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Benq w500 20080123 172219 Ver.00e Level2
Benq w500 20080123 172219 Ver.00e Level2
Benq w500 20080123 172219 Ver.00e Level2
All Regions
Version: 00e
Date:2008/01/23
Notice:
For RO to input specific “Legal Requirement” in specific NS regarding to responsibility and liability
statements.
Please check BenQ’s eSupport web site, http://esupport.benq.com, to ensure that you have the most
recent version of this manual.
2
Abbreviations & Acronyms
A
A/D Analog to Digital
B
BenQ BenQ Corporation
D
DLP Digital Light Processing / Texas Instruments®
DMD Digital Micro mirror Device
DVI Digital Video Interface
DVI-I Digital Video Interface-Integrated
P
POM Pond of Mirrors
R
RS232 Interface Between Data terminal Equipment and
Data Communications Equipment Employing
Serial Binary Data Interchange
S
SVGA Super Video Graphics Array, A screen resolution
of 800 x 600 pixels.
SXGA Super XGA. A screen resolution of 1280x1024
pixels.
V
VGA Video Graphics Array. A screen resolution of
640x480 pixels.
X
XGA A screen resolution of 1024x768 pixels.
3
About This Manual
This manual contains information about maintenance and service of BenQ products. Use this
manual to perform diagnostics tests, troubleshoot problems, and align the BenQ product.
Important
Only trained service personnel who are familiar with this BenQ Product shall perform
service or maintenance to it. Before performing any maintenance or service, the
engineer MUST read the “Important Safety Information”
Trademark
Other companies, products, or service names may be the trademarks of their respective companies.
Introduction
This section contains general service information, please read through carefully. It should be stored
for easy access place.
The RoHS (Restriction of Hazardous Substance in Electrical and Electronic Equipment Directive) is a
legal requirement by EU (European Union) for the global electronics industry which sold in EU and
some counties also require this requirement. Any electrical and electronics products launched in
the market after June 2006 should meet this RoHS requirements. Products launched in the market
before June 2006 are not required to compliant with RoHS parts. If the original parts are not RoHS
complaints, the replacement parts can be non ROHS complaints, but if the original parts are RoHS
compliant, the replacement parts MUST be RoHS complaints.
If the product service or maintenance require replacing any parts, please confirming the RoHS
requirement before replace them.
4
Safety Notice
1 Make sure your working environment is dry and clean, and meets all government safety
requirements.
2 Ensure that other persons are safe while you are servicing the product.
3 DO NOT perform any action that may cause a hazard to the customer or make the product
unsafe.
4 Use proper safety devices to ensure your personal safety.
5 Always use approved tools and test equipment for servicing.
6 Never assume the product’s power is disconnected from the mains power supply. Check that it is
disconnected before opening the product’s cabinet.
7 Modules containing electrical components are sensitive to electrostatic discharge (ESD). Follow
ESD safety procedures while handling these parts.
8 Some products contain more than one battery. Do not disassemble any battery, or expose it to
high temperatures such as throwing into fire or it may explode.
9 Refer to government requirements for battery recycling or disposal.
Compliance Statement
1. Caution: This Optical Storage Product contains a Laser device. Refer to the product
specifications and your local Laser Safety Compliance Requirements.
General Descriptions
This Service Manual contains general information. There are 2 levels of service:
Level 1: Cosmetic / Appearance / Alignment Service
Level 2: Circuit Board or Standard Parts Replacement
5
Product Overview
Specifications
6
Tested under 60” (diagonal) image size +120% offset with Wide
projection lens position unless other specified. Lamp is normal
mode. Measurement Details refer to Appendix A. Reference
1.0 Optical Performance meter : BENQ RD CL200 meter (S/N 72321017) for brightness,
BENQ RD T10 (S/N 52231049)for Iris Contrast
Equipment : Benq production line (Correlation based on BenQ
RD meter)
1.1 ANSI Brightness Minimum 800 Lumens
1.2 Brightness Uniformity
1.2.1 Uniformity Minimum 60%
1.3 Contrast Ratio
1.3.1 ANSI Contrast Minimum 150:1
1.3.2 FOFO Contrast
(Iris function on) Minimum 4000:1
1.4 Light Leakage
1.4.1 Light Leakage in Active
Not Visible
Area
7
R-G ≦1 ≦1.2
G-B ≦1 ≦1.2
R-B ≦1 ≦1.2
2.8 Image Quality
2.8.1 LCD Image Quality See Appendix D
2.8.2 Image Imperfection See Appendix D
3.0 Mechanical Specification
295.8 x 349 x 126.8mm (L x W x H)
3.1 Dimensions
295.8 x 349 x 109.5mm (L x W x H) without feet
3.2 Weight 4.0kg+/-0.2
3.3 Security Slot Kensington compatible slot 150N break away force
3.5 Lens Cover Attached Lens Cover
Two fast adjustable feet in front, A Fixed foot in rear. foot
3.6 Feet
Tilt:0-6∘,right/left: +2.2∘/-0.5∘
4.0 Packaging Detail refer to C309 (Packing Description)
4.1 Outside Dimensions 410 x 375 x 207(L x W x H)
4.2 Weight 5.9 Kg (Including Accessories, Projector).
4.3 Palletization 36 by Air; 1680 / 40’ container, or 840/20’ container by sea
5.0 Thermal Specification Mechanical component temperature at ambience 0~40℃
Normal surface:
5.1 Surface held or touched Metal < 70°C; Plastic<95°C
for short periods Bottom surface: @ 25° C
Metal < 55°C; Plastic<70°C
5.2 Surface which may be Metal Plastic
touched <60°C <85°C
5.3 Exhaust Air <95°C
6.0 Environmental Adhere to Appendix B
Operating 0~35°C, without condensation
6.1 Temperature
Storage -20~60°C, without condensation
Operating 10~90%RH, without condensation
6.2 Humidity
Storage 10~90%RH, without condensation
Normal mode: 31dBA @ 25°C
Typical
Eco mode: 27dBA @ 25°C
6.3 Audible Noise Level
Normal mode: 32dBA @ 25°C
Maximum
Eco mode: 28dBA @ 25°C
Operating:
6.4 Altitude 1) W/O high altitude mode:0~1499m, 0~35degC
2) With high altitude mode: 1500~3000m 0~30degC
Non-operating: 30°C @ 0~12200 feet above sea level
6.5 Shock See Appendix B2.1
6.6 Drop See Appendix B2.1
6.7 Vibration See Appendix B2.1
8
8.0 Reliability
Optical Measurement
1. Scope:
This document describes critical optical related test definitions and Instructions for data or video
projectors. The other general terminologies are specified in ANSI IT7.228-1997.
9
2. General Requirements
1. The unit under test should be allowed to stabilize without further adjustment for a minimum of 5
minutes, at nominal ambient room temperature of 25°C, before making measurements.
2. Measurements shall take place in a light proof room, where the only source of illumination is the
projector. Less than 1 lux of the light on the screen shall be from any source other than the
projector.
3. All measurements shall be made on flat screens that do not provide any advantage to the performance
of the unit
4. All measurements shall be made at standard color temperature setting, 100% white image (per ANSI
IT7.228-1997), except where noted
3. Practical Requirements
1. When measuring contrast manually, operators should not wear white clothing since light reflected
from white clothing can influence the measurement.
2. Unless otherwise specified, the projection lens is set in the widest zoom position since zoom function
can influence the measurement.
