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Santhanakrishnan Paper
Santhanakrishnan Paper
Heatsinks
M. Santhanakrishnan*1, T. Tilford1, C. Bailey1
1.Department of Mathematical Sciences, The University of Greenwich, London, UK
*m.santhanakrishnan@greenwich.ac.uk
thermal conductivity ratios for the objectives of
Abstract: minimum thermal compliance (TC) and viscous
The level set based topology optimisation technique dissipation (VD). The rest of the paper details the
is applied to optimise a 2D and 3D convectively LSM TO formulation in Section 2, Numerical
cooled heatsink. The approach is used to determine Implementation in Section 3 and Computational
the design providing minimal thermal compliance details in Section 4. Results of the study and
discussion are given in Section 5 and Conclusions
and minimal viscous dissipation. The optimisation
are given in Section 6.
has been performed utilising the COMSOL
multiphysics for solution of physics and sensitivity
2.0 Level set based TO formulation
analysis and the MATLAB Livelink functionality
The seminal papers on LSM TO were written by
for level set advection and reinitialisation. This
Allaire [3] and Wang [4], where they applied this
paper describes the details of implementation, the technique for the optimisation of structural
topology optimisation model and presents results members. Challis and Guest [5] applied this
obtained using this formulation. technique for the optimisation of Stokes flow
problems. Subsequently this technique has been
Keywords: Level set, Topology optimisation, Heat
extended by many researchers to various fields.
sink, Forced convection, Re-initialisation
In this technique, Signed Distance Function (SDF)
1.0 Introduction is used as level set function (LSF). Positive SDF (𝜓)
is considered to represent solid and negative SDF is
A heat sink is a passive cooling device which considered to represent fluid (Figure 1). This is
transfers the heat received from the heat source to enforced by the ersatz projection approach [3], using
adjacent fluid medium through forced or natural Heaviside function.
convection. Many electronic devices, such as CPU,
GPU, power transistors and LEDs generate = 0 ∀𝑥 ∈ 𝜕Ω (boundary)
significant levels of heat energy which must be 𝜓 = { > 0 ∀𝑥 ∈ Ω+ (𝑆𝑜𝑙𝑖𝑑 𝑟𝑒𝑔𝑖𝑜𝑛) (1)
efficiently dissipated in order to ensure reliable < 0 ∀𝑥 ∈ Ω− (𝐹𝑙𝑢𝑖𝑑 𝑟𝑒𝑔𝑖𝑜𝑛)
operation.
In this study Two & Three dimensional heat sinks Where, H is Heaviside function, which take unit
will be developed for two different solid to fluid value when LSF is positive and takes zero value
mpheval(model,
'shapesens','dataset','dset2','selection',3)
0 0
0.015 0.015
Parameter Value
Kf /Ks 0.001 & 0.1
0.05 0.05
0.01 0.01
f /s 1000/8920
Cpf /Cps 4184/385
0.005 0.005
Table 2 Material properties
0.1 0.1
0.1 0.1
0.08 0.08
0.04
0.06
0.04
0.06 0 0 Computational domain used for 3D study is shown
0.15
0
0.02
0.15
0
0.02
in Figure-5. The computational domain considered
Phi Phi
is 1 quadrant of the total domain, making use of
symmetry boundary condition on the two sides. The
0.035
0.035
design domain is a cube of side 0.1m length and it is
0.03 0.03
discretised by 43x43x43 mesh elements. Heat flux
0.025 0.025
of 1000W/m2 is applied at the bottom corner of area
0.03
0.02 0.02
1.353e-4 m2 of the design domain base and a fluid
0.03
0.1
0.02
0.01
0.02
0.01
0.09
0.1
0.09 0.015 0.015 flow of velocity 4e-5m/s is applied at the top surface
0.08 0.08
0
0
0
0
0.07
0.06 0.06
0.07
0.01 0.01 of the computational domain. The volume fraction
0.05 0.05 0.04
0.05
0.04
0.05
0.005 0.005 of solid material is constrained at 25%.
0.03 0.03
0 0
0.15 0.15
Figure 7 Convergence History Where F1 and F2 are factors and when F1 is equal
to zero, the optimisation becomes pure VD
minimisation problem and when F2 is zero it
becomes TC minimisation problem.
(0, 1) - 7.9642e-8