Professional Documents
Culture Documents
IMST Merged File
IMST Merged File
development stages
OBJECTIVES
2.1 Explain the concept of product development with a block diagram.
2.2 Give classification of Electronic Products.
2.3 Explain the Techno Commercial Feasibility of a product.
2.4 Explain customer requirements
2.5 Explain R&D prototype Assessment of reliability.
2.6 Explain factors for reliability of equipment.
2.7 Explain quality considerations.
2.8 List reasons for failure of an electronic product
2.9 Explain Bath tub curve
2.10 Explain the concept of ergonomic and aesthetic considerations of pilot production
2.11 Explain Product packaging and storage
2.12 Estimate power supply requirements of an electronic product
2.13 List two types of power supply protection devices
2.14 Define noise reduction.
2.15 Explain grounding, shielding and guarding techniques
2.16 Explain Thermal management
2-2 Electronic Product Design and Development Stages
2.0 Introduction
Microsoft Word
Every electronic product consists of many components that can be interconnected
so that some specific functions can be performed. These products have to be developed
systematically. The development can be carried out at various module levels. The
modules have to satisfy the specific task or function. At the end of the development, the
verification is done. The different methods to work out are:
• Functional analysis
• Synthesis
• Verification of decision
• Documentation
The main tasks at each module level are discussed here.
a) Functional Analysis:
Hardware and software are integral parts of every electronic product. The
specific requirements of a product to be carried out are assigned to either hardware or
software. At the same time, the human interface to the system plays an important role.
The environmental conditions, in which the product works, also decide the types of
components to be used for the hardware. These components are cascaded such that the
required targets can be achieved. The main aim of all these activities is to reduce the
complexity of the product.
b) Synthesis:
Synthesis is the process of testing and verifying the functional requirements of a
product. The test can be physically carried out on a bread board or simulated.
c) Verification and Decision Making:
Based on the test report, the verification to meet the requirements has to be
validated. From this report of verification, final decision of product development can be
taken.
d) Documentation:
Documentation is the heart of any product development. The detailed
explanation of product can be given by different forms of documents – brochures and
user manuals – where the following details are discussed in a user-friendly manner:
• Different test performed
• Test results
• Verification
• Maintenance
Product development is a process within organizations. As a process it takes a
series of inputs and, within a given set of constraints, produces a set of outputs. Fig. 2.0
depicts this general process form. The inputs can be in the form of raw materials,
Maanya’s M.G.B Publications Industrial Management & Smart Technologies
Electronic Product Design and Development Stages 2-3
components, people skills, time, money and so on. These basic inputs are transformed
by the process which operates with a set of constraints which would include the
company procedures and practices, the quality system, the human resources system, and
so on. The end result is the output, the final product, the service provided, or whatever
the process output happens to be.
Fig. 2.10(b) Input applied by Operator, Output will be given by the Machine
• The main aim is to design a safer and better UPE system, following the natural
limits/laws of a human being. It helps from the misuse of human energy, while
operating any product, or working under certain environmental conditions.
Fig. 2.15.3. Use of guarding for (a) inverting configuration (b) voltage follower circuit (c)
non inverting configuration (d) IC pins
• Guarding technique accepts that there will be some degree of leakage to the high –
impedance node, but minimizes the current flow to it by surrounding it with a
conductive trace that is connected to a low-impedance point at the same potential.
Maanya’s M.G.B Publications Industrial Management & Smart Technologies
2-28 Electronic Product Design and Development Stages
• If the voltage difference between two nodes is forced to be very low, the apparent
resistance between them is magnified. The electrical connections and printed circuit
Microsoft Word
layouts for the guarding for the basic op-amp configurations are as shown in
Fig.2.15.3.
• The guard ring will essentially absorb the leakage from other tracks, reducing that
reaching the high-impedance point that is high-input impedance of op-amp.
• In case of a double-sided board, the guard should be on both sides. Though the
guard virtually eliminates surface leakage, it has less effect on bulk leakage through
the board. With respect to surface resistance, the width of the track is not important.
The wider guard will improve the effect on bulk resistance.
• Need of guarding should be estimated during the initial design stages of the
product so as to reduce the interference of leakage with the actual circuit
performance.
• Fig. 2.15.3.(b) shows a component under test. R1 with R A and R B forms a parallel-
path shunting resistance.
• A measurement across points P1 and P3 will gives incorrect value of R1 . The
unknown resistance R1 must be isolated with R A and R B before its resistance may
be measured accurately.
