The Indian government is provid- growing demand for advanced storage
ing over 100 colleges with electronic solutions in the Indian market.
Electronics For You express | April 2024 43
 strategy: growth
Growth Opportunities
Connected With The Growing
Semicon EcoSystem In India
India must concentrate on electronics products and semiconductor components, as progress
in one area reinforces the other. The country can unlock immense economic opportunities and
enhance its global standing by aiming to capture a significant market share in these areas
A
country’s identity is determined by
the products that the country creates,
and technical progress is intrinsically
linked to the innovative products that the
country brings to the market. When we think
of such a country, one name that often comes
to mind is Japan. Products like Sony, Toyota,
and Toshiba are synonymous with Japan’s
Dr Satya Gupta,
identity. The types of products a country
President, VLSI creates fundamentally define the destiny of a
Society of India, country and its place on the world map.
Co-Chair, FICCI
Digital Economy In the modern era, electronics and semi-
Committee conductors have emerged as the lifeline for
everyone. We use hundreds of semiconductor
chips daily, driving almost every electronics
product. From the moment we wake up to the
car we drive, the computer we use, the mobile
devices that keep us connected, movies and
music we hear, electronics and semiconductor
devices that drive them play an omnipres-
ent role. These technologies are not limited
to personal use - they permeate every sector,
including education, mobility, healthcare,
infrastructure, defence, space, etc. Electronics
44 APril 2024 | Electronics For You express
and semiconductors have become the founda-
tion of our modern world and economies.
Transformative impact of
semiconductor on everything
Semiconductors have enabled most of the
contemporary age technologies like 5G, IoT,
AI, and others. AI has experienced unprec-
edented popularity and success in recent
years and is considered the most critical
technology of human evolution. We find AI
applications in everything, from assisting
us in crafting the perfect resume to solving
complex problems in science & engineering.
Generative AI today is transforming every
industry. Although foundational AI algo-
rithms such as ‘backpropagation’ and neural
networks have existed for many years,
they have not taken off because of limited
computing and storage capacity. Simulating
a simple neural network with just 500 nodes
required a tiny supercomputer. However,
the landscape has transformed dramatically
over the years. The exponential growth in
www.efymag.com

computational power
and storage powered
by semiconductors has
been astonishing. Today,
we can run very large
language models (LLMs)
with billions of param-
eters in seconds on our
mobile phones—a task
that would have taken
a significant supercom-
puter decades ago. Fig. 1: India’s growth in the manufacturing sector
This quantum leap in
semiconductor chips and storage has
made AI successful, deployable, and
accessible to various applications.
The growth in semiconductors
and electronics has been the silent
but indispensable driving force
behind the success of AI, communi-
cation, electric vehicles, and other
domains. What was once considered
a computational challenge beyond
reach is now a reality due to the
strides made in these technologi-
cal fields. Today’s computing power
on mobile devices dwarfs what was
available just a few years ago, dem-
onstrating the monumental progress
witnessed. These technologies have
transformed daily lives and propelled
AI and other applications to new
heights, enabling it to harness its
potential in previously unimaginable
ways. The intertwined evolution of
electronics, semiconductors, and AI
showcases the power of human in-
novation and our ability to shape the
future through technology.
Electronics: A thriving sector
and manufacturing surge
India has seen remarkable growth and
transformation in recent years. It is
not just a nation with a burgeoning
population of young and aspirational
individuals but also a rapidly expand-
ing market for electronics. The jour-
ney of India’s economic progress has
been fascinating, and the evolution
of its electronics industry is a pivotal
part of this narrative.
46 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS
STRATEGY: GROWTH
2015-16: $37 bn 2025-26: $300 bn
(Values in $ billion)
India’s gross domestic product
(GDP) reached the milestone of one
trillion dollars ($1T) after nearly 67
years of independence. However, the
subsequent years have witnessed
an accelerated pace of economic
growth. It took just seven years to
reach the two-trillion-dollar mark
($2T) and another three years to ac-
complish the third trillion ($3T).
This growth reflects the dynamic
nature of India’s economy. The elec-
tronics sector has been on a remark-
able trajectory at the heart of this
growth. The consumption of electron-
ics in India is surging from $67 billion
in 2015 to over $310 billion in 2026,
making it one of the country’s fastest-
growing sectors. This sector’s expan-
sion is driven by the aspirations of the
Indian population and their increas-
ing appetite for electronic devices for
various aspects of life.
Along with the market, India’s
manufacturing capabilities in the
electronics sector have grown sig-
nificantly over the past decade. From
a meagre $35-40 billion in 2015-16,
the nation is now poised to reach
the $300 billion mark for electronics
manufacturing before the decade’s
end with more than $100 billion in
exports. India has done an excellent
job creating large-scale manufacturing
capabilities that are growing quickly.
While India may manufacture a
substantial portion of electronics for
domestic consumption and exports,
global companies design and own
10x growth in 10 years
many of these products. More than
90% of the manufacturing in India
caters to global brands and compa-
nies, leaving domestic product design
and ownership at less than 10%. This
situation poses several challenges.
First, when India does not design its
products, it has limited control over
the choice of components used in
these devices. Foreign entities primar-
ily make decisions about components,
suppliers, and quality in their head-
quarters, limiting India’s influence in
semiconductor purchases
For instance, consider the iPhone.
While it may be manufactured in India,
the crucial decisions regarding its com-
ponents, such as processors, memory,
and connectivity chips, are made by
Apple in Cupertino and its suppliers
in places like Shenzhen, China. On
the economic side, manufacturing
companies, including global giants like
Foxconn and Indian manufacturing
companies, earn a small fraction of
the product’s value, less than 10%. At
the same time, the product and brand
owner reap significant economic value
and profits of upwards of 30%.
India needs to convert its out-
standing ‘M’arket potential, strong
‘M’anufacturing foundation, and
abundance of quality ‘M’anpower
to develop India-designed products
and brands to harness the economic
and strategic potential of the elec-
tronics sector. This shift will enable
the country to retain more value in
production, create jobs, and enhance
WWW.EFYMAG.COM

