Download as pdf or txt
Download as pdf or txt
You are on page 1of 100

Semiconductor Devices

Bipolar Junction Transistors: Part 1

M. B. Patil
mbpatil@ee.iitb.ac.in
www.ee.iitb.ac.in/~sequel

Department of Electrical Engineering


Indian Institute of Technology Bombay

M. B. Patil, IIT Bombay


Bipolar junction transistors

E p n p C E n p n C
(Emitter) (Collector) (Emitter) (Collector)

B (Base) B (Base)

M. B. Patil, IIT Bombay


Bipolar junction transistors

E p n p C E n p n C
(Emitter) (Collector) (Emitter) (Collector)

B (Base) B (Base)

* A bipolar junction transistor (BJT) consists of two pn junction diodes connected back to back.

M. B. Patil, IIT Bombay


Bipolar junction transistors

E p n p C E n p n C
(Emitter) (Collector) (Emitter) (Collector)

B (Base) B (Base)

* A bipolar junction transistor (BJT) consists of two pn junction diodes connected back to back.
* A BJT is a three-terminal device; the terminals are called emitter, base, and collector.

M. B. Patil, IIT Bombay


Bipolar junction transistors

E p n p C E n p n C
(Emitter) (Collector) (Emitter) (Collector)

B (Base) B (Base)

* A bipolar junction transistor (BJT) consists of two pn junction diodes connected back to back.
* A BJT is a three-terminal device; the terminals are called emitter, base, and collector.
* There are two types of BJTs: pnp and npn.

M. B. Patil, IIT Bombay


Bipolar junction transistors

E p n p C E n p n C
(Emitter) (Collector) (Emitter) (Collector)

B (Base) B (Base)

* A bipolar junction transistor (BJT) consists of two pn junction diodes connected back to back.
* A BJT is a three-terminal device; the terminals are called emitter, base, and collector.
* There are two types of BJTs: pnp and npn.
* The actual device construction is different than the above schematic diagram (to be discussed).

M. B. Patil, IIT Bombay


Bipolar junction transistors

E p n p C E n p n C
(Emitter) (Collector) (Emitter) (Collector)

B (Base) B (Base)

* A bipolar junction transistor (BJT) consists of two pn junction diodes connected back to back.
* A BJT is a three-terminal device; the terminals are called emitter, base, and collector.
* There are two types of BJTs: pnp and npn.
* The actual device construction is different than the above schematic diagram (to be discussed).
* For the device to work as a transistor (rather than two independent diodes), the two junctions must be
“close.”

M. B. Patil, IIT Bombay


p(x)
Basic operation

V1 + ∆V1
V1

pn0
0
W
E C
p n p

B
x=0 x=W

V1 = 0.6 V V2 = 5 V
D1
I2 = αI1
I1

V1 V2
p(x)
Basic operation

V1 + ∆V1
V1

pn0
0
W
E C
p n p

B
x=0 x=W

V1 = 0.6 V V2 = 5 V
D1
I2 = αI1
I1

V1 V2
dp
* If V1 is varied, p(x) varies → Ip (W ) ∝ (W ) varies, i.e., by changing V1 , I2 can be controlled. This is the basic transistor action.
dx
p(x) p(x)
Basic operation

V1 + ∆V1 V1 + ∆V1
V1 V1

pn0 pn0
0 0
W W
E C E C
p n p p n p

B B
x=0 x=W x=0 x=W

V1 = 0.6 V V2 = 5 V V1 = 0.6 V V2 = 5 V
D1
I2 = αI1 D1 D2
I1

V1 V2 V1 V2
dp
* If V1 is varied, p(x) varies → Ip (W ) ∝ (W ) varies, i.e., by changing V1 , I2 can be controlled. This is the basic transistor action.
dx

M. B. Patil, IIT Bombay


p(x) p(x)
Basic operation

V1 + ∆V1 V1 + ∆V1
V1 V1

pn0 pn0
0 0
W W
E C E C
p n p p n p

B B
x=0 x=W x=0 x=W

V1 = 0.6 V V2 = 5 V V1 = 0.6 V V2 = 5 V
D1
I2 = αI1 D1 D2
I1

V1 V2 V1 V2
dp
* If V1 is varied, p(x) varies → Ip (W ) ∝ (W ) varies, i.e., by changing V1 , I2 can be controlled. This is the basic transistor action.
dx
* If the two junctions are not sufficiently close, the device behaves like two independent diodes connected back-to-back, and there is no
transistor action.
M. B. Patil, IIT Bombay
W W
pnp and npn transistors
E p n p C E n p n C

B B
VEB VBC VBE VCB

Ec
EFn
EFp qVBE EFp
Ec qVBC
Ev qVCB

qVEB EFn
EFn
EFp
Ev
IE IC IE IC
E C E C
VEB VBC VBE VCB
B B
IB IB
IE IC = αIE IE IC = αIE
E C E C
(emitter) (collector) (emitter) (collector)
IB = (1 − α) IE
B (base) IB = (1 − α) IE B (base)

M. B. Patil, IIT Bombay


W W
pnp and npn transistors
E p n p C E n p n C

* In the “active” or “linear” mode, the B B


B-E junction is under forward bias, the VEB VBC VBE VCB
B-C junction is under reverse bias.
Ec
EFn
EFp qVBE EFp
Ec qVBC
Ev qVCB

qVEB EFn
EFn
EFp
Ev
IE IC IE IC
E C E C
VEB VBC VBE VCB
B B
IB IB
IE IC = αIE IE IC = αIE
E C E C
(emitter) (collector) (emitter) (collector)
IB = (1 − α) IE
B (base) IB = (1 − α) IE B (base)

M. B. Patil, IIT Bombay


W W
pnp and npn transistors
E p n p C E n p n C

* In the “active” or “linear” mode, the B B


B-E junction is under forward bias, the VEB VBC VBE VCB
B-C junction is under reverse bias.
* The B-E voltage (magnitude) is Ec
EFn
restricted to about 0.8 V in a EFp qVBE EFp
low-power silicon BJT, as in a
Ec qVBC
forward-biased diode. Ev qVCB

qVEB EFn
EFn
EFp
Ev
IE IC IE IC
E C E C
VEB VBC VBE VCB
B B
IB IB
IE IC = αIE IE IC = αIE
E C E C
(emitter) (collector) (emitter) (collector)
IB = (1 − α) IE
B (base) IB = (1 − α) IE B (base)

