Internal Use Only

Website:http://biz.LGservice.com
E-mail:http://www.LGEservice.com/techsup.html

COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : LM13E
MODEL: 24EA53V Q(24EA53VQ-*A)
( ) **Same model for Service

CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
 CONTENTS
SPECIFICATIONS ................................................... 2
PRECAUTIONS ....................................................... 4
TIMING CHART ....................................................... 8
DISASSEMBLY ....................................................... 9
BLOCK DIAGRAM ................................................. 11
DESCRIPTION OF BLOCK DIAGRAM...................12
ADJUSTMENT ...................................................... 14
TROUBLESHOOTING GUIDE .............................. 16
WIRING DIAGRAM ............................................... 19
EXPLODED VIEW...................................................20
REPLACEMENT PARTS LIST ...............................22
SCHEMATIC DIAGRAM ......................................... 26

SPECIFICATIONS
1. LCD CHARACTERISTICS 4. MAX. RESOLUTION
Type : TFT Color LCD Module Analog : 1920 x 1080 @60Hz
Active Display Area : 23.8 inch diagonal Digital : 1920 x 1080@60Hz
Pixel Pitch : 0.2745 mm x 0.2745 mm HDMI : 1920 x 1080@60Hz
Size : 543.0(H) x 317.4(V) x 11.2(D) mm (Typ.) 5. POWER SUPPLY
Color Depth : 16.7M colors(6-bit with A-FRC) 5-1. Power Adaptor(Built-in Power)
Electrical Interface : 2ch-LVDS Input : AC 100-240 V~, 50/60 Hz, 1.0A
Surface Treatment : Anti-Glare, Hard Coating(3H)
Operating Mode : Normally Black 5-2. Power Consumption
Backlight Unit : White LED
MODE H/V SYNC VIDEO POWER CONSUMPTION LED COLOR
less than 28 W(max)
2. OPTICAL CHARACTERISTICS POWER ON (NORMAL) ON/ON ACTIVE RED
2-1. Viewing Angle by Contrast Ratio >10 less than 24 W(typ)
Horizontal: Left:+85°, -85°(Typ) Right: +85°, -85°(Typ) STAND BY OFF/ON OFF less than 0.3 W RED
BLINKING
Vertical: Top:+75°, -85°(Typ) Bottom: +75°, -85°(Typ)
SUSPEND ON/OFF OFF less than 0.3 W RED
2-2. Luminance BLINKING
: 200(min),250(Typ)(Full white pattern,0.70V), DPMS OFF OFF/OFF OFF less than 0.3 W RED
BLINKING
WARM
:150（min)（Full whitepattern,0.70V),
POWER S/W OFF - - less than 0.3 W OFF
MEDIUM Super Energy Saving On/Off On Efficiency: RED
: 150(min)(Full white pattern,0.70V), up to30%
COOL 6. ENVIRONMENT
2-3. Contrast Ratio : 700(min), 1000(TYP) 6-1. Operating Temperature : 10°C~35°C (50°F~95°F)
DFC -> 5000 000 : 1(TYP) 6-2. Relative Humidity : 10%~80% (Non-condensing)
3. SIGNAL (Refer to the Timing Chart)
6-3. MTBF : 30,000 HRS with 90%
3-1. Sync Signal
Confidence level
• Type : Separate Sync, Digital Lamp Life : 30,000 Hours (Min)
3-2. Video Input Signal
7. DIMENSIONS (with TILT)
1) Type : R, G, B Analog
2) Voltage Level : 0~0.7 V
Width : 56.7 cm (22.32 '' )
3) Input Impedance : 75 Ω
Depth : 41.6 cm ( 16.37 ' ' )
Height : 18.1 cm ( 7.12 '')
3-3. Operating Frequency
Analog/Digital:
Horizontal : 30 ~ 83kHz 8. WEIGHT (with TILT/SWIVEL)
Vertical : 56 ~ 75Hz
Net. Weight : 3.3 kg (7.26 lbs)
HDMI: Gross Weight : 4.9 kg (10.78 lbs)
Horizontal : 30 ~ 83kHz
Vertical : 56 ~ 61Hz