80% India Smartphone Market
70%
60%
50%
40%
1320 cr
30%
900 cr
20%
540 cr
10% 189 cr
0%
2015 2016 2017 2018
Chinese Brands
Fig. 2: Success story of mobile phone manufacturing in India from 2015 to 2022
financial security. Security is a criti-
cal concern, as a lack of control over
product design can threaten data
and national security.
Chinese dominance in Indian
mobile market
Self-reliance in electronics requires
manufacturing and owning the
designs and products. By doing so,
India can ensure that its electronics
industry remains sustainable, resil-
ient, and economically fruitful in the
long run. Manufacturing is essential
and foundational, but manufactur-
ing alone is not enough for India to
move up in the value chain; domes-
tic products and product brands
are crucial to self-reliance and the
growth of the economy.
India’s journey to self-reliance
in the global electronics industry
is complex and multifaceted. It
requires leveraging the ever-grow-
ing manufacturing infrastructure
and making India a hub of prod-
uct design and innovation. This
transformation will bolster India’s
economic prospects and enhance its
security and global competitiveness.
As the nation continues to grow
and evolve, it must take steps to
shape its destiny in the electronics
sector and truly become self-reliant
through a good share of domestic
products and brands and the pre-
ferred destination for manufacturing
global products and brands.
48 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS
STRATEGY: GROWTH
2750 cr
2226 cr
2140 cr
1700 cr
2019 2020 2021 2022
Indian Brands
The success story of mobile
phone manufacturing in India, the
journey from 2015 to 2022, paints a
compelling picture. The green line
on the growth chart illustrates a re-
markable transformation, as mobile
manufacturing in India surged from
1.69 billion units to an impressive
figure and continues to grow. How-
ever, while the numbers represent
strong growth in manufacturing, a
closer look reveals a nuanced story
of the growing dominance of global
brands, especially Chinese brands,
and the need for Indian brands to
reclaim their lost market share.
The red curve tells a story of its
own. In 2015, Chinese smartphone
brands held less than 2% of the
Indian market share. Today, they com-
mand more than 75% of the Indian
smartphone market. The rise of
brands like Xiaomi, Oppo, Vivo, and
OnePlus has been meteoric. These
brands have captured the market and
become household names in India.
Conversely, the market share
of Indian brands like Micromax,
Carbon, and Lava, represented by
the blue line, has been decimated.
In 2015, they held around 14% of
the market, but today, they have less
than 1% market share. This decline,
while disheartening, underscores the
challenges Indian companies face
in a fiercely competitive market and
presents a fantastic economic and
strategic opportunity for domestic
product and manufacturing companies
to get a well-deserved market share of
at least 25%.
Mobile Lessons from China’s
Manu-
facturing
electronics and semiconductors
growth
What can India learn from China’s
trajectory in the electronics industry,
which offers valuable insights? Initially,
China focused on electronics manufac-
turing, catering to global demand just
like where India is today. However, as
they grew, they also learnt that technol-
ogy created domestic ecosystems and
skills to develop Chinese electronics
products and brands. China strategical-
ly moved toward products that added
substantial value, with about 30%
value addition to products as the next
stage in their evolution. With concen-
trated efforts in this direction by the
policymakers and the industry, Chinese
products and brands dominate most
essential and high-volume electronics
product categories.
Despite geopolitical hurdles limit-
ing access to advanced semiconduc-
tor technology, China is advancing in
creating essential chips like micro-
controllers and power controllers
for diverse electronics uses. Chinese
firms gain supply chain control by de-
veloping alternatives to traditionally
imported components. Increasingly,
semiconductors in electronic devices
are sourced from China, which is also
progressing in manufacturing proces-
sors for phones, computers, servers,
and AI and developing its semicon-
ductor production capabilities.
A growing presence of
Chinese chips in India
For instance, Chinese application pro-
cessors from UNISOC and Hi-Silicon
have made significant inroads into the
Indian mobile phone market. Their
market share has grown from zero to
10-15% in the last five years. Although
it is currently used in low-end devices,
it will move up and start challenging
WWW.EFYMAG.COM
 El Camino Technologies Pvt Ltd
Processes in OSAT/ATMP – Part 2
This article is in continuation to
my previous article “Processes in
OSAT/ATMP – Part 1” in which I
wrote about wafer mounting, back
grinding, wafer dicing, die attach
and curing, plasma cleaning and
wire bonding. These processes
are generally termed as assembly
processes. In this article, I would
like to focus on packaging
processes which are usually
referred to as the Back End-of-Line
processes of OSAT/ATMP indus-
tries.
Encapsulation
Encapsulation, or molding, is the
process of enclosing semiconduc-
tor devices in a protective casing
or package to shield them from
external elements and mechanical
damage. This casing is typically
made of epoxy or other polymer
materials that provide insulation,
moisture resistance, and mechani-
cal support to the semiconductor
die and its electrical connections.
The encapsulation process
involves several stages, including
dispensing the encapsulant mate-
rial onto the semiconductor
device, curing or hardening the
material to form a solid casing,
and trimming or singulating the
packaged devices into individual
components.
De-Flash
De-flash, also known as deflash-
ing, is the process of removing
excess material, residues, or
imperfections from semiconduc-
tor components, typically after
molding or encapsulation of
plastic packages.
The de-flash process involves
various methods, including
mechanical trimming, chemical
etching, abrasive blasting, or laser
ablation, depending on the
specific requirements of the semi-
conductor components and the
materials used in their fabrication.
Please feel free to contact us at
info@elcamino.in
Updates on LinkedIn: https://www.linkedin.com/company/elcamino-technologies-pvt-ltd
The goal is to remove the flash
while preserving the integrity and
functionality of the semiconduc-
tor devices.
Trim and Form
Trim and Form, also known as
lead trimming and bending, is the
process of shaping and preparing
semiconductor components,
such as integrated circuit (IC)
packages or discrete devices, for
final assembly onto printed circuit
boards (PCBs). This process
involves trimming excess leads or
terminals, bending leads to the
desired configuration, and form-
ing the components into the
required package outlines or
footprints.
The trim and form processes are
typically performed using special-
ized equipment, such as trim and
form machines or automated
handling systems, to ensure preci-
sion and consistency in compo-
nent shaping and preparation.
Marking and Singulation
In semiconductor manufacturing,
marking is the process of label-
ling or identifying semiconductor
components for traceability and
quality control purposes. Marking
typically involves applying alpha-
numeric codes, symbols, or logos
onto the surface of molded pack-
ages to facilitate component
identification and tracking
throughout the manufacturing
and assembly processes.
The marking process can be
achieved using various tech-
niques, including laser marking,
inkjet printing, or mechanical
engraving. Each method offers
unique advantages in terms of
precision, readability, and perma-
nence of the markings, ensuring
reliable component identification
and traceability.
Cutting, also known as singula-
tion or dicing, is the process of
Additional information on our website:
www.elcamino.in
CELEBRATING OVER
YEARS
separating individual semiconductor
components, such as molded pack-
ages, from a larger substrate or lead
frame. This step is essential for
creating individual semiconductor
components ready for final assem-
bly onto printed circuit boards
(PCBs).
Electrical Testing and Inspection
EOL electrical testing and inspection
are performed at the final stages of
semiconductor manufacturing to
evaluate the electrical performance
and quality of integrated circuits
(ICs). A series of electrical tests and
inspections are done to verify their
functionality, integrity, and compli-
ance with specified standards and
specifications.
Various electrical tests are
conducted during EOL testing,
including: Functional Testing, Para-
metric Testing, Reliability Testing,
and Burn-In Testing.
Packaging
Finally, the tape and reel packaging
process begin with the placement of
semiconductor components onto
the carrier tape using automated
pick-and-place equipment. The com-
ponents are then sealed and covered
with a top cover tape to secure them
in place. The carrier tape is then
wound onto a reel, forming a
continuous strip of packaged com-
ponents ready for transportation and
assembly.
El Camino Technologies offers equip-
ment for back-end manufacturing
and failure analysis processes. Also,
under the Government of India initia-
tive, we offer skill development
programs for universities and institu-
tions in “semiconductor manufactur-
ing process” - theory along with
practical demos. Feel free to contact
us at info@elcamino.in
-by Asher Vinod – Manager, Technical Sales.
Feel free to interact with the Team for any queries:
President: Ms. Chetna Mohan
General Manager: Mr. Prashant Kalalabandi
Manager Technical: Mr. Asher Vinod

Fig. 3: Learning from Dragon Strategy
established players like Qualcomm,
Samsung, and MediaTek soon.
In India, it is also important that
we move from electronics manufactur-
ing to electronics products and semi-
conductor chips. To chart a course
similar to China’s, Indian brands must
focus on owning product designs and
components. Reclaiming ownership of
the electronics landscape is crucial for
long-term success and self-reliance. By
shifting from being a manufacturing
hub to creating and owning semicon-
ductor components and manufactur-
ing, India can assert its presence on
the global stage.
From challenges to opportunity
In the ever-evolving landscape of
India’s electronics industry, the
intertwined and dependent entities of
electronics products and semiconduc-
tor chips have come to the forefront,
showcasing both challenges and op-
portunities. To better understand the
situation, let’s examine the broader In-
dian market for electronics products.
Only around 10% of these prod-
ucts originate from Indian brands and
companies. Global brands dominate
the remaining 90%. For long-term
sustainability and bringing in-depth
manufacturing as a next step, this ra-
tio needs a better balance for India’s
self-reliance in electronics. On the
50 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS
STRATEGY: GROWTH
to $100 billion, and the 33% market
share for Indian chips will unlock a
$33 billion economic opportunity.
These numbers underscore the
potential for India to make significant
strides in the global electronics and
semiconductor landscape. A host of
sectors eagerly await India’s prowess
in electronics and semiconductors. AI/
ML, digital education, digital health-
care, fintech, telecom, transport, smart
cities, data centres, and server domains
rely heavily on these technologies.
Beyond market share and eco-
nomic benefits, India’s cultural
ethos offers a unique advantage—a
commitment to sustainability and
semiconductor products front, more durability. Unlike the ‘use and throw’
than 98% of the chips used in $180 culture seen worldwide recently,
billion of electronics products come Indians tend to value and extend the
from global companies and brands. life of their products. This presents
There is no doubt that in today’s an opportunity to create ‘reusable,
interdependent world economy, re-pairable, and re-cyclable’ elec-
global products and brands play tronics products that align with the
a very crucial role, striving for an principles of a circular economy and
increased market share, particularly sustainable growth. Transitioning
in terms of Indian products, Indian from an electronics manufacturing
brands, and Indian design, is a well- hub to an electronics product na-
deserved aspiration. It is estimated tion, a global centre for innovation,
that the electronics market will grow design, and product ownership is the
to $400 billion before the end of this key to India’s success.
decade. Capturing a well-deserved As we embark on this transforma-
33% of the market share in electron- tive journey, various domains beckon
ics products, up from the current less our attention. A few such bright
than 10%, could unlock a market spots for immense opportunities
potential of $133 billion. Similarly, could be electric vehicles and drones.
the semiconductor market will grow The automotive sector, for instance,
The Government’s Initiatives
The Indian government has introduced several initiatives to bolster the semiconductor ecosystem.
• Under the India Semiconductor Mission, semiconductor manufacturing facilities receive incentives
to cover up to 50% of their costs on a Pari-passu basis.
• Additional 20-25% incentives for semiconductor manufacturing by governments like Gujarat, Odisha,
Uttar Pradesh, Tamil Nadu, Karnataka, and Telangana.
• ‘Design Linked Incentives (DLI)’ scheme also part of FutureDesign Initiative, which offers incentives
to semiconductor product companies and startups involved in chip design. This scheme covers
50% of project costs and provides access to EDA tools and resources, making chip design more
accessible and affordable.
• To address the talent gap, the government has implemented programmes such as ‘Chips to System’
(C2S), which aims to produce 175 ASICs, 30 SoC (system-on-chip) designs, and 30 IP (intellectual
property) blocks and support more than 150 academic institutes.
• A new B.Tech degree programme in electronics and VLSI (very large-scale integration) design has
been approved by the All India Council for Technical Education (AICTE). This degree will pave the
way for a more extensive pool of electronics and VLSI design professionals. So far, more than 130
institutes have signed up to offer the B.Tech degree in Electronics & VLSI Design.
• ChipIn Centre at C-DAC and Future LABs initiatives to support all these initiatives.
WWW.EFYMAG.COM