M. B. Patil, IIT Bombay


W W
pnp and npn transistors
E p n p C E n p n C

* In the “active” or “linear” mode, the B B


B-E junction is under forward bias, the VEB VBC VBE VCB
B-C junction is under reverse bias.
* The B-E voltage (magnitude) is Ec
EFn
restricted to about 0.8 V in a EFp qVBE EFp
low-power silicon BJT, as in a
Ec qVBC
forward-biased diode. Ev qVCB
* The B-C voltage (magnitude) can be qVEB EFn
much larger than the B-E voltage and EFn
EFp
is limited by breakdown phenomena. Ev
IE IC IE IC
E C E C
VEB VBC VBE VCB
B B
IB IB
IE IC = αIE IE IC = αIE
E C E C
(emitter) (collector) (emitter) (collector)
IB = (1 − α) IE
B (base) IB = (1 − α) IE B (base)

M. B. Patil, IIT Bombay


W W
pnp and npn transistors
E p n p C E n p n C

* In the “active” or “linear” mode, the B B


B-E junction is under forward bias, the VEB VBC VBE VCB
B-C junction is under reverse bias.
* The B-E voltage (magnitude) is Ec
EFn
restricted to about 0.8 V in a EFp qVBE EFp
low-power silicon BJT, as in a
Ec qVBC
forward-biased diode. Ev qVCB
* The B-C voltage (magnitude) can be qVEB EFn
much larger than the B-E voltage and EFn
EFp
is limited by breakdown phenomena. Ev
IE IC IE IC
* pnp transistor: Holes are injected
from the emitter. Most of them reach E C E C
the B-C depletion layer, get swept VEB VBC VBE VCB
away by the field there, and get
B B
collected by the collector. IB IB
IE IC = αIE IE IC = αIE
E C E C
(emitter) (collector) (emitter) (collector)
IB = (1 − α) IE
B (base) IB = (1 − α) IE B (base)

M. B. Patil, IIT Bombay


W W
pnp and npn transistors
E p n p C E n p n C

* In the “active” or “linear” mode, the B B


B-E junction is under forward bias, the VEB VBC VBE VCB
B-C junction is under reverse bias.
* The B-E voltage (magnitude) is Ec
EFn
restricted to about 0.8 V in a EFp qVBE EFp
low-power silicon BJT, as in a
Ec qVBC
forward-biased diode. Ev qVCB
* The B-C voltage (magnitude) can be qVEB EFn
much larger than the B-E voltage and EFn
EFp
is limited by breakdown phenomena. Ev
IE IC IE IC
* pnp transistor: Holes are injected
from the emitter. Most of them reach E C E C
the B-C depletion layer, get swept VEB VBC VBE VCB
away by the field there, and get
B B
collected by the collector. IB IB
IE IC = αIE IE IC = αIE
* npn transistor: Electrons are injected
from the emitter. Most of them reach E C E C
(emitter) (collector) (emitter) (collector)
the B-C depletion layer, get swept
IB = (1 − α) IE
away by the field there, and get B (base) IB = (1 − α) IE B (base)
collected by the collector.

M. B. Patil, IIT Bombay


W W
pnp and npn transistors
E p n p C E n p n C

B B
VEB VBC VBE VCB

Ec
EFn
EFp qVBE EFp
Ec qVBC
Ev qVCB

qVEB EFn
EFn
EFp
Ev
IE IC IE IC
E C E C
VEB VBC VBE VCB
B B
IB IB
IE IC = αIE IE IC = αIE
E C E C
(emitter) (collector) (emitter) (collector)
IB = (1 − α) IE
B (base) IB = (1 − α) IE B (base)

M. B. Patil, IIT Bombay


W W
pnp and npn transistors
E p n p C E n p n C

* The emitter arrow in the BJT symbol B B


indicates the direction of the emitter VEB VBC VBE VCB
current when the BJT is operating in
the active mode (for both pnp and Ec
npn BJTs). EFn
EFp qVBE EFp
Ec qVBC
Ev qVCB

qVEB EFn
EFn
EFp
Ev
IE IC IE IC
E C E C
VEB VBC VBE VCB
B B
IB IB
IE IC = αIE IE IC = αIE
E C E C
(emitter) (collector) (emitter) (collector)
IB = (1 − α) IE
B (base) IB = (1 − α) IE B (base)

M. B. Patil, IIT Bombay


W W
pnp and npn transistors
E p n p C E n p n C

* The emitter arrow in the BJT symbol B B


indicates the direction of the emitter VEB VBC VBE VCB
current when the BJT is operating in
the active mode (for both pnp and Ec
npn BJTs). EFn
EFp qVBE EFp
* The collector current IC is a fraction
Ec qVBC
of the emitter current: IC = αIE . Ev qVCB
For a good transistor, α ≈ 1. EFn
qVEB
EFn
EFp
Ev
IE IC IE IC
E C E C
VEB VBC VBE VCB
B B
IB IB
IE IC = αIE IE IC = αIE
E C E C
(emitter) (collector) (emitter) (collector)
IB = (1 − α) IE
B (base) IB = (1 − α) IE B (base)

M. B. Patil, IIT Bombay


W W
pnp and npn transistors
E p n p C E n p n C

* The emitter arrow in the BJT symbol B B


indicates the direction of the emitter VEB VBC VBE VCB
current when the BJT is operating in
the active mode (for both pnp and Ec
npn BJTs). EFn
EFp qVBE EFp
* The collector current IC is a fraction
Ec qVBC
of the emitter current: IC = αIE . Ev qVCB
For a good transistor, α ≈ 1. EFn
qVEB
* The three currents satisfy KCL, i.e., EFn
EFp
IE = IC + IB . Substituting for IC , we Ev
get IB = (1 − α) IE . IE IC IE IC
E C E C
VEB VBC VBE VCB
B B
IB IB
IE IC = αIE IE IC = αIE
E C E C
(emitter) (collector) (emitter) (collector)
IB = (1 − α) IE
B (base) IB = (1 − α) IE B (base)