Copyright 2010 LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
 PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT. WARNING
• There are some special components used in LCD BE CAREFUL ELECTRIC SHOCK !
monitor that are important for safety. These parts are
• If you want to replace with the new backlight (CCFL) or
marked on the schematic diagram and the
inverter circuit, must disconnect the AC adapter
replacement parts list. It is essential that these critical
because high voltage appears at inverter circuit about
parts should be replaced with the manufacturer’s
650Vrms.
specified parts to prevent electric shock, fire or other
hazard.
• Handle with care wires or connectors of the inverter
• Do not modify original design without obtaining written circuit. If the wires are pressed cause short and may
permission from manufacturer or you will void the burn or take fire.
original parts and labor guarantee.
Leakage Current Hot Check Circuit

AC Volt-meter
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners. Good Earth Ground
such as WATER PIPE,
• Do not press on the panel, edge of the frame strongly CONDUIT etc.
To Instrument's
or electric shock as this will result in damage to the exposed
screen. METALLIC PARTS

• Do not scratch or press on the panel with any sharp

objects, such as pencil or pen as this may result in 1.5 Kohm/10W
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)

CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.

Copyright 2010 LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
 SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cotton-
tipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
Copyright 2010 LG Electronics. Inc. All right reserved.
-4-
Only for training and service purposes
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "anti-
static" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)
LGE Internal Use Only
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Copyright 2010 LG Electronics. Inc. All right reserved.
-5-
Only for training and service purposes
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
LGE Internal Use Only
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
Copyright 2010 LG Electronics. Inc. All right reserved.
-6-
Only for training and service purposes
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.
LGE Internal Use Only
 TIMING CHART

Video

B
C
Sync

D E F
A

DOT Frequency Total Front Back

CLASSIF Polar CLOCK [kHz]/ Period Display Porch Sync. Porch Resolut
MODE ICATION ity [MHz] [Hz] (A) (D) (C) (B) ion
(E)
H(Pixels) - 31.468 900 720 18 108 54 720 X
1 28.321
V(Lines) + 70.08 449 400 12 2 35 400

H(Pixels) - 31.469 800 640 16 96 48 640 x

2 25.175
V(Lines) - 59.94 525 480 10 2 33 480

H(Pixels) - 37.5 840 640 16 64 120 640 x

3 31.5
V(Lines) - 75 500 480 1 3 16 480

H(Pixels) + 37.879 1056 800 40 128 88 800 x

4 40.0
V(Lines) + 60.317 628 600 1 4 23 600

H(Pixels) + 46.875 1056 800 16 80 160 800 x

5 49.5
V(Lines) + 75.0 625 600 1 3 21 600
H(Pixels) - 48.363 1344 1024 24 136 160 1024 x
6 65.0
V(Lines) - 60.0 806 768 3 6 29 768

H(Pixels) + 60.023 1312 1024 16 96 176 1024 x

7 78.75
V(Lines) + 75.029 800 768 1 3 28 768
H(Pixels) + 108.0 67.500 1600 1152 64 128 256 1152 x
8
V(Lines) + 75.000 900 864 1 3 32 864

H(Pixels) + 63.981 1688 1280 48 112 248 1280 x

9 108.0
V(Lines) + 60.02 1066 1024 1 3 38 1024

H(Pixels) + 79.976 1688 1280 16 144 248 1280 x

10 135.0
V(Lines) + 75.035 1066 1024 1 3 38 1024

H(Pixels) - 65.290 2240 1680 104 176 280 1680 x

11 146.25
V(Lines) + 59.954 1089 1050 3 6 30 1050

H(Pixels) + 67.50 2200 1920 88 44 148 1920 x

12 148.50
V(Lines) + 60 1125 1080 4 5 36 1080

Copyright 2010 LG Electronics. Inc. All right reserved.

-7- LGE Internal Use Only
Only for training and service purposes
 DISASSEMBLY-Set
#1 Place the monitor face Down on the cushion or soft cloth.

#2

Remove the stand body and atand base from the product.

#3

1. Pull the front cover upward.

2. Then, let the all latches are separated.
3. Put the front face down.

#4

Disassemble back cover.