offers opportunities beyond tradi-
tional OEMs, with subsystems and
components ripe for indigenous
design and manufacturing. Electric
vehicles represent a promising fron-
tier as they are the most electronic
systems. Other than batteries, all
other subsystems of electric vehicles
are prime for Indian-designed prod-
ucts and manufacturing.
Drones, too, hold immense
potential, especially with recent
import restrictions. While the as-
sembled drones may be imported,
the electronics components like
radio controllers, flight controllers,
and sensors can be designed and
manufactured locally.
Mapping India’s capability
landscape
For India to succeed as an electron-
ics and semiconductor product
nation, a strong engineering and
balanced workforce is a must. To
ensure we have the right capabilities
in all aspects of the electronics and
semiconductor value chain, we must
assess our current capabilities across
the electronics and semiconductor
ecosystem to gauge where India
stands today.
As depicted in Fig. 4, we have
a very good and growing market
for electronics and semiconductor
products and an excellent infrastruc-
ture for electronics manufacturing.
Over the last three decades, strong
capabilities have been developed for
electronics systems design, semicon-
ductor chip design, and embedded
software design as a service to the
global product companies.
For example, India has over
125,000 chip design engineers
working for global semiconductor
companies, and it is said that there
is hardly any chip which does not
have contributions from an Indian
chip design engineer. Looking for-
ward to domestic and global require-
ments, it is expected that India will
WWW.EFYMAG.COM
STRATEGY: GROWTH
Suggested initiatives to make India an electronics and
semiconductor product nation
• 1000 electronics products and 100 semiconductor chip domestic companies in next 5 years
• PDLI (Product Design Linked Incentives) scheme for electronics product design with $500 million
outlay, Similar to DLI scheme which was created for semiconductor chips
• PLI incentives should be based on percentage of value addition. Higher value-added manufacturing
should get a higher % of PLI incentives. A revision should be considered in the formula to calculate
value addition
• DLI and PDLI schemes should have seed funding mechanisms in addition to reimbursement
mechanisms in the current DLI scheme.
• Create strong infrastructure for product design, moulding, tooling, and enclosures, which is essential
for modern electronics products.
• Create a fund of $100 million/year for 5 years to support chip tape-outs by students
need to produce at least 125,000 achievements across various seg-
more chip design engineers in the ments, electronics and semiconductor
next five years. Similarly, the talent startups face significant challenges,
must be developed for electronics contrasting sharply with the success
products and system design. of software startups over the past
With the right focus, India is decade. These software enterprises
poised to become a talented supplier have notably contributed to India’s
to the world for the design and man- digital public infrastructure, generating
ufacturing of electronics products numerous unicorns and leading public
and semiconductor chips. The gov- firms. However, electronics and semi-
ernment of India has started multiple conductor ventures lag due to higher
programmes to accelerate the pace of expenses, extended development
talent development in India. times, scarce venture capital, and a
lack of successful precedents.
Fostering a strong ecosystem Addressing these hurdles, the gov-
for hardware startups in India ernment of India introduced the De-
Fostering a dynamic ecosystem for sign Linked Incentive (DLI) scheme
hardware startups in the electronics under its semiconductor policy. It
and semiconductor sectors is pivotal offered robust support, including
for India’s ambition to lead in this fiscal incentives covering 50% of pro-
key industry. Despite substantial ject costs and complimentary access
to premier design tools
from leading EDA firms
like Synopsys, Cadence,
and Siemens. Additionally,
states like Odisha augment
these benefits with up to
20% extra fiscal incentives,
pushing total support to
80-85% of project costs,
alongside 4-6% PLI ben-
efits on sales volume. This
comprehensive support
framework positions the
DLI scheme as a glob-
ally unparalleled initiative
to propel semiconductor
startups to new heights of
commercial and innovative
Fig. 4: India’s capacity landscape success.
ELECTRONICS FOR YOU EXPRESS | APRIL 2024 51

Fig. 5: Self-reliance vision for electronics and semiconductors
Electronics products provide a
market for semiconductor chips, and
the need of the hour is to provide
similar incentives as DLI for domes-
tic electronics product companies
and startups to create a strong design
and innovation ecosystem in this
very critical sector. Ideally, 10% of
money allocated for electronics and
semiconductor manufacturing under
the PLI and other schemes should be
allocated as incentives for domes-
tic electronics and semiconductor
product companies and startups.
Considering $10 billion has been al-
located for electronics manufacturing
under the PLI scheme, allocating $1
billion for design-linked incentives
for electronics products and systems
would be a game changer and help
grow sustainable and high-value-
added electronics manufacturing for
domestic consumption and exports.
Creating a conducive environ-
ment for hardware startups in India
is vital for achieving self-reliance and
global competitiveness in the elec-
tronics and semiconductor industry.
By re-balancing incentives, raising
awareness, and providing mentor-
ship and financial support, India can
nurture a new generation of suc-
cessful hardware startups and drive
innovation in this critical sector.
Leveraging organisations like VLSI
Society of India (VSI), India Electron-
ics and Semiconductor Association
52 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS
STRATEGY: GROWTH
(IESA), ELCINA, STPI, and hundreds
of incubators can be instrumental
in bringing together stakeholders,
fostering collaboration, and provid-
ing valuable support to the hardware
startups for both semiconductor and
electronics products.
Vision for self-reliance in
electronics and semiconductors
For India to become a self-reliant and
globally competitive trusted partner
in electronics and semiconductor
supply chain, a balanced approach
focusing on products, manufacturing,
and talent development and research
is needed. When we examine these
three essential pillars, it is evident
that significant strides have been
made in manufacturing, especially in
electronics manufacturing services
(EMS) and contract manufacturing.
The Indian government has intro-
duced schemes such as the Produc-
tion-Linked Incentive (PLI) scheme
for electronics manufacturing with
almost $20 billion in incentives and
the India Semiconductor Mission $10
billion for semiconductors for much
needed semiconductor ecosystem.
Electronics manufacturing, with
strong support from PLI and other
incentive schemes, has surpassed the
$100 billion mark with more than
$20 billion in exports and is expected
to grow to $300 billion and $100 bil-
lion just in exports.
For semiconductor manufactur-
ing, which is strategically critical,
India Semiconductor Policy of 2022
has provided a good impetus. The
government of India, many state gov-
ernments, industry, academia, and
many global Indians have put in out-
standing efforts over the last 18-24
months and many projects, including
that of Micron and Tata Group in
semiconductors, are in various stages
of planning, government approval,
and execution.
India can say, “Mere paas MA
hai,” fast-growing ‘MA’rket, glob-
ally competitive ‘MA’ nufactur-
ing, and the large pool of talented
‘MA’npower. The long-term vision’s
third and most critical pillar is
‘P’roducts. The Semiconductor DLI
scheme is a good start in this direc-
tion. However, significant work is
still needed for domestic electronics
and semiconductor product design
and brand creation to serve the solid
domestic and global market, utilise
and make the manufacturing ecosys-
tem sustainable and leverage strong
manpower.
India’s strategy has been manu-
facturing, and incentives are more
tilted towards manufacturing. Provid-
ing incentives for product develop-
ment equivalent to 10% of manufac-
turing incentives, or approximately
$2 billion, will help create thousands
of product companies, ODMs, OEMs,
brands, and unicorns in the electron-
ics and semiconductor field. Taking
advantage of India’s strengths, a
balanced focus on products, manu-
facturing, talent, R&D, and propor-
tionate incentives will propel India to
become ‘An Electronics and Semicon-
ductor Product Nation.’
This article is based on a tech talk session at EFY
Expo 2023, Delhi, by Dr Satya Gupta, President,
VLSI Society of India, Intel Veteran, Founder Open-
Silicon, EPIC Foundation and India Electronics and
Semiconductor Association. It has been transcribed
and curated by Akanksha Sondhi Gaur, Research
Analyst and Journalist at EFY.
WWW.EFYMAG.COM
 strategy: interview
‘China Plus Two,’
EPIC Foundation aims to
transform India into an
electronics hardware product
nation by collaborating with
governments, universities,
design houses, and startups.
In a conversation with EFY’s
Yashasvini Razdan, the
Foundation’s Chairman and
Former HCL Co-founder Ajai
Chowdhry advocates for SME-
friendly incentive schemes and
stresses on developing a VC
ecosystem for hardware
www.efymag.com
Policy
“Capitalise On
Where Products
With Higher Value
Addition Become
The Focus”
One of EPIC Foundation’s goals is “Transforming India
into an electronics hardware product nation.” Aren’t we
already well along that path, with the numerous policies
that the government has introduced?
I have seen many Indian brands vanish despite favour-
able government policies for manufacturing. Now, that’s
a very terrible situation to be in! At a time when the
government has come up with great policies for manu-
facturing products in India, the question that remains is,
how many Indian companies are benefiting from it? A few
Indian companies, like Dixon and VVDN, manufacture for
others, but a lack of Indian products globally is evident.
This is not a good situation for a large country like India;
we must have our own product ecosystem.
So, how is EPIC Foundation working to build India’s
product ecosystem, and who funds these activities?
EPIC advocates for building a product industry along-
side semiconductor and component manufacturing as
part of the India Semiconductor Mission Advisory Board.
Manufacturing alone won’t suffice without solid product
demand. Companies like Dixon are considering design-
ing and manufacturing their products, but more must
follow to compete globally. Our goal at EPIC is to col-
laborate with governments, fostering a comprehensive
product ecosystem around universities, design houses,
and startups. Over the next decade, this decentralised
approach across the country can create a thriving design
and product ecosystem, competing with China. By
nurturing hundreds of brands, we can seize the oppor-
tunity created by the trust deficit with China, attracting
Electronics For You express | April 2024 53