M. B. Patil, IIT Bombay


W W
pnp and npn transistors
E p n p C E n p n C

* The emitter arrow in the BJT symbol B B


indicates the direction of the emitter VEB VBC VBE VCB
current when the BJT is operating in
the active mode (for both pnp and Ec
npn BJTs). EFn
EFp qVBE EFp
* The collector current IC is a fraction
Ec qVBC
of the emitter current: IC = αIE . Ev qVCB
For a good transistor, α ≈ 1. EFn
qVEB
* The three currents satisfy KCL, i.e., EFn
EFp
IE = IC + IB . Substituting for IC , we Ev
get IB = (1 − α) IE . IE IC IE IC
* Note that the diagrams are not drawn E C E C
to scale. In reality, for a silicon BJT, VEB VBC VBE VCB
the depletion regions would be
B B
narrower. IB IB
IE IC = αIE IE IC = αIE
E C E C
(emitter) (collector) (emitter) (collector)
IB = (1 − α) IE
B (base) IB = (1 − α) IE B (base)

M. B. Patil, IIT Bombay


BJT in active mode

IE IC IE IC
E C E C
VEB VBC VBE VCB
B B
IB IB

IE IC = αIE IE IC = αIE
E C E C
(emitter) (collector) (emitter) (collector)
IB = (1 − α) IE IB = (1 − α) IE
B (base) B (base)

M. B. Patil, IIT Bombay


BJT in active mode

IE IC IE IC
E C E C
VEB VBC VBE VCB
B B
IB IB

IE IC = αIE IE IC = αIE
E C E C
(emitter) (collector) (emitter) (collector)
IB = (1 − α) IE IB = (1 − α) IE
B (base) B (base)

* The “common-emitter current gain” β – a figure of merit of a BJT – is defined as β = IC /IB .

M. B. Patil, IIT Bombay


BJT in active mode

IE IC IE IC
E C E C
VEB VBC VBE VCB
B B
IB IB

IE IC = αIE IE IC = αIE
E C E C
(emitter) (collector) (emitter) (collector)
IB = (1 − α) IE IB = (1 − α) IE
B (base) B (base)

* The “common-emitter current gain” β – a figure of merit of a BJT – is defined as β = IC /IB .


IC αIE α
* β= = = .
IB (1 − α)IE 1−α

M. B. Patil, IIT Bombay


BJT in active mode

IE IC IE IC
E C E C
VEB VBC VBE VCB
α 1−α β = α/(1 − α)
B B
IB IB
0.9 0.1 9

IE IC = αIE IE IC = αIE 0.95 0.05 19


E C E C 0.99 0.01 99
(emitter) (collector) (emitter) (collector)
0.995 0.005 199
IB = (1 − α) IE IB = (1 − α) IE
B (base) B (base)

* The “common-emitter current gain” β – a figure of merit of a BJT – is defined as β = IC /IB .


IC αIE α
* β= = = .
IB (1 − α)IE 1−α

M. B. Patil, IIT Bombay


BJT in active mode

IE IC IE IC
E C E C
VEB VBC VBE VCB
α 1−α β = α/(1 − α)
B B
IB IB
0.9 0.1 9

IE IC = αIE IE IC = αIE 0.95 0.05 19


E C E C 0.99 0.01 99
(emitter) (collector) (emitter) (collector)
0.995 0.005 199
IB = (1 − α) IE IB = (1 − α) IE
B (base) B (base)

* The “common-emitter current gain” β – a figure of merit of a BJT – is defined as β = IC /IB .


IC αIE α
* β= = = .
IB (1 − α)IE 1−α
* For a typical discrete low-power transistor such as BC107A, β is in the range of 100 to 200.

M. B. Patil, IIT Bombay


BJT modes of operation

E p n p C E n p n C
(Emitter) (Collector) (Emitter) (Collector)

B (Base) B (Base)

Mode B-E junction B-C junction

Active (linear) forward reverse


Cutoff reverse reverse
Saturation forward forward
Inverse active reverse forward

M. B. Patil, IIT Bombay


BJT modes of operation

E p n p C E n p n C
(Emitter) (Collector) (Emitter) (Collector)

B (Base) B (Base)

Mode B-E junction B-C junction

Active (linear) forward reverse


Cutoff reverse reverse
Saturation forward forward
Inverse active reverse forward

* In analog circuits, BJTs are generally biased to operate in the active mode.

M. B. Patil, IIT Bombay


BJT modes of operation

E p n p C E n p n C
(Emitter) (Collector) (Emitter) (Collector)

B (Base) B (Base)

Mode B-E junction B-C junction

Active (linear) forward reverse


Cutoff reverse reverse
Saturation forward forward
Inverse active reverse forward

* In analog circuits, BJTs are generally biased to operate in the active mode.
* BJT as a switch:
- Closed: saturation mode
- Open: cutoff mode

M. B. Patil, IIT Bombay


Device structure (pnp transistor)

Emitter
Base
insulator

z
p epi-layer
y
x n p+
rb
p n+

Rsub
p+
(substrate)

Collector

M. B. Patil, IIT Bombay


Device structure (pnp transistor)

* The substrate thickness is hundreds of microns whereas


the p epi-layer and the rest of the device structure is
confined to a few microns. Emitter
Base
insulator

z
p epi-layer
y
x n p+
rb
p n+

Rsub
p+
(substrate)

Collector

M. B. Patil, IIT Bombay


Device structure (pnp transistor)

* The substrate thickness is hundreds of microns whereas


the p epi-layer and the rest of the device structure is
confined to a few microns. Emitter
Base
* The p + substrate can be treated as a small resistance
insulator
Rsub .
z
p epi-layer
y
x n p+
rb
p n+

Rsub
p+
(substrate)

Collector

M. B. Patil, IIT Bombay


Device structure (pnp transistor)

* The substrate thickness is hundreds of microns whereas


the p epi-layer and the rest of the device structure is
confined to a few microns. Emitter
Base
* The p + substrate can be treated as a small resistance
insulator
Rsub .
* The “active” region of the device is only the top few z
microns (the p epi-layer). p epi-layer
y
x n p+
rb
p n+

Rsub
p+
(substrate)

Collector

M. B. Patil, IIT Bombay


Device structure (pnp transistor)

