Dell EMC PowerEdge C6400_FSM

Dell EMC PowerEdge C6400
Field Service Manual
Regulatory Model: E43S Series

Regulatory Type: E43S001
Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
© 2017 - 2019 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other
trademarks may be trademarks of their respective owners.
2019 - 04
Rev. A03
Contents
1 Product overview........................................................................................................................................... 6
Target market..................................................................................................................................................................... 6
Product positioning............................................................................................................................................................ 6
Product features.................................................................................................................................................................7
Product comparison...........................................................................................................................................................7
Supported operating systems...........................................................................................................................................8
System information label................................................................................................................................................... 9
Sled service information.............................................................................................................................................. 9
Cable routing............................................................................................................................................................... 10
Mechanical overview.................................................................................................................................................. 11
Link board and Drive cage......................................................................................................................................... 12
Jumper settings.......................................................................................................................................................... 12
System tasks............................................................................................................................................................... 13
2 Field service information.............................................................................................................................. 14

Field service overview...................................................................................................................................................... 14
Chassis Overview............................................................................................................................................................. 14
Front view of the Dell EMC PowerEdge C6400 enclosure................................................................................... 15
Rear view of the enclosure with sleds..................................................................................................................... 16
Inside the enclosure....................................................................................................................................................16
System board diagnostic LED indicators................................................................................................................. 18
Safety precautions............................................................................................................................................................18
Standby power............................................................................................................................................................18
Bonding........................................................................................................................................................................ 18
Electrostatic discharge...............................................................................................................................................19
ESD field service kit...................................................................................................................................................20
ESD Wrist Strap tester...............................................................................................................................................21
Insulator elements...................................................................................................................................................... 22
Consider the working environment..........................................................................................................................22
ESD packaging........................................................................................................................................................... 22
Transporting sensitive components......................................................................................................................... 23
ESD protection summary.......................................................................................................................................... 23
Lifting equipment....................................................................................................................................................... 23
Recommended tools........................................................................................................................................................ 24
Need to know................................................................................................................................................................... 24
Critical callout............................................................................................................................................................. 25
Diagnostic indicators........................................................................................................................................................33
Drive indicator codes................................................................................................................................................. 33
Power supply unit indicator codes........................................................................................................................... 34
Power and system board indicator codes...............................................................................................................35
NIC indicator codes................................................................................................................................................... 35
Contents 3
System board diagnostic LED indicators.................................................................................................................36
Disassembly and reassembly.......................................................................................................................................... 36
Dell EMC PowerEdge C6420 sled........................................................................................................................... 36
Drives........................................................................................................................................................................... 41
Power supply units.....................................................................................................................................................45
System cover..............................................................................................................................................................47
Backplane cover.........................................................................................................................................................48
Cooling fans ...............................................................................................................................................................50
Power interposer board.............................................................................................................................................53
Chassis management board..................................................................................................................................... 56
Linking board.............................................................................................................................................................. 58
Midplane...................................................................................................................................................................... 61
Drive cage...................................................................................................................................................................65
Backplanes and expander board.............................................................................................................................. 69
Control panel...............................................................................................................................................................73
Thermal sensor board................................................................................................................................................ 76
Entering the system Service Tag by using System Setup...........................................................................................78
Installation......................................................................................................................................................................... 78
Rack rails..................................................................................................................................................................... 78
Accessing system information by using QRL.......................................................................................................... 81
3 Technology and components........................................................................................................................83

System fan........................................................................................................................................................................83
Linking board.................................................................................................................................................................... 84
Backplane..........................................................................................................................................................................84
SAS Expander board..................................................................................................................................................86
Backplane cable routing............................................................................................................................................ 87
Sled to hard drive mapping.......................................................................................................................................90
Expander zoning........................................................................................................................................................ 90
Power interposer board...................................................................................................................................................92
Midplane board.................................................................................................................................................................93
Chassis Management board........................................................................................................................................... 94
Communication failure with Chassis Manager (CM).............................................................................................96
Power supplies..................................................................................................................................................................97
Power supply efficiency.............................................................................................................................................97
Fault tolerant redundancy......................................................................................................................................... 98
4 Technical specifications..............................................................................................................................100
Dimensions of the Dell EMC PowerEdge C6400 enclosure...................................................................................... 101
Chassis weight.................................................................................................................................................................101
PSU specifications......................................................................................................................................................... 102
Chassis management board specifications................................................................................................................. 102
Drives and storage specifications.................................................................................................................................103
Midplane specifications................................................................................................................................................. 104
Environmental specifications........................................................................................................................................ 104
Standard operating temperature specifications....................................................................................................104
4 Contents
Expanded operating temperature specifications ..................................................................................................113
Particulate and gaseous contamination specifications......................................................................................... 115
Maximum vibration specifications........................................................................................................................... 116
Maximum shock specifications................................................................................................................................116
Maximum altitude specifications............................................................................................................................. 116
Fresh Air Operation................................................................................................................................................... 117
5 Troubleshooting your system...................................................................................................................... 118

Safety first — for you and your system.......................................................................................................................118
Troubleshooting a wet system....................................................................................................................................... 118
Troubleshooting a damaged system..............................................................................................................................118
Troubleshooting cooling problems.................................................................................................................................119
System messages............................................................................................................................................................119
6 Documentation resources...........................................................................................................................120
7 Document history....................................................................................................................................... 122
Contents 5
1
Product overview
The PowerEdge C6400 is a 2U rack mounted chassis that supports up to four independent PowerEdge C6420 sled servers.
The PowerEdge C6400 chassis is available in two versions:
• 12 x 3.5-inch SAS/SATA drive
Figure 1. PowerEdge C6400 chassis with 12 x 3.5-inch hard drives

• 24 x 2.5-inch SAS/SATA drives.
Figure 2. PowerEdge C6400 chassis with 24 x 2.5-inch hard drives
Topics:
• Target market
• Product positioning
• Product features
• Product comparison
• Supported operating systems
• System information label
Target market
The PowerEdge C6400 chassis is designed to support the capabilities of the C6420 sleds which include high-performance computing
fields-technical computing, scientific research, oil and gas exploration, financial services, and medical imaging. Other target workloads for
the C6420 include web scale applications-SaaS and IaaS, High Performance Data Analytics (HPDA), Financial and High Frequency Trading
(HFT), and Hyper Converged Infrastructure (HCI)-vSAN and Private Cloud.
Product positioning
The PowerEdge C6400 is positioned to accommodate high-level enterprise businesses at all sizes. The 2U chassis supports up to four 1U
nodes-PowerEdge C6420 sled servers, which is suitable for High Performance Computing (HPC) and hyper converge solutions.
6 Product overview
Product features
Table 1. C6400 features
Feature Description
Drive Bays
• Up to 12 x 3.5-inch hard drive backplane configuration-SAS/
SATA
• Up to 24 x 2.5-inch hard drive backplane configuration-SAS/
SATA/NVMe
• Up to 24 x 2.5-inch hard drive backplane with expander board
configuration
• No hard drive configuration
Form factor 2U
Supported server sled PowerEdge C6420
Rack rails Static rails only
Dimension 482.6 mm (19-inches) x 797.3 mm (31.38-inches) x 86.8 mm (3.41-
inches)
Weight
• 24 x 2.5-inch hard drive chassis: 41.46 kg (91.40 lb)
• 12 x 3.5-inch hard drive chassis: 43.62 kg (96.16 lb)
• No backplane systems: 34.56 Kg (76.19 lb)
Supported USB peripherals on the sled

• USB key (bootable)
• Keyboard (only one USB keyboard)
• Mouse (only one USB mouse)
Internal hard drives

• Wingman (2.5") or Surge (3.5") drive carrier
• 7200 rpm 3.5-inch SAS hard drives
• 7200 rpm 2.5-inch SAS hard drives
• 7200 rpm 2.5-inch Enterprise SATA hard drives
• 7200 rpm 3.5-inch Enterprise SATA hard drives
Orientation Support 4 x 1U nodes in 2U chassis.
Product comparison
Table 2. Comparison table
Feature C6400 C6300

Drive Bays
• Up to 12 x 3.5-inch hard drive backplane • Up to 12 x 3.5-inch SAS/SATA hard drives with
configuration-SAS/SATA passive backplane
• Up to 24 x 2.5-inch hard drive backplane • Up to 24 x 2.5-inch SAS/SATA hard drives with
configuration-SAS/SATA/NVMe passive backplane
• Up to 24 x 2.5-inch hard drive backplane with • Up to 24 x 2.5-inch SAS/SATA hard drives with
expander board configuration passive backplane and extender board.
• No hard drive configuration is also supported
Form factor 2U 2U
Product overview 7
Feature C6400 C6300
Supported server PowerEdge C6420 PowerEdge C6320p or C6320
sled
Rack rails Static rails only Static rails only
Dimension 482.6 mm (19-inches) x 797.3 mm (31.38-inches) x 86.8 790.3 mm mm x 448 mm x 86.8 mm
mm (3.41-inches)
Weight
• 24 x 2.5-inch hard drive chassis: 41.46 kg (91.40 lb) • 24 x 2.5-inch hard drive chassis: 41.0 kg or 90.4lbs
• 12 x 3.5-inch hard drive chassis: 43.62 kg (96.16 lb) • 12 x 3.5-inch hard drive chassis: 41.0 kg or 90.4lbs
• No backplane systems: 34.56 Kg (76.19 lb) • Empty chassis: 15.1 kg or 33.3 lbs
Supported USB
• USB key (bootable) • USB key (bootable)
peripherals on the
sled • Keyboard (only one USB keyboard) • Keyboard (only one USB keyboard)
• Mouse (only one USB mouse) • Mouse (only one USB mouse)
Orientation Support 4 x 1U nodes in 2U chassis. Support 4 x 1U nodes in 2U chassis.

iDRAC direct 1 micro USB connection type-AB 1 USB port for iDRAC
Supported operating systems

The Dell EMC PowerEdge C6400 supports the following operating systems:
• Canonical Ubuntu LTS

• Citrix XenServer
• Microsoft Windows Server with Hyper-V
• Red Hat Enterprise Linux
• SUSE Linux Enterprise Server
• VMware ESXi
NOTE: For more information about the specific versions and additions, see https://www.dell.com/support/home/drivers/
supportedos/poweredge-c6400
8 Product overview
System information label
Sled service information
Figure 3. Sled service information
Product overview 9
Cable routing
Figure 4. Cable routing
10 Product overview
Mechanical overview
Figure 5. Mechanical overview
Product overview 11
Link board and Drive cage
Figure 6. Link board and Drive cage
Jumper settings
Figure 7. Jumper settings
12 Product overview
System tasks
Figure 8. System tasks
Product overview 13
2
Field service information
The information in this section is designed specifically for field service personnel who perform installation, diagnosis, and repair activities.
Field personnel are required to know the information and procedures in this section whether or not they perform all the service tasks.
NOTE: Information in this section is required knowledge, but should never override regional or local policy and procedure.
Topics:
• Field service overview