countries to India for product design
and manufacturing.
The initial funding was put in
by my co-founder, Arjun Malhotra,
and I. We do some consulting work
to generate revenues and look at
the industry to contribute through
CSR (corporate social responsibility)
activities.
How can India implement the ‘China
plus one’ strategy?
When the concept of ‘China plus
one’ emerged, Vietnam seized the
opportunity quickly, leaving India
behind. Rapid decision-making and
ease of doing business contributed
to Vietnam’s success, resulting in
exports of $120 billion compared to
India’s $25 billion. The challenge is
to learn from the past and capitalise
on ‘China plus two,’ where products
with higher value addition become
the focus. India is shifting from be-
ing a mere assembler to scaling up
manufacturing, especially in areas
like mobiles, where substantial
exports are now a reality. Now, the
focus needs to shift from low-value
scale to sustained value addition to
counter threats from competitors
offering more incentives, potentially
causing companies to move away.
The key to navigating this land-
scape is understanding China’s shift
to prioritise higher value addition
while assigning manufacturing to
countries like Vietnam.
How does the contribution of
MSMEs and startups in creating a
high-value addition industry com-
pare to that of large manufacturing
companies?
When India signed the WTO
agreement in 1999, applicable in
2015, MSMEs were adversely af-
fected due to a lack of protection
and zero-duty imports. Both startups
and SMEs, essentially interchange-
able, contribute significantly to the
country’s design landscape and fos-
54 APril 2024 | Electronics For You express
strategy: interview
ter innovation. Unlike large corpora-
tions driven by quarterly results and
stock market pressures, SMEs oper-
ate more flexibly, allowing for real
innovation. Small companies can
grow into large entities by securing
substantial funds through IPOs and
other public investment avenues,
expanding manufacturing, and
evolving into sizable companies.
How can government incentive
schemes be made more SME-
inclusive?
Current policies lack focus on
designing, creating, and adding value
within India, hindering support for
SMEs and startups. The emphasis is
skewed toward large-scale manufac-
turing and favours global companies,
necessitating a shift to SME-friendly
policies. Schemes like SPECS fail to
understand SMEs’ specific needs,
with a significant difference in
component revenue-to-investment
ratio. Acknowledgement of this issue
by the DPIIT Secretary is a positive
step, and the awaited SPECS 2.0 is
crucial for addressing SME concerns.
A dedicated PLI for SMEs, promot-
ing growth from `2 billion to `15
billion, can foster scale and inclusiv-
ity. Multiple SMEs producing both
passive and active components are
essential to strengthen the electron-
ics industry. Long-term schemes,
such as adopting a ten-year approach
to develop the component industry
beyond the typical three to five-year
plans, are vital for sustained industry
growth to make India a developed
nation by 2047.
Is EPIC’s role restricted to an advi-
sor to the government, or is it act-
ing as a mediator between SMEs,
startups, and the state and central
governments?
As an ecosystem player, we
collaborate with the central govern-
ment, state governments, research
and education institutes, startups,
and SMEs. We address challenges
faced by SMEs in marketing by
connecting them with established
brands. Similarly, when startups or
SMEs lack design expertise, we fa-
cilitate partnerships with education
institutes possessing the required
capabilities. This is an ongoing com-
mitment, not a short-term endeav-
our, ensuring sustained support
for the growth and development of
these entities.
The electronics industry encom-
passes different verticals. Do you
believe that the current policies
account for all these verticals?
In all sectors—electronics, tele-
com, and automobiles—components
are crucial, with electric vehicles
being 70% electronics, highlighting
industry interconnectivity. Advis-
ing Niti Aayog, my focus was on
identifying standard sub-assemblies
and components across these sec-
tors. Electronics should be viewed
horizontally, given its influence
across industries. Magazines like
Electronics For You showcase this
horizontal nature. Deeper explora-
tion into service and component
areas is crucial for enhanced value
addition. Positive developments in
the PLI for telecom, emphasising
value addition and design, are steps
in the right direction. Similar consid-
erations should apply to hardware
PLI, encouraging localisation and
purchasing components in India for
increased appeal. The current PLI
framework requires re-evaluation for
more effective implementation.
How do we encourage more invest-
ments in equipment and infrastruc-
ture building to decrease the cost
of production for SMEs and start-
ups?
The VC ecosystem for hardware
is non-existent, as most VCs pri-
oritise e-commerce, software, and
SaaS investments. With the evolving
www.efymag.com

