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AOZ1284PI Support Documents
AOZ1284PI Support Documents
AOZ1284PI Support Documents
Applications
Point-of-load DC/DC conversion
Set top boxes and cable modems
Automotive applications
DVD drives and HDDs
LCD Monitors & TVs
Telecom/Networking/Datacom equipment
Typical Application
VIN up to 36V
CSS
CIN
VIN SS BS
L1 VOUT
FSW LX
22µH
RF R1
AOZ1284
EN FB CO
COMP GND R2
CC
RC
Ordering Information
Part Number Ambient Temperature Range Package Environmental
AOZ1284PI -40 °C to +85 °C EPAD SO-8 Green Product
AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.
Please visit www.aosmd.com/media/AOSGreenPolicy.pdf for additional information.
Pin Configuration
LX 1 8 EN
BST 2 Exposed 7 SS
PAD
GND 3 VIN 6 FB
FSW 4 5 COMP
Pin Description
Pin Number Pin Name Pin Function
1 LX PWM Output. Connect to inductor.
2 BST Bootstrap Voltage Input. Driver supply for High-side NMOS. Connected to 100nF
capacitor between BST and LX.
3 GND Ground.
4 FSW Frequency Bias. Connect to resistor to determine switching frequency.
5 COMP Compensation. Connect to resistor and capacitor for system stability.
6 FB Feedback Input. It is regulated to 0.8V. The FB pin is used to determine the PWM output
voltage via a resistor divider between the output and GND.
7 SS Soft Start.
8 EN Enable.
Exposed Pad VIN Supply Voltage Input.
Electrical Characteristics
TA = 25 °C, VIN = 12V, VEN = 3V, VOUT = 3.3V, unless otherwise specified. Specifications in BOLD indicate a temperature range of
-40°C to +85°C. These specifications are guaranteed by design.
Block Diagram
FSW VIN
Regulator
Ramp
Generator OC
SS
CLK
OSC Driver
FB
PWM
Logic LX
0.8V
Error
Amplifier PWM
Comparator
COMP GND
IN Ripple IN Ripple
Voltage Voltage
(1V/div) (1V/div)
Inductor Inductor
Current Current
(1A/div) (5A/div)
LX LX
Voltage Voltage
(20V/div) (20V/div)
1µs/div 1µs/div
OUT LX
Voltage Voltage
(2V/div) (20V/div)
OUT
Voltage
(2V/div)
IN
Current Inductor
(1A/div) Current
(2A/div)
20ms/div 10ms/div
LX
Voltage
(20V/div)
OUT
OUT
Voltage
Voltage
(2V/div)
(0.5V/div)
Inductor
OUT
Current
Current
(2A/div)
(2A/div)
100µs/div 10ms/div
Efficiency Curves
90
Efficiency (%)
85
36V–5V
80
75
70
65
60
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Load Current (A)
90
Efficiency (%)
85
80 36V–3.3V
75
24V–3.3V
70
65
60
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Load Current (A)
Detailed Description
The AOZ1284 is a current-mode step down regulator less than the error voltage, the internal high-side switch
with integrated high side NMOS switch. It operates from is on. The inductor current flows from the input through
a 3V to 36V input voltage range and supplies up to 4A of the inductor to the output. When the current signal
load current. Features include enable control, Power-On exceeds the error voltage, the high-side switch is off. The
Reset, input under voltage lockout, external soft-start and inductor current is freewheeling through the Schottky
thermal shut down. diode to output.
The AOZ1284 has internal short circuit protection to if we let m equal the conversion ratio:
protect itself from catastrophic failure under output short VO
circuit conditions. The FB pin voltage is proportional to --------
- = m
the output voltage. Whenever FB pin voltage is below V IN
0.2V, the short circuit protection circuit is triggered.
The relationship between the input capacitor RMS
Power-On Reset (POR)
current and voltage conversion ratio is calculated and
A power-on reset circuit monitors the input voltage. When shown in Figure 2. It can be seen that when VO is half of
the input voltage exceeds 2.9V, the converter starts VIN, CIN is under the worst current stress. The worst
operation. When input voltage falls below 2.3V, the current stress on CIN is 0.5 x IO.
converter will stop switching.
0.5
Thermal Protection
An internal temperature sensor monitors the junction 0.4
temperature. It shuts down the internal control circuit and
high side NMOS if the junction temperature exceeds ICIN_RMS(m) 0.3
145ºC. The regulator will restart automatically under the IO
control of soft-start circuit when the junction temperature 0.2
decreases to 100ºC.
