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#MICROCHANNELS AND MINCHANNELSHISTORY, TERMINOLOGY, CLASSIFICATION AND CURRENT RESEARCH NEEDS
#MICROCHANNELS AND MINCHANNELSHISTORY, TERMINOLOGY, CLASSIFICATION AND CURRENT RESEARCH NEEDS
As the channel dimension becomes smaller, it approaches the Slip flow: rarefaction effects
mean free path between the molecules in a gaseous flow. The that can be modeled with a
continuum assumption in the flow introduces increasing errors 0.1>Kn>0.001 modified continuum theory
as the need to recognize the “granular” nature of flow becomes accounting for wall slip.
significant with decreasing channel dimensions. The departure
from continuum becomes more pronounced for low pressure Transition Flow: a type of
gas flows, as the mean free path becomes larger with a flow between slip flow and
reduction in pressure. free molecular flow that is
10>Kn>0.1
analyzed statistically; i.e.
A measure of the departure from the continuum is introduced with Boltzman equation.
through the Knudsen number, Kn, defined as:
Free Molecular Flow:
motion of individual
λ
Kn = (1) Kn>10 molecules must be modeled
Dh and then treated statistically
where Dh is the hydraulic diameter of the flow channel, and λ is
the mean free path for the gas calculated from the following
equation:
The slip flow model recognizes the departure from the
continuum assumption by replacing the conventional non-slip
µ π wall boundary condition with a finite slip velocity at the wall.
λ= (2)
ρ 2 RT A similar temperature jump at the wall is considered during
heat transfer analysis of gas flows in microchannels. The
kinetic theory of gases and wall interactions are considered in
where R – gas constant, J/kgK, µ - dynamic viscosity, N/ms, ρ- deriving various first order and second order slip flow models
density, kg/m3, and T is absolute temperature in K. Mean free in literature.
paths for some common gases are given in Table 1, Kandlikar
and Grande (2002). As Kn becomes larger, the departure from continuum becomes
significant, and a simple wall velocity correction is no longer
able to handle the complex wall and intermolecular interactions
Electric Double Layer in Liquid Flows As the channel dimensions become small, the errors involved
in the measurement of the channel dimensions, such as the
Most solid surfaces have electrostatic charges on their surface. diameter or cross-sectional dimensions, become significant. It
When a liquid containing even a small number of ions flows is therefore essential to employ precision instrumentation in
Arriving at the correct wall boundary condition in As a single-phase fluid flows through the microchannel, the
microchannel and minichannel flows poses yet another combination of the high heat transfer coefficient and the low
challenge. In general, the microchannels will be employed mass flow rates lead to a very high effectiveness value for a
under the following two configurations: given heat exchanger configuration. The difference between
the outlet fluid temperature and the wall temperature at the
1. Direct cooling of silicon wafers using microchannel flow outlet can be quite small, sometimes less than 1 °C. In
passages reducing such experimental data using LMTD equations, large
errors are introduced in estimating the heat transfer coefficient.
2. Incorporation of microchannel flow passages in a large The remedy might be to conduct the tests under low
conductive medium, such as copper or sapphire, to provide a effectiveness configuration by shortening the flow passage
combination of high degree of substrate conduction in the length. This however is not desirable from developing length
microchannel field and high transfer coefficients associated considerations. Proper design of the experimental setup thus
with flows in microchannels. becomes quite challenging.
In the case of silicon wafers, although the substrate Pressure Tap Size and Shape
conductivity is high, the convective heat transfer coefficients
within the microchannels are also high. In this case, it is The pressure drop along the channel length is sometimes
expected that the thermal boundary condition imposed on the measured through small holes made in the channel walls. The
substrate from the heat source would be a reasonable first guess opening of these holes should be small (relative to the channel
for the microchannel walls. In the case of copper blocks, it will cross-sectional dimensions) to avoid excessive interference
be very difficult to generalize the heat transfer conditions, but with the flow field. On the other hand, smaller holes require
considering that the individual channels are relatively short longer time to attain steady state conditions between two runs
compared to the conduction path lengths within the metal with different flow settings. Another aspect that needs to be
block, a constant temperature boundary condition may be a carefully inspected is the protrusions at the hole openings into
closer approximation. In any event, it is recognized that lack of the flow channel introduced during the fabrication process.
accurate knowledge of the wall boundary condition will
introduce errors since the laminar flow characteristics are more Errors in Local Temperature Measurements
dependent on them than the turbulent flow characteristics
generally encountered in conventional channels. The local wall temperatures in microchannels and minichannels
are estimated from the measurements made a certain distance
The wall boundary condition also influences the estimation of away from the actual heat transfer surface. This introduces
the local fluid temperature in the microchannel at a given uncertainties in the measurements. In the case of fabrication on
location along the length in the flow direction. In the case of a silicon wafers, it may be possible to provide direct wall
constant heat flux boundary condition, the heat balance temperature measurement by installing diodes or
provides the variation of local fluid enthalpy, which can be thermocouples using IC fabrication technology. In both cases,
Large fluctuations in pressure drop and individual channel flow Kandlikar, S.G., Campbell, L., 2002, “Effect of Entrance
rates have been reported in literature during flow boiling in Condition on Frictional Losses and Transition to Turbulence,”
parallel channel arrangement. Further experimental work as Paper No. IMECE2002-39573, International Mechanical
well as theoretical development is needed to obtain a Engineering Conference and Exposition 2002, New Orleans,
fundamental understanding of this phenomenon and to provide Nov. 17-21, ASME.
accurate guidelines to designers. Flow instabilities coupled
with frequent dryout conditions lead to degradation of the Kandlikar, S.G., and Grande, W.J., 2002, “Evolution of
thermal performance of the microchannel heat exchanger, often Microchannel Flow Passages – Thermohydraulic Performance
leading to the CHF conditions. and Fabrication Technology,” Paper No. IMECE2002-32043,
International Mechanical Engineering Conference and
Rarefaction and Compressibility Effects in Two-Phase Exposition 2002, New Orleans, Nov. 17-21, ASME, Also being
Flows published in Heat Transfer Engineering, Vol. 25, No. 1, Jan.
2003.
The gaseous phase of a two-phase flow in microchannel may
experience the rarefaction and compressibility effects that were Kandlikar, S.G., Joshi, S., and Tian, S., 2001, “Effect of
discussed under single-phase flows. This issue is not addressed Channel Roughness on Heat Transfer and Fluid Flow
Mala, G. M., Li, S., and Dale, J.D., 1997, “Heat Transfer and
Fluid Flow in Microchannels,” International Journal of Heat
and Mass Transfer, Vol. 40, No. 13, pp. 3079-3088.