• Chassis Overview
• Safety precautions
• Recommended tools
• Need to know
• Diagnostic indicators
• Disassembly and reassembly
• Entering the system Service Tag by using System Setup
• Installation
Field service overview

Field service information for the system includes the following content:
• Product overview – High-level description of the system that includes features and functions, product-to-product comparison, and
supported operating systems, if applicable, and OEM branding information.
• Safety precautions – Generic safety precautions for every service event.
• Tools and utilities – Hand tools, diagnostic tools or utilities, software applications, or GUIs that are required to service the system.
• Need to know - Specific callouts about the system, common error codes, version control for BIOS, firmware, or software for OEM,
required startup or shutdown sequence, new product technologies or components comparison.
• Diagnostics and indicators – Visual information about the health and state of the system.
• System board connectors – Information on system board connectors.
• System board jumper settings – Information on system board jumper settings.
• Disassembly and reassembly – Instructions for removing and replacing each replaceable part, with information needed before, during,
and after parts replacement.
• Installation – Includes information about rack rails.
Chassis Overview
The following section contains images and information about the front panel, back panel, and inside the system.
14 Field service information

Front view of the Dell EMC PowerEdge C6400 enclosure
Figure 9. Front view of the enclosure with 24 x 2.5-inch drives
1 Left control panel 2 Drive bay

3 Right control panel 4 EST tag
Figure 10. Front view of the enclosure with 12 x 3.5-inch drives
1 Left control panel 2 Drive bay

3 Right control panel 4 EST tag
Field service information 15

Rear view of the enclosure with sleds
Figure 11. Rear view of the enclosure with sleds
1 Sled 3 2 Power supply unit (2)

3 Sled 1 4 Sled 2
5 Sled 4
NOTE: For more information about sled installation sequence, see Sled installation guidelines.
Inside the enclosure

CAUTION: This system must be operated with the system cover installed to ensure proper cooling.

Figure 12. Inside the PowerEdge C6400 enclosure
1 sled 2 right midplane

3 fan cage (2) 4 fan (4)
5 right linking board 6 backplane
7 drive cage 8 expander board
9 left linking board 10 left midplane
11 chassis management board 12 power interposer board
Figure 13. Inside the PowerEdge C6420 sled
1 sled handle 2 mezzanine card

3 SATA connector 4 memory slot (4)
5 Processor 1 and heat sink module 6 Processor 2 and heat sink module
7 supporting bracket 8 M.2 SATA riser
9 memory slot (4) 10 PCIe expansion card riser assembly

System board diagnostic LED indicators
The system board LED indicators provide status of the system when it is powered on, which help identify POST and hardware issues.
For information on the different LED indicator sequences and description, see the interactive LED pattern decoder tool -https://
internal.software/blink/.
Safety precautions
Follow the safety precautions that are described in the following sections during an installation or a disassembly/reassembly procedure:
• Power off the system and all attached peripherals.

• Disconnect the system and all attached peripherals from AC or DC power.
• Disconnect all network cables from the system.
• Use a wrist grounding strap and mat when working inside any system to avoid electrostatic discharge (ESD) damage.
• After removing a system component, carefully place the removed component on an antistatic mat.
• Wear shoes with nonconductive soles or rubber soles to help reduce the risk of electrical shock or seriously injured in an electrical
accident.
Standby power
When applicable Dell products that feature a standby power mode, must be unplugged before the system is serviced.
NOTE: Systems that incorporate standby power, continue to use power even when they are powered off. For example, standby
power enables the system to be powered on remotely with the wake on LAN feature enabled, suspended into sleep mode, or
other advanced power management features.
After you unplug a system and before you remove components, wait approximately 30 to 45 seconds to allow the charge to drain from the
circuits.
Bonding
Bonding is a method of connecting two or more grounding conductors to the same electrical potential. This method requires the Field
Service ESD kit. When connecting a bonding wire, always ensure that it is connected to a bare metal system and never to a painted or
nonmetal surface. The Wrist Strap should be secured to your skin. Ensure that you remove all jewelry such as watches, bracelets, or rings
before bonding yourself and the equipment.

Figure 14. Proper bonding method
Electrostatic discharge
Electrostatic discharge (ESD) is a major concern when you handle sensitive components such as expansion cards, processors, memory
DIMMs, and system board. A slight charge can result in damaging the circuits on these components causing intermittent problems or
shortening the life span.
Due to the increased density of semiconductors that are used in recent Dell products, the sensitivity to static damage is now higher than in
earlier Dell products. For this reason, some previously approved methods of handling parts are no longer applicable.
There are two recognized types of ESD damage: catastrophic and intermittent failures.
• Catastrophic—The damage causes an immediate and complete loss of device functionality. For example, a memory DIMM that has
received a static shock, immediately generates a No POST/No Video symptom.
NOTE: Catastrophic failures represent approximately 20 percent of ESD-related failures.

• Intermittent—The damage weakens the component causing intermittent failure in performance. For example, if a memory DIMM
receives a static shock, the tracing weakens without producing any outward symptoms that are related to damage. The weakened
trace may take weeks or months to melt, and in the meantime may cause degradation of memory integrity and intermittent memory
errors.
NOTE: Intermittent failures represent approximately 80 percent of ESD-related failures. The high rate of intermittent
failures means that most of the time when damage occurs, it is not immediately recognizable.
Intermittent or latent failures are difficult to identify and troubleshoot. The image shows an example of damage to a memory module trace.
Although the damage is complete, the symptoms may not become an issue or cause permanent failure for some time after the damage
occurs.
Figure 15. Intermittent, latent damage to a wiring trace
To avoid an ESD damage, ensure you:
• Use a wired ESD Wrist Strap that is properly grounded.

NOTE: Wireless antistatic straps or touching the chassis is not recommended as they do not provide adequate ESD protection.
Figure 16. Incorrect handling of components without ESD protection
• Handle all static-sensitive components in a static-safe area. If possible, use antistatic floor pads and workbench pads.
• Grasp the static-sensitive components by the side and not the top.
• Avoid touching the pins and circuit boards.
• Do not remove components from the antistatic packing material until you are ready to install the components. Before unwrapping the
antistatic packaging, be sure to discharge static electricity from your body.
• Place the component in an antistatic container or packaging before transporting the components.
ESD field service kit

The unmonitored Field Service kit is the most commonly used. Each Field Service kit includes three main components:
• Antistatic mat
• Wrist Strap
• Bonding wire
Figure 17. ESD field service kit
The antistatic mat is dissipative and must be used to safely place parts on during service procedures. When using an antistatic mat, your
Wrist Strap must be snug, connected to the mat, and to the bare-metal on the system that is being worked on. After the mat and Wrist
Strap are deployed properly, remove the components to be serviced form the ESD bag and place them on the mat. Remember, the only
safe place for ESD-sensitive items are in your hand, on the ESD mat, in the system, or inside a bag.

Figure 18. Antistatic mat
The Wrist Strap and bonding wire can be connected either to:
• Your wrist and bare metal of the hardware

• Your wrist and antistatic mat, to protect hardware that is temporarily placed on the mat
NOTE: The physical connection of the Wrist Strap and bonding wire between your skin, the ESD mat, and the hardware is known
as bonding.
NOTE: Use only Field Service kits with a Wrist Strap, mat, and bonding wire. Avoid using wireless Wrist Straps.
The internal wires of a Wrist Strap are prone to damage from normal wear and tear, and must be checked regularly with a Wrist Strap
tester to avoid accidental ESD hardware damage. Dell recommends to test the Wrist Strap and bonding wire regularly.
ESD Wrist Strap tester

The wires inside an ESD strap are prone to damage over time. When using an unmonitored kit, Dell recommends to regularly test the strap
before each service call, and at a minimum, test once per week. A Wrist Strap tester is the best method for performing this test. If you do
not have your own Wrist Strap tester, check with your regional office to find out if they have one. To perform the test, plug the bonding
wire on the Wrist Strap to the tested while it is strapped to your wrist and press the button. A green LED lights up if the test is successful;
a red LED lights up and an alarm sounds if the test fails.
Figure 19. Wrist Strap tester

Insulator elements
Dell recommends to place ESD sensitive devices, such as plastic heat sink casings, away from internal components that are insulators and
highly charged.
Table 3. Placement of insulator elements
Unacceptable placement Acceptable placement
Consider the working environment

Before deploying the ESD Field Service kit, assess the situation at the customer location. For example, deploying the kit for a server
environment is different than for a desktop or portable environment. Servers are typically installed in a rack within a data center; desktops
or portables are typically placed on office desks or cubicles.
Look for a large open flat work area that is free of clutter and large enough to deploy the ESD kit with more space to accommodate the
type of system that is being repaired. The workspace should also be free of insulators that can cause an ESD event. On the work area,
insulators such as Styrofoam and other plastics must be moved at least 12-inches or 30 centimeters away from sensitive parts before
physically handling any hardware components.
ESD packaging
All ESD sensitive devices must be shipped and received in static-safe packaging. Preferably, metal, static-shielded bags. Ensure that you
return the damaged parts in the same ESD bag or packaging in which the new part arrived in. The ESD bag should be folded over and
taped shut, and the foam packing material used in the original box must be used.
ESD sensitive devices should be removed from packaging only at an ESD protected work surface, and parts should never be placed on top
of the ESD bag because only the inside the bag is shielded. Always place parts in your hand, on the ESD mat, in the system, or inside an
antistatic bag.

Figure 20. ESD packaging
Transporting sensitive components

When transporting ESD sensitive components such as replacement parts or returned parts to Dell, it is critical to place these parts in
antistatic bags for safe transport.
ESD protection summary

It is suggested that all field service engineers use the traditional wired ESD grounding Wrist Strap and protective antistatic mat when
servicing Dell products. In addition, it is critical that engineers place sensitive parts separate from all insulator parts while performing service
and that they use antistatic bags for transporting sensitive components.
Lifting equipment
WARNING: Do not lift systems that are greater than 50 pounds. Always obtain assistance, or use a mechanical lifting device.
Adhere to the following guidelines when lifting equipment:
1 Get a firm balanced footing. Keep your feet apart for a stable base, and point out your toes.
2 Bend your knees. Do not bend at the waist.