3. Measurement should be performed with Minolta Chromameter, Model CL-100, or equivalent.
L10 L11
L1 L2 L3
L4 L5 L6
L7 L8 L9
L13 L12
Note: L10, L11, L12, L13 are located at 10% of the distance from corner itself to L5
A2. UNIFORMITY
Unit: %
Brightness: Default
Contrast: Default
MIN ( E10, E11, E12, E13)
L1 + L2 + L3 + L4 + L5 + L6 + L7 + L8 + L9
Uniformity = 9
10
Contrast Ratio shall be determined from illuminance values obtained from a black-and-white ”chessboard”
pattern consisting of 16 equal rectangles. The white rectangles shall be at 100% gray and the black
rectangles at 0% gray. Illuminance measurements shall be made at the center of each of the rectangles.
W3
H1 H3 H2
W1
A9. THROW RATIO
Throw ratio = projection distance / the width of the projected image
A12. COLOR
Color is expressed as (x, y) in 1931CIE chromaticity values
Note: Color is measured at the center of the screen that is entirely the measured color under default
brightness and contrast settings
Grid of 1.5
1 Pixel pixels
Flare
Defocus
1.5 pixels
i.
12
13
Pattern 1 (Please contact BenQ RD for file with correct resolution)
14
Pattern 3 (Please contact BenQ RD for file with correct resolution)
15
Chart 1 Example of Pixel Testing Pattern (60” screen size)
(Please contact BenQ RD for file with correct size)
16
A20. Definition of “Slight flare”
Slight flare is observed with following steps:
1. Slight flare is measured with the “Line” in pattern “Cross hatch with dots”
2. A slight flare is defined as flare with very faint brightness compares to
“Normal Flare” in “Line”. Please refer to the drawing below:
“Normal”
Flare
Slight flare
Brightness PE = 0.981 RD
Color
Wx PE = RD -8
Wy PE = RD +1
Rx PE = RD +3
Ry PE = RD -3
Gx PE = RD -18
Gy PE = RD +15
Bx PE = RD -1
By PE = RD -3
BKx PE = RD -6
Bky PE = RD -2
17
Design Verification Test Procedure
Drop test with packing gross weight and falling height relationship
Gross Weight Falling Height (cm) Spec.
( Kg ) C3 C4/C5/MP
0.0<W<4.5 91 (106) 91
4.5≦W<11.0 91 (106) 91
11.0≦W<20.5 76 (91) 76
20.5≦W<34.0 61 (76) 61
34.0≦W<45.5 46 (61) 46
45.5≦W<79.4 31 (46) 31
Package Drop
Criteria *A *B
Test Orientation: 1 corner, 3 edges, 6 faces
Criteria:
1. Criterion *A: After testing, no abnormality on function
and appearance, brightness and uniformity deviation
must be within +/- 5%.
2. Criterion *B: After testing, no abnormality on function
and appearance. (This is tightened spec to double
check design margin on R&D stage only.)
3. No broken issue on carton.
4. No broken issue on cushion, but cracks acceptable.
Package Vibration Test condition :
1. Sine wave:
5~200Hz 1.5G, 1 octave/min, 15 min dwell on each resonant
frequency, all primary axis, one sweep 30 minutes/Min. per
orientation, total of 90+ min.
2. Random wave:
5-100Hz, 0dB/Oct. 0.015(g2/Hz);
100-200Hz, -6dB/Oct. N/A
200Hz, N/A 0.0038(g2/Hz)
Equivalent to 1.47 Grms, all primary axes, 20 min
per-orientation, total of 60 min.
Note: Perform random vibration test before, the Sine-wave
vibration should be done first.
Un-package Vibration Sine-wave, 5~200Hz, 1.5G, all primary axis, one sweep (5 minutes)
(Non-operating) per orientation, total of 15 min.
18
Un-package Shock Waveform: Half sine
(Non-operating) Faces: 6 sides/per orientation, 3 shocks
Duration: < 20 ms
Velocity accelerate: 50 G
Bench Drop 1. Pivot, 90 degree, sitting on right and left side, 1 drop per
orientation, total of 2 drops.
2. Bottom and opposite, 1 drop per orientation, drop height 5 cm,
totally 2 drops.
Storage High Temperature / Test condition: (-20°C ~ 60°C, 10% ~ 90% R.H.)
Humidity
1. Storage high temperature / humidity exposure test:
(Non-operating, with package)
25℃/60%, 1hrs → 60℃/90%, 24hrs → 25℃/60%, 1hrs
Criteria Inspection:
1. The products should be operated normally at specified lower and
higher temperature environment.
2. The carton no crash and broken issue.
Altitude Operating:
0°C ~ 40°C @ 0 ~ 3000 feet above sea level
0°C ~ 30°C @ 3000 ~ 6000 feet above sea level
1°C drop per 500 feet @ 6000 ~ 10000 feet above sea level
Non-operating: 30°C @ 0 ~ 40000 feet above sea level
B2.3 Regulatory
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FCC part 15J class B, EN55022 class B, under 3 dBuv
Surge 1KV line to line, 2KV line to ground on input power lines.
The product is expected to perform to its full potential without loss of function, performance,
critical parametric changes, and other undesirable anomalies, over the applied boundaries of this
specification. The following product failure is not allowed within the boundaries defined in this
specification:
1. Failure including permanent damage, critical paramedics changes (optical performance defined in
3. Failure violating external laws, regulatory agency standards, and government directives.
20
B4. Test Sequence
Atmospherics, Dynamic, and Regulatory test sets require separate units and can be processed in
21
Thermal and Noise Test Procedure
Ⅰ、Noise Testing Standard Based on *B Shown as follows,
A
i
r
F
l
o
w
F
i
n
d
t
h
e
m
a
x
i
m
u
m
t
e
m
p
e
r
a
t
u
r
e
a
n
d
p
o
s
i
t
i
o
n
Position of measurement
22
Ⅲ、Temperature of System Level:
Before measurement temperature, we can use IR camera to make sure the position of hot spot.
We defined maximum temperature and measurement position as following:
Spec. Maximum
Area Define
metal℃ plastic℃
23
LCD Image Quality
Bright defect
(white dot)
(Image In Focus)
(Test pattern: Any grey level with 100% dot)
Count Size
G R B R/B G/R/B
White dot (5% OVER) White dot(0.8%-5%)
Under 0.8% No count No count No count
1.3~0.8% ≦8 No count No count
2.0~1.3% ≦1 No count No count
2.5~1.3% 0 ≦4 No count
5~1.3% 0 No count < 2 pixel < 3 pixel
10~2.0% 0
10~2.5% 0 ≦1
20~5% 0 0 ≦3
100~20% 0 0 0
Total ﹣ ﹣ ﹣
24
Black dot defect Blemish and
Bright dust(0% FB )
(Black level depends on Shark Unevenness(Same
Dark dust(100%FW) Pixel short cut
limit sample) skin sample),
(Dust In Focus)
(Image In focus) Rubbing strain
Size =Total dust area Count Size Pair Size 30% Grey
G R B G R B G/R/B R/G/B R/G/B G R G B
Limit
sample
1 3 5 S<3dot 5 < 3 dot Area Limit sample
depands
≦4 dot ≦ 6 dot on picture
≦ 10 dot
﹣ ﹣ ﹣ 1 3 5 5
25
Bright dust
Half-bright dust black Dust
(Possible to
(Possible to Just Focus (out of Focus) Scratch
Just Focus
\Out of Focus) (Lens Array )
\Out of Focus)
Set Set TBD
G/R B G/R W B
﹣
﹣ ﹣ ﹣ ﹣
T≦10% ﹣
﹣ ﹣ ﹣
T≦30% T≦30% ﹣
﹣ ﹣ ﹣ ﹣
﹣ T≦50%
﹣ ﹣ ﹣ ﹣
﹣ ﹣ ﹣ T≧80% ﹣
﹣
﹣ ﹣ ﹣ ﹣ ﹣
26
Supporting Timings
1. Timing Table
27
HDMI support timing is as following:
1080p@24Hz
28
YPbPr support timing is as following:
1080p@24Hz
29
2. Characteristics of inputs/outputs
30
3. Electrical Interface Character
Interface Definition
1 5
6 10
11 15
31
• Video & Component Input
Composite input
Pin Definition
1 Composite video
input
• S-Video input
Pin Description
4 3 1 GND
2 1 2 GND
3 Luminance
4 Chroma
• Control Port
Pin Description Pin Description
8 7 6 1 RX 2 NC
5 4 3 3 NC 4 GND
2 1 5 NC 6 NC
7 TX 8 GND
• HDMI Port
32
• Component Port
1 2 3
33
Local Keyboard Description (Detailed description refer to SW Specification)
Key Name Detailed Description
Power Use this button to turn your Data Projector on and off (standby mode).