dynamics of the software industry,
it’s crucial to plan for the next 15-20
years and steer India towards becom-
ing a product-centric nation. Revisit-
ing the proposed fund of funds, like
the Electronics Development Fund,
with a focus on hardware, is neces-
sary. Allocating funds for startups
and SMEs is essential, reconsidering
the distinction between them for a
more inclusive approach. Access to
funds remains a significant hurdle;
the fund of funds, initially proposed
with `100 billion, should be revis-
ited and possibly increased to `200
billion. A comprehensive approach,
merging SMEs and startups, is es-
sential for successful implementa-
tion, addressing the current funding
challenge for these entities.
Software Technology Parks of
India (STPI) has established many
Centres of Excellence for electron-
ics innovation nationwide. Is such
infrastructure not enough?
An initiative similar to STPI for
hardware, akin to a Product Tech-
nology Park, can streamline process-
es, facilitate exports, and create a
conducive environment for product
development. This model would
replicate the ease of doing business
that STPI provides for the software
industry. I envision the transforma-
tion of all 150 offices of STPI into
HTPI (Hardware Technology Parks
of India). These offices already pos-
sess the necessary infrastructure and
space conducive to the skill develop-
ment, design, and creation required
for SMEs and startups. To foster
hardware growth, we must replicate
the same passion, incentives, and
infrastructure models instrumental
in developing the software industry.
Should India set up a separate
fund for research and development
activities in SMEs and startups?
Once a fund of funds is estab-
lished, investments can be made in
56 APril 2024 | Electronics For You express
strategy: interview
various types of companies, whether
design-oriented or manufacturing-
focused. The current issue lies in the
fact that VCs rarely invest in manu-
facturing. Addressing this through a
comprehensive fund of funds, with-
out limiting definitions to SMEs or
startups, is crucial. The criterion for
funding should revolve around enti-
ties involved in electronic product
development, encompassing financ-
ing for research and development,
design, and manufacturing.
Is the cost of making a mistake
while designing electronics hard-
ware not much higher than the cost
of making a mistake when develop-
ing software?
When designing a hardware
product, a company will encounter
mistakes during the initial attempts.
With each iteration, the number
of errors diminishes. The learning
process is integral to organisational
maturity, where processes evolve,
mistakes decrease, and overall
quality and reliability improve. This
gradual progression requires ac-
ceptance, acknowledging that such
refinement doesn’t occur overnight.
Is that also the reason that hinders
investors from venturing into the
electronics sector?
Venture capitalists typically seek
returns within the next five to ten
years and desire an exit within five
to seven years. However, achieving
results in the electronics or design in-
dustry may take longer, necessitating
patient capital. The US offers such
patient capital, with numerous com-
panies investing in extended product
development and design projects.
Unfortunately, such patient capital is
absent in India, creating the need for
a distinct policy tailored for startups
and SMEs in the electronics sector.
How can the Indian government
incentivise investments in the local
electronics industry?
Through demand aggregation,
the government acts as a major
buyer. This is similar to what the US
did through significant investments
in R&D centres like the Defence
Advanced Research Projects Agency
(DARPA), fostering innovation and
industry growth. DARPA’s model
involved presenting challenges to
companies, providing funding for
viable solutions, and subsequently
awarding business opportunities
to those who succeeded. In India,
aligning central and state govern-
ment policies is essential. States
could be incentivised to prioritise
locally made products by link-
ing education fund allocations to
purchasing domestically produced
hardware, promoting the ‘Make
in India’ initiative. This approach
requires collaboration between the
central and state governments to en-
sure a unified strategy for national
development.
If the government steps up and pro-
vides the funds, would we see more
private investors venturing into this
space?
When referring to a fund-of-
funds, the government allocates a
significant amount, say `100 billion,
for software development. This sum
is then divided among numerous
venture capitalists (VCs). The cru-
cial aspect is that each VC contrib-
utes additional funding, potentially
amounting to ten times the initial
allocation. Therefore, the impact
of `100 billion does not merely
double; it could multiply, reaching
up to `1000 billion, exemplifying the
leverage achieved through a fund-
of-funds approach. The government
can create a thriving electronics
ecosystem by creating distinct funds
tailored to specific sectors, such as
the Electronics Development Fund
or the Automotive Development
Fund.
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 strategy: my story

“Don’t Let Designations Become

A Wild Goose Chase”

Bhanu Prakash
Srivastava
CMD, Bharat Electronics Limited

In his childhood, he possessed just one sweater, meant to last through many winters. He could
not join IIT Roorkee because the cost of a train ticket to Roorkee from his home town was “much
more” than a train ticket to IT Banaras Hindu University (BHU). Bhanu Prakash Srivastava embraced
postings that many others shied away from. Putting less emphasis on titles and more on the work
itself, he now leads Bharat Electronics Limited (BEL) with determination and vision. This is the story
of Bhanu Prakash Srivastava, as recounted to EFY’s Mukul Yudhveer Singh

B Dearth of money is not dearth

orn in Jaunpur near Vara-
nasi, Uttar Pradesh, Bhanu
Prakash Srivastava is the
youngest of five siblings, with two
elder brothers and two elder sisters.
His childhood was filled with chal-
lenges which only a few have the
power to go through and come out
smiling.
His father, who had been ailing
from a serious illness, passed away
when Srivastava was just eight!
This meant that his mother would
now have to make sure that there
was enough to eat in the house,
while also making sure that her
children did not have to stop going
to school.
of education
Eight-year-old Srivastava was too
young to sense the difficulties his
mother was going through, but he
made sure to study hard, and the re-
sults of his hard work started paying
back in the form of 100% education

58 APril 2024 | Electronics For You express www.efymag.com

 STRATEGY: MY STORY
scholarships he got standard after
standard, starting Class V. In 10th
standard, he was at 9th rank in the
merit list of the entire UP Board of
Education. The feat was repeated in
1982 when he secured 6th rank in UP
State merit list for 12th standard.
“I had only one sweater to wear
in winters, and it was clear in my
mind that going out to play would
mean getting it dirty and going to
school without wearing one. There
was no choice other than staying back
home most winter days,” he recalls!
And while staying at home most of
the time would sound like a major
setback to a lot of children; to him, it
was an opportunity to read more!
He smiles and adds, “I think that
one sweater is what made me read
more. One sweater is what made it
possible for me to stand in the top
10 list of students for standard 10
exams. That sweater made me a hero
amongst a million students!”
Phoolpati Devi, Srivastava’s
mother and his first role model,
meanwhile continued to teach her
children the importance of studying
and working hard. Srivastava remem-
bers incidents when she would skip
meals because one of her children
needed a new notebook! Meanwhile,
his eldest brother had cleared his
engineering and got a job. This also
meant that the eldest brother was
now supporting the whole family,
and this is when he became the sec-
ond role model for Srivastava!
“Family is the most important
thing in the universe” is what I learnt
from my eldest brother. He was the
first graduate engineer from our vil-
lage, and that made us all immensely
proud, Srivastava recalls. Eating puri-
sabji is one of the most cherished
memories of Srivastava from his
childhood days. He remembers how
his mother would cook puri-sabji
even at 10 pm in the night because
he wanted to enjoy the same. In his
mother’s words conveyed by Sriv-
WWW.EFYMAG.COM
astava to us, “The most important
priority in life should be hard work;
rest everything falls in place.” She
used to tell her kids these lines when
they had to choose between meals
and buying a book!
The `750 difference in BHU
and IIT Roorkee
Having done much of his schooling
via the 100% scholarship route, Sriv-
astava did not just master academ-
ics but also understood the value of
punctuality and discipline, and never
took the scholarships offered by the
government for granted. Apart from
his dedication towards education, he
credits his mother for the same.
“I hardly took leave from school.
Even on days when it poured, I went
to school. My mother would ensure
that I go to school on days it rained
for checking whether a holiday was
announced or not! On most such
days, I was among a few students who
showed up to school,” he recalls.
Though the financial condition
that the family had to go through after
the death of his father had taught him
about the value of money, the same
proved to be one of the crucial decid-
ing factors when it came to choosing
between IIT and BHU! Pursuing engi-
neering was Srivastava’s first choice,
but everyone told him that his chances
were bleak as the IIT entrance exam
was conducted in English.
“Though I studied in Hindi medi-
um, I was a topper in English subject
throughout school. With excellent
academic results with rank in state
merit, I was confident that I will be
able to crack the IIT entrance,” he
shares.
And so, he did! However, he
got 1110 rank in the IIT entrance. At
the same time, he also gave exams
for the University of Roorkee, a
very prestigious institute (presently
IIT Roorkee), where the option to
answer in Hindi was also available.
In this exam, he secured a rank in
ELECTRONICS FOR YOU EXPRESS | APRIL 2024 59
 strategy: my story
the language. In the next semester
Bhanu Prakash Srivastava’s guru mantras
result Srivastava got first rank. From
• The only results you should be concerned about are the results for the organisation, not then on, he was in the top three
for your individual self! ranks most of the time.
• Times will come when teams need to make sacrifices. Be the first one to be ready to Listening to BBC shows also
sacrifice for the team! sparked his curiosity about global
• Running after designations is like chasing a wild goose. Chase efficiency if you want to affairs and India’s place in the world.
chase something! As a result, he started comparing
• Stay relevant by constantly updating yourself with the latest from your industry and India’s growth to that of the modern
how it intersects with everything else. It is easy for others to fool you if you do not stay
world.
relevant!
“This was the point when I made
• Everything you expect from your team, you should be able to give them!
up my mind to work for the country
• Do not be afraid to upset people if that is the requirement of the task at hand. Similarly, till the last breath. Though a lot of
always be ready to get upset by people!
my fellow students were going to the
• The applause for the success of a project belongs to the team, never to an individual! United States and other parts of the
world, I wanted to stay here in India
the top 50. As he was not getting the most sought after colleges and and serve my country. In the form of
the engineering branch of his choice institutions in India.” scholarships, the country had spent so
in IITs, the option was choosing much on me. It was my time to dedi-
between IT BHU and the University India over the US, engineering cate myself to the country,” he says
of Roorkee. He could get any branch over civil services with a proud face. Srivastava did not
of his choice in these two institutes. The first semester at BHU did not have a passport till he joined BEL and
He chose IT BHU—the reason being come easy at all for Srivastava. was sent to Tokyo for training in 1989.
`750 difference in fee structure! BHU Though he ranked 14th in the first Even though Srivastava had a
(Banaras Hindu University’s engi- set of results, it was a shock for great inclination towards the cov-
neering colleges were a part of IIT a student who was always in the eted civil services exam of India, he
entrance exams back in those days. merit lists! Srivastava could not decided not to pursue it because he
Not only was Srivastava getting an believe the results he had yielded believed every effort made by him
admission in a good college, he was despite studying hard, and instead for gaining technical knowledge and
also getting the mechanical engineer- of going into a state of denial, he every penny spent by the govern-
ing stream, and on top of everything chose to find out the reason. BHU ment of the country in enabling the
the fee for BHU was almost `750 less was filled with toppers from all over same “would go in vain.”
than that of Roorkee. India: the competition, as he recalls, “I sometimes think I could have
“BHU’s fee was `359. A train tick- was tough, but he had not left any helped a lot in policymaking if I
et to my hometown from BHU college stone unturned. Then what was the had chosen to give the civil services
was much cheaper than a train ticket cause of him being able to secure exam. However, I am happy that
to Roorkee. Money was so scarce a re- only 14th rank? because of BEL, I have been able to
source for us those days that I had to “English was the main problem. work with a lot of departments of the
choose between the entrance exams Though I was a topper in the subject government,” he says.
I wanted to give as every exam form at school level, the English every- Srivastava was selected at BEL via
needed a fee,” he shares. one spoke at the BHU campus was campus interviews and was holding
He adds, “I was happy choosing completely different from the Eng- multiple job offers when he appeared
BHU as I knew I could visit my fam- lish we learned at school level. All for the BEL interview. In fact, many
ily more than I could have visited lectures used to be in English, the companies reached out to him while
while studying at IIT Roorkee. One study material used to be in English, he was working with BEL, with job
more reason that triggered Srivas- and most discussions would be in offers that promised much higher
tava’s decision to join BHU was his English,” Srivastava says. salaries. He says he has never consid-
visit to the same in his childhood Everyone at BHU was busy ered such an offer.
with his elder brother. The latter was studying, and Srivastava could not
studying in BHU when he had taken find help for learning English. He Ringing a bell at BEL
his younger brother to see and feel started listening to BBC news shows Before joining BEL, Srivastava was
the experience of studying in one of on the radio to build mastery over asked about his choice of posting.