3 Tighten stomach muscles. Abdominal muscles support your spine when you lift, offsetting the force of the load.
4 Lift with your legs, not your back.
5 Keep the load close. The closer it is to your spine, the less force it exerts on your back.
6 Keep your back upright, whether lifting or setting down the load. Do not add the weight of your body to the load. Avoid twisting your
body and back.
7 Follow the same techniques in reverse to set the load down.
Recommended tools
Table 4. Recommended tools and optional tools
Recommended tools Optional tools
• Key to the bezel lock • Needle-nose pliers to disconnect cables and connectors in
The key is required only if your system includes a bezel. hard-to-reach locations
• Phillips #1 and #2 screwdriver • Small flat-head screwdriver to disconnect small cables from
boards
• 1/4 inch flat blade screwdriver
• 5mm hex nut screwdriver
• Torx #T30 screwdriver
• Wrist-grounding strap connected to the ground
• ESD Mat
Need to know
Before you begin servicing the system, you must read the following information:
• Critical callouts
• Common error codes
• Version control for BIOS/firmware/software
• Startup/Shutdown Sequence

Critical callout
This section lists the important critical callouts for field service technicians.
Updating the Chassis Manager (CM) service tag

The PowerEdge C6400 chassis service tag requires an update when the Chassis Manager (CM) board is replaced. Perform the following
steps to update the chassis service tag using the CM board:
1 Hardware and software requirements:

a CM-serial port adapter. PN: RDB09-0164
b Serial mini-gender changer
c USB to serial adapter from the PC
d Serial COM terminal software-PUTTY or Build-in Serial COM Terminal of Flash Magic
2 Connect the serial port adapter to the CM board.
3 Then connect the PC's USB to serial adapter to the CM serial port adapter.
Figure 21. Cable connections
4 Launch the serial COM terminal console on the PC.

5 Power on the chassis by inserting the power cord to the power supply.
NOTE: The Chassis Manager screen is displayed.

Figure 22. Flash Magic Terminal COM

Figure 23. PUTTY terminal COM
6 Update the chassis number:

a Type dumpFRU 2 to view the the Chassis Area Information.
b Type setFRUChassisInfo Chassis_Serial_Number XXXXXXXXXX.
NOTE: Replace XXXXXXXXXX with the new Service tag number.

c Type dumpFRU 2 to verify the update.

Figure 24. Updating the chassis number
7 Update the asset tag:

a Type dumpFRU 4 to view the current Product Area Information which shows the Asset Tag information.

Figure 25. Asset tag information
b Type setFRUProductInfo Asset_Tag ATXXXXXXX
NOTE: Replace ATXXXXXXX with the new number for the asset tag.

Figure 26. Setting the asset tag
c Type dumpFRU 4 to verify the update.
Chassis Manager (CM) back up and restore

To back up and restore the Chassis Manager, users require two script files:
NOTE: Systems with Windows operating system uses the .bat file, while Linux based operating system uses the .sh file.
• BackupProp.sh - A bash script for Linux or Windows (uses .bat file format). This script backs up the Chassis Manager properties to a
configuration file. This script does not take any argument. Just run the script from the current directory. It creates the backup file in
current directory. The script has default iDRAC IP address, username and password in the beginning of the file. To change the default
values, please edit the BackupProp.sh file and change the necessary fields at the top of the file. It only stores the following properties:
Chassis service tag, backplane present info, and FTR setting.
• RestoreProp.sh - A bash script for Linux or Windows (uses .bat file format). This script restores the value of the properties that are
saved in the configuration file by BackupProp.sh. This script does not take any argument. Just run the script from the current directory.
The script has default iDRAC IP address, username and password in the beginning of the file. To change the default values, please edit
the RestoreProp.sh file and change the necessary fields at the top of the file. It only stores the following properties: Chassis service tag,
backplane present info, and FTR setting.
The following list the requirements to run the scripts:
1 IPMITool- The backup and restore scripts use IPMITool to communicate with iDRAC to get or set the properties. Make sure that
IPMITool is installed in your system. Users can download them from the source below:

a Dell OpenManage BMC Utility, v8.1: https://www.dell.com/support/home/us/en/04/Drivers/DriversDetails?driverId=6MR62
b IPMItool packages from sourceforge: http://ipmitool.sourceforge.net
NOTE: Refer to these links for IPMITool related questions:

• IPMI specifications: http://developer.intel.com/design/servers/ipmi/spec.htm
• OpenIPMI: http://sourceforge.net/projects/openipmi
2 Connection to iDrac - The backup and restore scripts internally communicates with the iDRAC. It is necessary that the system
running this script and iDRAC should be on the same network. This can be done by:
• Using universal USB connector: Attach one end of the connector to the USB port of your system/laptop and the other end to
iDRAC’s micro USB port.
• Connect your system (either by LAN or Wi-Fi) to the same network as iDRAC provided the iDRAC is configured and connected to
any network.
Steps to back up the Chassis Manager properties

1 Once the iDRAC and your system are connected (either directly or over the network), send a ping request to the iDRAC to make sure
it's reachable and responding to ping request.
2 If you are able to ping iDRAC from your laptop, open up a terminal and navigate to the folder containing the BackupProp.sh script.
3 Open the BackupProp.sh file and update the iDRAC IP address, username and password. If you are connected via the iDRAC micro
USB port, the iDRAC IP would be 169.254.0.3.
4 Then run the BackupProp.sh script with no parameter. It will create a backup.config in the same folder and save the Chassis Manager
properties that file.
5 Now you can use the backup.config file to restore the same board or any other board with the same values.
Steps to restore the Chassis Manager properties

1 Once the iDRAC and your system are connected (either directly or over the network), send a ping request to the iDRAC to make sure
it's reachable and responding to ping request.
2 If you are able to ping iDRAC from your laptop, open up a terminal and navigate to the folder containing the RestoreProp.sh script.
3 Open the RestoreProp.sh file and update the iDRAC IP address, username and password. If you are connected via the iDRAC micro
USB port, the iDRAC IP would be 169.254.0.3.
4 Make sure the backup.config file is present in the current folder.
5 Then run the RestoreProp.sh script with no parameter. It will read the configuration properties from the backup.config present in the
same folder and restore the Chassis Manager properties with the new values.
6 The script will print the old and new values on the screen.
Commands to set the Chassis Manager properties

If the backup option is unavailable for some reason or old Chassis Manager board is corrupted and not accessible, then we can manually set
these properties. First, connect to the iDRAC using the same method mentioned above. If you are able to ping iDRAC from your laptop,
open up a terminal and run the following commands:
NOTE: Ensure that the CMC firmware and IPMI tool are updated to the latest version.
• Backplane present setting:

– Get:
ipmitool -I lanplus -H <ip_address> -U <username> -P <password> raw 0x6 0x34 0x45 0x70 0xc0
0xc8 0x20 0x0 0xa0 0x0 0x01 0x1b 0xd8

Set (The second last byte is the BP setting. Use 0x01 if the Backplane is present and 0x00 if there is no Backplane. The example
below has Backplane presence):
0xc8 0x20 0x0 0xa1 0x1 0x1 0x1b 0x01 0xd8
• FTR feature setting:
– Get:
0xc8 0x20 0x0 0xa0 0x0 0x01 0x1a 0xd8
– Set (The second last byte is the FTR setting. Use 0x01 if the FTR is enabled and 0x00 if FTR is disabled. The example below has
FTR enabled):
0xc8 0x20 0x0 0xa1 0x1 0x1 0x1a 0x00 0xd8
• Chassis service tag:
– Get:
ipmitool -I lanplus -H <ip_address> -U <username> -P <password> raw 0x30 0xC8 0x01 0x00 0x0c
0x00 0x00 0x00 0x00
– Set (The last 8 bytes are the Chassis Service Tag. The values are expected to be in Hex format. Please use any standard ASCII to
HEX converter tool to convert any string to Hex format):
ipmitool -I lanplus -H <ip_address> -U <username> -P <password> raw 0x30 0xC8 0x0 0x00 0x0c
0x00 0x00 0x00 0x0c 0x0 0x11 0x08 0x31 0x32 0x33 0x34 0x35 0x36 0x37 0x42
NOTE: Here is a link to a Hex converter for reference: https://www.asciitohex.com/

Diagnostic indicators
The diagnostic indicators on the system indicate operation and error status.
Drive indicator codes

Each drive carrier has an activity LED indicator and a status LED indicator. The indicators provide information about the status of the drive.
The activity LED indicator indicates whether the drive is in use or not. The status LED indicator indicates the power condition of the drive.
Figure 27. Drive indicators on the drive and the mid drive tray backplane
1 Drive activity LED indicator 2 Drive status LED indicator

3 Drive
NOTE: If the drive is in the Advanced Host Controller Interface (AHCI) mode, the status LED indicator does not turn on.
Table 5. Drive indicator codes
Drive status indicator code Condition

Flashes green twice per second Identifying drive or preparing for removal.
Off Drive ready for removal.
NOTE: The drive status indicator remains off until all drives are
initialized after the system is turned on. Drives are not ready
for removal during this time.
Flashes green, amber, and then turns off Predicted drive failure.
Flashes amber four times per second Drive failed.
Flashes green slowly Drive rebuilding.
Solid green Drive online.
Flashes green for three seconds, amber for three seconds, and Rebuild stopped.
then turns off after six seconds

Power supply unit indicator codes
AC power supply units (PSUs) have an illuminated translucent handle that serves as an indicator. The indicator shows whether power is
present or if a power fault has occurred.
NOTE: The 2400 W and 2000 W PSUs use a C19 or C20 connector. The 1600 W PSUs use a C13 or C14 connector.
Figure 28. AC PSU status indicator
1 AC PSU status indicator/handle
Table 6. AC PSU status indicator codes
Power indicator codes Condition

Green A valid power source is connected to the PSU and the PSU is operational.
Blinking amber Indicates a problem with the PSU.
Not illuminated Power is not connected to the PSU.
Blinking green When the firmware of the PSU is being updated, the PSU handle blinks green.
CAUTION: Do not disconnect the power cord or unplug the PSU when updating firmware. If
firmware update is interrupted, the PSUs do not function.
Blinking green and turns off When hot-plugging a PSU, the PSU handle blinks green five times at a rate of 4 Hz and turns off. This
indicates a PSU mismatch with respect to efficiency, feature set, health status, or supported voltage.
CAUTION: The PSUs must have the same type of label; for example, Extended Power
Performance (EPP) label. Mixing PSUs from previous generations of PowerEdge servers is not
supported, even if the PSUs have the same power rating. This results in a PSU mismatch
condition or failure to turn the system on.
CAUTION: When correcting a PSU mismatch, replace only the PSU with the blinking indicator.
Swapping the PSU to make a matched pair can result in an error condition and unexpected
system shutdown. To change from a high output configuration to a low output configuration or
vice versa, you must turn off the system.
CAUTION: AC PSUs support both 240 V and 120 V input voltages with the exception of Titanium
PSUs, which support only 240 V. When two identical PSUs receive different input voltages, they
can output different wattages, and trigger a mismatch.
CAUTION: If two PSUs are used, they must be of the same type and have the same maximum
output power.