Source To select input sources as Computer, Video, S-Video, YPbPr, HDMI
Exit Exit menu function
Mode Change Different presentation mode
Menu (1) OSD –up (2)OSD close
Enter Enter menu function
Right (1) Move next page (2) OSD increment & move next sub-item (3) Keystone+.
Left (1) Move previous page (2) OSD decrement & move previous sub-item (3)
Keystone-.
Up (1) Move item bar. (2) Move to page level
Down Move item bar
Remote Control Keys Description (Detailed description refer to SW Specification)
Function Description
To turn on and off projector
Comp 1 select component 1
Comp 2 select component 2
Video select composite video
HDMI select HDMI digital signal input
D-sub select PC signal input,
S-Video select S-video channel
ANA select 16:9 linear aspect ratio(1280*720)
4:3 select 4:3 aspect ratio (960*720)
LB select letter box (1280*720)
WIDE select nonlinear scaling (depends on input source)
REAL output without scaling when input resolution is lower 1280*720
PICTURE Load PICTURE MODE: Jump to osd “picture” page
MEMORY 1 Load User 1
MEMORY 2 Load User 2
MEMORY 3 Load user 3
DEFAULT LOAD DEFAULT VALUE
← If Menu item is selected, press this button to decrease the setting scale bar
number.
→ If Menu item is selected, press this button to increase the scale bar number
setting.
↑ If Menu item is selected, press this button to increase the scale bar number
34
setting
↓ When the Menu page is selected, and shift to lower item. If Menu item is
selected, press this button to decrease the scale bar number setting.
Menu press it to pop-up OSD menu, press again to close
Exit press it to exit focused menu layer
Enter press it to enter focused function
BRIGHTNESS Hot Key Brightness
CONTRAST Hot Key Contrast
COLOR Hot Key Color
TINT Hot Key Tint
LIGHT Press to light on and off
35
4. Functionality
36
External Message indicator (Detailed description refer to SW Specification)
Message Occasion
PC/Composite Video /S-Video /YPbPr/HDMI The system does not detect the signal
Searching
Acquiring Signal The system is auto- adjusting
Out of range The signal is over the specification
Chang Lamp if Brightness is Low Lamp Hour is over 2000 hours
Change the lamp! The power will turn off after 3000 Lamp Hour is over 2980 hours
hours.
Change the lamp! Lamp Hour is over 3000 hours.
And the message will blink , and it will shut down
after 40 seconds.
37
Power Supply Specification
Specification Description
Input Voltage Range The unit shall meet all the operating requirements with the range 90
~ 264 VAC
Frequency Range The unit shall meet all the operating requirements with an input
frequency range 50 Hz ~ 60 Hz
Power Consumption Normal operation: 215 W (Max)
standby mode: <1.5 W
Regulation Efficiency 80 % (typical) measuring at 115Vac and full load
Specification Description
Applicable Lamp 140W, DC operation
Starting pulse from Ignitor Pulse voltage 10KV max.
38
4. Others
Item Description
Power good signal Active high after 5 Volt reach 95% of its rating and goes to logic low at
least 0.5ms before power falls to 90% of its rating
High voltage and high To avoid user from the dangerous of HV and high temperature, when
temperature protection front door of lamp case is opened whether intentionally or accidentally,
the power should be disconnected immediately. When the door is closed
again, the igniter restart sequence should be compliant to that is
described previously
39
Drawing
40
Packing
41
Customer Acceptance
42
43
44
45
Disassembly/Assembly
Exploded View
46
47
Module 2 – ASSY Blower
48
Module 3 – ASSY Ballast Module
49
Module 5 – ASSY Lower Case
50
Disassembly / Assembly
Lens Cap
51
Lamp + Lamp Door
52
53
Filter
54
Front Case
55
MB
56
MB Fan
57
Ballast
58
59
OPT Engine
60
Power BD
61
Blower
62
63
Level 1 - Cosmetic / Appearance / Alignment Service
圖 1
64
等級區分 A 區 B 區 C 區
Classification Area A Area B Area C
光源位置 被觀察物正上方
Lighting positioning Above of inspected part
目視與被觀察物位置(垂直)
90º 90º 90º
Inspection position relative to part
目視距離(參考距離)
45 cm 45 cm 45 cm
Inspection distance
表 1
1.1.3 檢視時間
Inspection interval (time)
檢視時間與樣品大小及檢視區域有關。
Inspection interval is a function of surface area.
檢視時間以 10 秒為限。
Time for visual inspection: 10sec.
65
TABLE 1. 產品一般外觀塑膠件的黑點、雜質、凸點、砂粒缺陷檢驗標準
(General Product of plastic outlook of dot, blemish, and others spec inspection standard)
A 級面 B 級面 C 級面
規格 A surface B surface C surface
Spec (允許數) (允許數) (允許數)
(面積 cm2) (Number of defect) (Number of defect) (Number of defect)
( Area cm2 ) 100*10 100*10
20*20 50*50 70*70 20*20 50*50 70*70 20*20 50*50 70*70 100*100
0 0
P < 0.1 mm2 不計 不計 不計 不計 不計 不計 不計
不計 不計 不計 不計 不計
雜質 點距 Distance Ignor Ignor Ignor Ignor Ignor Ignor Ignor
Ignore Ignore Ignore Ignore Ignore
Particle 2cm e e e e e e e
黑點 0.1 ≦P< 0.2
Blemis mm2
h 2 3 4 5 2 3 4 5 4 4 5 6
點距 Distance
| 4cm
異色點 0.2≦P
Color <0.3mm2 點距 0 0 0 0 2 3 4 5 3 4 5 6
spot Distance 4cm
P<0.1 mm2 不計 不計 不計 不計 不計 不計
不計 不計 不計 不計 不計 不計
點距 Distance Ignor Ignor Ignor Ignor Ignor Ignor
Ignore Ignore Ignore Ignore Ignore Ignore
凸點 2cm e e e e e e
0.1≦P<0.2mm
砂粒 2
點距 Distance 4 4 5 6 5 5 6 7 6 6 7 8
棉絮
4cm
毛屑
0.2 ≦P <
Particle 0.3mm2
| 3 4 4 5 4 5 5 6 6 7 7 8
點距 Distance
同色點
4cm
Spot with
0.3 ≦P <
same color
0.5mm2
2 2 3 4 3 3 4 5 4 4 5 6
點距 Distance
5cm
Total 4 4 5 6 5 5 6 7 6 6 7 8
備註 Note:
1. 檢測面積 A <20*20 以 20*20 之規範檢驗之, 20*20≦A<50*50,以 50*50 等級檢驗之,以此類
推
Use the 20*20 criteria to the area less than 20*20; 50*50 inspection criteria to the area
20*20≦A<50*50; etc.