• This may be carried out by one of the method of guarding by connecting P2 to a
guard point G that is at an earth potential. In this way, the effect of R A and R B is
negligible with virtually all the current flowing from R1 going to op-amp.
• The loading effect of R A is negligible, because of very low resistance of power
supply providing the stimulus voltage R B is earthed at virtual earth and thus
taking no current. In practice, parallel paths are more complex, and guarding may
not be as simple as shown in Fig.2.15.3(a).
OBJECTIVES
3.1 Explain the importance of product testing and Environmental testing
3.2 Explain Dry heat testing, Vibration testing, random testing and Bump testing
3.3 Explain Temperature extreme testing for linear and step stress profiles
3.4 Explain Vibration & temperature cycling
3.5 Explain EMI and EMC compliance testing standardization
3.6 Explain UL and CE Certification of industrial electronic products.
3.7 Explain the importance of documentation
3.8 List types of documentation.
3.9 Explain types of documents
3.10 List rules for preparation of effective document
3.11 Explain PCB documentation
3.12 Explain Assembly and fabrication related documentation for Laminate grade
3.13 Explain the preparation a manual document
3.14 Explain the details of service manual
3.15 Explain test report/manuals
3.16 Explain product documentation, Bill of materials, Production test specifications
3-2 Electronic Product Testing & Documentation
3.0 Introduction
Microsoft Word
The theory is that since the advent of mass production manufacturers produce
branded products which they assert and advertise to be identical within some technical
standard.
Product testing seeks to ensure that consumers can understand what products will
do for them and which products are the best value. Product testing is a strategy to
increase consumer protection by checking the claims made during marketing strategies
such as advertising, which by their nature are in the interest of the entity distributing the
service and not necessarily in the interest of the consumer. The advent of product testing
was the beginning of the modern consumer movement.
Product testing might be accomplished by a manufacturer, an independent
laboratory, a government agency, etc. Often an existing formal test method is used as a
basis for testing. Other times engineers develop methods of test which are suited to the
specific purpose. Comparative testing subjects several replicate samples of similar
products to identical test conditions.
Product testing is any process by means of which a researcher measures a
product's performance, safety, quality, and compliance with established standards. The
primary element which constitutes an objective comparative test program is the extent to
which the researchers can perform tests with independence from the manufacturers,
suppliers, and marketers of the products.
Fig. 3.5 Possible sources of ambient noise and how they may be coupled into a receiver
3.5.2. EMC
• Electromagnetic compatibility (EMC) is defined as the ability of an equipment, or
system, to work satisfactorily in an electromagnetic environment without
introducing intolerable electromagnetic disturbances in that environment.
• The electromagnetic environment is composed of both radiated and conducted
energy. Because, it is nearly impossible to predict actual interference of the field, so
it is very difficult to get rid of noise sources completely.
• The goal of electromagnetic compatibility (EMC) testing is the correct operation, in
the same electromagnetic environment, of different equipment that employs
electromagnetic phenomena and the avoidance of any interference effects.
• But, it can be minimized to a certain level by use of some devices like a power line
filter.
• Thus special design techniques, or solutions, adopted to minimize field
interferences and subsequent reduction in the noise due to it is known as EMC and
compliance.
• In the defense application, areas of various equipments or circuits get crowded in a
small space and have to be electromagnetically compatible such as radar, radio
transmitters, computer controlled weapon system, power generating stations and
telephones.
• The interface caused to any of them will lead to disaster. So, some standards for
EMI or EMC must be followed in defense.
• A third-party organization should test the electromagnetic compatibility (EMI,
EMC standards) of electrical products and certifies that products are both
protected from the interference environment and ensures that they do not pollute
the environment with unwanted electromagnetic emissions.
Comparison of Conducted EMI and Radiated EMI
S.No. Conducted EMI Radiated EMI
Fig.(a) UL mark
(B) Several Categories of UL Certification
The following are several categories of UL certification:
• Products under its listing service are said to be “UL Listed”, identified by the
distinctive UL mark.
• In some cases, a component may be “UL Recognized”, meaning UL has found it
acceptable for use in a complete UL listed product.
• Some products may be “UL Classified” for specific hazards or properties.
1. Resistor 470 Ω 1
2. Resistor 100 kΩ 1
3. Resistor 1.5 MΩ 1
6. Capacitor 10 nF 63V 1