Copyright 2010 LG Electronics. Inc. All right reserved. --

LGE Internal Use Only
Only for training and service purposes
 LED PANEL 19V
F/B
From Adapter
(Plus 13 F.HD)
V_LED

Only for training and service purposes

LED B/L

LVDS
19-to-5V DC/DC
24C02
DVI IIC 5V-to-3.3V LDO

Copyright 2010 LG Electronics. Inc. All right reserved.

Embedded
DVI_TMDS LED Driver T-Con 5V
DVI-D Block
24C02 System 3.3V
HDMI IIC

-9-
NT68772
(Novatek)
HDMI_TMDS 5V-to1.2V LDO
HDMI
RGB IIC
BLOCK DIAGRAM

Core 1.2V
R/G/B/H/V

RGB SPI
Data/ LED
CLK (RED)
HP
Key IIC
L/R out
4M SERIAL
Flash

H/P
6 Keys : Power/MENU/SES/
FUNC/AUTO/INPUT(Exit)

LGE Internal Use Only

 DESCRIPTION OF BLOCK DIAGRAM

1. Video Controller Part.

This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the
digital video signal using a pixel clock.
The pixel clock for each mode is generated by the PLL.
The range of the pixel clock is from 28MHz to 148MHz in 24EA53V case
This part consists of the Scaler, ADC convertor, TMDS receiver and LVDS transmitter.
The Scaler gets the video signal converted analog to digital, interpolates input to 1920 X
1080 resolution signal and outputs 8-bit R, G, B signal to transmitter.

2. Power Part.
This part consists of one regulator convert power from 19V to 5V.19V is provided by adapter.
5V is provided for LCD panel .
Also, 5V is converted 3.3V by regulator.Converted Power is provided for IC in the main board.
Boost converter of LED block converters 19V to 47.3V and operates back-light LED strings of module in
24EA53V case.

3. MICOM Part.
This part is include video controller part. And this part consists of Flash IC which stores control data and the Micom.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.
The controlled data of each modes is stored in.

Copyright 2010 LG Electronics. Inc. All right reserved.

- 10 - LGE Internal Use Only
Only for training and service purposes
 LPB Board Block Diagram

30~60V

20V
50 ~ 60Hz LED
drive
HVDC KHz 5V block
EMI INPUT RECTIFIER ENERGY OUTPUT RECTIFIER
COMPONENTS AND FILTER TRANSFER AND FILTER
LINE GND
100 ~ 240V

PHOTO- SIGNAL
PWM
COUPLER Collection
CONTROL
CIRCUIT ISOLATION ,21

PRIMARY SECONDARY

Operation description_Power
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.

2. Input rectifier and filter.

This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.

3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.

4. Output rectifier and filter.

This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to
adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and
also the over power protection is also monitor by this part.

5. Photo-Coupler isolation.
This part function is to feed back the DC output changing status through a photo transistor to primary controller to
achieve the stabilized DC output voltage.

6. Signal collection.
This part function is to collect the any change from the DC output and feed back to the primary through photo
transistor.

7. LED driver block

This part function is to drive LED Back light.

Copyright 2010 LG Electronics. Inc. All right reserved.

 LGE Internal Use Only
Only for training and service purposes
 ADJUSTMENT
Windows EDID V1.0 User Manual 2. EDID Read & Write
1) Run WinEDID.exe
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Doesn’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available for LCD Monitor only.

1. Port Setup
a) Copy “UserPort.sys” file to
“c:\WINNT\system32\drivers” folder
b) Run Userport.exe

2) Edit Week of Manufacture, Year of Manufacture,

Serial Number
a) Input User Info Data
b) Click “Update” button
c) Click “ Write” button

c) Remove all default number

d) Add 300-3FF

e) Click Start button.

f) Click Exit button.

Copyright 2010 LG Electronics. Inc. All right reserved.

- 12 - LGE Internal Use Only
Only for training and service purposes
 SERVICE OSD
1) Turn off the power switch at the right side of the display.

2) Wait for about 5 seconds and press MENU, POWER switch for 1 second interval.