雜質/黑點/異色點(Particle/Blemish/Color Spot)
1.1 A、B、C 級面定義請參考 6.2 級面定義。
Definition of surface A, B, C refer to 6.2
1.2 LOGO 周邊 2 cm 內不可有 0.05 mm2 以上之點, (0.05 mm2 以內之點不計)。
Blemish around the logo must be equal or smaller than 0.05 mm2
1.3 表面氣泡—不可有。
Bubble on the surface is to be reject.
66
TABLE 2 :產品一般外觀的塑膠件檢驗標準
(General Product of plastic outlook inspection standard)
NO Appearance Spec
A 區:不可有縮水,以帶手套檢驗,手摸過去不可有凹陷的感覺
A region: No Shrink. With gloves, no feeling of sink when touching
縮水
1 the surface
Shrinkage
B/C 區:不能明顯看出
B/C region: not obvious
流痕, 咬花, 光澤 不能有明顯的深淺不均
2
Run, Texture, Gloss No obvious non-uniformity
用指甲劃過不會有停頓感,並附近無明顯之光澤差異
接合線
3 When scratching on it, there’s no feeling of obstruction. Also, there
Welding Line/Knit Line
should not be obvious difference in gloss nearby it.
頂白 不可
4
Ejector Mark Reject
不允許
5 Label/screws shortage
Reject
缺料不可影響機構强度和表面
缺料
6 Material shortage is not allowed to impact structure strength and
Material shortage
surface
噴漆(Painting): ΔE<=2; L<=1.5 ; Δ A,B <= 0.6 銀粉漆 (Paint,
色差 aluminum)ΔE<=2 L<=1.0; Δ A, B <= 0.6
7
Chromatic aberration 非銀粉漆(Paint, non-aluminum)素材(Raw material) :
ΔL,A,B<=0.6 ,ΔE<=0.75
文字印刷不得有漏印、斷線、重影、組細不均、溢墨、印偏
( 1mm )、印斜 (歪斜<0.3 mm )。
Printing must not have incomplete printing, break off, overlap,
印刷
8 uneven thickness, excessive ink, printing misalignment (1mm),
Printing
printing slanting & crooked (<0.3mm)
文字印刷顏色須確認是否正確。
Printing color must be comparable to color chip and sample.
文字印刷不得有漏印、斷線、重影、組細不均、溢墨、印偏(1mm)
印斜 (歪斜 < 0.4 mm).
Printing must not have incomplete printing, break off, overlap,
9 Logo of panel sticker uneven thickness, excessive ink, printing misalignment (1mm),
printing slanting & crooked (<0.4mm)
文字印刷顏色須確認是否正確.
Printing color must be comparable to color chip and sample.
67
Side A:
(W < 0.1mm , L < 3mm): 容許 1 個
Only 1 this kind of scratch is accepted
W < 0.1mm , L < 3-5mm 容許 0 個
No this kind of scratch is accepted
Side B:
W < 0.15mm , L < 3mm 容許 2 個
Only less than 2 this kind of scratch is accepted
W < 0.15mm , L < 3-5mm 容許 1 個
Only 1 this kind of scratch is accepted
刮傷 Side C:
10
Scratch/Nicks W < 0.2mm , L < 1mm 容許 4 個
Only 4 this kind of scratch is accepted
W < 0.2mm , L < 3mm 容許 3 個
Only 3 this kind of scratch is accepted
W < 0.2mm , L < 3-5mm 容許 2 個
Only 2 this kind of scratch is accepted
Note:
刮傷見底材者不允許
Severe scratch which disclose the Natural
刮擦傷兩兩需相距 5cm 以上
Each scratch should be 5cm more far away from each other
68
69
70
Gap Spec (Refer to C321 document)
71
72
73
74
75
76
Adjustment / Alignment Procedure
1. YPBPR Color Alignment:
Default valve (User menu)
Contrast Brightness color Tint Sharpness Temp
YPbPr 50 50 50 0 50 Normal
RGBHD 50 50 50 0 50 Normal
YCbCr 50 50 50 0 50 Normal
S-Video 50 50 50 0 50 Normal
Video 50 50 50 0 50 Normal
HDMI-0 IRE 50 50 50 0 50 Normal
The color temp of User1 ~3 is the same as that of Normal color temperature
Color temperture Lamp Native Warm Normal Cool
77
Use Lux meter to
read the coordinate of
black and the value
note (x1,y1).
Decrease Pb offset until the y Decrease Pb offset until the x Increase Pb offset until the y Increase Pb offset until the x
C B A D
value <= y2 - 1/2Dy . Now, the value <= x2 - 1/2Dx . Now, the value >= y2 + 1/2Dy . Now, the value >= x2 + 1/2Dx . Now, the
reading of the Lux meter = reading of the Lux meter = reading of the Lux meter = reading of the Lux meter =
(x3,y3) and x3 will < x0, y3 will (x3,y3) and x3 will > x0, y3 will (x3,y3) and x3 will > x0, y3 will (x3,y3) and x3 will < x0, y3 will
> y0. < y0. < y0. > y0.
Decrease Pr offset the x value Increase Pr offset the x value will Increase Pr offset the x value will Decrease Pr offset the x value
will increase and y value will decrease and y value will increase decrease and y value will increase will increase and y value will
decrease to meet the spec. to meet the spec. to meet the spec. decrease to meet the spec.
x =.301
dx=.01
1/2dx=0.005
y =.321 x =.291 y =.311 dec. Pb x =.286
dec. Pb inc. Pr
x0 =.281 y0 =.311 x0 =.281 y0 =.311 x0 =.281 y0 =.311 x =.281 y =.311
y =.306
y =.291
dx=.01
1/2dx=0.005 y =.316
dec. Pb inc. Pb dec. Pr
x0 =.281 y0 =.311 x0 =.281 y0 =.311 x0 =.281 y0 =.311 x =.281 y =.311
y =.311 x =.276
y =.301
x =.271
x =.261
y =.291
x =.301 dx=.01
1/2dx=0.005
x =.291 y =.311 dec. Pb x =.286
inc. Pr inc. Pr
x0 =.281 y0 =.311 x0 =.281 y0 =.311 x0 =.281 y0 =.311 x =.281 y =.311
y =.306
y =.301
dx=.01
y =.321 1/2dx=0.005
inc. Pb y =.316
dec. Pr dec. Pr
x0 =.281 y0 =.311 x0 =.281 y0 =.311 x0 =.281 y0 =.311 x =.281 y =.311
y =.311 x =.276
x =.271
x =.261
78
2. Video Color Alignment Procedure
Equipment:
- Pattern generator (VG-828)
- Lux meter ( CL-200)
OSD Default value used for S-video color temp alignment:
Item Value Item Value
Factory > Video signal > Composite &
USER>Picture> 0 IRE 7.5 IRE
S-Video
USER>Picture>Basic Brightness 101
Contrast 50 Contrast 131
Brightness 50 Saturation 140
Color 50 Hue 0
Tint 0 Sharpness 50
Sharpness 50
Color Temp Normal
The color temp of User 1 ~3 is the same as that of Normal color temperature
Color temperture Lamp Native Warm Normal Cool
79
2. Mechanical alignment procedure
3.