60 APril 2024 | Electronics For You express www.efymag.com

 STRATEGY: MY STORY
Bhanu Prakash
Srivastava’s postings
• 1.5 years at Ghaziabad
• 10 years at Kotdwara
• 3 years at New York, USA
• 10 years in Kotdwara
• 7 years at Ghaziabad
• 2007 onwards at Bengaluru
While he told the seniors that he
was open to being posted at any of
the locations that BEL operates in,
the process required him to mention
names of two cities he wanted to
be posted in. Srivastava mentioned
Ghaziabad and Kotdwara as the top
two choices.
As Kotdwara was a remote place
and very few opted for that, he was
selected for the Kotdwara unit and
posted to the Ghaziabad unit for
initial training. For general informa-
tion, the Ghaziabad unit is consid-
ered one of the most sought-after
postings in the organisation as it not
only gives one proximity to seniors
but also opportunities to work on
technologies that are among the
prime interests of the nation. How-
ever, little did Srivastava of that time
know that Kotdwara, the city that he
mentioned on his posting preference
form at BEL, would prove to be one
of the best opportunities for him.
On completion of around 1.5
years at BEL’s Ghaziabad unit, he
was moved to Kotdwara. “Many saw
this as a backtrack of my career at
BEL, but it turned out to be a bless-
ing for me,” he says.
Why was it so hard to be posted
at Kotdwara for a lot of people? The
city is located about 200 kilometres
away from Delhi. In today’s Uttara-
khand, this city back in time (around
1985 to 1990) did not have amenities
like telephone lines, proper medical
facilities, and a lot of other things. As
this unit of BEL was new, the avail-
ability of these amenities would have
WWW.EFYMAG.COM
taken a few more years to come.
“One needed to travel at least
100 kilometres one way to make
a telephone call to his/her family.
There were many more significant
challenges. But more than those, the
opportunities were the biggest,” he
shares.
What Srivastava saw at Kotd-
wara was an opportunity to work
in a senior role as the facility did
not have a lot of presence of seniors
back then. It meant a lot of expo-
sure to work and an opportunity to
prove his worth at BEL. Srivastava
remained positioned at the Kotd-
wara unit for the next ten years!
During this time frame, he devel-
oped expertise in numerous projects
and technologies. And what hap-
pened at the end of those ten years?
He was selected among many
aspirants to work at BEL’s office in
New York, United States of America.
Srivastava got a chance to work
on procurement for all the projects
spread across all the geographies
BEL was operating in. As Srivastava
informs, “The opportunity gave him
a chance to learn about all the tech-
nologies, products, and solutions
that BEL was working on. As I was
in the procurement division, I was
responsible for sourcing components
for all the projects; this was a chal-
lenging yet superb posting for me.”
Firefighting on the
international podium
One of the core principles of Sriv-
astava has been not to be choosy.
Rather, he has concentrated on de-
veloping a passion for whatever he
has been entrusted with. He says, “I
chose BEL to serve my country and
made it a point that everything cho-
sen by BEL for me would be my des-
tiny. I have learnt it from Ramayana
and Mahabharata to be devoted to a
cause wholeheartedly!”
In New York, fate was going to
try and test Srivastava’s resilience
ELECTRONICS FOR YOU EXPRESS | APRIL 2024 61

