Q1: Explain design concepts in thin silicon diaphragm which is in rectangular

shape used in micro pressure when subjected to pressure.

Q2: Determine the maximum stress and deflection in a square plate made of
silicon when is subjected to a pressure loading, pressure=p = 20 MPa. The plate
has edge length, a = 532 µm and a thickness, h = 13.887 µm.

Q3: Explain the mechanical vibration principle used in the design of micro-
accelerometer which is used in mems.

Q4: Explain the design concepts of accelerometer attached to a moving solid

which is subjected to vibration.

Q5: Estimate the damping coefficient (c) of a micro accelerometer using

a cantilever beam spring as illustrated below. Also determine the moment of
inertia (I) of the beam.

Q6: Explain the mechanical vibration principle used in the design of micro-
accelerometer which is used in mems.
Q7: Estimate the damping coefficient (c) of a micro accelerometer using a
cantilever beam spring as illustrated below.
Q8: Explain the design concepts of accelerometer attached to a moving solid
which is subjected to vibration.
Q8: Enumerate on the input Information to FEA and output in Stress Analyses
from Finite Element.
Q9: Briefly explain the various engineering applications of Finite Element
Method.
Q10: Enumerate on the input Information to FEA and output in Stress Analyses
from Finite Element.