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Tendencias GIS
Tendencias GIS
http : //www.cigre.org
SUMMARY
The gas-insulated switchgear (GIS) technology has constantly been improved in the past years
regarding compactness, SF6 volume, cost and accessibility. Between the first introduction in
the late 1960s and today for example the SF6 mass of a 145 kV standard double busbar GIS
bay was reduced by 85%, the bay volume by almost 90% and the drive energy by more than
50%.
Besides these achievements described above, improvements in terms of accessibility,
monitoring, flexibility and gas tightness have been made.
Further improvements can be achieved but come along with restrictions given by physical
limitations or causing higher manufacturing cost. An example is the use of alternative gases
like dry air or CO2 to replace SF6 within the GIS which is possible already today. Also the use
of vacuum interrupters limits todays current interrupting and carrying capabilities.
A complete substitution of SF6 will most probably not be in form of a single gas but rather a
mixture of different gases. The paper shows results of laboratory tests from the dielectric and
temperature rise point of view. The results of the investigations of alternative gases look
promising and there is a chance that further investigations lead to a possible substitution of
SF6 as insulating gas within high voltage switchgear.
KEYWORDS
Gas Insulated Switchgear, GIS, Alternative Gases, CO2, SF6, Dielectric Withstand, Temperature Rise,
Latest Technology, GIS Evolution.
david.gautschi@alstom.com
1. INTRODUCTION
Since the introduction of gas-insulated high voltage switchgear (GIS) on the market in the late 1960s
the development of this technology has shown a constant evolution. Not only the size of the
switchgear and the drive energy of circuit-breakers have constantly decreased due to the introduction
of new technologies [1, 2], but also the current carrying capability of the circuit-breakers,
disconnectors and make-proof earthing switches has dramatically increased. In the last years a trend in
the direction towards eco-design is visible [3]. The volume and the leakage rate of SF6 have been
consequently reduced and the focus was set to use a high proportion of recyclable material and to
reduce the joule losses of the components. This paper presents the evolution of GIS in the past, the
actual stage and possible future evolutions especially the use of alternative gases.
The Figure 1 show the evolution of key parameters of 145 kV GIS of different generations from the
same manufacturer. The dotted blue line shows an exponential trend line for three-phase encapsulated
GIS, the dashed red line the exponential trend line for single-phase encapsulated GIS. The compared
bay layout contains two busbar disconnectors/earthing switches, a circuit breaker, a current and
voltage transformer, a line disconnector/earthing switch, a make-proof earthing switch and cable
sealing ends.
Bay weight in t
Bay volume in m
2
the bay volume has decreased dramatically since the introduction of GIS technology in the 1960s. In
Figure 1a) this evolution is illustrated for three-phase and single-phase 145 kV GIS with the same
ratings. It is visible that the introduction of three-phase arrangements made it possible to further
reduce the volume of the bays. Even if the physics behind the switchgear remains the same, the
introduction of new simulation tools, improvements in manufacturing processes and the design closer
to the physical limits has made this evolution possible and will probably lead to further improvements
in the future.
3
Circuit breaker with spring drive
Voltage
Local control transformer
cubicle
Make-proof
2.5 m earthing switch
Combined
busbar
Integrated cable
disconnector
& earthing interface
switch
Current transformer
3.75 m
Figure 2: State of the art ultra-compact three-phase encapsulated double busbar 145 kV GIS bay
Enclosure flanges
Barrier insulator
Figure 3: Barrier insulator fixed between two flanges without the need of additional fixation rings
4
3.3 MEASURES TO OVERCOME TEMPERATURE RISE LIMITATIONS
The reduction of the size leads to a reduction of the surface of the switchgear. The surface is a key
factor of the behavior of the temperature rise at nominal current. In addition the lower SF6 pressure
compared to the previous generation leads to an inferior temperature rise between the high voltage
conductors and the enclosure. The heat dissipation ability was therefore one of the critical subjects.
The behavior was simulated with sophisticated tools already from the beginning of the design of the
components. To improve the thermal performance and to pass the test within the IEC limits different
measures were taken:
• On critical components the enclosure surface was enlarged by cooling fins in order to increase
the convection on the enclosure.
• The high voltage conductors were designed with an enlarged surface and a high emission
coefficient in order to increase the radiation of heat towards the enclosure
• On critical parts the high voltage conductors were made with slots and holes in order to
increase the convection around the live parts of the switchgear.
Table I: Comparison of advantages and drawbacks of different enclosure and conductor arrangements
Effect on Effect
Arrangement Advantages Disadvantages
SF6 volume on cost
small bay width, simple
bigger diameter of the
enclosures, simple
+ +++ enclosure than for
conductors, easy
triangle arrangements
direction changes
accessibility, 2 phase
+++ + arrangements possible, bay width, use of material
complex layouts possible
reduction of the bay complex housings,
+++ + width regarding to single accessibility to
phase enclosure design components
5
4.2 LABORATORY INVESTIGATIONS OF ALTERNATIVE GASES FOR GIS-APPLICATION
Due to the high global warming potential of SF6, manufacturers and universities are searching for a
replacement since decades. Possible alternative gases have already been found but they come along
with other restrictions like highly toxic decomposition products (ex. CF3I), still too high global
warming potential (ex. PFC) or limitations in the operating temperature of the switchgear to a non-
convenient point [4, 5, 6]. For GIL and low temperature applications below -25°C mixtures of SF6 and
N2with the ratio of 20%/80% have been successfully installed and operate since decades [7].