0.1
0
0 0.5 1
m
For reliable operation and best performance, the input The selected output capacitor must have a higher rated
capacitors must have current rating higher than ICIN-RMS voltage specification than the maximum desired output
at worst operating conditions. Ceramic capacitors are voltage including ripple. De-rating needs to be
preferred for input capacitors because of their low ESR considered for long term reliability.
and high ripple current rating. Depending on the
application circuits, other low ESR tantalum capacitor or Output ripple voltage specification is another important
aluminum electrolytic capacitor may also be used. When factor for selecting the output capacitor. In a buck
selecting ceramic capacitors, X5R or X7R type dielectric converter circuit, output ripple voltage is determined by
ceramic capacitors are preferred for their better inductor value, switching frequency, output capacitor
temperature and voltage characteristics. Note that the value and ESR. It can be calculated by the equation
ripple current rating from capacitor manufactures is below:
based on certain amount of life time. Further de-rating 1
may be necessary for practical design requirement. V O = I L ESR CO + -------------------------
8fC O
Inductor
The inductor is used to supply constant current to output where,
when it is driven by a switching voltage. For given input CO is output capacitor value, and
and output voltage, inductance and switching frequency
ESRCO is the equivalent series resistance of the output
together decide the inductor ripple current, which is:
capacitor.
VO VO
I L = ----------- 1 – --------
- When low ESR ceramic capacitor is used as output
fL V IN capacitor, the impedance of the capacitor at the switching
frequency dominates. Output ripple is mainly caused by
The peak inductor current is: capacitor value and inductor ripple current. The output
ripple voltage calculation can be simplified to:
I L
I Lpeak = I O + -------- 1
2 V O = I L -------------------------
8 f C
O
High inductance gives low inductor ripple current but
requires larger size inductor to avoid saturation. Low If the impedance of ESR at switching frequency
ripple current reduces inductor core losses. It also dominates, the output ripple voltage is mainly decided by
reduces RMS current through inductor and switches, capacitor ESR and inductor ripple current. The output
which results in less conduction loss. ripple voltage calculation can be further simplified to:
Surface mount inductors in different shape and styles are In a buck converter, output capacitor current is
available from Coilcraft, Elytone and Murata. Shielded continuous. The RMS current of output capacitor is
inductors are small and radiate less EMI noise. But they decided by the peak to peak inductor ripple current.
cost more than unshielded inductors. The choice It can be calculated by:
depends on EMI requirement, price and size. I L
I CO_RMS = ----------
Output Capacitor 12
The output capacitor is selected based on the DC output
voltage rating, output ripple voltage specification and Usually, the ripple current rating of the output capacitor is
ripple current rating. a smaller issue because of the low current stress. When
the buck inductor is selected to be very small and
inductor ripple current is high, output capacitor could be
overstressed.
Schottky Diode Selection In the AOZ1284, FB pin and COMP pin are the inverting
The external freewheeling diode supplies the current to input and the output of internal transconductance error
the inductor when the high side NMOS switch is off. To amplifier. A series R and C compensation network
reduce the losses due to the forward voltage drop and connected to COMP provides one pole and one zero.
recovery of diode, Schottky diode is recommended to The pole is:
use. The maximum reverse voltage rating of the chosen
Schottky diode should be greater than the maximum GEA
fP 2
input voltage, and the current rating should be greater 2 CC GVEA
than the maximum load current.
where;
Low Input operation
When VIN is lower than 4.5V, such as 3.0V, an external GEA is the error amplifier transconductance, which is
5V is required to add into the BST pin for proper 200·10-6 A/V;
operation. GVEA is the error amplifier voltage gain, which is 500 V/V
and
Loop Compensation CC is compensation capacitor.
The AOZ1284 employs peak current mode control for
easy use and fast transient response. Peak current mode The zero given by the external compensation network,
control eliminates the double pole effect of the output capacitor CC (C5 in Figure 1) and resistor RC (R1 in
L&C filter. It greatly simplifies the compensation loop Figure 1), is located at:
design.
1
fZ 2
With peak current mode control, the buck power stage 2 CC RC
can be simplified to be a one-pole and one-zero system
in frequency domain. The pole is dominant pole and can To design the compensation circuit, a target crossover
be calculated by: frequency fC for close loop must be selected. The system
crossover frequency is where control loop has unity gain.
1 The crossover frequency is also called the converter
fP 1
2 CO RL bandwidth. Generally a higher bandwidth means faster
response to load transient. However, the bandwidth
The zero is a ESR zero due to output capacitor and its should not be too high due to system stability concern.
ESR. It is can be calculated by: When designing the compensation loop, converter
stability under all line and load condition must be
1 considered.
fZ1
2 CO ESRCO
Usually, it is recommended to set the bandwidth to be
less than 1/10 of switching frequency.
where;
The strategy for choosing RC and CC is to set the cross
CO is the output filter capacitor; over frequency with RC and set the compensator zero
RL is load resistor value and with CC. Using selected crossover frequency, fC, to
ESRCO is the equivalent series resistance of output calculate RC:
capacitor.
VO 2 CO
The compensation design is actually to shape the RC fC
converter close loop transfer function to get desired gain VFB GEA GCS
and phase. Several different types of compensation
network can be used for AOZ1284. For most cases, a where;
series capacitor and resistor network connected to the
COMP pin sets the pole-zero and is adequate for a stable fC is desired crossover frequency;
high-bandwidth control loop. VFB is 0.8V;
GEA is the error amplifier transconductance, which is
200·10-6 A/V and
GCS is the current sense circuit transconductance, which
is 4.5 A/V.