B.P. Srivastava with family
via one of the most rigid situations
BEL has ever been in. “There was
a misunderstanding between the
governments of the United States
and India, and the former imposed
sanctions on BEL. It was a tough
situation to be in,” he recalls.
“BEL was put on the banned list
for exports. We started working with
the Department of Commerce and
a lot of other stakeholders in the
USA to bring BEL out of the ban,”
explains Srivastava. He was having
a constant dialogue with the indus-
tries and all stakeholders BEL was
procuring from the US.
He adds, “That gave me a per-
spective of how things work on the
global stage. I got to understand fire-
fighting, how international business
is done, and a lot of other things”.
According to Srivastava, the
circumstances that he and his family
went through when he was young
made everything else look “solv-
able.” The single sweater that he
had while growing up gave him a
62 APril 2024 | Electronics For You express
strategy: my story
different outlook towards the world
and the problems it faces. In his
words, “he unknowingly developed
an approach where he, instead of
asking questions, wanted to ask the
right questions!”
In his professional innings with
BEL so far, the organisation has
asked him to change base six times
and, according to Srivastava, every
posting has been a demanding yet
rewarding one. The toughest assign-
ment at BEL, he recalls, has been
the one where he was posted as the
general manager of Naval Systems.
“Sonar, communications, and a lot
of other things made things complex
for me. Additionally, it was tough
because we had to work with a lot
of customers,” he says.
Radio equipment, data equip-
ment, switches, radar systems, sonar
systems, communication systems,
missile systems, surface-to-air missile
(SAM) systems, are some of the tech-
nologies and solutions that Srivas-
tava has worked on at BEL so far.
After his three-year stint in New
York, he was once again asked to
work at Kotdwara! This time he was
posted to this unit for 10 years! As
he recalls, “After New York, which
is seen as a corporate posting, I
was asked where I would like to be
posted. I told my seniors anywhere
they liked, and I was once again
given Kotdwara.”
Leading BEL
During April 2022, Srivastava was
promoted to the Board as Director
(Other Units). Other Units of BEL
include the eight manufacturing units
of BEL across India (other than the
oldest unit at Bengaluru) – Ghazi-
abad, Kotdwara, Panchkula, Pune,
Navi Mumbai, Hyderabad, Machili-
patnam, and Chennai. As Operational
Head of Other Units, he has the
overall responsibility and accounta-
bility for the growth and profitability
of these eight units. He gave a major
thrust to improving the turnaround
time of products to meet the delivery
timelines and ensure the fast-track
execution of capital projects.
Since November 2022, Srivastava
is also holding Additional Charge
as Chairman & Managing Director
of BEL and is responsible for the ef-
ficient functioning of BEL to achieve
its corporate objectives and perfor-
mance parameters as per the MoU
signed between BEL and the Ministry
of Defence, Government of India.
Srivastava says, “Having a modest
background during my early days, I
never aspired to lead BEL. Apart from
my passion for my work, my profes-
sional journey has been supported by
God’s grace.”
“If we look at the business envi-
ronment of BEL, the defence business
segment continues to remain dy-
namic. It is constantly changing due
to ecosystem drivers like procure-
ment policies, industry competition,
rapid advances in technology, R&D
policies, and the global geopolitical
www.efymag.com
 STRATEGY: MY STORY
Bhanu Prakash
Srivastava’s favourites
• Fav book - The Goal
• Fav food - Puri-sabji
• Fav singer - Mukesh Kumar
• Fav actor - Amitabh
• Fav actress - Rekha
• Fav movies - Baghban, Zanjeer
• Fav villain - Amjad Khan
• Cars or bikes - Cars
• First car - Maruti 800
• Fav car - Cars are only for utility
• Fav sport - Cricket
• Fav cricketer - Sunil Gavaskar
scenario. To remain on par with the
current industry standards, meeting
the stakeholders’ expectations, and
continuously striving for innovation
towards achieving self-reliance in de-
fence brings its own challenges. I feel
proud to have an energetic workforce
at BEL who selflessly keep pursuing
these goals,” says Srivastava.
Leading BEL requires extensive
travel to meet stakeholders across the
country. Srivastava’s travel schedule
is often gruelling. He shrugs off his
Staff Officer’s suggestions for a more
relaxed travel plan or to sub-dele-
gate/reschedule back-to-back meet-
ings. Srivastava says that it’s part of
life and keeps up a hectic schedule
to meet stakeholders and ensure that
BEL is in the forefront.
Ramayana, Mahabharata, and
the vision of BEL
If you ever encounter Srivastava,
you will find a man who is spiritu-
ally strong. He often recites verses
and quotes from Ramayana and
Mahabharata to elucidate present-
day events. The focal point of these
two revered literary works for him is
not just admiring one character, but
rather every character described.
“There is something to learn from
every character. You can glean lead-
WWW.EFYMAG.COM
ership from Lord Rama, while Shri
Krishna can impart the right set of
values necessary for being an excel-
lent advisor. Similarly, focus can be
gleaned from the mighty Hanuman,
and the importance of experience
can be imbibed from Jamwant. The
list goes on,” he says, with hands
folded in respect.
Blessed with a family compris-
ing a daughter, a son, and a caring
wife, Srivastava credits his achieve-
ments to his better half, Alka. “I owe
everything to her decision to be a
homemaker. She has singlehandedly
managed our kids most of the time.
Despite my late nights at BEL, she
ensured my absence never adversely
affected Yash and Payal!”
With just over a year left until
his retirement, Srivastava is uncer-
tain about his plans post BEL. “I
have never given it much thought.
But everyone needs a break, and I
believe my break is approaching in
a few months. I want to spend more
time with my family, and even start
working on my PhD,” he jokes with
a mix of emotions in his eyes.
For now, he aims to steer BEL
towards a path that leads to a larger
share of civilian electronics, consider-
ing that Defence currently contributes
over 90% of BEL’s revenue. He also
intends to ensure that BEL remains
profitable in the years to come.
“I joined BEL out of love and re-
spect for the nation, but I stayed with
BEL because I wanted to contribute
to India’s self-reliance in defence elec-
tronics. Moving forward, I see BEL
expanding and excelling in the export
market,” he concludes, “I hope to
impart my learnings to the younger
generation after my retirement.”
Interestingly, his teachers from
school days used to urge him to
share lessons he had mastered with
his fellow students. Perhaps India
will have another teacher who im-
parts wisdom more from experiences
and less from books!
ELECTRONICS FOR YOU EXPRESS | APRIL 2024 63
 DESIGN: CIRCUIT
Interesting
Reference Designs OF SMOKE DETECTORS
Title of Reference Wireless Smoke Detector
Design
Image
Key The wireless smoke detector design offers network-wide alarm
Attractions triggering, easy setup, long battery life, and remote access, with
a sub-GHz wireless module for communication and powered by a
single battery for enhanced safety and convenience.
Highlights The wireless smoke detector reference design from Microchip is
centred around a low-power nanoWatt XLP 8-bit PIC microcon-
troller, the PIC16LF1825. The RE46C190 photoelectric smoke
detector IC is utilised to provide all necessary features for a
photoelectric smoke detector with minimal external components.
Alarm conditions are communicated through the MRF89XAM8A
(or 9A) sub-GHz wireless module. The board is powered by a
single CR123 battery. The key features of the system include an
alarm event that triggers all alarms in the network for enhanced
safety. The setup is easy with automatic wireless node detection,
and the system is powered by a single CR123 3V battery. It fea-
tures low power sleep modes, including a 50nA sleep mode for
the PIC microcontroller, 0.5μA LPWDT operation in sleep mode,
and a 0.1μA sleep mode for the transceiver module, leading to a
long battery life. Remote access capability allows users to receive
remote alarm alerts, test alarm functionality, and monitor battery
voltage from a distance.
Applications The reference design is suitable for early fire detection and home
safety.
OEM Brand Microchip
URL https://www.electronicsforu.com/electronics-projects/wireless-
smoke-detector-reference-design
64 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS
Smoke Detector
The smoke detector design features a photoelectric sensor,
high-decibel alarm, and battery operation with low power con-
sumption. It provides reliable fire detection, ensuring safety with
a wide coverage area and advanced power management.
The Cypress reference design serves as a smoke detector that uti-
lises a photoelectric sensor to detect infrared radiation refracted by
smoke or dust particles produced by fire. It features a high-decibel
alarm exceeding 70dB within a 3m range, ensuring adequate cover-
age of a 60 square metre area when mounted less than 5m above
the floor. The detector is powered by two batteries operating at a
1.8V to 3.3V DC voltage range and includes a low battery output
warning. The DC-DC boost converter maintains a constant power
output of 3.3V when the battery voltage falls below 3V, using the
EMH7600 boost converter that supports an input range of 0.3V to
6V and provides a 3.3V output with up to 500mA. The design also
includes a photoelectric detector with an IR-emitting diode and an
IR-receiving diode positioned within a dark cavity, requiring an am-
plifier circuit to amplify the signal for the analogue-to-digital stage.
To reduce power consumption, the design implements a sleep
mode with periodic wakeups, which is crucial in battery-powered
systems from both a firmware and hardware perspective.
The reference design is suitable for residential homes, hotels, etc.
Cypress
https://www.electronicsforu.com/electronics-projects/smoke-
detector-reference-design
WWW.EFYMAG.COM