3) The SVC OSD menu contains additional menus that the User OSD menu as described below.

a) CLEAR ETI : To initialize using time.

c) Auto Color : W/B balance and Automatically sets the gain and offset value.
(press key for over 3 sec)
d) AGING : Select Aging mode(on/off).
b) Module : To select applied module.
d) NVRAM INIT : EEPROM initialize.(24C16, press key for over 3 sec)
e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.
f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.
g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only)
h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)

IBM 9 6
Video Signal 5 1
Compatible PC 15 11
Generator 10 6
5 1
C
PARALLEL PORT
d

13 1
se
tu

25 14
2C
No

23

OFF ON
RS

5V
F
EL
Control Line

C
LL
RA
PA

Power inlet (required) 5V

4.7K
220

VG
Power Select Switch ON 4.7K
R

5V
WE

S
(110V/220V) E
PO

74LS06
A MO Power LED
T

4.7K
CS

NI OFF
TO
YN

R
V-S

74LS06

E ST Switch
B
B
F V-Sync On/Off Switch
(Switch must be ON.)

Figure 1. Cable Connection

Copyright 2010 LG Electronics. Inc. All right reserved.

- 13 - LGE Internal Use Only
Only for training and service purposes
 TROUBLESHOOTING GUIDE
1. NO POWER

NO POWER
(POWER INDICATOR OFF)

IS ADAPTER NO
1 VOLTAGE 19V? CHECK Adapter

YES

2 NO
IS IC102 PIN 3(5V)? CHECK IC102(5V)
3
1

YES

"IS IC 100 PIN1 (3.3V), NO CHECK IC 100 PIN1(3.3),PIN

PIN3 (1.2V)?" PIN3(1.2V)

YES

Check IC101 PIN 42,43 NO

4
1 CHECK CRYSTAL(X100)
PULSE

YES

CHECK IC101

Waveforms
1 JK100#1 2 IC102#3 3 IC102#1 4 IC104#42,43

1.2V

Copyright 2010 LG Electronics. Inc. All right reserved.

- 14 - LGE Internal Use Only
Only for training and service purposes
 2. NO RASTER (OSD IS NOT DISPLAYED) - MAIN

NO RASTER
(OSD IS NOT DISPLAYED)

1.CHECK IC101 PIN 42,43

CHECK IC101PIN 42,43 NO SOLDRING CONDITION
1
PULSE 2.CHECK IC101
3.TROUBLE IN IC101

YES

CHECK IC101 PIN 35,36 PULSE NO CHECK CONNECTION LINE

FROM D-SUB TO IC101

YES

TROUBLE IN CABLE
OR LCD MODULE

Copyright 2010 LG Electronics. Inc. All right reserved. -15- LGE Internal Use Only
Only for training and service purposes
 3. TROUBLE IN DPM

TROUBLE IN DPM

CHECK P300 PIN13 NO CHECK PC

H sync， PIN 14 V sync? PC IS GOING
INTO DPM MODE

YES

1 CHECK IC101 PIN 35 NO

HSYNC, PIN36 VSYNC CHECK H/V SYNC LINE
2

YES

TROUBLE IN IC101

Waveforms
1 H-SYNC 2 V-SYNC

Copyright 2010 LG Electronics. Inc. All right reserved. -16- LGE Internal Use Only
Only for training and service purposes
 WIRING DIAGRAM

EAD62122555
EAD62186002

MAIN BOARD

6631900011S
EAD38438703

Copyright 2010 LG Electronics. Inc. All right reserved.