Several layout tips are listed below for the best electric
Thermal Management and Layout and thermal performance.
Consideration
In the AOZ1284 buck regulator circuit, high pulsing 1. Do not use thermal relief connection to the VIN and
current flows through two circuit loops. The first loop the GND pin. Pour a maximized copper area to the
starts from the input capacitors, to the VIN pin, to the LX GND pin and the VIN pin to help thermal dissipation.
pins, to the filter inductor, to the output capacitor and 2. Input capacitor should be connected to the VIN pin
load, and then return to the input capacitor through and the GND pin as close as possible.
ground. Current flows in the first loop when the high side
switch is on. The second loop starts from inductor, to the 3. Make the current trace from LX pins to L to Co to the
output capacitors and load, to the GND pin of the GND as short as possible.
AOZ1284, to the LX pins of the AOZ1284. Current flows 4. Pour copper plane on all unused board area and
in the second loop when the low side diode is on. connect it to stable DC nodes, like VIN, GND or
VOUT.
In PCB layout, minimizing the two loops area reduces the
noise of this circuit and improves efficiency. A ground 5. Keep sensitive signal trace such as trace connected
plane is recommended to connect input capacitor, output with FB pin and COMP pin far away from the LX pins.
capacitor, and GND pin of the AOZ1284.
In the AOZ1284 buck regulator circuit, the three major VOUT GND VIN
power dissipating components are the AOZ1284,
external diode and output inductor. The total power
dissipation of converter circuit can be measured by input
power minus output power.
P total_loss = V IN I IN – V O V IN
BST SS
P inductor_loss = IO2 R inductor 1.1 2 7
VIN
FB
GND 3 6
The power dissipation of diode is: FSW COMP
4 5
VO
P diodeloss = I O F V 1 – --------- AOZ1284PI
V IN
Gauge plane
D0 0.2500
C
L1
E2 E3 E1 E
D1 L1'
Note 5
D
θ
7 (4x)
A2 A
B e
A1
Carrier Tape P1
D1
P2
T
E1
E2 E
B0
K0 D0
A0 P0 Feeding Direction
UNIT: mm
Package A0 B0 K0 D0 D1 E E1 E2 P0 P1 P2 T
SO-8 6.40 5.20 2.10 1.60 1.50 12.00 1.75 5.50 8.00 4.00 2.00 0.25
(12mm) ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10
Reel
W1
S
G
N
M K
V
R
H
W
UNIT: mm
Tape Size Reel Size M N W W1 H K S G R V
12mm ø330 ø330.00 ø97.00 13.00 17.40 ø13.00 10.60 2.00 — — —
±0.50 ±0.10 ±0.30 ±1.00 +0.50/-0.20 ±0.50
Part Marking
AOZ1284PI
(SO-8)
Z1284PI
Part Number Code
FAYWLT
LEGAL DISCLAIMER
Applications or uses as critical components in life support devices or systems are not authorized. AOS does not
assume any liability arising out of such applications or uses of its products. AOS reserves the right to make
changes to product specifications without notice. It is the responsibility of the customer to evaluate suitability of the
product for their intended application. Customer shall comply with applicable legal requirements, including all
applicable export control rules, regulations and limitations.
AOS' products are provided subject to AOS' terms and conditions of sale which are set forth at:
http://www.aosmd.com/terms_and_conditions_of_sale
ALPHA AND OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.
As used herein:
1. Life support devices or systems are devices or 2. A critical component in any component of a life
systems which, (a) are intended for surgical implant into support, device, or system whose failure to perform can
the body or (b) support or sustain life, and (c) whose be reasonably expected to cause the failure of the life
failure to perform when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can be effectiveness.
reasonably expected to result in a significant injury of
the user.
L1
E2
E3
L1'
D1
q
D NOTE 5
7°
(4X
)
A2
A
B e
A1
5.74
E3 0.40REF 0.016REF
1.27 L 0.400 0.950 1.270 0.016 0.037 0.050
Y ----- ----- 0.100 ----- ----- 0.004
θ 0° 3° 8° 0° 3° 8°
|L1-L1'| ----- 0.040 0.120 ----- 0.002 0.005
0.80 L1 1.04REF 0.041REF
0.635
UNIT: mm
NOTE
1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH AND
GATE BURRS
2. DIMENSION L IS MEASURED IN GAGE PLANE
3. TOLERANCE 0.10 mm UNLESS OTHERWISE SPECIFIED
4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED
INCH DIMENSIONS ARE NOT NECESSARILY EXACT.
5. DIE PAD EXPOSURE SIZE IS ACCORDING TO LEAD FRAME
DESIGN.
6. FOLLOWED FROM JEDEC MS-012
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