* The substrate thickness is hundreds of microns whereas


the p epi-layer and the rest of the device structure is
confined to a few microns. Emitter
Base
* The p + substrate can be treated as a small resistance
insulator
Rsub .
* The “active” region of the device is only the top few z
microns (the p epi-layer). p epi-layer
y
* The figure is not drawn to scale. Typically, the y and z x n p+
dimensions are much larger than the p epi thickness. rb
p n+

Rsub
p+
(substrate)

Collector

M. B. Patil, IIT Bombay


Device structure (pnp transistor)

* The substrate thickness is hundreds of microns whereas


the p epi-layer and the rest of the device structure is
confined to a few microns. Emitter
Base
* The p + substrate can be treated as a small resistance
insulator
Rsub .
* The “active” region of the device is only the top few z
microns (the p epi-layer). p epi-layer
y
* The figure is not drawn to scale. Typically, the y and z x n p+
dimensions are much larger than the p epi thickness. rb
* Because the contact region dimensions are much larger p n+
than the base width (∼ the width of the n base region),
the device can be considered to be one-dimensional in
nature. Rsub
p+
(substrate)

Collector

M. B. Patil, IIT Bombay


Device structure (pnp transistor)

* The substrate thickness is hundreds of microns whereas


the p epi-layer and the rest of the device structure is
confined to a few microns. Emitter
Base
* The p + substrate can be treated as a small resistance
insulator
Rsub .
* The “active” region of the device is only the top few z
microns (the p epi-layer). p epi-layer
y
* The figure is not drawn to scale. Typically, the y and z x n p+
dimensions are much larger than the p epi thickness. rb
* Because the contact region dimensions are much larger p n+
than the base width (∼ the width of the n base region),
the device can be considered to be one-dimensional in
nature. Rsub
p+
* A “base resistance” rb exists between the base region and (substrate)
the base contact. To keep rb small, the base contact is
made close to the emitter.
Collector

M. B. Patil, IIT Bombay


Device structure (pnp transistor)

Emitter
Base
insulator

y
x n p+
rb
p n+

Rsub
p+
(substrate)

Collector
Device structure (pnp transistor)

Emitter
Base 1020

Doping density (cm−3 )


insulator Nd (B)
1018
z Na (E)
Na (C)
y 1016
x n p+
rb 1014
p n+

Rsub
p+
(substrate)

Collector
Device structure (pnp transistor)

Emitter
Base 1020

Doping density (cm−3 )


insulator Nd (B)
1018
z Na (E)
Na (C)
y 1016
x n p+
rb 1014
p n+

Rsub
p+
(substrate)

Collector
Device structure (pnp transistor)

Emitter
Base 1020

Doping density (cm−3 )


insulator Nd (B)
1018
z Na (E)
Na (C)
y 1016
x n p+
rb 1014
p n+

Rsub
p+
(substrate)

Collector

* For simplicity, we will assume the doping densities to be constant in the emitter, base, and collector regions.
Device structure (pnp transistor)

Emitter
Base 1020

Doping density (cm−3 )


insulator Nd (B)
1018
z Na (E)
Na (C)
y 1016
x n p+
rb 1014
p n+ NEa
1020

Doping density (cm−3 )


Rsub 1018
p+ NBd
(substrate)
1016 NCa

Collector 1014
0 1.5 3
x (µm)

* For simplicity, we will assume the doping densities to be constant in the emitter, base, and collector regions.

M. B. Patil, IIT Bombay


Device structure (pnp transistor)

Emitter
Base 1020

Doping density (cm−3 )


insulator Nd (B)
1018
z Na (E)
Na (C)
y 1016
x n p+
rb 1014
p n+ NEa
1020

Doping density (cm−3 )


Rsub 1018
p+ NBd
(substrate)
1016 NCa

Collector 1014
0 1.5 3
x (µm)

* For simplicity, we will assume the doping densities to be constant in the emitter, base, and collector regions.
* The relationship NaE > NdB > NaC , which is a consequence of the fabrication process, is also desirable from the
device performance angle.
M. B. Patil, IIT Bombay
BJT structure in integrated circuits (npn transistor)
insulator base emitter collector substrate
contact contact contact contact

p+ n+ n+
p+
p
epi-layer ∼ 5 µm
n

n+ buried layer

p+ substrate > 250 µm


(Not drawn to scale. Typically, the
horizontal dimensions are much larger
than the junction depths.)

M. B. Patil, IIT Bombay


BJT structure in integrated circuits (npn transistor)
insulator base emitter collector substrate
contact contact contact contact

p+ n+ n+
p+
p
epi-layer ∼ 5 µm
n

n+ buried layer

p+ substrate > 250 µm


(Not drawn to scale. Typically, the
horizontal dimensions are much larger
than the junction depths.)

* To make an integrated circuit (IC), a large number of transistors are fabricated on a single silicon piece
and interconnected as required.

M. B. Patil, IIT Bombay


BJT structure in integrated circuits (npn transistor)
insulator base emitter collector substrate
contact contact contact contact

p+ n+ n+
p+
p
epi-layer ∼ 5 µm
n

n+ buried layer

p+ substrate > 250 µm


(Not drawn to scale. Typically, the
horizontal dimensions are much larger
than the junction depths.)

* To make an integrated circuit (IC), a large number of transistors are fabricated on a single silicon piece
and interconnected as required.
* The BJTs are isolated from each other using reverse-biased pn junctions.

M. B. Patil, IIT Bombay


BJT structure in integrated circuits (npn transistor)
insulator base emitter collector substrate
contact contact contact contact

p+ n+ n+
p+
p
epi-layer ∼ 5 µm
n

n+ buried layer

p+ substrate > 250 µm


(Not drawn to scale. Typically, the
horizontal dimensions are much larger
than the junction depths.)

* To make an integrated circuit (IC), a large number of transistors are fabricated on a single silicon piece
and interconnected as required.
* The BJTs are isolated from each other using reverse-biased pn junctions.
* Contacts (E, B, C) are made on the top surface for connecting to other transistors.

M. B. Patil, IIT Bombay


BJT structure in integrated circuits (npn transistor)
insulator base emitter collector substrate
contact contact contact contact

p+ n+ n+
p+
p
epi-layer ∼ 5 µm
n

n+ buried layer

p+ substrate > 250 µm


(Not drawn to scale. Typically, the
horizontal dimensions are much larger
than the junction depths.)