IR wire ground
80
Item Picture Remark
blower wire
AC switch wire
81
Item Picture Remark
LED sponge
82
Item Picture Remark
thermal break
wire position
83
Item Picture Remark
10
Ground wire
addressed route
Position of ballast
wire
11
12
gap( reference)
84
Item Picture Remark
13
Upper
shielding Touch Main board shielding
14 together
Rear case
85
Item Picture Remark
15
16
86
4. Optical Engine Alignment & Assembly Concerns
Optical Engine Alignment procedure
1. Please refer to “Optical engine RMA process and Date Code Criteria”.
2. After confirm optical engine S/N, please download “Optical engine Alignment Data” from eSupport
and get correct alignment file to write data.
87
4. Extract the compressed file “*.zip” to a specific folder and open “ReadMe.doc” first.
88
【Optical Engine Setting - Read Data】
1. Choose “Control Panel” first and Click “Option”.
2. Select a folder for saving projector data and a specified COM port and click “Change” first and
then click “Exit.”
89
3. After selecting a data folder, the folder path is showed in “File Path.”
Then Click “Read Data.”
4. Gamma and RGB data of LCD panel is read first and IRIS data after.
90
91
5. “Read Data” process is completed as soon as “Finish!” message is showed.
92
2. Gamma and RGB data of LCD panel is written back first and IRIS data after.
93
3. “Recover” process is completed as soon as “Finish!” message is showed.
94
Condition
1. Projector needs to change main board:
The alignment data is related to optical engine, not main board. If the main board needs to be
changed, there are two ways to make it.
a. Power on the projector, and read the alignment data from original main board. After change
to new main board, write it back.
b. If the original main board is no work, change a new main board. And get the optical engine
alignment data from E-Support by serial number. Use this service tool to write it back.
c. If the data can’t be found from E-Support, please exchange the main board’s EEPROM which
stored the alignment data. The EEPROM location is U43.
95
I. Assembly Lamp Module
1. Screw (8F.1G524.8R0) & Washer (8H.00032.001) Assembly.
ÆRefer to the following Figure.
. Screw M3 Washer
HLD_Lamp (3J.J2K01.001)
96
2. Clip_Corner_Lamp (3D.J2K04.001) vs. Lamp HLD (3J.J2K01.001) Assembly:
The Clip Must be Hooked well with HLD Lamp Æ Refer to the following Figure.
Hook
Clip_Corner_Lamp
Clip_Corner_Lamp Opening
97
3-1. Lamp vs. HLD Lamp Assembly: Lamp Must be Placed to Contact Well with 3
Datum(X, Y, Z) of Lamp HLD. Æ Refer to the following Figures.
Lamp
98
Y Datum
X Datum
Z Datum
99
3. Clip_Lamp (3D.J2K03.001) Assembly:
Æ Refer to the following Figures.
Pins
Opening
Opening
Clip_Lamp
100
4. Mesh_Lamp (3D.J2K13.001) Assembly:
The “Mesh_Lamp” Must be Hooked Well with “Lamp HLD”.Æ Refer to the
following Figure.
Mesh_Lamp
101
6. “Mesh_Fin_Lamp” (3D.J2K14.001) Assembly:
The “Mesh_Fin_Lamp” Must be Hooked Well with “Lamp HLD”.Æ Refer to
the following Figure.
102
7. “Negative Lens” (3E.81J2K.001) Assembly:
To Place the Lens by Setting the “Blue-marked” Side forward Holder_Lamp Æ
Refer to the following Figure.
103
8. “Clip_Lens” (3D.J2K01.001) Assembly:
Æ Refer to the following Figure.
Hook
104
9. “Plate_Lamp” (3J.J2K02.001) Assembly:
Æ Refer to the following Figure.
Plate_Lamp
Screw M2.5
105
10-1. “Connector_Lamp” Assembly Criteria :( see the following Fig1.~ Fig4.)
.
Fig1.
106
Fig2.
107
Fig3.
108
Fig4.
109
10-2. Wire-Dressing Criteria:
Æ Refer to the following Figure.
Weak
110
II. Assy_Cap_Lens_Module
Æ Refer to the following Figure.
Spring_Clip_Cap_Lens Clip_Cap_Lens
(3D.J2K12.001) 4B.J2K18.001
111
III. Optical Engine Assembly
1.“Ring_Zoom_Inner” (3J.J2K06.001) Assembly:
Æ Refer to the following Figure.
Ring_Zoom_Inner
112
2.“Ring_Focus_Inner” (3J.J2K05.001) Assembly:
Æ Refer to the following Figure.
.
Ring_Focus_Inner
113
3.Lamp Module vs. Engine Assembly:
Æ Refer to the following Figures.
Orientation
Hole
Pins
114
115
IV. Ring_Zoom_Adjustment & Ring_Focus_Module Assembly
4-1. “Ring_Zoom”/”Ring_Focus_Module” Assembly(Dis-assembly)
To Assemble the “Rings” in the direction Normal to the Projection Lens. Æ
Refer to the following Figures.
116
4-2. “Ring_Zoom_Adjustment”/ “Assy_Ring_Focus_Module”
Disassembly :
Example: First turn Projection Lens clockwise to end, then thumbs push Projection
Lens, and the other fingers pull Ring_Zoom_Adjustment or
Assy_Ring_Focus_Module.
Æ Refer to the following Figures.
Pull
Pull
Push
117
5. PC ADC Alignment Procedure:
Equipment:
- Pattern generator( Chroma -2327)
Procedure:
Source:D-SUB
ADC :AD9380
1. Input test pattern with SXGA timing 1280×1024@60Hz
2. Input pattern as follow.
3. Into factory OSD
4. Select “ Graphic signal ” and press Enter key
5. Select “ RGBHV Format “ and press Enter key
6. Select “ Auto Calibration “ and press Enter key
A. 480p
Equipment:
- Pattern generator (Chroma-2327)
Procedure:
Source:Component
AD :AD9380
1. Input test pattern with 480P timing(attached file hcolourbar.bmp)
2. Into factory OSD
3. Select “ Graphic signal ” and press Enter key
4. Select “YPbPr Format…“ and press Enter key
5. Select “ Auto Calibration “ and press Enter key
118
B. 1080p
Equipment:
- Pattern generator (Chroma-2327)
Procedure:
Source:Component
AD :AD9380
1. Input test pattern with 1080P ( 60 / 50 Hz ) timing(attached file hcolourbar.bmp)
2. Into factory OSD
3. Select “ Graphic signal ” and press Enter key
4. Select “YPbPr Format…“ and press Enter key
5. select “ Auto Calibration “ and press Enter key
119
7. LCD Panel Correction Procedure
Equipment:
- Pattern generator( Chroma -2327)
Source:D-SUB
120
8.Thermal alignment concerns
2. When burning in the factory, the projector must use Eco model and the ambient
temperature is under 40 degree C.
3. When burning in the factory, the distance between each other must be more than
30cm and the outlet area can’t have any thing.
121
9.POWER alignment concerns
註記: Silicon glue is added between D703 and T691 and D703 can’t touch T691.
122
Silicon glue is added on pine of TR601 that is closer to AC skt . As TR601 is push by
10Nt force , TR601 can’t touch iron shelf.
123
2 855MHz Blower 線加 shielding 接地線在 Main board 下 shielding
上.
124
4 593MHz PFC 穿過排線 core.
2E.72102.051
125
6 293MHz IR 線加 shielding 夾 clip 鎖在 main board shielding 上.
126
8 855MHz Len shifter 上面貼 gasket.
4G.J1B13.001
127
128
Software/Firmware Upgrade Process
1. Please download “Service Tool” from eSupport and install it.
2. Extract the compressed file “*.zip” to a specific folder and open “ReadMe.doc” first.
129
3. Execute “Setup.exe” to install.
130
【Main Board Setting – Read Data】
1. Choose “Scaler Information” and then click “Read Scaler.”
131
3. It will show a finished message as below.
132
【Main Board Setting – Recover】
1. After upgrade firmware or swap main board, please reboot the projector and click “Recover
Scaler” to write back all setting data.