Power and system board indicator codes
The LEDs on the system front panel and back panel display status codes during system startup and operation. For location of the LEDs on
the front panel, see the Front panel features and indicators section. For location of the LEDs on the back panel, see the Back panel
features and indicators section.
Table 7. Status indicator codes
Component Indicator Condition

Power-on indicator (A bi-color Green Solid Power On (S0)
LED on power button)
Amber Off
Green Off BMCiDRAC critical condition event in Power Off mode (S4/S5)
Amber Blinking
Green Off BMCiDRAC critical condition event in Power On mode (S0)
Amber BlinkingOn
System identification indicator Steady blue IPMI using Chassis Identify Command On or ID Button Press ID
On
Blinking blue Only IPMI using Chassis Identify Command Blink On
Off IPMI using Chassis Identify Command Off or ID Button Press ID

Off
NIC indicator codes

Each NIC on the back of the system has indicators that provide information about the activity and link status. The activity LED indicator
indicates if data is flowing through the NIC, and the link LED indicator indicates the speed of the connected network.
Figure 29. NIC indicator codes
1 Link LED indicator 2 Activity LED indicator
Table 8. NIC indicator codes
Status Condition
Link and activity indicators are off. The NIC is not connected to the network.
Link indicator is green, and activity indicator is blinking The NIC is connected to a valid network at its maximum port speed, and
green. data is being sent or received.
Link indicator is amber, and activity indicator is blinking The NIC is connected to a valid network at less than its maximum port
green. speed, and data is being sent or received.

Status Condition
Link indicator is green, and activity indicator is off. The NIC is connected to a valid network at its maximum port speed, and
data is not being sent or received.
Link indicator is amber, and activity indicator is off. The NIC is connected to a valid network at less than its maximum port
speed, and data is not being sent or received.
Link indicator is blinking green, and activity is off. NIC identify is enabled through the NIC configuration utility.
System board diagnostic LED indicators

The system board LED indicators provide status of the system when it is powered on, which help identify POST and hardware issues.
For information on the different LED indicator sequences and description, see the interactive LED pattern decoder tool -https://
internal.software/blink/.
Disassembly and reassembly

The following sections contain the procedures for removing and replacing system components.
Dell EMC PowerEdge C6420 sled

Sled Installation Guidelines
NOTE: Ensure to install a sled blank in all the empty slots. Operating the enclosure without a blank results in overheating.
NOTE: For optimized thermal operation, ensure to follow the sled population sequence mentioned below:

Figure 30. Sled Installation Guidelines
Removing a sled
Press the retaining latch and using the sled pull handle, slide the sled out of the enclosure horizontally, ensuring that the sled is
supported from beneath.

Figure 31. Removing a sled

Figure 32. Removing a sled blank
Installing a sled
Prerequisite
1 If installed, remove the sled blank.
Step
Slide the sled into the enclosure horizontally, ensuring that the sled is supported from beneath until it locks into place.

Figure 33. Installing a sled

Figure 34. Installing a sled blank
Drives
Removing a drive blank

The procedure for removing 2.5-inch and 3.5-inch drive blanks is identical.
Press the release button, and slide the drive blank out of the drive slot.

Figure 35. Removing a drive blank
Installing a drive blank

The procedure for installing 2.5-inch and 3.5-inch drive blanks is identical.
Insert the drive blank into the drive slot, and push the blank until the release button clicks into place.
Figure 36. Installing a drive blank
Removing a drive carrier

Prerequisite
1 Using the management software, prepare the drive for removal.

If the drive is online, the green activity or fault indicator flashes while the drive is turning off. When the drive indicators are off, the
drive is ready for removal. For more information, see the documentation for the storage controller.
CAUTION: To prevent data loss, ensure that your operating system supports drive installation. See the documentation
supplied with your operating system.
Steps
1 Press the release button to open the drive carrier release handle.
2 Holding the handle, slide the drive carrier out of the drive slot.

Figure 37. Removing a drive carrier
Installing a drive carrier

Prerequisites
CAUTION: To prevent data loss, ensure that your operating system supports hot-swap drive installation. See the documentation
supplied with your operating system.
CAUTION: When a replacement hot swappable drive is installed and the system is powered on, the drive automatically begins to
rebuild. Ensure that the replacement drive is blank or contains data that you wish to overwrite. Any data on the replacement
drive is immediately lost after the drive is installed.
Steps
1 Press the release button on the front of the drive carrier to open the release handle.
2 Insert and slide the drive carrier into the drive slot.
3 Close the drive carrier release handle until it clicks in place.

Figure 38. Installing a drive carrier
Removing the drive from the drive carrier

1 Using a Phillips #1 screwdriver, remove the screws from the slide rails on the drive carrier.
2 Lift the drive out of the drive carrier.
Figure 39. Removing the drive from the drive carrier
Installing a drive into the drive carrier

1 Insert the drive into the drive carrier with the connector end of the drive towards the back of the carrier.
2 Align the screw holes on the drive with the screws holes on the drive carrier.
When aligned correctly, the back of the drive is flush with the back of the drive carrier.

3 Using a Phillips #1 screwdriver, secure the drive to the drive carrier with screws.
Figure 40. Installing a drive into the drive carrier
Power supply units
Removing a power supply unit

Prerequisite
1 Disconnect the power cable from the power source and from the PSU you intend to remove, and then remove the cable from the
strap on the PSU handle.
Step
Press the release latch and slide the PSU out of the system by using the PSU handle.

Figure 41. Removing a power supply unit
Installing a power supply unit

Step
Slide the PSU into the system until the PSU is fully seated and the release latch snaps into place.
Figure 42. Installing a power supply unit
Next step
1 Connect the power cable to the PSU, and plug the cable into a power outlet.
CAUTION: Secure the power cable to the PSU with the strap provided on the PSU handle.

System cover
Removing the system cover
Prerequisites
1 Power off the system and all attached peripherals.

2 Disconnect the system from the electrical outlet and disconnect the peripherals.
Steps
1 Press and hold the cover release latch lock down.
2 With your palm on one of the traction pads, slide the system cover toward the rear of the system.
3 Lift the cover from the system.
Figure 43. Removing the system cover
Installing the system cover

Place the system cover on the chassis, and slide it to the front of the chassis until it locks into place.

Figure 44. Installing the system cover
Backplane cover
Removing the backplane cover

Prerequisite
NOTE: This procedure is not applicable for enclosures with the 3.5-inch hard drive configuration.
Steps
1 Using the Phillips #1 screwdriver, remove the screws that secure the backplane cover to the enclosure.
2 Slide the backplane cover toward the back of the enclosure and lift the cover away.

Figure 45. Removing the backplane cover
Installing the backplane cover

1 Align the screw holes on the backplane cover with the screw holes on the chassis by sliding the cover toward the front of the
enclosure.
2 Using the Phillips #1 screwdriver, tighten the screws to secure the backplane cover to the enclosure.
Figure 46. Installing the backplane cover

Cooling fans
Removing a cooling fan
Prerequisite
WARNING: Do not attempt to operate the system without the cooling fans.
Step
Disconnect the fan cable from the connector on the cooling fan cage and lift the fan out.
Figure 47. Removing a cooling fan
Installing a cooling fan

Steps
1 Align the cooling fan with the fan slot on the cooling fan cage, and push the cooling fan until it is firmly seated.
2 Connect the fan cable to the connector on the cooling fan cage.

Figure 48. Installing a cooling fan
Next step
1 Check the management software to see if the fan is rotating at the optimal speed.
Removing the cooling fan cage

Prerequisites
NOTE: Observe the routing of the cables when removing them from the system. Route these cables properly when you replace
them to prevent the cables from being pinched or crimped.
1 Remove the cooling fans.
Steps
1 Disconnect the fan power cable from the chassis management board.
2 Lift the cooling fan cage out of the chassis.

Figure 49. Removing the cooling fan cage
Installing the cooling fan cage

Prerequisites
NOTE: Observe the routing of the cables when removing them from the system. Route these cables properly when you replace
them to prevent the cables from being pinched or crimped.
Steps
1 Align the guide pins on the cooling fan cage with the guide holes on the chassis.
2 Install the fan cage onto the chassis, and push until it is firmly seated on the guide holes.
3 Connect the fan power cable to the connector on the chassis management board.
To prevent the cable from being damaged, route this cable properly.

Figure 50. Installing the cooling fan cage
Next steps
1 Install the cooling fans.

2 Check the management software to see if all the fans are rotating at the optimal speed.
Power interposer board

Removing the power interposer board
Prerequisites
WARNING: Allow the power interposer board (PIB) to discharge after you power off the system. Handle the PIB by the edges
and avoid touching the contact surfaces of the connectors.
1 Remove the power supply units.

2 Disconnect all the cables from the PIB except for the mid-plane power cables.
Steps
1 To release the PIB from the lock on the chassis, pull the blue release latch.
2 Holding the release latch, lift the PIB up and away from the guide hooks on the chassis.
3 Using the Phillips #2 screwdriver, remove the screws that secure the mid-plane power cables to the PIB.

Figure 51. Removing the PIB
Figure 52. Removing the midplane power cables from the PIB

Installing the power interposer board
Prerequisite
WARNING: Allow the power interposer board (PIB) to discharge after you power off the system. Handle the PIB by the edges
and avoid touching the contact surfaces of the connectors.
Steps
1 Using the Phillips #2 screwdriver, replace the screws that secure the midplane power cable to the PIB.
Figure 53. Installing the midplane power cables to the PIB
2 Align and insert the PIB on the guide hooks on the chassis.
3 Push the PIB down to secure it with the lock on the chassis.

Figure 54. Installing the PIB
Next steps
1 Reconnect all the disconnected cables.

2 Install the power supply units.
Chassis management board

Removing the chassis management board
Prerequisites
1 Remove the power supply units.