Photoelectric Smoke Detector
This reference design for a photoelectric smoke
detector features battery monitoring, a dual LED
driver, adjustable gain amplifiers, and supports a
range of batteries, making it a solution for safety
applications.
The RAA239101 reference design by Renesas
Electronics Corporation is an analogue front-
end (AFE) integrated circuit (IC) designed for
low-power consumption and serves as the core
component in developing comprehensive smoke
detection systems. It is used in conjunction with
a microcontroller, a photoelectric emitter/detector
setup, a horn, and a few external components to
constitute a full-fledged smoke detector solution.
Notably, it has a battery monitoring capability to
trigger an alarm upon detecting low battery levels
and a dual LED driver that facilitates the pulsing of
smoke-detection LED emitters with an adjustable
current via a digital-to-analogue converter (DAC).
It also features two photodiode receiver channels
with adjustable gain amplifiers (AGAs), controlled
by an analogue-to-digital converter (ADC), to
accurately sense smoke particles through the
scattering of LED light in a detection chamber.
With ultra-low power consumption, the device
supports both 9V batteries and a range of 3V to
5V batteries. It includes an LDO for microcontroller
power supply, a 10-bit ADC for comprehensive
voltage measurement across seven analogue pins,
and the capacity to drive two LED emitters with
8-bit current control from 45mA to 600mA.
The reference design is suitable for household and
commercial buildings.
Renesas Electronics Corporation
https://www.electronicsforu.com/electronics-
projects/reference-design-for-a-photoelectric-
smoke-detector
WWW.EFYMAG.COM
DESIGN: CIRCUIT
Multistandard Verified Smoke Detector
The reference design for multistandard verified
smoke detector features a dual-wavelength opti-
cal module with integrated LEDs and photode-
tectors, streamlining design with pre-verified
algorithms and adaptability for various standards.
The CN0537 reference design by Analog Devices is
a smoke detector developed to comply with UL 217/
UL 268 and similar smoke and fire detection stand-
ards. It is compatible with the Arduino form factor,
aiming to expedite prototyping and evaluation of
embedded smoke detection algorithms. The design
includes an algorithm and a dataset based on the
ADPD188BI optical module, which is a comprehen-
sive photometric system tailored for smoke detec-
tion applications. The optical module employs a
dual-wavelength technique, featuring two integrated
LEDs that emit light at different wavelengths, and
two integrated photodetectors that capture scattered
light, enabling the detection of smoke particles.
Verified algorithms accelerate the deployment of the
smoke detection solution, and additional data can be
collected and integrated into the algorithm to adapt it
for other standards. Incorporating the optical module
instead of traditional discrete smoke detector circuits
significantly streamlines the design process, as the
optoelectronics and the analogue front end (AFE) are
already integrated into the module.
The reference design is particularly well-suited for
smoke detection applications.
Analog Devices (ADI)
https://www.electronicsforu.com/electronics-
projects/multistandard-verified-smoke-detector-
reference-design
ELECTRONICS FOR YOU EXPRESS | APRIL 2024
The author, Nidhi Agarwal, works
as Technology Journalist at EFY
Smoke Detection with Ambient Light
Cancellation
The design provides a solution for smoke detec-
tion, complying with UL217 9th edition standards.
It uses a photoelectric system and dual-wavelength
optical approach for light rejection and signal-to-
noise ratio, reducing false alarms and supporting
air quality monitoring.
The TIDA-010941 reference design by Texas
Instruments offers a cost-effective solution for
smoke detection, complying with UL217 9th
edition standards through a low BoM approach.
The design achieves a high signal-to-noise ratio,
enabling advanced algorithms that minimise false
alarms and enable precise particulate measure-
ment for air quality monitoring. The device features
a sophisticated sensing signal chain with modula-
tion for enhanced ambient light rejection and a
compressive sensing method for efficient power
use. Its dual-wavelength and angle optical system
significantly reduces false alarms and supports
air quality assessment. With a signal chain SNR
of 77dB and a total current consumption of only
5.8µA, the design ensures exceptional detec-
tion clarity and over 10 years of battery life. This
design surpasses traditional DC-based systems
by offering superior ambient light rejection and
SNR, eliminating the need for an optical chamber,
and reducing materials and assembly costs. Its
dual-wavelength strategy and multi-angle light
scattering measurement technique enhance detec-
tion accuracy by precisely distinguishing between
smoke particles and other particulates, highlighting
its potential to improve safety and environmental
monitoring in various settings.
The reference design finds applications in industrial
devices such as air-conditioner units, air purifiers,
and air quality sensors, as well as in commercial
and residential smoke and heat detectors.
Texas Instruments (TI)
https://www.electronicsforu.com/electronics-
projects/ambient-light-cancelling-smart-analog-
smoke-sensor-interface-reference-design
65
 DESIGN: TIPS
NETS FOR ELECTRONICS DESIGN:
Migrating From Amateur To
Professional Designer
Nets are transforming electronics design! From messy wire connections to organised circuits,
learn why professionals are making the switch
S
ASHWINI KUMAR SINHA chematic circuit design is a key step for
any electronics product design, which
we later convert to PCBs and then
generate the Gerber files for PCB production.
However, the circuit diagrams and designs
we often see during our engineering days
look something like Fig. 1, with wires to
show connections. Yet, when you transition
to the professional world and delve into
complex designs, you encounter designs like
the one in Fig. 2. Most professional circuit
designs and reference designs often resem-
ble this. Many engineers, especially those
who are self-taught or lack formal training in
electronics design, may not be aware of this
design, which uses nets.
For basic circuit design, the first option
is acceptable. However, for professional
product design and prototyping, if you need
to make changes to the design and replace
Fig. 1: Circuit design using normal wiring lines
66 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS
any ICs, or diodes, it becomes a complex
problem. Making such changes in the
initial design, where we have wire lines to
connect the pins and components on the
circuit, can be challenging. If your design
has many components, a mesh of wire
lines makes it complex to read the design.
It also becomes impossible to change or
replace the ICs and components in the de-
sign. Many newbies and amateur design
engineers unknowingly make this mistake
and find themselves in a difficult situation
when their design requires modification
or updating.
This article is for those design engi-
neers, especially those new to electronics
design, who may have entered electron-
ics design as hobbyists and learned
through experience rather than pursuing
a certification course in circuit design.
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Recently, I published a RISC-V
system design using the nets-based
design and received numerous
messages from people who were
unaware of it and unable to read
DESIGN: TIPS
the circuit design I published.
This article is based entirely on
my experience with students and
newcomers who are not famil-
iar with nets-based designs and
often make mistakes in their initial
electronic circuit and schematic
designs. Later, they find themselves
trapped when they need to update
the design or replace any compo-
nents in it. Moreover, when design-
ing electronic devices like SBCs or
smartphones, or any device with
many electronic components, using
wiring-based circuit schematics
becomes impractical. The mesh of
wires in such schematics (as in Fig.
1) makes all connections appear
jumbled and unreadable, even to the
designer.

Solution
The solution is to use nets when
designing the circuit and schemat-
ics for your product. Let’s explore
what these ‘nets’ are, why profes-
sional design engineers use them,
and how.
As you can see in Fig. 1, if
you need to change the ICs and
Fig. 2: While designing a circuit using nets, each component and circuit can be modified and replaced
without affecting the overall design. Each system can be individually managed—power circuit,
components, you must delete the
charging circuit, clock circuit like wise component and add new wiring. All

Fig. 3: Big complex circuit design divided in individual system for device then connected with main design to form whole complete system circuit. Powering
circuit, peripheral circuit, I/O circuit, connectors circuit all can be separately managed and modified while forming the main design for device

68 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS WWW.EFYMAG.COM


Fig. 4: Example circuit of RISC-V system where each component is divided into blocks connected over nets
connection lines attached to it get
deleted, and you need to rewire it.
In the second diagram, you can sim-
ply delete and use another compo-
nent if needed to modify the design.
Only the net port gets deleted, and
you can easily add the new nets and
connect the component using nets.
What are nets
Nets, in the context of electronics
design, refer to logical connections
between different components in a
circuit. Instead of physically draw-
ing wires between components,
engineers use the named nets to
represent these connections.
Why do professional design
engineers use nets?
1. Clarity and organisation.
Nets provide a clear and organised
representation of connections within
a circuit. By naming and labelling
nets appropriately, engineers can
easily understand the interconnec-
tions between components. A big
70 APRIL 2024 | ELECTRONICS FOR YOU EXPRESS
DESIGN: TIPS
and complex circuit with many com-
ponents connected using wires can
become messy and unreadable, with
lines crossing each other. Using nets
allows engineers to separate these
connections.
2. Modularity and scalability.
Using nets facilitates a modular
design approach, where circuits
are broken down into manageable
sections or modules. This modular-
ity promotes scalability, allowing
engineers to reuse modules in dif-
ferent designs or expand the circuit
without redesigning the entire
system (Fig. 3).
3. Ease of modification. Nets-
based designs are easier to modify
and maintain compared to wiring-
based designs. When changes
are needed, engineers can simply
modify the connections between
nets without having to redraw the
entire schematic. This flexibility
streamlines the design iteration pro-
cess and reduces the risk of errors.
4. Hierarchical design. Nets
enable hierarchical design meth-
odologies, where complex circuits
are divided into hierarchical blocks
or modules. Each module com-
municates with others via named
nets, simplifying the overall design
structure and enhancing readability
(Fig. 4).
5. Compatibility with EDA
tools. Electronic design automation
(EDA) tools, used for schematic
capture and PCB layout, support
nets-based designs. These tools
can automatically generate netlists,
which describe the connections be-
tween components, facilitating the
design-to-production workflow.
6. Standardisation and collabo-
ration. Using nets promotes stand-
ardisation and consistency in circuit
designs. Engineers can easily share
schematics with colleagues or col-
laborators, knowing that the logical
connections represented by nets will
be universally understood.
WWW.EFYMAG.COM
 DESIGN: TIPS
EDA tools can extract netlists
directly from schematics, capturing
the connections between compo-
nents accurately. This automation
reduces manual effort and minimis-
es the risk of errors during down-
stream processes.

Checking the connection and

DRC (design rule checking) in
nets vs wiring design
In wire-based designs, all compo-
nents are connected with wire lines
crossing over each other. When a
design has numerous components,
these overlapping lines make it im-
possible to cross-check and adhere
to design rules. However, with nets,
each net port and pin connection
can be clearly cross-checked to see
which pins and how many compo-
nents are connected.
For instance, if you have a volt-
age regulator IC powering the main
chip, sensors, indication system,
and clock signal generator in a
system, selecting the output pin on
the power system circuit shows all
other components connected to it.
If you want to replace the regulator
in a later version or make modifi-
cations, you can easily modify the
power system module, and all other
circuits adapt to that new IC of the
voltage regulator. You only need to
manage the name of the net port
for that.

Ashwini Kumar Sinha, an IoT and AI

enthusiast, is a tech journalist at EFY
Fig. 5: Cross-checking in wire-based design vs checking the design connection using nets

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