* To make an integrated circuit (IC), a large number of transistors are fabricated on a single silicon piece
and interconnected as required.
* The BJTs are isolated from each other using reverse-biased pn junctions.
* Contacts (E, B, C) are made on the top surface for connecting to other transistors.
* An n+ buried layer is used to provide a low-resistance path for the electron current.

M. B. Patil, IIT Bombay


Dependence of α on device parameters
E-B C-B
depletion depletion
region region

E (p) B (n) C (p)

emitter collector
current current

recombination

base
x=0 x=W
Dependence of α on device parameters
E-B C-B
depletion depletion
region region

E (p) B (n) C (p)

emitter collector
current current

recombination

base
x=0 x=W

Consider a pnp transistor.


* IE has a hole component and an electron component. Of these, only the hole component contributes to IC .
IpE IpE
We define “emitter injection efficiency” (or simply “injection efficiency”) as γ = = .
IE IpE + InE
Dependence of α on device parameters
E-B C-B
depletion depletion
region region

E (p) B (n) C (p)

emitter collector
current current

recombination

base
x=0 x=W

Consider a pnp transistor.


* IE has a hole component and an electron component. Of these, only the hole component contributes to IC .
IpE IpE
We define “emitter injection efficiency” (or simply “injection efficiency”) as γ = = .
IE IpE + InE
* Some of the injected holes are lost due to recombination in the neutral base region (we will ignore G-R in the
B-C depletion regions).
IpC
We define “base transport factor” as αT = .
IpE
Dependence of α on device parameters
E-B C-B E-B C-B
depletion depletion depletion depletion
region region region region

E (p) B (n) C (p) E (n) B (p) C (n)

emitter collector emitter collector


current current current current

recombination recombination

base base
x=0 x=W x=0 x=W

Consider a pnp transistor.


* IE has a hole component and an electron component. Of these, only the hole component contributes to IC .
IpE IpE
We define “emitter injection efficiency” (or simply “injection efficiency”) as γ = = .
IE IpE + InE
* Some of the injected holes are lost due to recombination in the neutral base region (we will ignore G-R in the
B-C depletion regions).
IpC
We define “base transport factor” as αT = .
IpE
M. B. Patil, IIT Bombay
Dependence of α on device parameters

E-B C-B
depletion depletion
region region

E (p) B (n) C (p)

emitter collector
current current

recombination

base
x=0 x=W

Since the C-B junction is reverse biased, the pn junction current arising because of VCB is negligibly small.

M. B. Patil, IIT Bombay


Dependence of α on device parameters

E-B C-B
depletion depletion
region region

E (p) B (n) C (p)

emitter collector
current current

recombination

base
x=0 x=W

Since the C-B junction is reverse biased, the pn junction current arising because of VCB is negligibly small.
→ IC is entirely due to the holes injected by the emitter which make it to the C-B depletion boundary (x = W ), i.e.,
IC
IC ≈ IpC = αT IpE = αT (γ IE ) → α = = γ αT .
IE

M. B. Patil, IIT Bombay


Dependence of α on device parameters

E-B C-B
depletion depletion
region region

E (p) B (n) C (p)

emitter collector
current current

recombination

base
x=0 x=W

Since the C-B junction is reverse biased, the pn junction current arising because of VCB is negligibly small.
→ IC is entirely due to the holes injected by the emitter which make it to the C-B depletion boundary (x = W ), i.e.,
IC
IC ≈ IpC = αT IpE = αT (γ IE ) → α = = γ αT .
IE
→ For α ≈ 1, both γ and αT must be close to 1.

M. B. Patil, IIT Bombay


E-B C-B
depletion depletion
region region

E (p) B (n) C (p)

p(x)

n(x)

n0E

xE 0 W

We assume that the emitter width is greater than 5 Ln .

M. B. Patil, IIT Bombay


E-B C-B
depletion depletion
region region

E (p) B (n) C (p)

p(x)

n(x)

n0E

xE 0 W

We assume that the emitter width is greater than 5 Ln .


Neglecting the drift components for minority carriers in the emitter and base neutral regions, we get

d 2 ∆n ∆n
DnE − = 0, x < xE , with
dx 2 τnE
   
VEB
∆n(xE ) = n0E exp −1 ,
VT
∆n(−∞) = 0.
M. B. Patil, IIT Bombay
E-B C-B
depletion depletion
region region

E (p) B (n) C (p)

p(x)

n(x)

n0E

xE 0 W

We assume that the emitter width is greater than 5 Ln .


Neglecting the drift components for minority carriers in the emitter and base neutral regions, we get
d 2 ∆p ∆p
d 2 ∆n ∆n DpB − = 0, 0 < x < W , with
DnE − = 0, x < xE , with dx 2 τpB
dx 2 τnE    
    VEB
VEB ∆p(0) = p0B exp −1 ,
∆n(xE ) = n0E exp −1 , VT
VT    
VCB
∆n(−∞) = 0. ∆p(W ) = p0B exp −1 .
VT
M. B. Patil, IIT Bombay
Dependence of α on device parameters
E-B C-B
depletion depletion
region region

E (p) B (n) C (p)

p(x)

n(x)

n0E

xE 0 W
Dependence of α on device parameters
E-B C-B
depletion depletion
region region

E (p) B (n) C (p)

p(x)

n(x)

n0E

xE 0 W

Solution: ∆n(x) = ∆n(xE ) e −(xE −x)/LnE , x < xE ,


∆p(x) = A e −x/LpB + B e +x/LpB , 0 < x < W .
Dependence of α on device parameters
E-B C-B
depletion depletion
region region

E (p) B (n) C (p)

p(x)

n(x)

n0E

xE 0 W

Solution: ∆n(x) = ∆n(xE ) e −(xE −x)/LnE , x < xE ,


∆p(x) = A e −x/LpB + B e +x/LpB , 0 < x < W .
Using the boundary conditions (last slide), we get
W −x
   
x
sinh sinh
LpB LpB
∆p(x) = ∆p(0)   + ∆p(W )  .
W W
sinh sinh
LpB LpB
Dependence of α on device parameters
E-B C-B
depletion depletion
region region