2 Remove the power interposer board.
3 Disconnect all the cables that are connected to the chassis management board.
Steps
1 Using the Phillips #2 screwdriver, remove the two screws that secure the chassis management board to the chassis.
2 Sliding the board toward the front of the enclosure, lift the board away after the guide slots are free of the standoffs.

Figure 55. Removing the chassis management board
Installing the chassis management board

Steps
1 Insert the chassis management board into the enclosure, aligning the guide slots with the standoffs on the chassis.
2 Push the board toward the back of the enclosure to align the screw holes on the board and standoffs chassis.
3 Using the Phillips #2 screwdriver, replace the screws to secure the board in place.
Figure 56. Installing the chassis management board

Next steps

2 Install the power interposer board.
3 Install the power supply units.
Linking board
Removing the linking board
Prerequisites
1 Remove all the sleds from the enclosure.

2 Remove the fan cage.
Steps
1 Using the Phillips #1 screwdriver, remove the screw that secures the linking board to the enclosure.
2 Lift the linking board out of the enclosure.
3 Disconnect all the attached cables.
Figure 57. Removing the right linking board

Figure 58. Removing the left linking board
Installing the linking board

Steps
1 Reconnect all the disconnected cables to the linking board.
2 Align the board with the standoff on the chassis and slide the board into place.
NOTE: Ensure that the linking board cable connector is not folded or twisted while installing the sled, to avoid damaging
the linking board cable connector.
3 Using a Phillips #1 screwdriver, replace the screw on the linking board to secure the board in place.

Figure 59. Installing the right linking board
Figure 60. Installing the left linking board
Next steps
1 Install the fan cage.

2 Install the sleds into the enclosure.

Midplane
Removing the right midplane
Prerequisites
NOTE: Observe the routing of the cables on the chassis as you remove them from the system. Route these cables properly when
you replace them to prevent the cables from being pinched or crimped.

2 Remove the cooling fan cage.
3 Disconnect all the connected cables.
Steps
1 Using the Phillips #1 screwdriver, remove the screws that secure the midplane to the chassis.
2 Lift the midplane out of the chassis.
3 Using the Phillips #1 screwdriver, remove the screws that secure the power cables to the midplane.
Figure 61. Removing the right midplane
Next step
1 Install the right midplane.

Installing the right midplane
Prerequisite
NOTE: You must route the cables properly on the chassis to prevent them from being pinched or crimped.
Steps
1 Using the Phillips #1 screwdriver, connect and secure the power cables to the midplane.
2 Place the midplane into the chassis.
3 Using the Phillips #1 screwdriver, tighten the screws that secure the midplane to the chassis.
Figure 62. Installing the right midplane
Next steps

2 Install the cooling fan cage.
3 Install the sleds into the enclosure.
Removing the left midplane

Prerequisites
NOTE: Observe the routing of the cables on the chassis as you remove them from the system. Route these cables properly when
you replace them to prevent the cables from being pinched or crimped.

2 Remove the cooling fan cage.
3 Disconnect all the connected cables.

Steps
1 Using the Phillips #1 screwdriver, remove the screws that secure the midplane.
2 Slide and lift the midplane out of the chassis.
3 Using the Phillips #1 screwdriver, remove the screws that secure the power cables to the midplane.
Figure 63. Removing the left midplane
Next step
1 Install the midplanes.
Installing the left midplane

Prerequisite
NOTE: You must route the cables properly on the chassis to prevent them from being pinched or crimped.
Steps
1 Using the Phillips #1 screwdriver, connect and secure the power cables to the midplane.
2 Place the midplane into the chassis.
3 Using the Phillips #1 screwdriver, secure the midplane to the chassis with the screws.

Figure 64. Installing the left midplane
Next steps
1 Connect all the disconnected cables.

2 Install the cooling fan cage.

Midplane power cable routing
Figure 65. Midplane power cable routing from power interposer board
1 left midplane 2 +12 V power cable for left midplane

3 GND cable for left midplane 4 power interposer board
5 +12 V power cable for right midplane 6 GND cable for right midplane
7 right midplane
Drive cage
Removing the 2.5 inch drive cage
Prerequisites
CAUTION: To prevent damage to the drives and backplane, you must remove the drives from the system before removing the
backplane.
CAUTION: You must note the number of each drive and temporarily label them before removal so that you can replace them in
the same locations.
NOTE: Observe the routing of the cables on the chassis as you remove them from the system. You must route these cables
properly when you replace them to prevent the cables from being pinched or crimped.
1 Remove the backplane cover.

2 Remove the fan cages.

3 If applicable, disconnect the backplane and expander board cables from the linking board and chassis management board.
4 Remove all the drives.
Steps
1 Using the Phillips #1 screwdriver, remove the screws that secure the drive cage to the chassis.
2 Slide the drive cage to the unlock position.
3 Lift the drive cage away from the enclosure.
Figure 66. Removing the 2.5-inch drive cage
Next step
1 Install the 2.5-inch drive cage.
Installing the 2.5 inch drive cage

Prerequisites
backplane.
the same locations.
Steps
1 Insert the drive cage into the enclosure, aligning the cage with the standoffs on the chassis.
2 Slide the drive cage toward the lock position.
3 Reconnect all the cables that were disconnected from the backplane.
4 Using the Phillips #1 screwdriver, secure the drive cage in place with screws.

Figure 67. Installing the 2.5-inch drive cage
Next steps
1 If applicable, reconnect all the cables that were disconnected from the linking board and chassis management board.
2 Install the removed drives.
3 Install the fan cage.
4 Install the backplane cover.
Removing the 3.5 inch drive cage

Prerequisites
backplane.
CAUTION: You must note the slot number of each drive and temporarily label them before removal so that you can replace them
in the same slots.
1 Remove the fan cages.

2 Disconnect the backplane cables from the linking board and chassis management board.
Steps
1 Using the Phillips #1 screwdriver, remove the screws that secure the drive cage to the chassis.
2 Slide the drive cage to the unlock position.
3 Hold and lift the drive cage up.
4 Lift the drive cage away from the enclosure.

Figure 68. Removing the 3.5-inch drive cage
Next step
1 Install the 3.5-inch drive cage.
Installing the 3.5 inch drive cage

Prerequisites
backplane.
the same locations.
Steps
1 Insert the drive cage into the enclosure, aligning the drive cage with the standoffs on the chassis.
2 Slide the drive cage toward the lock position.
3 Using the Phillips #1 screwdriver, secure the drive cage in place with screws.

Figure 69. Installing the 3.5-inch drive cage
Next steps
1 Reconnect all the backplane cables that were disconnected from the linking board and chassis management board.
2 Install all the drives.
3 Install the fan cages.
Backplanes and expander board

Removing the backplane
Prerequisites
backplane.
in the same slots.
1 Remove the drive cage.

2 Disconnect all the cables from the backplane.
Steps
1 Orient the drive cage so that the drive bays are facing down.
2 Using the Phillips #2 screwdriver, remove the screws that secure the backplane to the drive cage.
3 Lift the backplane away from the drive cage.

Figure 70. Removing the backplane
Next step
1 Install the backplane.
Installing the backplane

Prerequisites
in the same slots.
Steps
1 Orient the drive cage so that the drive bays are facing down.
2 Place the backplane on the drive cage, aligning the screw holes on the backplane with the holes on the drive cage.
3 Using the Phillips #2 screwdriver, replace the screws to secure the backplane to the drive cage.

Figure 71. Installing the backplane
Next steps

2 Install the drive cage into the enclosure.
Removing the backplane expander board

Prerequisites
NOTE: To prevent damage to the drives and backplane, you must remove the drives from the system before removing the
backplane.
NOTE: Observe the routing of the cable on the chassis as you remove them from the system. You must route these cables
NOTE: The backplane expander board is only available with 24 x 2.5-inch drives with NVMe configuration.
1 Remove the drive cage.

2 Disconnect all the cables from the backplane expander board.

Steps
1 Using the Phillips #2 screwdriver, remove the screws that secure the backplane expander board to the drive cage.
2 Lift the backplane expander board out of the enclosure.
Figure 72. Removing the backplane expander board
Next step
1 Install the backplane expander board.
Installing the backplane expander board

Prerequisites
NOTE: Observe the routing of the cable on the chassis as you remove them from the system. You must route these cables
NOTE: The backplane expander board is only available with 24 x 2.5-inch drives with NVMe configuration.
Steps
1 Install the backplane expander board into the enclosure, aligning the screw holes on the board with the holes on the drive cage.
2 Using the Phillips #2 screwdriver, secure the backplane expander board to the chassis.

Figure 73. Installing the backplane expander board
Next steps

2 Install the drive cage.
Control panel
Removing the control panel
Prerequisites
NOTE: Observe the routing of the cables on the enclosure as you remove them. You must route these cables properly when you
replace them to prevent the cables from being pinched or crimped.

2 Disconnect all the backplane cables from the linking board and chassis management board.
3 Remove the drive cage from the enclosure.
4 Disconnect control panel cables from the midplane.
Steps
1 Using the Phillips #1 screwdriver, remove the screws that secure the control panel assembly to the enclosure.
2 Remove the cable from the cable retention clips.
3 Lift the control panel assembly away.

Figure 74. Removing the left control panel assembly
Figure 75. Removing the right control panel assembly
Next step
1 Install the control panel assembly.

Installing the control panel
Prerequisites
NOTE: Additional tape maybe required to secure the cables.
Steps
1 Route the control panel cable through the cable retention clips.
2 Install the control panel assembly and secure it in place with screws.
Figure 76. Installing the left control panel

Figure 77. Installing the right control panel
Next steps
1 Reconnect the control panel cable to the midplane.

2 Install the drive cage into the enclosure.
3 Reconnect all the disconnected backplane cables.
4 Install all the removed drives.
Thermal sensor board

Removing the thermal sensor board
Prerequisites
backplane.
the same locations.

2 Disconnect all the cables from the backplane.
3 Disconnect the control panel cable from the midplane.
4 Remove the drive cage from the chassis.
Steps
1 Using the Phillips #1 screwdriver, remove the screw that secures the thermal sensor board assembly to the drive cage.
2 Disconnect the cable from the sensor board assembly.

3 Remove the screw that secures the sensor board to the drive cage, and lift the board away.
Figure 78. Removing the sensor board
Next step
1 Install the sensor board.
Installing the thermal sensor board

Prerequisite
properly on the chassis to prevent them from being pinched or crimped.
Steps
1 Install the thermal sensor board into the sensor board holder, and using the Phillips #1 screwdriver, secure it to the holder.
2 Connect the cable to the sensor board assembly.
3 Install the sensor board assembly into the drive cage.
4 Replace the screw that secures the sensor board assembly to the drive cage.