133
3. It will show a finished message as below.
z How to Download
Hardware required
1. Standard USB Download cable (P/N: 5K.B6S01.001,or other USB cable with the same connector)
2. Personal computer or laptop computer
Software required
1. SOI TDK tools with “Updater” of “File Manager”
2. New version FW
Download:
1. Power off the unit and unplug power cord.
2. A USB cable connect to PC and projector
3. Push right key on the keypad and plug in power cord.
134
4. Ac power on (let the projector into download mode): After three LEDs (Power, Temp, Lamp) on keypad show
orange light, release right key.
5. Open Updater tool
6. Select USB in “Targets on” and press “Search”. If PC find the link between pc and projector,
The below window will show otherwise go back to first step and go through again.
135
7. Press “Browse…” to find the source code (*.brec) location in your computer.
8. Click BOOT-SOI{\\..........................: 0}
9. Press “Update Firmware” to update firmware
10. As finish the firmware update, the window will show 100%
11. Reboot the projector
136
z RS232 Control Code
Hardware required
1. RS232 cable (P/N 50.J5019.501)
2. Personal computer or laptop computer
Software required
1. Use remote control and press “ZOOM “key.
2. PC setting please sees following picture.
137
User Mode Command
Code Function Comment
138
X071X Baud Rate9600 Baud Rate
139
X171X Save current factory settings Factory application
X205X Save as video and data color temp 4 Video and Data color temperature
X206X Save as video and data color temp 5 Video and Data color temperature
Load default of all video color temp.
X207X settings Video color temperature
X215X Load default of all data color temp. settings Data color temperature
140
X224X 32-Blue bars Test pattern
X231X DMDRedCurtain
X232X DMDGreenCurtain
X233X DMDBlueCurtain
X234X DMDBlackCurtain
X235X DMDYellowSolidField
X236X DMDCyanSolidField
X237X DMDMagentaSolidField
X238X DMDHorizontalRamp
X239X DMDVerticalRamp
X240X DMDHorizontalLines
X241X DMDDiagonalLines
X242X DMDVerticalLines
X243X DMDGrid
X244X DMDCheckerBoard
X245X DMDBlue60Curtain
X246X DMDGray20Curtain
X247X DMDGray10Curtain
X248X DMDGray6Curtain
X249X DMDFullWhiteCurtain 5X
X250X DMDFullBlackCurtain
X251X DMDRedRampCurtain
X252X DMDFullWhiteCurtain 4X
X271X ColorWheelSpeed_4X
X272X ColorWheelSpeed_5X_NoSLR
X273X ColorWheelSpeed_5X_SLR
X274X ColorWheelSpeed_6X_NoSLR
141
X998X Show error message record
142
Level 2 - Circuit Board and Standard Parts Replacement
Catalog:
1. Introduction
143
Introduction
Overview
The Projector consists of the LCD projector controller, Lamp controller, Power supply system, and the system
cooling controller. The LCD controller captures the digital PC data and video data and converts them into the
LCD display device. The lamp controller controls the lamp’s power and synchronizes its frequency with color
display sequence. Power supply unit controls the AC line power factor and converts primary voltage to
secondary low voltage for digital board. The system cooling controller drives the airflow to cool the lamp’s heat
and electrical component’s heat.
Hardware Architecture
The Projector consists of the Source board, Main board, Keypad board, Fan board, PFC board, Ballast
board, Door interlock switch, and the Thermal break sensor board. Please see Figure 1.
Source Board consists of audio phone jack, video RCA jack, S-video mini-DIN head, and USB head. Main
Board consists of RGB A/D conversion, Video decoder, T1+ ASIC, Flash and DDR and IR receiver. Please see
Figure 2. Keypad Board consists of 10 keypads and 3 twice-color LEDs. Please see Figure 3. Fan Board consists
of DC/DC converter, Thermal Break circuit, Blower Fan driver circuit, Rear Fan driver circuit, and the
temperature sensing circuit. Please see Figure 8. Power supply circuit consists of AC line EMI filter, Power
Factor Correction circuit. Ballast Board consists of Lamp synchronization circuit, Lamp lit feedback circuit,
and Lamp power control circuit.
The following chapter will introduce each function block circuit operation theory.
144
Hardware Architecture
Thermal break
Keypad Main
sensor Circuit
Circuit Operation
Fan Driver
Circuit
Circuit
Input Ballast
Source Module
Circuit
Figure 1
145
Chapter 1 System Operation Theory
1.1 Overview
The Projector system consists of display function, cooling function, lighting function, safety protection function, and User
interface control function and power control function. An processor embedded in the T1+ ASIC is used to execute system
firmware. The processor serves as the master controller of the projector and provides the link between the display screen
and end-user controls such as a keypad and IR remote control. These inputs can be processed in the processor by system
firmware so that commands can be issued to configure the T1+ ASIC, the analog interface device, the video decoder, the
cooling device, and other system peripheral devices. Please see figure 2.
Figure 2 Main board & Input board BLOCK DIAGRAM
146
1.2 User Interface Function
(1) Keypad function: There are 10 keypads on top case. Please see Figure 3. MCU does polling on these signals
[KEY9:0] to detect the key pressing action. Each key pressing action will request MCU to execute the specified
program.
(2) Indicator LED function: There are 3 twice color LED on top case. MCU releases the status of program indication
by setting LED signal LED[5:0]. It will show the power status, lamp status, and temperature status.
(3) IR remote function: There are two IR receivers, one is at the front side, and the other one is at back side. The
receiver sensor has 3 legs, pin1 is output, pin2 is ground, and pin3 is VCC (5V). The output pin is pulled high,
and will sink to low when it receives infrared signal coming from remote controller. MCU will decode the signal
and execute related program.
(4) USB function: There is a MINI USB terminal for FW at back side. MCU supports the universal serial bus version
1.1 in a slave mode only.
(5) OSD function:Please refer to C212 Software Specification.
Keypad Board
KEY[9:0] 10
KEYPADS
To main
LED[5:0]
3
board
CONNECTO Twice-color
R LED
VDD, GND
2
Backlight LED
147
(2) Turn Off function: User can touch “Power” key, or use remote controller to turn off the projector. When MCU
receives the command, it will start the power down sequence. T1+ ASIC will be reset off, and then Lamp enable
signal will be turn off. The Lamp will be turned off. MCU will remain the cooling circuit operation for two
minute in order to cool down the lamp module. After the cooling procedure is end, then the whole system goes
to standby mode.
148
1.4 System Protection Function
(1) Lamp Door Open Protection: There is a Door interlock switch built at bottom case. When lamp door is opened,
the switch will send signal to T1+. Then the whole system will be shutdown immediately.
(2) Lamp Box Thermal Break Protection: There is a thermal break built around the lamp box. If the temperature of
lamp box goes too high, the thermal break will shutdown AC power. Then the lamp will be turned off
immediately.
(3) Ballast Over Heat Protection: There is an over heat protection circuit built on ballast board. When it alarm, the
ballast will shut down the lamp.
(4) Fan Spinning Abnormal Protection: There are 4 fans built on this system. MCU will do polling the fan spinning
status. If the speed of fan is abnormal, MCU will shut down the whole system.
(5) System Temperature Over Heat Protection: There are 2 temperature sensor built in the system. MCU will do
polling the temperature status. If the system temperature is over heat, MCU will shut down the whole system.