- 17 - LGE Internal Use Only
Only for training and service purposes
300 400

510

520

410
200

or

900

540
 PCB P/N: EAX65148301_1.1 (LM13E) LED DRIVE FB LED DRIVE CH

FB4

FB3

FB2

FB1
L103 D107
33UH BR210

Date : 2012.10.25
5VS 19V_LED
100V C151

R188
100K
1uF

1/16W
50V

R183
150K
C154

1%
33uF
7
100V

R153
D
C152

R189
100K
FB1

1K
R165 Q106 1uF JP129
6

READY
10 AOD478 50V

R187
10K
1/16W
Q101 D Q102 D Q103 D Q104 D G
DRV

R158
1/16W

1/16W

READY 1/16W
R156

R157

R184
150K
1/16W
S FB2

1M

1%
R155
G G G G JP130 5

1M

1%

1M

1%

R185 1%
1M

1%
Ready

R160
1.2VS

47K

1/10W
Ready
S S D106
2N7002K S 2N7002K S

R152
4.7K

300K
C143 2N7002K 2N7002K 4
1uF BAT54 30V
JP128

READY
10V

C148
0.1uF
C119 C121 C123 3

16V
0.1uF 0.1uF 0.1uF
16V 16V 16V R161
200 FB3 JP131 2
SENP
3.3VS

VDT2

VFB1

VDT1
FB4

VFB4

VFB3

VDT3

VFB2

R159
JP132 1

VDT4

100

R164

R166
R167
R168
R169
R172

R175

R178
R179
R180
1

1
1
1
1
1

1
1
1
C117 C118 C120 C122 C124 C125 C126 C127 C129
C116 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF
0.1uF 16V 16V 16V 16V 16V 16V 0.1uF 0.1uF 12507WR-06L
16V 16V 16V

KEY_SCL/KEY0_ADC

KEY_SDA/KEY1_ADC
16V P102

GND

LED_INDICATOR
OVP

HDMI_DET

DVI_DET
FB

READY
R186
10K
Check!! Control wafer,LED Color 5VS

VFB4

VDT4

VFB3

VDT3

VFB2

VDT2

VFB1

VDT1

SENP

DRV
GND
HDMI model only

FB
5VS 3.3VS 3.3VS

R130

R132

R136
R128
1.2VS

56

56
R138 Close to Scaler

56

56
EA53,43
P100 EA63
1K
SMAW200-06 R106 R109 OVP
0

PB2/INTE1/ADC2

PE1/LPDIN0/VSO
L100 0 C140 S/W Control

PA2/ADC6/CEC0

DVDD/LED_3.3V
JP104 BLM18PG121SN1D 1uF C144

R154
8.2K
R150

1%
PC4/IR1/PWMC
1 1K 10V 100pF

MVDD_3.3V_2

CVDD_1.2V_2
5VS 5VS 50V
1/16W
JP100 5%

1/10W

1/10W

1/10W

1/10W
2

R143

R145

R147

R149
5.1

5.1

5.1

5.1
R194

PB3/ADC3
PE2/PWMC

5%

5%

5%

5%
R105 10

P30/RXD
P31/TXD
R104
C105 4.7K R114
3 0.1uF
4.7K
4.7K

5.6V
EA53,43 10V D108

ISEN4

VDET4
ISEN3

VDET3
ISEN2

VDET2
ISEN1

VDET1
16V READY 4.7uF
JP103 MMBT3904-(F)

[EP]

DGND

VFB4

VFB3

VFB2

VFB1

SENP
SENN
COMP

5VCC
EA53,43 C142 CDS3C05HDMI1
4 Q100

PC2

OVP

DRV
C R112

FB
B 10K 3.3VS
JP101 C110 LED_INDICATOR 1.2VS
5
ADUC 20S 02 010L

KEY_SCL/KEY0_ADC
ADUC 20S 02 010L

ADUC 20S 02 010L

ADUC 20S 02 010L

0.1uF
R110
JP102 16V E
6 READY 4.7K JP133

128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
KEY_SDA/KEY1_ADC READY D105
20V

20V

20V

20V

C106
68pF
C108
68pF
50V
HDMI_HPD
PA4/INTE2 1 96 BOOT BAT54

30V
LVDS OUT
50V
EA63 EA63 R120 PA7/SDA3/TXD3 2 95 LVDS_3.3V C145
HDMI_SDA THERMAL 1uF
56 31
Multi Option for EA53,43 HDMI model only PA6/SCL3/RXD3 3 94 T0M 10V
READY

129
VA100

VA103

VA101

VA102
READY

READY

READY

Y0M-B Y0M-B JP123

R119 30
EA53,43 EA53,43 HDMI_SCL
56
TVCC 4 93 T0P Y0P-B
C106-*1 C108-*1 Y0P-B JP107 29
0.1uF 0.1uF HDMI model only
16V 16V
RX1C- 5 92 T1M Y1M-B JP108 28
HDMI_RXC- Y1M-B
Y1P-B
RX1C+ 6 91 T1P JP109 27
HDMI_RXC+ Y1P-B Y2M-B JP110 26
RX10- 7 90 T2M Y2P-B
HDMI_RX0- Y2M-B JP111 25
RX10+ 8 89 T2P 24
HDMI_RX0+ Y2P-B
CLKOUTM-B
RX11- 9 88 TCLK1M JP112 23
HDMI_RX1- CLKOUTM-B CLKOUTP-B JP113 22
RX11+ 10 87 TCLK1P Y3M-B
Multi Option for APW7313(DC/DC) HDMI_RX1+ CLKOUTP-B JP114 21