Figure 79. Installing the sensor board assembly
Next steps
1 Replace the drive cage into the chassis.
2 Connect all the cables to the backplane.
3 Connect the control panel cables to the midplane.
4 Install the drives.
Entering the system Service Tag by using System

Setup
If Easy Restore fails to restore the Service Tag, use System Setup to enter the Service Tag.
1 Turn on the system.

2 Press F2 to enter System Setup.
3 Click Service Tag Settings.
4 Enter the Service Tag.
NOTE: You can enter the Service Tag only when the Service Tag field is empty. Ensure that you enter the correct
Service Tag. After the Service Tag is entered, it cannot be updated or changed.
5 Click OK.
6 Import your new or existing iDRAC Enterprise license.
For more information, see the Integrated Dell Remote Access Controller User's Guide at Dell.com/idracmanuals.
Installation
The sections below contains information about installation procedures of the enclosure into the rack rails.
Rack rails
The rail offerings consist of the static rails only.
The static rails do not support serviceability in the rack and are thus not compatible with the CMA.

Figure 80. Static rail
One key factor in selecting the proper rails is identifying the type of rack in which they are installed. The static rails support tool-less
mounting in 19” wide, EIA-310-E-compliant square hole and unthreaded round hole 4-post racks. It also support tooled mounting in
threaded hole 4-post racks and mounting in 2-post-Telco racks.
Table 9. Static rails
Rail Mounting Rail type Supported rack types

identifi interface
er 4-Post 2-Post
Square Round Thread Flush Center
B4 ReadyRails Static √ √ √ √ √
NOTE: Screws are not included in either kit because threaded racks are offered with various thread designations. Users must
therefore provide their own screws when mounting the rails in threaded racks.
Other key factors governing proper rail selection include the following:
• Spacing between the front and rear mounting flanges of the rack
• Type and location of any equipment mounted in the back of the rack such as power distribution units (PDUs)
• Overall depth of the rack
The static rails offer a greater adjustability range and a smaller overall mounting footprint than the sliding rails. This feature is due to their
reduced complexity and lack of need for CMA support.
Table 10. Static rails adjustability

Rail Rail Type Rail Adjustable Range—mm Rail Depth—mm
Identifier
Square Round Threaded Without With CMA
CMA
Min Max Min Max Min Max
B4 Static 608 879 594 872 604 890 622 N/A

NOTE: The adjustment range of the rails is a function of the type of rack in which they are being mounted. The Min/Max values
listed above represent the allowable distance between the front and rear mounting flanges in the rack. Rail depth without the
CMA represents the minimum depth of the rail with the outer CMA brackets removed-if applicable as measured from the front
mounting flanges of the rack.
Installing the system into the rack

The following steps are procedures to install the system into the rack:
1 Install the optional chassis retention bracket and insert two cage nuts in the two rack holes above the rail.
NOTE: If the system is a 1U system, the optional chassis retention brackets cannot be installed.
NOTE: The cage nuts must be installed before installing the system in the rack.
2 Position the system on the rail.
3 Hold the system rack ears and slide the system into the rack until the system is seated in place.
4 Tighten the thumbscrews to secure the system.
Removing the system from the rack

The following steps are procedures to remove the system from the rack:
1 Loosen the thumbscrews to release the system.

2 Pull and remove the system out from the rail.
Figure 81. Diagram and description of installing the system into the rack

1 Thumbscrews (2)
2 Rack ear (2)
3 System
4 Cage nut (2)
Figure 82. Diagram and description of installing the optional chassis retention bracket
1 Cage nut (2)

2 Screws (2)
3 Chassis retention bracket
Accessing system information by using QRL

Prerequisites
Ensure that your smartphone or tablet has the QR code scanner installed.
The QRL includes the following information about your system:
• How-to videos
• Reference materials, including the Installtion and Service Manual, and mechanical overview
• Your system service tag to quickly access your specific hardware configuration and warranty information

• A direct link to Dell to contact technical assistance and sales teams
Steps
1 Go to Dell.com/qrl and navigate to your specific product or
2 Use your smartphone or tablet to scan the model-specific Quick Resource (QR) code on your system or in the Quick Resource
Locator section.
Quick Resource Locator for C6400 and C6420 systems
Figure 83. Quick Resource Locator for PowerEdge C6400 and C6420 systems

3
Technology and components
The following sections contain information about the technology and components in the Dell EMC PowerEdge system.
Topics:
• System fan
• Linking board
• Backplane
• Power interposer board
• Midplane board
• Chassis Management board
• Power supplies
System fan
The PowerEdge C6400 systems support four 60-mm high-efficiency fans mounted in a fan assembly. The fan assembly is located in the
chassis between the hard drive bay and server sleds. Each fan has a power connector located near the fans allowing easy access to the fan
cable. These fans are not hot-swappable.
Figure 84. Cooling fan
NOTE: The arrows are steps to remove the cooling fan. Remove the cooling fan cable first, and then lift the cooling fan from the
cooling fan assembly.
Technology and components 83

The embedded server management logic in the system controls and monitors the speed of the fans. A fan failure or temperature that is too
high in the system results in a notification from the BMC and the remaining fans ramp to 100% duty cycle.
Linking board
The PowerEdge C6400 supports two linking boards used to bridge the sled server and chassis. It bypass SATA and PCIe signals from the
system board to the hard drive backplane. One linking board can support two sleds. There are two linking boards in a chassis to support
four sleds. There are two types of Linking Board, one supports both SATA/SAS and PCIE (DPN: MP84G) , one only supports SATA/
SAS(DPN: VNFMF). Both of them share same PCB. The dimension of the linking board is 73.2 mm x 46.6 mm.
Table 11. Linking board

Linking board with SATA/SAS and PCIe support Linking board with SATA/SAS
support
Figure 85. Linking board with SATA/SAS and PCIe support Figure 86. Linking board with
SATA/SAS support
Backplane
The following pages contain information about the backplane and middle plane connectors.
NOTE: SGPIO features will only be available on all passive backplanes at Quarter 4 2017's firmware release.
The image below shows the 12 x 3.5-in hard drive backplane:
84 Technology and components

Figure 87. 12 x 3.5-in hard drive backplane
1 SATA/SAS connector (12)

2 Backplane signal cable to sled 4 connector
4 Backplane power connector
6 Backplane signal cable connector
The image below shows the 24 x 2.5-in hard drive backplane:
Figure 88. 24 x 2.5-in hard drive backplane
1 SATA connector (24)

2 Expander power connector
3 Backplane power connector
4 Backplane signal connector
The image below shows the 24 x 2.5-in hard drive backplane with NVMe:
Figure 89. 24 x 2.5-in hard drive backplane with NVMe
1 SATA connector (24)

2 Signal cable to sled 4
3 NVMe ports 19 and 18 connect to sled 4

6 Connector for chassis management board cable
SAS Expander board

The SAS Expander board is necessary to achieve higher, single-volume hard drive configurations. An expander board allows the C6400 to
maximize the hard drive space in the hard drive bay. A single expander board supports up to 24 hard drives in the C6400 chassis. The
expander board is integrated with the 24 x 2.5-in backplane via MiniSAS hard drive connectors.
The image below shows the SAS Expander board:
Figure 90. SAS Expander board
1 Expander signal cable connector 2

2 Power connector
3 SAS expander F connector
4 SAS expander E connector
5 SAS expander D connector
6 PERC 3 expander and PERC 4 expander connector
7 PERC 1 expander and PERC 2 expander connector
8 SAS expander C connector
9 SAS expander B connector
10 SAS expander A connector
11 Expander signal cable connector 1

Backplane cable routing
Figure 91. Cabling the 24 x 2.5-inch backplane with NVMe hard drives
1 Backplane 2 Backplane signal cable 1(BP: BPSIG2 to MB: left linking

board)
3 Backplane signal cable 2(BP: BPSIG1 to MB: left linking board) 4 SATA cable for sled 1(BP: sled 1 to MB: left linking board)
5 NVMe cable for sled 1(BP: BP_NVMe0 sled 1 to MB: left linking 6 NVMe cable for sled 2(BP: BP_NVMe6 sled 2 to MB: left
board) linking board)
7 NVMe connector for sled 2 8 NVMe connector for sled 1
9 Left linking board 10 Linking board connector for sled 1
11 Linking board connector for sled 2 12 SATA cable for sled 2(BP: sled 2 to MB: left linking board)
13 NVMe cable for sled 3(BP: BP_NVMe12 sled 3 to MB: Right 14 NVMe cable for sled 4(BP: BP_NVMe18 sled 4 to MB: right
linking board) linking board)
15 NVMe connector for sled 4 16 NVMe connector for sled 3
17 Right linking board 18 Linking board connector for sled 3
19 Linking board connector for sled 4 20 SATA cable for sled 3(BP: sled 3 to MB: right linking board)
21 SATA cable for sled 4(BP: sled 4 to MB: right linking board) 22 Backplane signal cable 3(BP: BPSIG2 to MB: right linking
board)
23 Backplane signal cable 4(BP: BPSIG3 to MB: Right linking
board)

Figure 92. Cabling the 24 x 2.5-inch backplane with expander board
1 Backplane to expander board signal cable 2 Expander SAS B cable (BP: EXP_SAS B to Expander Board
EXP_SAS B)
3 Backplane 4 Expander SAS A cable(BP: EXP_SAS A to Expander Board
EXP_SAS A)
5 Expander board 6 Expander SAS C cable(BP: EXP_SAS C to Expander Board
EXP_SAS C)
7 PERC cable from sled 2(EB: EXP_PERC2 sled 2 to left linking 8 PERC cable from sled 1(EB: EXP_PERC1 sled 1 to left linking
board) board)
11 Linking board connector for sled 2 12 PERC cable from sled 4(EB: EXP_PERC4 sled 3 to right
linking board)
13 PERC cable from sled 3(EB: EXP_PERC3 sled 3 to right linking 14 right linking board
board)
15 Linking board connector for sled 3 16 Linking board connector for sled 4
17 Expander SAS E cable(BP: EXP_SAS E to Expander Board 18 Expander SAS F cable(BP: EXP_SAS F to Expander Board
EXP_SAS E) EXP_SAS F)
19 Backplane to expander board power cable 20 Expander SAS D cable(BP: EXP_SAS D to Expander Board
EXP_SAS D)