149
Chapter 2 LCD Operation Theory
2.1 Overview
W500 LCD SOLUTION used Epson solution. It include L3E07110K0A , L3E01060P0A , and L3E06150S2A
The L3E07110K0A is a video signal processing IC for active matrix TFT panels with built-in drivers. This
IC uses digital processing to perform adjustments such as contrast, brightness, gamma correction, color
uniformity correction, and picture quality improvement. It also generates the timing signals that are used to
drive the panel.
The L3E01060P0A is an interface IC for driving TFT active matrix panels with built-in drivers. Its high
voltage circuit acts as an interface between the control IC and the drivers on the LCD panel. A circuit that uses
variation in the performance of transistors on the LCD panel to control delay timing is built into this IC in
order to adjust the delay timing of the LCD panels used for projectors.
The L3E06150S2A provides a fast 10bit latched decimating digital input, which drives 12 channel high
voltage drive outputs. Flexible digital input formats, allow several L3E06150S2As to be used in parallel for
higher resolution displays.
Color Light
sequence
module
150
Chapter 3 Input Signal Processing Theory
3.1 Overview
The Projector signal input terminals consist of PC input, Component input, HDMI input, S-Video input, and
Video input.
Hs Vs SOG Sync
processing
151
3.3 Videos Signal Processing
Video and S-Video input: The Video and S-video signal will be fed to a Video Decoder (VDC) device built on main
board. The video decoder accepts NTSC/PAL/SECAM composite and s-video inputs. The output is formatted as YCrCb
and routed to the DDP3020.
The VDC device is the key component of video signal processing. It is an integrated device that consists of A/D
interface, Sync processing, Luma/Chroma decoding and processing, and Digital output interface. Please see Figure 9.
Video Digital
Luma/Chroma Digital YUV 16
S-Video A/D output
decoding bits output
Component interface
152
Chapter 4 Cooling Circuit Operation Theory
4.1 Overview
The Projector cooling circuits consist of Fan driver devices, Fans, and Thermal sensors. The cooling purpose is for
protecting System Elements from over heat damage. Please see figure 8. The particular hot spot points are Lamp Tip,
Lamp Burner, DMD Heat-sink, and Lamp Box. There are three fans, blower fan, main fan 1, and main fan 2 for driving
airflow to cool down the system and hot spot point temperature.
To Main To Ballast
board
LAMP board
CONTROL
153
4.2 Blower Fan
Blower fan is designed for cooling the lamp tip and lamp burner. The speed of blower fan is controlled and
monitoring by MCU.
154
Chapter 5 Power Supply Circuit Operation Theory
5.1 Overview
The power supply unit includes EMI board, PFC board, DC/DC board (built on Fan board), and
Ballast board.
The EMI board has EMI filter circuit to reduce EMC noise coupling to AC line. The PFC board
circuit supply AC line power factor correction function. DC/DC board converts primary voltage to
secondary DC low level voltage for system using. And Ballast board generates the lamp ignition high
voltage to ignite the lamp, maintains the stable power consumption of lamp, and synchronizes the
lamp sequence with DLP color index sequence.
Block Diagram
DC 380V
DC 380V
DC-DC input :26W
DC-D 5V/1
switching power
A
12V/0.83
η=80%
15.5V/0.36A
155
1 380V 1.73A
2 15.5V 0.36A
3 5V 1A
4 12V 0.83A
240U
4 3
CX603 6 1
0.6U L603
4
L602
3MH
1
CY 605
4700P
CY 604
CX602 4700P
0.22U M
L601
4 2
CN602
3 1
1
N 300UH
CX601
3 0.22U M
L
2K61007103
156
Bridge converts the AC input into DC output, and the CAP is AC filter.
157
5.5 Power Factor Correction
The Power Factor Correction (PFC) like a Boost converter . The AC mains voltage is rectified by a bridge and the
rectified voltage delivered the the boost converter . This using a switching technique ,boost the recdtified input voltage
to a regulated DC output voltage Vo . The boost converter consists of a boost inductor (L) , a controlled power switch
(Q) , a catch diode (D) , an output capacitor (Co) ,and a PFC controller . PFC’s goal id to shape the input current in a
sinsoidal fashion , in-phase with the input sinusoidal voltage .
158
PFC schematic:
In
5
T601
350U
12
1
R611
332KF
HS612 HSink
3DJ1Y01001
2
G1
G2
B+ TP6
R612 CN603
332KF 3 1 1
1
1
1
2
D611 + C619 C618 3 2 TP7
SF10L60U 82U 1U K 3
D
450V 5KJ1B08001
1
L606 R624
R614 R613
Z80 Q611 332KF
G SPW20N60C3
D
D613
332KF 332KF
S
K
R619 P4KE440A Q651
20K G 2SK3677-01MRSC
R620
K
K
20K
S
ZD612 R625 R659 ZD651
A
ZCD TZMC27 332KF 10K TZMC27
R621
A
A
4.7
A
15VDC IC601
D612
1N4148 R658
8 5 300
VCC ZCD R630 R626
K
R622 E C C E
C612 + 2 4 22
10U 50V COMP CS R661
R627
7.5K F
2
B
C614 6 1 R660
0.01U K GND INV 1.2K
K
R617 R657
11KF TVS601 332KF 1
10K
SMAJ5.0A R656
C613 R623 2 10K
0.1U M C615 R618 8.66K
A
1U K 20K
3
IC652
R662 LM 431ACM 3(X)
1.5K F A
C616
4700P J R628
ZCD 11KF
C
Q612 B
2N3904LT1G
E
R629 C617
1K 1U K
159
L6561:
Description:
L6561 is the improved version of the L6561 standard Power Factor Corrector. Fully compatible
with the standard version, it has a superior performent multiplier making the device capable of
working in wide input voltage range applications (from 85V to 265V) with an excellent THD.
Furthermore the start up current has been reduced at few tens of mA and a disable function has been
implemented on the ZCD pin, guaranteeing lower current consumption in stand by mode.
Pin assignment:
160
A
ZD681 R681
P6KE250A-LF 15K R682 R683 C682
15K 15K 0.01U K T691
PQ2020
K
10 4
2
D682
US1M
1
1
D683 L604 9
ES1D Z80
2 1 6
D684 5
ES1D
2 1 7
L605
Z80
8 3
C684
1U K
In a flyback converter operated in the discontinuous mode, the energy stored in the flyback
transformer must be zero at the beginning and end of each switching period . During the on-time
energy is stored in the transformer and energy taken from the transformer when the switching transistor turn-off,
the stored energy is all delivered to the output .The flyback transformer is T691,
IC681 is the power module IC, it include PWM IC and MOSFET . R681 R682 R683 C682,ZD681, D682 are
the snubber circuit, which is reduce the spike voltage.
161
5.7 Power module IC
2
IC681
D
L
TOP247Y
1
C
S
F
R688
4
5 6.8
C686
1
C685 47U 25V
R687 0.1U M <Spec> +
27K
2
The Power module IC is TOP247Y , The function of each pins described as follow.
pin 1 : Control pin pin 5 : Frequency pin
pin 2 : Line-sense pin pin 6 : NA
pin 3 : External current limit pin pin 7 : Drain pin
pin 4 : Source pin
162
5.8 Feedback circuit and photo coupler
R707
5Vs
330
1
R711
IC682 1K R708
PC123FY 1 2.55K F
3
R710
20K
IC701 C713
C714
L M 4 3 1 A CM 3 (X )
1
1U K 0.1U M
C706 + 2
10U 50V
<Spec>
2
R709
2.4K
The power supply adapt a single feedback circuit of 5V. It used IC702or voltage regulation and IC682 for
primary-secondary isolation. The output voltage will be controlled by IC702pin 1 (feedback) ,the duty cycle of
MOSFET will be decided to control the output voltage.