APW7313
L102-*1 R103-*1
HDMI_RX2-
RX12-
RX12+
11
12
IC100 86 T3M
T3P
Y3M-B
Y3P-B
Y0M-A
JP115

JP116
20

19
IC102-*1
APW7313KAITRG[EP]GND
C111-*1
0.01uF
C115-*1
0.1uF
10uH 100
HDMI_RX2+ 85 Y3P-B Y0P-A JP117 18
BS SS 25V 16V PA0/ADC4 T4M
1 8
APW7313 APW7313 APW7313 1/10W
13
NT68773 84 Y0M-A
THERMAL

VIN EN
APW7313 17
9

2 7

LX COMP
PA1/ADC5 14 83 T4P Y1M-A JP118 16
3 6
R108-*1 C114-*1 R101-*1 R102-*1 Y0P-A
3300pF 68K Y1P-A
GND
4 5
FB
8.2K
50V
15K
PC3 15 82 T5M JP119 15
APW7313 APW7313 APW7313 APW7313 Y1M-A
14
PA5/INTE3 16 81 T5P Y2M-A
Y1P-A JP120 13

R121 PB7/SDA1/TXD1 17 80 T6M Y2P-A JP121 12

DVI_SDA Y2M-A
56 CLKOUTM-A
R122 PB6/SCL1/RXD1 18 79 T6P JP124 11
DVI_SCL Y2P-A CLKOUTP-A JP122
56 10
PE3/CEC1 19 78 TCLK2M Y3M-A JP125
CLKOUTM-A 9
R123
470 REXT 20 77 TCLK2P Y3P-A JP126
8
CLKOUTP-A
NEAR DC JACK 19V to 5V DC/DC DVIC-
1/16W
5% RX2C- 21 76 T7M
Y3M-A
7
6
JK100 RX2C+ 22 75 T7P
DS-262HB DVIC+ Y3P-A 5
SHIELD_1
RX20- 23 74 LVDS_GND/DGND 4
4 5VS
19V_LED DVI0-
RX20+ 24 73 SPI_CLK ZXMP3F30FHTA 3
3 FIX JP106 DVI0+ SPI_CLK Q107
RX21- SPI_SI 5VS 2
25 72 JP127

D
R107 DVI1- SPI_DI READY 1
SW 100K C153
2
RX21+ 26 71 SPI_SO R176 C147
C150
1uF R191
SPI_DO 1000pF

G
L101 DVI1+ 22K 1uF 10V 1K
VIN JP105
UBW2012-121F IC102 RX22- SPI_CE 10V 50V
1
27 70 10031HR-30
SN1208022 [EP]GND
DVI2- SPI_/CS

C149
RX22+ PE0/PWMA/DBC R177 P101

10V
1uF
C107C103
C158
DVI2+
28 69 WP_Flash
R162
1K
68uF4.7uF 4.7uF VBST SS 4.7K
35V 25V 25V
1 8
1.2VS
TGND 29 68 P34 READY
THERMAL

C
Close to IC TPS5433
VIN EN
ADC_3.3V/TVCC P35/LPD_OUT MODON
9

B Q105
TPS5433
2 7 C115 30 67 MMBT3904(NXP)
C109 8200pF R163
4.7uF
C170
0.1uF TPS5433 SW VREG5 25V ADC_1.2V 31 66 PC0/PWMB 4.7K E
3 6
25V 25V C111 MODON
0.1uF AGND 32 65 PC6/MUTE/PWMB R171
TPS5433

5VS
R108

16V GND VFB 4.7K

0

4 5
READY
TPS5433
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
L102
4.7uH

