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VO14642A Solid State Relay
VO14642A Solid State Relay
www.vishay.com
Vishay Semiconductors
1 Form A Solid-State Relay
FEATURES
• High speed SSR - ton/toff < 800 μs
S DC S' • Maximum RON 0.25 Ω
6 5 4 • Isolation test voltage 5300 VRMS
• Load voltage 60 V
• Load current 2 ADC configuration
• DIP-6 package
• Clean bounce free switching
1 2 3 • TTL / CMOS compatible input
• Available on tape and reel
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
DESCRIPTION • Instrumentation
The VO14642 is a high speed single channel normally open • Industrial controls
solid-state relay (SPST - 1 form A) in a DIP-6 package. The
relay is constructed as a multi-chip hybrid device. A high • Security
efficient infrared LED enables low forward current on the • Automatic measurement equipment
input side. On the output side high performance MOSFET
switches provide a low RON and can be configured for AGENCY APPROVALS
AC/DC or DC only operation. • UL1577
• cUL - UL1577
• DIN EN 60747-5-5 (VDE 0884-5) capable, consult sales
representative for details
Note
• Agency approvals are valid only for ambient temperature range
-40 °C to 85 °C
ORDERING INFORMATION
DIP-6 SMD-6
V O 1 4 6 4 2 A x x T R
PACKAGE
SMD-6, tape and reel VO14642AABTR
DIP-6, Tubes VO14642AT
DC mode
2.0
Load Current/A
1.5
AC/DC mode
1.0
0.5
0.0
-50 -25 0 25 50 75 100
Ambient Temperature/°C
Fig. 1 - Load Current (AC/DC) vs. Temperature
THERMAL CHARACTERISTICS
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Maximum LED junction temperature At 25 °C Tjmax. 125 °C
Maximum output die junction temperature At 25 °C Tjmax. 125 °C
Thermal resistance, junction emitter to board At 25 °C θEB 176 °C/W
Thermal resistance, junction emitter to case At 25 °C θEC 208 °C/W
Thermal resistance, junction detector to board At 25 °C θDB 67 °C/W
Thermal resistance, junction detector to case At 25 °C θDC 134 °C/W
Thermal resistance, junction emitter to junction detector At 25 °C θED 310 °C/W
Thermal resistance, case to ambient At 25 °C θCA 2180 °C/W
Note
• The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the
temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of
PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay's thermal
characteristics of optocouplers application note
TA
θCA
Package
TC
θDC θEC
θDB
θEB
TB
θBA
19996
TA
PIN CONFIGURATION
1 6 1 6
Anode Load Anode
2 5 2 5
Cathode Cathode
3 4 3 4
Do not use Load Do not use
20545
Input
Output
TON
TOFF
Output 90 %
10 %
20991-1
160
Maximum Safety Input Current (mA)
450
400 140
0 0
0 25 50 75 100 125 150 175 200 0 25 50 75 100 125 150 175 200
1.7
1.8
1.6 IF = 50 mA
1.6 Tamb = -55 °C
VF - Forward Voltage (V)
1.5 IF = 30 mA
Fig. 4 - Forward Voltage vs. Forward Current Fig. 7 - LED Voltage vs. Temperature
1.60 100
1.20
60
1.00
40
0.80
20
0.60
0
0.40
0.20 -20
0.00 -40
-55 -35 -15 5 25 45 65 85 -55 -35 -15 5 25 45 65 85
Fig. 5 - LED Leakage Current vs. Ambient Temperature Fig. 8 - LED Forward Current for Switch Turn-On vs. Temperature
40 1.8
ON-Resistance, Normalized to 25°C
IF = 10 mA
VLoad = 60 V
35 1.6 IL = 1 A
Leakage Current (nA)
30
1.4
25
1.2
20
1.0
15
0.8
10
5 0.6
0 0.4
-55 -35 -15 5 25 45 65 85 -55 -35 -15 5 25 45 65 85
Temperature (°C) Temperature (°C)
25 2200
IF = 10 mA, IL = 1 A, tP = 5 ms IL = 1 A, tP = 5 ms
1800
20
Turn-off Time (μs)
5 200
-55 -35 -15 5 25 45 65 85 5 10 15 20
Temperature ( C) IF - Forward Current (mA)
Fig. 10 - Turn-Off Time vs. Temperature Fig. 13 - Turn-On Time vs. Forward Current
30 250
IL = 1 A, tP = 5 ms
T = 85°C
20
150
15 T = 25°C
100
10
T = -55°C 50
5
0 0
5 10 15 20 0 20 40 60
Forward Current (mA) Applied Voltage (V)
Fig. 11 - Turn-Off Time vs. Forward Current Fig. 14 - Switch Capacitance vs. Applied Voltage
1000
IF = 10 mA, IL = 1A, tP = 5 ms
900
Turn-on Time (μs)
800
700
600
500
-55 -35 -15 5 25 45 65 85
Temperature (°C)
3.55 ± 0.25
0.25 ± 0.10
1.00 ± 0.10
0.25 ± 0.20
Leads coplanarity
2.54 nom. 0.60 min. 8.00 min. 0.1 max.
2 x 2.54 = 5.08
6 5 4
Recommended footprint
5.08
1.50
2.54
DIP-6
7.60 max. 7.62 typ.
7.25 ± 0.10 6.65 ± 0.15
0.79 typ.
3.55 ± 0.25
6.09 ± 0.25
0.70 ± 0.20
3.04 ± 0.25
1.00 ± 0.10
0.50 ± 0.10
2.54 nom. 3° to 9
° .10
0.25 ± 0
2 x 2.54 = 5.08
6 5 4
1 2 3
VO14642
V YWW 68
Note
• Tape and reel suffix “TR” is not part of the package marking
7.5 ± 0.1
16.0 ± 0.3
CL 7.77 ± 0.1
3.9 ± 0.1
12.0 ± 0.1 10.3 ± 0.1
4.4 ± 0.1
1.5 min.
Fig. 15 - Tape and Reel Packing
TUBE PACKING
TYPE UNITS/TUBE TUBES/BOX UNITS/BOX
DIP-6 50 40 2000
SOLDER PROFILES
300 300
5s
Lead temperature max. 260 °C
250 255 °C
250 240 °C 245 °C
235 °C to
260 °C second full line: typical
wave 217 °C
Temperature (°C)
Temperature (°C)
0 0
0 50 100 150 200 250 0 50 100 150 200 250 300
94 8626 Time (s) 19841 Time (s)
Fig. 16 - Wave Soldering Double Wave Profile According to Fig. 17 - Lead (Pb)-free Reflow Solder Profile According to
J-STD-020 for DIP Devices J-STD-020 for SMD Devices
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