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MSE Finals Reviewer
MSE Finals Reviewer
24. It occurs where crystals of different 35. It observes microscopic defects and
orientations meet in a polycrystalline elements, including optical and electron
material. These boundaries can impact microscopes. Transmissive and reflective
things like how the material corrodes or how modes are chosen based on the specimen
it conducts electricity. GRAIN BOUNDARIES and defect type. MICROSCOPY
25. The example scenario for this is where 36. It includes transmission (TEM) and scanning
sometimes, instead of having just the atoms (SEM), each with distinct imaging methods.
of the host material, we intentionally Scanning probe microscopes produce three-
introduce other atoms into the mix. dimensional images with nanometer
IMPURITIES resolution. ELECTRON MICROSCOPES
26. It's not pure silver but rather a blend of 92.5% 37. It examines how materials behave under
silver and 7.5% copper. STERLING SILVER cyclic loading. Think of it as the wear and tear
a material experience over time due to
27. It is essentially a blend of two or more repeated stress cycles. FATIGUE
elements, typically metals, that come
together to form a new metallic substance. 38. It investigates how materials deform under
It's like mixing different ingredients to create constant stress at elevated temperatures.
a unique recipe. ALLOY CREEP BEHAVIOR
28. What are the two main types of solid 39. It involves studying how materials respond to
solutions? SUBSTITUTIONAL AND stress when flaws or cracks are present. This
INTERSTITIAL is essential for understanding the integrity of
structures and components in various
29. What type of solid solution involves impurity applications. FRACTURE MECHANICS
atoms substituting for host atoms within the
crystal lattice? SUBSTITUTIONAL SOLID 40. It is a measure of a material's ability to
SOLUTION absorb energy before fracturing.
TOUGHNESS
30. What type of solid solution occur when
relatively small impurity atoms squeeze into 41. It is about how well a material resists failure
the spaces, or interstices, between the host when there's already a flaw present, like a
atoms.? INTERSTITIAL SOLID crack. FRACTURE
SOLUTIONS
42. What is fracture toughness often quantified
31. One-dimensional crystalline defects, using? Klc
categorized into edge and screw types.
DISLOCATIONS 43. It is like simulating the wear and tear a
material experience over time due to
repeated stress cycles. FATIGUE TESTING
48. Why is it important to study Thermal
44. We use tools like this to understand how Properties?
stress levels correlate with the number of
cycles a material can endure before failure. Understanding thermal properties is crucial
This information is crucial in designing for preventing thermal shock, particularly in
durable components for applications ranging ceramics, where it can lead to brittle fracture.
from automotive to aerospace. S-N CURVE By altering properties like heat capacity and
thermal expansion, engineers enhance
45. It is slow, steady deformation under thermal shock resistance. This knowledge
prolonged stress at high temperatures. informs material design and engineering
CREEP processes, ensuring optimal performance in
specific applications. Heat capacity
46. In semiconductors, it plays a pivotal role in measures a material's ability to absorb
modulating conductivity by altering the energy, while specific heat accounts for
concentration of charge carriers. differences in mass. Thermal expansion,
IMPURITIES quantified by the coefficient of thermal
expansion, guides engineers in designing
47. Why Study the Electrical Properties of structures that accommodate temperature-
Materials? induced dimensional changes without
compromising integrity.
Studying the electrical properties of materials
enables engineers to make informed 49. Why do materials expand when heated?
decisions in component and structure
design, select and process materials Materials expand when heated due to
effectively, understand conduction increased atomic vibrations, causing atoms
mechanisms, consider the influence of band to move further apart. The strength of atomic
structures, and account for the effects of bonds determines the extent of expansion,
temperature and impurities, ultimately with tighter bonds resulting in less
leading to the development of efficient expansion. Each material has a unique
electronic devices. expansion coefficient; polymers expand
more than metals, which expand more than
Understanding electrical properties is vital for ceramics, reflecting differences in bond
electronic engineering. Engineers must strength. Thermal conductivity dictates how
select materials with suitable conductivity efficiently materials transport heat: metals
and band structures for efficient device excel due to free electron movement, while
design. Different materials conduct electricity ceramics and polymers rely on phonon
via various mechanisms, from free electrons conduction. Thermal expansion can induce
in metals to ions in ceramics. Temperature stresses leading to fracture, particularly in
and impurities also affect conductivity, with ceramics prone to thermal shock due to
metals experiencing increased resistivity and brittleness.
semiconductors altering charge carrier
concentration. By grasping these properties,
engineers can optimize material
performance, ensuring the functionality and
efficiency of electronic devices throughout
their lifecycle.