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
p(x) 1

n(x)

n0E 0
0 0.2 0.4 0.6 0.8 1
xE x/W
0 W

Solution: ∆n(x) = ∆n(xE ) e −(xE −x)/LnE , x < xE ,


∆p(x) = A e −x/LpB + B e +x/LpB , 0 < x < W .
Using the boundary conditions (last slide), we get
W −x
   
x
sinh sinh
LpB LpB
∆p(x) = ∆p(0)   + ∆p(W )  .
W W
sinh sinh
LpB LpB
M. B. Patil, IIT Bombay
E-B C-B
depletion depletion
region region

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
p(x) 1

n(x)

n0E 0
0 0.2 0.4 0.6 0.8 1
xE x/W
0 W

dn d∆n
InE = qADnE (xE ) = qADnE (xE )
dx dx
qADnE qADnE  
= ∆n(xE ) = n0E e VEB /VT − 1 ,
LnE LnE

M. B. Patil, IIT Bombay


E-B C-B
depletion depletion
region region

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
p(x) 1

n(x)

n0E 0
0 0.2 0.4 0.6 0.8 1
xE x/W
0 W

dn d∆n
InE = qADnE (xE ) = qADnE (xE )
dx dx
qADnE qADnE  
= ∆n(xE ) = n0E e VEB /VT − 1 ,
LnE LnE
dp d∆p
IpE = −qADpB (0) = −qADpB (0)
dx dx
qADpB   cosh(W /L )
pB
= p0B e VEB /VT − 1 .
LpB sinh(W /LpB )

M. B. Patil, IIT Bombay


E-B C-B
depletion depletion
region region

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
p(x) 1

n(x)

n0E 0
0 0.2 0.4 0.6 0.8 1
xE x/W
0 W

dn d∆n
InE = qADnE (xE ) = qADnE (xE ) IpE 1
dx dx γ = =
IpE + InE 1 + (InE /IpE )
qADnE qADnE  
= ∆n(xE ) = n0E e VEB /VT − 1 , 1
LnE LnE = ,
DnE LpB NdB sinh(W /LB )
 
dp d∆p 1+
IpE = −qADpB (0) = −qADpB (0) DpB LnE NaE cosh(W /LB )
dx dx
 cosh(W /L ) n0E n2 NdB NdB
qADpB since = i × 2 = .

pB
= p0B e VEB /VT − 1 . p0B NaE ni NaE
LpB sinh(W /LpB )

M. B. Patil, IIT Bombay


Base transport factor
E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
W −x x=0 x=W
   
x
sinh sinh 1
LpB LpB
∆p(x) = ∆p(0)   + ∆p(W )  .
W W W/LpB = 0.5

∆p(x)/∆p(0)
sinh sinh
LpB LpB 1

0
0 0.2 0.4 0.6 0.8 1
x/W

M. B. Patil, IIT Bombay


Base transport factor
E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
W −x x=0 x=W
   
x
sinh sinh 1
LpB LpB
∆p(x) = ∆p(0)   + ∆p(W )  .
W W W/LpB = 0.5

∆p(x)/∆p(0)
sinh sinh
LpB LpB 1
d∆p 2
IC ≈ IpC = −qADpB (W )
dx

0
0 0.2 0.4 0.6 0.8 1
x/W

M. B. Patil, IIT Bombay


Base transport factor
E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
W −x x=0 x=W
   
x
sinh sinh 1
LpB LpB
∆p(x) = ∆p(0)   + ∆p(W )  .
W W W/LpB = 0.5

∆p(x)/∆p(0)
sinh sinh
LpB LpB 1
d∆p 2
IC ≈ IpC = −qADpB (W )
dx
qADpB   1
= p0B e VEB /VT − 1 .
LpB sinh(W /LB ) 0
0 0.2 0.4 0.6 0.8 1
x/W

M. B. Patil, IIT Bombay


Base transport factor
E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
W −x x=0 x=W
   
x
sinh sinh 1
LpB LpB
∆p(x) = ∆p(0)   + ∆p(W )  .
W W W/LpB = 0.5

∆p(x)/∆p(0)
sinh sinh
LpB LpB 1
d∆p 2
IC ≈ IpC = −qADpB (W )
dx
qADpB   1
= p0B e VEB /VT − 1 .
LpB sinh(W /LB ) 0
0 0.2 0.4 0.6 0.8 1
The base transport factor is (using IpE from the last slide), x/W
IpC 1
αT = = .
IpE cosh(W /LpB )
M. B. Patil, IIT Bombay
αT with W  LpB

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
emitter collector
1
current current
2
recombination

0
base 0 0.2 0.4 0.6 0.8 1
x=0 x=W x/W
2.5
W −x
   
x cosh (x)
sinh sinh x2
LpB LpB 2 1+
∆p(x) = ∆p(0) 2
  + ∆p(W )  .
W W 1.5
sinh sinh
LpB LpB
1 sinh (x)

0.5 x

0
0 0.5 1 1.5
x

M. B. Patil, IIT Bombay


αT with W  LpB

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
emitter collector
1
current current
2
recombination

0
base 0 0.2 0.4 0.6 0.8 1
x=0 x=W x/W
2.5
W −x
   
x cosh (x)
sinh sinh x2
LpB LpB 2 1+
∆p(x) = ∆p(0) 2
  + ∆p(W )  .
W W 1.5
sinh sinh
LpB LpB
1 sinh (x)
IpC 1 1
αT = = ≈ 2 . 0.5 x
IpE cosh(W /LpB ) 1

W
1+
2 LpB 0
0 0.5 1 1.5
x

M. B. Patil, IIT Bombay


αT with W  LpB

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
emitter collector
1
current current
2
recombination

0
base 0 0.2 0.4 0.6 0.8 1
x=0 x=W x/W
2.5
W −x
   
x cosh (x)
sinh sinh x2
LpB LpB 2 1+
∆p(x) = ∆p(0) 2
  + ∆p(W )  .
W W 1.5
sinh sinh
LpB LpB
1 sinh (x)
IpC 1 1
αT = = ≈ 2 . 0.5 x
IpE cosh(W /LpB ) 1

W
1+
2 LpB 0
0 0.5 1 1.5
Remark: αT → 1 if the base width W is made small compared to LpB . x