Large thermal PAD on bottom side

BIN+
BIN-
GIN+
GIN-
R133 56 C133 0.047uF RIN+

R134 100C134 0.047uFRIN-

HSYNCI
VSYNCI/TOUTP
R139 56PB5/SDA0/TXD0

R140 56PB4/SCL0/RXD0
PC5/IR2/PWMD
OSC_VDD
OSCO
OSCI
OSC_GND/DGND
PB0/INTE0/ADC0
PB1/ADC1
PA3/PWMD
NC
MVDD_3.3V_1
DVDD
RSTB
CVDD_1.2V_1
PC7/IR3/SPDIF
AUDIO_VDD
AUDIO_CEXT1
WD/AIN_R
I2S0/AIN_L
SCK/AOUT_R
MCLK/AOUT_L
AUDIO_VP
AUDIO_GND
C146
TPS5433 15pF
READY READY R101 50V C114
100K TPS5433 0.47uF
C159 C100 C101 C102 16V
10uF 10uF 10uF 10uF R103 TPS5433
R126 56C128 0.047uF

R127 100C130 0.047uF

R129 56C131 0.047uF

R131 100C132 0.047uF

0
10V 10V 10V 10V

TPS5433
R102
18K
1/10W
TPS5433 4M Serial Flash
3.3VS
5VS

HDMI model only

R135 56

R137 56

READY C139
1M 10uF
R141 56

10V
5VS R142 1.2VS HDMI model only

R195
4.7K

READY
IC101

R182
4.7K
C HDMI model only R170
W25X40CLSNIG

HDMI model only

R124 14.31818MHz B Q108 4.7K C157
4.7K X100 MMBT3904(NXP)
50V 50V HDMI model only 0.1uF
R125 CS VCC

R196
HEAD_LOUT
10V 16V

HEAD_ROUT
4.7K 3.3VS E SPI_/CS 1 8

20K
22pF 22pF
3.3VS C135 C136 4.7uF
2-Ch LDO R148
C160 R173
33 DO[IO1] HOLD R190 10K
D100 2 7
SPI_DO

C138
KDS184 10K
R174 R192

0.1uF
RED

33 WP CLK 33
BLUE

GREEN

IC103

16V
WP_Flash 3 6 SPI_CLK
5VS
DSUB_SCL

A1 10V
DSUB_SDA

DSUB_DET
HSYNC

VSYNC

APE8839AMP-C [EP]GND
Ready 4.7uF R193
C
WP_24C02

R181
4.7K
R144 C141 GND DI[IO0] 33
A2 C113 4 5
VOUT1 EN1 4.7uF SPI_DI
D101 10K HDMI model only
1 8 10V C156
Ready C137

KDS184
THERMAL

0.1uF

22pF
16V

20K
R146

VIN1 GND_1 50V

9

A1 2 7 READY
C
Ready

A2 VOUT2 GND_2
3 6
R100
6.8 VIN2 EN2 1.2VS
4 5
ADUC 5S 02 0R5L

2W

C155
VA104

READY
5.5V

1uF
10V Large thermal PAD on bottom side
READY

C112
4.7uF
10V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EA53/63 2012-10-25
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. SCALER 1 2
 JK202

ADUC 5S 02 0R5L

ADUC 5S 02 0R5L

ADUC 5S 02 0R5L
DSB47C-15BS1YN32
DVI INPUT
DSUB INPUT

5.5V

5.5V

5.5V

75
75

75
JK203

VA200

VA201

VA202
DVI42C_24HS1YN4A

R205
R203

R204
R221
10

6 RED_GND 17 9 1 DVI2-
GNDR
R222
GND_2 10
1 11
18 10 2
R223
DVI2+
RED 10
RED DVI1-
R224
GREEN_GND 19 11 3
10
7 JP204
GNDG
R225
DVI1+
DDC_DATA 10
2 12 DSUB_SDA 20 12 4 DVI0-
R226 DVI_HPD
GREEN 10
GREEN DVI0+
8 BLUE_GND 21 13 5 R227 D204

