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Ingot_Christallisation
Ingot_Christallisation
Manufacturing process
from Poly Silicium to Wafer
Confidential
for internal use only
Video: 1.1_Solarmaus30052004.wmv
© centrotherm SiTec GmbH Thema der Präsentation | Unterkapitel | Referent | File: ctsitec_0906.pot 2
Ingot & Wafer Line
Process Flow Overview (multi/mono-like)
Turnkey Solution
Ingot
Squaring
Brick
Gluing
Crucible
Crucible Brick
Crucible
Charging
Charging Grinding
Charging
Wire
Sawing
Brick
Crystallization
Inspection
Wafer
Cleaning
Brick
Cropping
Final Wafer
Inspection
Recycling
© centrotherm SiTec GmbH Thema der Präsentation | Unterkapitel | Referent | File: ctsitec_0906.pot Version: 4.1 3
2. Ingot & Wafer Production Process
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3.1 Graphite support crucible,
crucible & coating layer
crucible is centered on
graphite support plate
© centrotherm SiTec GmbH Thema der Präsentation | Unterkapitel | Referent | File: ctsitec_0906.pot 5
3.1 Crucible Gen5 & Gen6
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3.1 Charging of crucible
There are several methods to charge a crucible. Normally you aim for
a high fill factor using different types of silicon:
Polysilicon of different size distributions (chips, chunks, rods)
Self recycling silicon (bottom and side-plates of multi-ingots as well
as out of spec bricks
Add dopant (depending also on amount of recycling silicon)
© centrotherm SiTec GmbH Thema der Präsentation | Unterkapitel | Referent | File: ctsitec_0906.pot 7
3.2 Crystallization phase and
directional crystallization
1 2 3 4 5
liquid silicon liquid silicon
© centrotherm SiTec GmbH Thema der Präsentation | Unterkapitel | Referent | File: ctsitec_0906.pot 8
4.1 Squaring
© centrotherm SiTec GmbH Thema der Präsentation | Unterkapitel | Referent | File: ctsitec_0906.pot 9