Figure 93. Cabling the 12 x 3.5-inch backplane
1 Backplane 2 SATA cable for sled 1(BP: SATA cable sled 1 to left linking
board)
3 Signal cable sled 1(BP: BP_SIG1 to left linking board) 4 Linking board connector for sled 1
7 SATA cable for sled 2(BP: SATA cable sled 2 to left linking 8 Signal cable sled 2(BP: BP_SIG2 to left linking board)
board)
9 SATA cable for sled 3(BP: SATA cable sled 3 to right linking 10 Signal cable sled 3(BP: BP_SIG3 to left linking board)
board)
11 Right linking board 12 Linking board connector for sled 3
13 Linking board connector for sled 4 14 SATA cable for sled 4(BP: SATA cable sled 4 to right linking
board)
15 Signal cable sled 4(BP: BP_SIG4 to left linking board)

Sled to hard drive mapping
Figure 94. Sled to drive mapping for the enclosure with 24 x 2.5-inch drives
1 Drives 0–5 mapped to sled 1 2 Drives 6–11 mapped to sled 2

5 (Optional) NVMe hard drive location
Figure 95. Sled to drive mapping for the enclosure with 12 x 3.5-inch drives

NOTE: The warranty of the drives are linked to the Service Tag of the corresponding sled.
Expander zoning
A SAS expander board allows higher, single-volume hard drive configurations. An integrated expander device expands each sleds hard drive
footprint.
The PowerEdge 6400 enclosure allows four sleds to access a single expander controller at the same time. there are two zoning options
available, they are:
• Up to 6 SAS/SATA device of each sled in Split Mode (6+6+6+6)

• Up to 12 SAS/SATA device of sled 1 and sled 3 in Zoning Mode (12+12)
NOTE:
• Install expander firmware 2.07 (X25-00) or later to support these configurations

• The expander mode works only with a PERC card, and is not supported by the onboard SATA controller.

Power interposer board
The power interposer board is an electrical interface connection that distributes power to other boards in the system such as the Chassis
Manager board, backplane, and midplane boards.
There are two sides to the Power Interposer Board (PIB). The top side has two slots to connect two power supplies. The bottom slot of
the PIB distributes power to the Chassis Manager (CM), hard drive backplane, and the midplane board. The board dimension for the PIB is
86 mm x 81 mm.
Figure 96. Power interposer board (PIB)
1 backplane power connector

2 release lever
3 chassis management board power connector
4 chassis management board signal connector
5 ground power cable connector for right midplane
6 +12 V power cable connector for right midplane
7 ground power cable connector for left midplane
8 +12 V power cable connector for left midplane
The image below shows the block diagram of the PIB:

Figure 97. PIB block diagram
Midplane board
The midplane board is used to bridge power from the system chassis to the server sleds. One midplane board is able to support to sleds.
There are two midplane boards in the PowerEdge C6400 to support four sleds. The midplane board dimension is 76.48 mm x 59.5 mm.
The image below shows the midplane board and the components description:
Figure 98. Midplane board
1 Midplane signal connector 2

2 Midplane signal connector 3
3 Midplane signal connector
4 Midplane +12 V power connector
5 Midplane ground power connector

The image below is the block diagram for the midplane board:
Figure 99. Midplane board diagram
Chassis Management board

The PowerEdge C6400 Chassis Management (CM) board is based on MCU (NXP LPC1833) + FPGA (ALTERA 10M04). The CM board
controls the items below:
• Fan speed control

• Sled power, temperature, and monitoring status
• Backplane power, and monitoring status
• Power supply current, and monitoring status
The image below shows the CM board with descriptions of the connectors:

Figure 100. Chassis Management (CM) board
1 fan cage 1 connector for fans 1 and 2

2 left midplane signal cable
3 chassis management board signal cable to backplane
4 chassis management board power connector from PIB
5 chassis management board signal cable to PIB
6 FPGA connector
7 MCU connector
8 COM connector
9 firmware jumpers
10 right midplane signal cable
11 fan cage 2 connector
The image below is the block diagram for the CM board:

Figure 101. Chassis Management (CM) board block diagram
Communication failure with Chassis Manager (CM)

With IPMB, power supply sensors are gathered from the CM. Communication errors may occur with the CM and iDRAC. The
communication failure could be seen as response 0xc3 as shown below:
Figure 102. Communication failure response 0xc3
An example of a successful communication response is shown below:
Figure 103. Successful communication response
Table 12. Possible communication failure solutions

Problem Possible solutions
Chassis Manager (CM) communication failure • Check for CM to linking board cable connections.

Problem Possible solutions
• Reset the iDRAC.

• Reset the CM.
Sensor disabled • Reset the iDRAC.
Power supplies
Energy Smart power supplies have intelligent features, such as the ability to dynamically optimize efficiency while maintaining availability and
redundancy. Also featured are enhanced power consumption reduction technologies, such as high-efficiency power conversion and
advanced thermal-management techniques, and embedded power-management features, including high-accuracy power monitoring.
The following power supply unit options are available for the Dell PowerEdge C6420:
• 1600 W AC
• 2000 W AC
• 2400 W AC Power
The image below shows the position of the PowerEdge C6420 power supplies—highlighted in red:
Figure 104. PowerEdge C6420 power supplies
Power supply efficiency

Table 13. Power supply efficiency
Parameter Class 10% 20% 50% 100%

descriptio
n
Efficiency Platinum N/A 85% 88% 90%
at 115 Vac
Efficiency Platinum 87% 90% 94% 91%

at 230 Vac
Auxiliary Platinum 58% 73% 79%

power
efficiency
at 230 Vac
—PFC
ON
Auxiliary Platinum 64% 77% 84%

power
efficiency

Parameter Class 10% 20% 50% 100%
descriptio
n
at 230 Vac
—PFC
OFF
NOTE: Efficiency values are at minimum values.
NOTE: Power supplies are certified to be compliant with the 80 Plus Program.
Fault tolerant redundancy

Policy Budgeting
Fault Tolerant Redundancy is a hybrid redundancy mode which uses the power capacity limits of a single Power Supply Unit for Power
Budget Checks, similar to Grid Redundancy, but enforces added performance limiting after redundancy is lost. Previous generation modular
sleds will still work with Fault Tolerant Redundancy enabled, but they treat it identically to Grid Redundancy.
When the maximum potential power needs of installed chassis components exceeds the capacity of a single Power Supply, the Chassis
Management Controller (CMC) will deny power on to further chassis components. The Power Budget Checks for Fault Tolerant
Redundancy ensure that the Shared Infrastructure Chassis will remain operational in the event of maximum potential workload conditions at
the time of an AC Grid or PSU Supply failure. Using the maximum potential is a conservative target that ensures continued operation across
the wide range of potential customer workloads for a given configuration.
Policy philosophy
Similar to Grid Redundancy, Fault Tolerant Redundancy is a conservative redundancy policy that ensures that the Shared Infrastructure
Chassis and all installed components remain operational with no risk of shutdown in the event of an AC Grid or Power Supply failure even
when all installed components are simultaneously running at their worst case power consumption. New for Fault Tolerant Redundancy is a
limit on peak performance that occurs when redundancy is lost. Fault Tolerant Redundancy can maintain the same conservative standards
of redundancy as traditional Grid Redundancy by limiting peak power after redundancy is lost to levels which fit within the surviving Power
Supply.
Policy control
As with all Redundancy Policies, while the two Power Supplies remain healthy, load is shared evenly between them and the capacity of both
Power Supplies is made available for use. In the event of an AC Grid or Power Supply failure, Power Controls will rapidly engage to restrict
the power consumption of the chassis and ensure that consumption is restricted to what a single Power Supply can support. Besides the
controls used with all Redundancy Policies, Fault Tolerant Redundancy also implements more performance limiting functionality which
restricts the peak power after redundancy loss.
For a fully loaded chassis running at maximum potential power this can result in some observed performance reduction as the chassis
Power Control limits are enforced. In practice, customer workloads are often not at the maximum potential power and so practical
performance reduction during an AC Grid or Power Supply failure is often minor or even unnoticeable.

Power on behavior after fault
In the event of an AC Grid or Power Supply failure, new chassis components are enabled to power on as long as the maximum potential
power of the newly installed chassis components does not exceed the capacity of a single Power Supply when evaluated by the chassis
Power Budget Checks. This means that, while customers will note a chassis "Critical" state due to the loss of redundancy, they will observe
no difference in which chassis components are enabled to power on (both before and after a redundancy fault). This is because in both
cases, the chassis Power Budget Checks use the capacity of only a single Power Supply. This is a key difference from the other Shared
Infrastructure Chassis Redundancy Policies.
Logging behavior
As with all Redundancy Policies, when a Power Supply Unit fails, a log message is generated. For the Fault Tolerant Redundancy policy, a
log message will also be recorded to note a "Loss of Redundancy". This message indicates that the system is continuing to operate in a
Non-Redundant state, and action is necessary to either restore power to a failed AC Grid or replace a failed Power Supply Unit. Details in
log messages make it possible to distinguish between these two cases. Finally, in case power-on of a chassis component is denied due to a
Power Budget Check, the denial is logged both in CMC logs and iDRAC logs (in the case of compute sleds).