M. B. Patil, IIT Bombay


γ with W  LpB

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
emitter collector
1
current current
2
recombination

0
base 0 0.2 0.4 0.6 0.8 1
x=0 x=W x/W
2.5
IpE 1 1 cosh (x)
γ= = = x2
NdB sinh(W /LB )
 
IpE + InE 1 + (InE /IpE ) DnE LpB 2 1+
1+ 2
DpB LnE NaE cosh(W /LB )
1.5

1 sinh (x)

0.5 x

0
0 0.5 1 1.5
x

M. B. Patil, IIT Bombay


γ with W  LpB

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
emitter collector
1
current current
2
recombination

0
base 0 0.2 0.4 0.6 0.8 1
x=0 x=W x/W
2.5
IpE 1 1 cosh (x)
γ= = = x2
NdB sinh(W /LB )
 
IpE + InE 1 + (InE /IpE ) DnE LpB 2 1+
1+ 2
DpB LnE NaE cosh(W /LB )
1.5
1
≈   1
DnE LpB NdB W /LpB sinh (x)
1+
DpB LnE NaE 1 + 12 (W /LpB )2 0.5 x

0
0 0.5 1 1.5
x

M. B. Patil, IIT Bombay


γ with W  LpB

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
emitter collector
1
current current
2
recombination

0
base 0 0.2 0.4 0.6 0.8 1
x=0 x=W x/W
2.5
IpE 1 1 cosh (x)
γ= = = x2
NdB sinh(W /LB )
 
IpE + InE 1 + (InE /IpE ) DnE LpB 2 1+
1+ 2
DpB LnE NaE cosh(W /LB )
1.5
1
≈   1
DnE LpB NdB W /LpB sinh (x)
1+
DpB LnE NaE 1 + 12 (W /LpB )2 0.5 x

1
≈   0
DnE W NdB 0 0.5 1 1.5
1+ x
DpB LnE NaE
M. B. Patil, IIT Bombay
γ with W  LpB

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
emitter collector
1
current current
2
recombination

0
base 0 0.2 0.4 0.6 0.8 1
x=0 x=W x/W
2.5
1 cosh (x)
γ≈ . 2 x2
1+

DnE W NdB 2
1+
DpB LnE NaE 1.5

1 sinh (x)

0.5 x

0
0 0.5 1 1.5
x

M. B. Patil, IIT Bombay


γ with W  LpB

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
emitter collector
1
current current
2
recombination

0
base 0 0.2 0.4 0.6 0.8 1
x=0 x=W x/W
2.5
1 cosh (x)
γ≈ . 2 x2
1+

DnE W NdB 2
1+
DpB LnE NaE 1.5

* γ → 1 if NaE  NdB . 1 sinh (x)

0.5 x

0
0 0.5 1 1.5
x

M. B. Patil, IIT Bombay


γ with W  LpB

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
emitter collector
1
current current
2
recombination

0
base 0 0.2 0.4 0.6 0.8 1
x=0 x=W x/W
2.5
1 cosh (x)
γ≈ . 2 x2
1+

DnE W NdB 2
1+
DpB LnE NaE 1.5

* γ → 1 if NaE  NdB . 1 sinh (x)


* It is now clear why a higher doping density in the emitter region 0.5 x
(compared to the base doping density) is desirable.
0
0 0.5 1 1.5
x

M. B. Patil, IIT Bombay


Example E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
x=0 x=W

Consider a pnp BJT with NaE = 1018 cm−3 , NdB = 5 × 1016 cm−3 , NaC = 1015 cm−3 , and with
a base width W = 2 µm (T = 300 K).
(a) Calculate αT , γ, α, and β, using the following parameters.
µnE = 250 cm2 /V-s, µpB = 500 cm2 /V-s, µnC = 1500 cm2 /V-s,
τnE = 0.2 µs, τpB = 1 µs, τnC = 1 µs.

M. B. Patil, IIT Bombay


Example E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
x=0 x=W

Consider a pnp BJT with NaE = 1018 cm−3 , NdB = 5 × 1016 cm−3 , NaC = 1015 cm−3 , and with
a base width W = 2 µm (T = 300 K).
(a) Calculate αT , γ, α, and β, using the following parameters.
µnE = 250 cm2 /V-s, µpB = 500 cm2 /V-s, µnC = 1500 cm2 /V-s,
τnE = 0.2 µs, τpB = 1 µs, τnC = 1 µs.
(b) Repeat (a) for the BJT operating in the reverse active mode.

M. B. Patil, IIT Bombay


Example E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
x=0 x=W

Solution:
The minority carrier diffusion lengths are
√ √ √
LnE = DnE τnE = VT µnE τnE = 0.0258 × 250 × 0.2 × 10−6 = 1.14 × 10−3 cm = 11.4 µm.

LpB = DpB τpB = VT µpB τpB = 0.0258 × 500 × 1 × 10−6 = 3.59 × 10−3 cm = 35.9 µm.
p p

√ √ √
LnC = DnC τnC = VT µnC τnC = 0.0258 × 1500 × 1 × 10−6 = 6.22 × 10−3 cm = 62.2 µm.

Note that LpB  W (2 µm).

M. B. Patil, IIT Bombay


Example E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
x=0 x=W

DnE W NdB µnE W NdB 250 2 × 10−4 5 × 1016


(a) = = = 4.386 × 10−3 .
DpB LnE NaE µpB LnE NaE 500 1.14 × 10−3 1018

M. B. Patil, IIT Bombay


Example E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
x=0 x=W

DnE W NdB µnE W NdB 250 2 × 10−4 5 × 1016


(a) = = = 4.386 × 10−3 .
DpB LnE NaE µpB LnE NaE 500 1.14 × 10−3 1018
1
γ= = 0.9956.
1 + 4.386 × 10−3

M. B. Patil, IIT Bombay


Example E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
x=0 x=W

DnE W NdB µnE W NdB 250 2 × 10−4 5 × 1016


(a) = = = 4.386 × 10−3 .
DpB LnE NaE µpB LnE NaE 500 1.14 × 10−3 1018
1
γ= = 0.9956.
1 + 4.386 × 10−3
1 1
αT = = = 0.9985.
1 + 12 (W /LpB )2 1 + 12 (2.0/35.9)2