2.5V
D703
+
T651 C709
GND
Since the transformer T651 acts as a storing energy inductance , Diode D703 is rectifier and capacitor C709 is to
reduce the output ripple and noise.
163
Trouble Shooting Guide
164
Chapter 1 EE System Trouble Shooting Guide
165
166
167
168
Chapter 2 LED Messages Definition
Power Temp Lamp Status Action
O - - Stand-by
G - - Powering up
G - - Normal operation
Burn-In Messages
G G G Burn-in ON
O - O Burn-in OFF
G G G Burn-in powering up
Thermal Sensor 1 open error (the remote diode has 1.Change Thermal sensor board
R R R 2.Check Thermal sensor board wire
an open-circuit condition) 3.Change main board
Thermal Sensor 2 open error (the remote diode has 1.Check Thermal sensor2
R R G 2.Change main board
an open-circuit condition)
Thermal Sensor 1 short error (the remote diode has 1.Change Thermal sensor board
G R R 2.Check Thermal sensor board wire
an short-circuit condition) 3.Change main board
Thermal Sensor 2 short error (the remote diode has 1.Check Thermal sensor2
G R G 2.Change main board
an short-circuit condition)
1.Change Thermal sensor board
O R R Temperature 1 error (over limited temperature) 2.Check Thermal sensor board wire
3.Change main board
1.Check Thermal sensor2
O R G Temperature 2 error (over limited temperature)
2.Change main board
- G R Fan IC #1 I2C connection error Change main board
1.Check fan
- O R Fans do not rotate in the process of powering up
2.Check main board
System Error Messages
1. Check Dust Filter lock or not
- O G Dust Filter error
2. Check Dust Filter wire OK or not
1.Turn off Power, then power on again
R - - Scaler’s shutdown fail
2.Change main board
169
Chapter 3 Error Count Messages Definition
Error message Define
Blower Fan Fail Blower Fan error
Front Fan Fail Front Fan error
Front Blower Fan Fail Front Blower Fan error
LCD Blower Fan Fail LCD Blower Fan error
Blower Fan error
Blower Fan Out off Ctrl
(the actual fan speed is ±25% outside the desired speed)
Front Fan error
Front Fan Out of Ctrl
(the actual fan speed is ±25% outside the desired speed)
Front Blower Fan error
Front Blower Fan Out of Ctrl
(the actual fan speed is ±25% outside the desired speed)
LCD Blower Fan error
LCD Bolwer Fan Out of Ctrl
(the actual fan speed is ±25% outside the desired speed)
G794 I2C Error Fan IC #1 I2C connection error
Turn On Fan Fail Fans do not rotate in the process of powering up
Thermal Sensor 1 open error
Diode 1 Open
(the remote diode has an open-circuit condition)
Thermal Sensor 2 open error
Diode 2 Open
(the remote diode has an open-circuit condition)
Thermal Sensor 1 short error
Diode 1 Short
(the remote diode has an short-circuit condition)
Thermal Sensor 2 short error
Diode 2 Short
(the remote diode has an short-circuit condition)
Temp 1 Over Temperature 1 error (over limited temperature)
Temp 2 Over Temperature 2 error (over limited temperature)
Lamp Fail Lamp turn off when system working
Light UP Lapm Fail Lamp not turn on
Dust Filter Error Dust Filer Open
Scaler Reset Fail Scaler turn on fail
Scaler Shutdown Scaler fail in normal mode
MCU WT61P7 Fail MCU fail in normal mode
Abnormal Power Off Power Off when system in normal working
Break off Cooling Power Off when system in Cooling
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Appendix 1 – Screw List /Torque
Model name : W500
Description Torque
No. Screw P/N QTY Where use
Type Head Length Surface (kgf-cm)
8F.1A352.8R0
B-ZN
M2 1. SCRW MACH PH MACH PH 8.0 0.5~1 BKT_FILTER_SENSOR & FILTER_SWITCH(1)
1
NYL
M2*8L B-ZN NYL
8F.VA523.6R0
M2.5 2. SCRW TAP PAN TAP D-PT PAN 6.0 Ni 6~8 RC & LC(1)
1
M2.5*6L D-PT NI
NOZZLE_PANEL & LC (2)
TUNNEL OUTLET & LC (2)
8F.VA564.8R0 SHD_LOWER & PWR_BD (5)
SHD_LOWER & LC (1)
BOX_LAMP & LC (2)
M3 3. SCRW TAP PAN TAP D-PT PAN 8.0 Ni 6~8
24 SAFTY_INTER_LOCK & LC (1)
FILTER_SENSOR & LC (1)
M3*8L NI D-PT UC & LC (6)
BKT CEILING INSIDE & LC (3)
FC & LC (1)
8F.VA564.100
BLOWER PANEL(5025) & LC (2)
M3 4. SCRW TAP PAN TAP D-PT PAN 10.0 Ni 6~8
6 OPT_ENG & LC(4)
M3*10L NI D-PT
8F.TA524.100
RC & CNT (1)
M3 5. SCRW TAP FLAT TAP D-PT FLAT 10.0 Ni 6~8
3 FC & LC(2)
M3*10L NI
8F.VG564.350
PH
M3 6. SCRW TAP PH W/FL TAP D-PT 35.0 Ni 5~7 BLOWER_PANEL(7035) & LC(2)
2
W/FL
M3*35 NI D-PT
8F.1G524.100
PH
M3 8. SCRW MACH PH MACH 10.0 Ni 1 5~7 BALLAST CNT & LAMP BOX (1)
W/FL
W/FL M3*10L NI
8F.1G524.240
M3 9.. SCRW MACH PH MACH PAN 24.0 Ni 2 5~7 SHD_LOWER & BLOWER_LAMP(2)
W/FL M3*24L NI
8F.1D526.6R0
POWER GND & Y/G WIRE(1)
M4 10 SCRW MACH PAN MACH PAN 6 Ni 6~8
4
BKT CEILING INSIDE & LC(3)
EXT-TOO M4*6L NI
171
Model name : W500
Description Torque
No. Screw P/N QTY Where use
Type Head Length Surface (kgf-cm)
8F.00461.120
STAND STAND
11. STAND OFF MACH 3.0 Ni 2 3~5 D-SUB (2)
OFF OFF
XH4#-40X4+8.1 NI
=SUM 55
Power Board
Model name : W500
Description Torque
No. Screw P/N QTY Where use
Type Head Length Surface (kgf-cm)
M2 2 8F.1A352.3R0 MACH FPH 3.0 BNI 1 2~3 Clip Lens & Holder Lamp(*1)
M2.5 3 8F.1A523.4R0 MACH FPH 4.0 NI 1 2~3 Plate Lamp & Holder Lamp(*1)
M3 4 8F.1G524.8R0 MACH PAN 8.0 NI 2 3~4 Holder Lamp & Optical Engine(*2)
172
Appendix 2 –Optical Engine RMA
The least
yellowish
part
<Formula>ΔE=√((xn-x5)
^2+(yn-y5)^2)
*example case :
x,y5 is the most yellowish.
x,yn is the least yellowish.
173
Level 4 Measurement (Without color meter )
• Measure condition :
1. Projection size:40inch
2. Projection image: Level 4 test pattern
3. Project picture mode : Dynamic mode
• Fail criteria :
If most yellowish area is more yellow than test pattern, it fails.
Yellow point
pattern
174
175
176