Professional Documents
Culture Documents
Boro Study
Boro Study
Detection of Joints
While there are several destructive methods (SEM or pull strength testing) for detecting the presence of defective solder joints undernea
array and the surface of the individual solder balls. Clues to the quality of this joint include its texture, uniformity, smoothness, color and brightness and
auge a go/no-go decision in terms of the quality of the solder joint. By using window overlays of good/bad reference pictures the joints can be inspected
nique and useful purpose. A solder joint can prematurely fail due to the shear stresses caused by the Coefficient of Thermal Expansion mismatch betw
moothness, color and brightness and surface characteristics. A poor solder joint with micro cracks on its surface could be "seen" with the endscopic ins
e pictures the joints can be inspected as part of the quality control process. Critical ball dimensions can be measured in terms of their stand off heights
f Thermal Expansion mismatch between the ceramic material and the substrate is substantial. The ability to "see" whether the reflow process delivers
ould be "seen" with the endscopic inspection tool but would not show up on XRAY. Flux residue spread between the balls underneath the array can lea
red in terms of their stand off heights, wetting angles, pt-pt distances in order to confirm the "quality". These images can be captured and trended for c
whether the reflow process delivers a defective or a target joint condition (see figures below) can be accomplished with this inspection tool. While this
he balls underneath the array can lead to bridging of conductive particles and a shorting between pads. This can be discovered with the use of this insp
es can be captured and trended for capability studies or failure analysis. These measurements also add to the objectivity of the soldering process. Ove
d with this inspection tool. While this joint would pass a test for shorts and opens during electrical test, life cycle tests would reveal a different story.
ectivity of the soldering process. Over time a large database containing the various critical process parameters involving soldering (flux, paste temperat
sts would reveal a different story.
olving soldering (flux, paste temperature profile, etc) can be stored and subsequent troubleshooting becomes faster. Component and equipment suppli
er. Component and equipment suppliers as well as end customers can be shown these images in order to effectively communicate the status of the pro
ely communicate the status of the process development.