0.1uF
10
GNDB KDS184

C213
DVIC+ MMBD301LT1G

16V
H_SYNC JP202 R228 A2
D203 DVI_5V
3 13 HSYNC 22 14 6 10 C
BLUE DVIC- A1 5VS
BLUE JP203
9 NC 23 15 7 DVI_SCL
IC201

R233 4.7K

R234 4.7K
V_SYNC M24C02-RMN6T
DVI_SDA

1/16W
4 14 VSYNC 24 16 8

R235
10K
GND_1

5%
E0 VCC
3.3VS 1 8

READY

READY

READY

READY

READY
SYNC_GND R220 WP_24C02
10 E1 2 7 WC
JP205 10K
DDC_CLOCK DVI_DET
ADUC 20S 02 010L

ADUC 20S 02 010L

ADUC 20S 02 010L

ADUC 20S 02 010L

ADUC 20S 02 010L

20V

20V

20V

20V

20V
5 15 DSUB_SCL E2 SCL R231 33 DVI_SCL
DDC_GND 3 6
DSUB_DET DVI_HPD
R219 10K
VSS SDA R232 33 DVI_SDA

68pF

C207 68pF
4 5

C203 68pF

C205 68pF
3.3VS

C202 68pF

C204 68pF

VA208

VA209

VA210

VA211

VA213
ADUC 20S 02 010L

ADUC 20S 02 010L

ADUC 20S 02 010L

ADUC 20S 02 010L

ADUC 20S 02 010L

DVI_5V
20V

20V

20V

20V

20V
25 C208

C206
R215
16 10K 0.1uF

R209 4.7K
R210 4.7K
16V
SHILED
VA203

VA204

VA205

VA206

VA207

HDMI INPUT
3.3VS

HDMI model only

Ear-phone OUT
R200
3.3VS

READY
C209
10uF
10K

10V
HDMI model only
HDMI_DET L200
R208 JP206 JP207 BLM18PG121SN1D HEAD_LOUT
MMBT3904-(F)

HDMI model only 10K

R206 0 READY

ADUC 20S 02 010L

R229
SHIELD_PLATE

HDMI model only

C210

20V
HDMI model only 5.1

Ready
R237
R217 100uF 16V
R202 HDMI model only
C HDMI model only

10
SHIELD HDMI_5V 10K 1K
B R207 HDMI model only
20 HDMI_HPD
HDMI model only

VA214
10K

READY
R201 1K C215
E READY T_SPRING

C211
10uF
C200 0.01uF

10V
19
HPD 1/10W 0.1uF Q200 Ready
16V READY HDMI model only
18 HDMI model only R_SPRING
+5V_POWER L201
17 BLM18PG121SN1D HEAD_ROUT
DDC/CEC_GND
16
HDMI_SDA

Ready
HDMI model only
SDA JP201 HDMI model only R230
JP208

R236
ADUC 20S 02 010L
HDMI_SCL HDMI model only C212

20V
HDMI model only BAT54 30V 5.1

10
15 100uF 16V
SCL JP200 C201 D200 HDMI_5V E_SPRING HDMI model only HDMI model only
D201
14 JK201 R218
NC C214
HDMI model only

0.1uF HDMI model only BAT54 30V

HDMI model only

BAT54 PEJ024-06 1K
16V 5VS 0.01uF
HDMI model only

13
IC200 30V

VA212
CEC D202 HDMI model only HDMI model only Ready
12
HDMI_RXC- M24C02-RMN6T HDMI model only
CLK-
R213
4.7K

R214

4.7K

R216
4.7K

11
CLK_SHIELD E0 1 VCC
HDMI_RXC+ 8
10
CLK+
9
HDMI_RX0- E1 WC WP_24C02
DATA0- 2 7
8 HDMI model only
DATA0_SHIELD
HDMI_RX0+ E2 SCL R211 33 HDMI_SCL
7 3 6
DATA0+
6
HDMI_RX1-
DATA1- VSS SDA HDMI_SDA
4 5 R212 33
5
DATA1_SHIELD HDMI model only
4
HDMI_RX1+
DATA1+
3
HDMI_RX2-
DATA2-
2
DATA2_SHIELD
1
HDMI_RX2+
DATA2+

51V019S-35SN-CR2-B-LG
JK200
HDMI model only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EA53/63 2012-10-25
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Interface 2 2
 DECEMBER.2012
P/NO : MFL67715409 Printed in China