A number of investigations were made with dry air or components which are part of air (N2, O2, CO2,
Ar etc) or mixtures between SF6 and these components [8, 9, 10]. Different manufacturers have
already launched products based on dry air and CO2 for the lower high voltage range up to 145 kV.
Most of these products are based on vacuum interrupting chambers with limited rated current
compared with SF6 equivalents. In the past years new investigations have been made by the use of
modern approaches like chemical molecule analysis or the pulsed townsend method [10].
In the following sections the performance of dry air and artificial mixtures of different gases in
comparison to SF6 are presented. The investigations were made in the manufacturer’s laboratory.
a) b)
AC breakdown voltage in kV
LI breakdown voltage in kV
Figure 4: Breakdown voltage versus pressure for dry air within a 145 kV GIS disconnector (blue
dotted curve) a) AC and b) negative lightning impulse withstand voltage. In red the IEC
test voltages for 72.5 kV equipment.
As shown in Figure 4 the use of dry air instead of SF6 in the same pressure vessel leads to much lower
dielectric performance. More or less the same results can be assumed if CO2 is used and a slightly
lower performance is anticipated for pure N2 [8, 9, 11].
Even if the dielectric performance of the above mentioned gases is divided by more than two
compared with SF6, multiple manufacturers have already introduced SF6-free systems based on these
gases, leading to systems which are more expensive and/or use more space than the SF6 equivalents.
In order to reach the compactness SF6 GIS have today, the manufacturers therefore search for other
gases. The latest research in terms of alternative gases leads to a mix of different gases. The mixing
ratio of the gases can be changed and the pressure concept adapted in order to reach the dielectric
performance as the SF6 counterpart. Examples are the mixtures of N2/CF3I or C6K/air. Unfortunately
the results were not satisfying as shown in the Table II.
6
Table II: Comparison of the dielectric performance for mixtures CF3I/N2 (data from [6])
Case 1 Case 2
Total pressure [MPa] 0.5 0.5
Ratio CF3I/N2 [%/%] 20/80 60/40
CF3I pressure [MPa] 0.1 0.3
Equivalent SF6 dielectric
64 100
withstand (%)
Minimum operating
-22 +7
temperature [°C]
Minimum
Oversizing of
operating
Consequence the GIS / cost
temperature not
increase
acceptable
Other gas mixtures than those mentioned above show better dielectric performances. Tests with such
gas mixtures have been performed on a disconnector/earthing switch combined with a cable end box
of an existing GIS design. Results of such investigations are shown in Figure 5 where the mixtures 4
and 5 show a lower performance than SF6. The mixtures 1 to 3 show the same or even better dielectric
performance compared with SF6.
LI breakdown voltage in kV
mixtures
Figure 5: Breakdown voltage U*50 and standard deviation for negative lightning impulse for
different gas mixtures within a 145 kV line disconnector/earthing switch housing with
cable end box. In red the corresponding IEC limits for 145 kV ratings.
An increase of the pressure is resulting in a decrease in temperature rise. This is shown in Figure 7
where the results of the same equipment filled with dry air but for two different pressures 0.2 MPag
and 0.4 MPag are presented. The difference between the curves of the same phases is in the range
between 5 and 10 K for the pressure difference of 0.2 MPa.
7
Temperature rise in K
Thermocouple location
Figure 6: Temperature rise results of a fully equipped 145 kV GIS bay at 2500 A filled with
0.4 MPag dry air (dashed lines) versus 0.55 MPag SF6.
Temperature rise in K
Thermocouple location
Figure 7: Temperature rise results of a fully equipped 145 kV GIS bay at 2000 A filled with
0.2 MPag (dashed lines) versus 0.4 MPag dry air.
Due to the dielectric restrictions described in chapter 4.2.1 other gases than dry air are under
investigation. Figure 8 shows results of the temperature rise tests of different gas mixtures on a 145 kV
GIS busbar disconnector of the latest generation. The difference in temperature rise of the hottest
phase compared to SF6 is plotted. The temperature difference of around 6 K can be compensated by
measures described in chapter 3.3. From the temperature rise performance an application of all of the
three gases shown in Figure 8 is therefore possible.
8
Temperature difference in K
Thermocouple location
5. CONCLUSIONS
The GIS technology has been improved in the past years regarding compactness, SF6 mass and cost.
Further improvements can be achieved in one or the other direction but come along with other
restrictions given by physical limitations or manufacturing cost.
The use of alternative gases to replace SF6 within the GIS is technically possible already today.
In this paper the focus of alternative gases was set to dielectric properties and temperature rise
behaviour. The latest research on gas mixtures show that SF6 replacing candidates can be evaluated.
To launch a SF6-free product a number of further parameters have to be taken into account. Further
investigations are required in the field of switching and interrupting performance and the evaluation of
decomposition products.
Therefore the application of alternative gases looks promising and there is a chance that further
investigations lead to a possible substitution of SF6 as insulating gas within high voltage switchgear.
BIBLIOGRAPHY