M. B. Patil, IIT Bombay


Example E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
x=0 x=W

DnE W NdB µnE W NdB 250 2 × 10−4 5 × 1016


(a) = = = 4.386 × 10−3 .
DpB LnE NaE µpB LnE NaE 500 1.14 × 10−3 1018
1
γ= = 0.9956.
1 + 4.386 × 10−3
1 1
αT = = = 0.9985.
1 + 12 (W /LpB )21 + 12 (2.0/35.9)2
α
α = γαT = 0.9940 → β = = 166.
1−α

M. B. Patil, IIT Bombay


Example E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
x=0 x=W

(b) With E ↔ C ,
DnE W NdB DnC W NdB µnC W NdB 1500 2 × 10−4 5 × 1016
→ = = = 4.823.
DpB LnE NaE DpB LnC NaC µpB LnC NaC 500 6.22 × 10−3 1015
1 1
γ= = 0.1717, αT = = 0.9985.
1 + 4.823 1 + 12 (2/35.9)2
→ α = γ αT = 0.1714 → β = 0.2, a disaster.
Conclusion: NaE  NdB is crucial.
(Note that we have treated W as a constant, but it would vary with bias conditions.)

M. B. Patil, IIT Bombay


γ with W << LpB

E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
xEn x=0 x=W

M. B. Patil, IIT Bombay


γ with W << LpB

E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
xEn x=0 x=W

xE − x
    
d VEB
InE = −q A DnE n0E exp exp − n at x = xnE
dx VT LnE

M. B. Patil, IIT Bombay


γ with W << LpB

E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
xEn x=0 x=W

xE − x
    
d VEB
InE = −q A DnE n0E exp exp − n at x = xnE
dx VT LnE

1
 
VEB
= q A DnE n0E exp ×
VT LnE

M. B. Patil, IIT Bombay


γ with W << LpB

E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
xEn x=0 x=W

xE − x
    
d VEB
InE = −q A DnE n0E exp exp − n at x = xnE
dx VT LnE

1
 
VEB
= q A DnE n0E exp ×
VT LnE

1
 
VEB
IpE ≈ q A DpB p0B exp ×
VT W

M. B. Patil, IIT Bombay


γ with W << LpB

E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
xEn x=0 x=W

xE − x
    
d VEB
InE = −q A DnE n0E exp exp − n at x = xnE
dx VT LnE

1
 
VEB
= q A DnE n0E exp ×
VT LnE

1
 
VEB
IpE ≈ q A DpB p0B exp ×
VT W
InE DnE n0E W

IpE DpB p0B LnE

M. B. Patil, IIT Bombay


γ with W << LpB

E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
xEn x=0 x=W

xE − x
    
d VEB
InE = −q A DnE n0E exp exp − n at x = xnE
dx VT LnE

1
 
VEB
= q A DnE n0E exp ×
VT LnE

1
 
VEB
IpE ≈ q A DpB p0B exp ×
VT W
InE DnE n0E W DnE ni2 NdB W
≈ =
IpE DpB p0B LnE DpB NaE ni2 LnE

M. B. Patil, IIT Bombay


γ with W << LpB

E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
xEn x=0 x=W

xE − x
    
d VEB
InE = −q A DnE n0E exp exp − n at x = xnE
dx VT LnE

1
 
VEB
= q A DnE n0E exp ×
VT LnE

1
 
VEB
IpE ≈ q A DpB p0B exp ×
VT W
InE DnE n0E W DnE ni2 NdB W DnE NdB W
≈ = = .
IpE DpB p0B LnE DpB NaE ni2 LnE DpB NaE LnE

M. B. Patil, IIT Bombay


γ with W << LpB

E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
xEn x=0 x=W

M. B. Patil, IIT Bombay


γ with W << LpB

E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
xEn x=0 x=W

InE DnE NdB W



IpE DpB NaE LnE

M. B. Patil, IIT Bombay


γ with W << LpB

E (p) B (n) C (p) E (p) B (n) C (p)

p(x) emitter collector


current current

recombination
n(x)

base
xEn x=0 x=W

InE DnE NdB W



IpE DpB NaE LnE
IpE 1 1
→γ= = ≈ .
InE

IpE + InE DnE W NdB
1+ 1+
IpE DpB LnE NaE

M. B. Patil, IIT Bombay


αT with W  LpB

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
emitter collector
1
current current
2
recombination

0
base 0 0.2 0.4 0.6 0.8 1
x=0 x=W x/W

When W  LpB , ∆p(x) is linear.


IpC IpC 1
αT = = = .
IpE IpC + IpB IpB
1+
IpC

M. B. Patil, IIT Bombay


αT with W  LpB

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
emitter collector
1
current current
2
recombination

0
base 0 0.2 0.4 0.6 0.8 1
x=0 x=W x/W

When W  LpB , ∆p(x) is linear.


IpC IpC 1
αT = = = .
IpE IpC + IpB IpB
1+
IpC
dp ∆p(0)
IpC = −q A DpB (W ) ≈ q A DpB .
dx W

M. B. Patil, IIT Bombay


αT with W  LpB

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
emitter collector
1
current current
2
recombination

0
base 0 0.2 0.4 0.6 0.8 1
x=0 x=W x/W

When W  LpB , ∆p(x) is linear.


IpC IpC 1
αT = = = .
IpE IpC + IpB IpB
1+
IpC
dp ∆p(0)
IpC = −q A DpB (W ) ≈ q A DpB .
dx W
1
Qp qA 2
∆p(0) W
IpB = =
τpB τpB

M. B. Patil, IIT Bombay


αT with W  LpB

1
E (p) B (n) C (p)

W/LpB = 0.5

∆p(x)/∆p(0)
emitter collector
1
current current
2
recombination

0
base 0 0.2 0.4 0.6 0.8 1
x=0 x=W x/W

When W  LpB , ∆p(x) is linear.


IpC IpC 1
αT = = = .
IpE IpC + IpB IpB
1+
IpC
dp ∆p(0)
IpC = −q A DpB (W ) ≈ q A DpB .
dx W
1
Qp qA 2
∆p(0) W 1
IpB = = → αT ≈ 2 .
τpB τpB 1

W
1+
2 LpB
M. B. Patil, IIT Bombay

You might also like