4
Technical specifications
The technical and environmental specifications of your system are outlined in this section.
Topics:
• Dimensions of the Dell EMC PowerEdge C6400 enclosure

• Chassis weight
• PSU specifications
• Chassis management board specifications
• Drives and storage specifications
• Midplane specifications
• Environmental specifications
100 Technical specifications

Dimensions of the Dell EMC PowerEdge C6400
enclosure
Figure 105. Dimensions of PowerEdge C6400 enclosure
Table 14. Dimensions of the PowerEdge C6400 enclosure
Xa Xb Y Za Zb Zc
482.6 mm (19 inches) 448 mm (17.63 86.8 mm (3.41 26.8 mm (1.05 763.2 mm (30.28 797.3 mm (31.38
inches) inches) inches) inches) inches)
Chassis weight
Table 15. Chassis weight of the Dell EMC PowerEdge C6400 enclosure with PowerEdge C6420 sleds
System Maximum weight (with all sleds and drives)
12 x 3.5-inch hard drive systems 43.62 Kg (96.16 lb)
24 x 2.5-inch hard drive systems 41.46 Kg (91.40 lb)
No backplane systems 34.56 Kg (76.19 lb)
Technical specifications 101

PSU specifications
The Dell EMC PowerEdge C6400 enclosure supports two AC power supply units (PSUs).
Table 16. PSU specifications
PSU wattage Class Heat dissipation Frequency Voltage Maximum input current
(maximum)
100–240 V AC,
2400 W AC Platinum 9000 BTU/hr 50/60 Hz 14 A–16 A
autoranging
100–240 V AC,
2000 W AC Platinum 7500 BTU/hr 50/60 Hz 11.5 A
autoranging
100–240 V AC,
1600 W AC Platinum 6000 BTU/hr 50/60 Hz 10 A
autoranging
NOTE: Heat dissipation is calculated using the PSU wattage rating.
NOTE: This system is also designed to connect to the IT power systems with a phase to phase voltage not exceeding 240 V.
NOTE: If a system with 2400 W AC PSU operates at low line 100–120 V AC, then the power rating per PSU is derated to 1400 W.
NOTE: If a system with 2000 W AC PSU operates at low line 100–120 V AC, then the power rating per PSU is derated to 1000 W.
NOTE: If system with 1600 W AC PSU operates at low line 100–120 V AC, then the power rating per PSU is derated to 800 W.
Chassis management board specifications
Figure 106. Chassis management board specifications
1 Fan cage 1 connector for fans 1 and 2 2 Left midplane signal cable
3 Chassis management board signal cable to backplane 4 Chassis management board power connector from PIB

5 Chassis management board signal cable to PIB 6 FPGA connector
7 MCU connector 8 COM connector
9 Firmware jumpers 10 Right midplane signal cable
11 Fan cage 2 connector for fans 3 and 4
Drives and storage specifications

The Dell EMC PowerEdge C6400 enclosure supports SAS and SATA hard drives and Solid State Drives (SSDs).
Table 17. Supported drive options for the Dell EMC PowerEdge C6400 enclosure
Maximum number of drives in the enclosure Maximum number of drives assigned per sled
12 x 3.5-inch drive systems Three SAS or SATA hard drives and SSDs per sled
24 x 2.5-inch drive systems Six SAS or SATA hard drives and SSDs per sled
24 x 2.5-inch drive systems with NVMe The NVMe backplane supports either of these configurations:
• Two NVMe drives and four SAS or SATA hard drives and SSDs
per sled
• Six SAS or SATA hard drives and SSDs per sled
M.2 SATA drive (optional) The supported capacity of the M.2 SATA card is up to 240 GB
NOTE: The M.2 SATA card can be installed on the x16 riser
slot (slot 5).
Micro-SD card (optional) for boot (up to 64 GB) One on each PCIe riser of each sled
Table 18. Supported RAID options with M.2 SATA drives
Options Single M.2 SATA drive without RAID Dual M.2 SATA drives with hardware RAID
Hardware RAID No Yes
RAID Mode N/A RAID 1
Number of drives supported 1 2
Supported CPUs CPU 1 CPU 1 and CPU 2

Midplane specifications
Figure 107. Midplane specifications
1 Midplane signal connector 2 2 Thermal sensor cable connector

3 Chassis management board cable connector 4 Midplane +12 V power cable connector
5 Midplane power cable ground connector
Environmental specifications
The sections below contains information about the environmental specifications of the system.
NOTE: For additional information about environmental certifications, please refer to the Product Environmental Datasheet
located with the Manuals & Documents on Dell.com/poweredgemanuals
Standard operating temperature specifications

NOTE:
1 Not available: Indicates that the configuration is not offered by Dell EMC.
2 Not supported: Indicates that the configuration is not thermally supported.
NOTE: All components including the DIMMs, communication cards, M.2 SATA, and PERC cards can be supported with sufficient
thermal margin if the ambient temperature is equal to or below to the maximum continuous operating temperature listed in these
tables except for the Mellanox DP LP card and Intel Rush Creek card.
Table 19. Standard operating temperature specifications
Standard operating temperature Specifications

Temperature ranges (for altitude less than 950 m or 3117 ft) 10°C–35°C (50°F–95°F) with no direct sunlight on the
equipment.

NOTE: Some configurations require a lower ambient temperature. For more information, see the following tables.
Table 20. Maximum continuous operating temperature for nonfabric dual processor configuration
Max No-BP
3.5-inch chassis 2.5-inch chassis
memor Chassis
TDP Processo Heat sink
Watts r model model y/ 4x 24x 20x 12x 8x 4x
proces 12x 8x 16x
Drives Drive Drive Driv Drive Drive Drive N/A
sor Drives Drives
s s es s s s
CPU1: CPU1:
FMM2M | 6|
8280 20 21 21 21 21 30
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
FMM2M | 6|
8280L 20 21 21 21 21 30
CPU2: CPU2:
V2DRD 8
Not Not Not
CPU1: CPU1: Not
Suppo Supp Supp
FMM2M | 6| Suppor
205 W 8280M rted orted orte 20 21 21 21 21 30
CPU2: CPU2: ted
(10°C (11°C d(19°
V2DRD 8 (2°C)
) ) C)
CPU1: CPU1:
FMM2M | 6|
8270 20 21 21 21 21 30
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
FMM2M | 6|
8268 20 21 21 21 21 30
CPU2: CPU2:
V2DRD 8
CPU1: CPU1: Not Not Not

FMM2M | 6| Suppor Suppo Supp
200 W 6254 20 21 22 22 22 22 30
CPU2: CPU2: ted(6° rted(1 orted(
V2DRD 8 C) 4°C) 15°C)
CPU1: CPU1:
JYKMM | 8|
8276 30 30 30 30 30 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
8276L 30 30 30 30 30 35 35
CPU2: CPU2: Not Not Not
V2DRD 8 Suppor Suppo Supp
165 W
CPU1: CPU1: ted(11° rted(1 orted(
JYKMM | 8| C) 8°C) 19°C)
8276M 30 30 30 30 30 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
8260 30 30 30 30 30 35 35
CPU2: CPU2:
V2DRD 8

Max No-BP
memor Chassis
TDP Processo Heat sink y/ 4x 24x 20x 12x 8x 4x
Watts r model model 12x 8x 16x
proces
sor Drives Drives
s s es s s s
CPU1: CPU1:
JYKMM | 8|
8260L 30 30 30 30 30 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
8260M 30 30 30 30 30 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
8260C 30 30 30 30 30 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
6252 21 23 30 30 30 30 30 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
6248 21 23 30 30 30 30 30 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
6240 21 23 30 30 30 30 30 35 35
CPU2: CPU2: Not
V2DRD 8 Suppor
150 W
CPU1: CPU1: ted(14
JYKMM | 8| °C)
6242 21 23 30 30 30 30 30 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
FMM2M | 6|
6244 21 23 30 30 30 30 30 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
FMM2M | 6|
6240C 21 23 30 30 30 30 30 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
6230 25 30 30 30 30 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
125 W
CPU1: CPU1:
JYKMM | 8|
5220 25 30 30 30 30 35 35 35 35 35
CPU2: CPU2:
V2DRD 8

Max No-BP
memor Chassis
proces
sor Drives Drives
s s es s s s
CPU1: CPU1:
JYKMM | 8|
5218 25 30 30 30 30 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
5218B 25 30 30 30 30 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
8253 25 30 30 30 30 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
6238T 25 30 30 30 30 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
6230N 25 30 30 30 30 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
FMM2M | 6|
115 W 5217 25 30 30 30 30 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
FMM2M | 6|
5218T 30 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
FMM2M | 6|
5218N 30 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
105 W
CPU1: CPU1:
FMM2M | 6|
5222 30 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
FMM2M | 6|
8256 30 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
100 W 4216 30 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8

Max No-BP
memor Chassis
proces
sor Drives Drives
s s es s s s
CPU1: CPU1:
JYKMM | 8|
5215 35 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
5215M 35 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
5215L 35 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
4215 35 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
85 W 4214 35 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
4214C 35 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
4210 35 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
4208 35 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
3204 35 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8
CPU1: CPU1:
JYKMM | 8|
70 W 4209T 35 35 35 35 35 35 35 35 35 35
CPU2: CPU2:
V2DRD 8

Table 21. Maximum continuous operating temperature for non-fabric single processor configuration
Max No-BP
3.5-inch chassis 2.5-inch chassis Chassis
Processor Heat sink memor
TDP Watts y/ 12x 8x 4x 24x 16x
model model
Drive Drive Drive 20x Drive 12x
process 8x 4x
Drive N/A
or Drives Drives Drives Drives
s s s s s
CPU1:
8280 CPU1: 6 30 30 30 35 35 35 35 35 35 35
FMM2M
CPU1:
8280L CPU1: 6 30 30 30 35 35 35 35 35 35 35
FMM2M
CPU1:
205W 8280M CPU1: 6 30 30 30 35 35 35 35 35 35 35
FMM2M
CPU1:
8270 CPU1: 6 30 30 30 35 35 35 35 35 35 35
FMM2M
CPU1:
8268 CPU1: 6 30 30 30 35 35 35 35 35 35 35
FMM2M
CPU1:
200 W 6254 CPU1: 6 30 30 30 35 35 35 35 35 35 35
FMM2M
CPU1:
6212U CPU1: 8 30 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
8276 CPU1: 8 30 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
8276L CPU1: 8 30 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
8276M CPU1: 8 30 35 35 35 35 35 35 35 35 35
JYKMM
165 W
CPU1:
8260 CPU1: 8 30 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
8260L CPU1: 8 30 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
8260M CPU1: 8 30 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
8260C CPU1: 8 30 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
6210U CPU1: 8 30 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
6252 CPU1: 8 30 35 35 35 35 35 35 35 35 35
JYKMM
150 W
CPU1:
6248 CPU1: 8 30 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
6240 CPU1: 8 30 35 35 35 35 35 35 35 35 35
JYKMM

Max No-BP
model model
process 8x 4x
Drive N/A
s s s s s
CPU1:
6242 CPU1: 8 30 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
6244 CPU1: 6 30 35 35 35 35 35 35 35 35 35
FMM2M
CPU1:
6240C CPU1: 6 30 35 35 35 35 35 35 35 35 35
FMM2M
CPU1:
6230 CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
5220 CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
5218 CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
125W 5218B CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
8253 CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
6238T CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
6230N CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
115 W 5217 CPU1: 6 30 35 35 35 35 35 35 35 35 35
FMM2M
CPU1:
5218T CPU1: 6 30 35 35 35 35 35 35 35 35 35
FMM2M
CPU1:
5218N CPU1: 6 30 35 35 35 35 35 35 35 35 35
FMM2M
105 W
CPU1:
5222 CPU1: 6 30 35 35 35 35 35 35 35 35 35
FMM2M
CPU1:
8256 CPU1: 6 30 35 35 35 35 35 35 35 35 35
FMM2M
CPU1:
100 W 4216 CPU1: 8 30 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
5215 CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
85 W 5215M CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
5215L CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM

Max No-BP
model model
process 8x 4x
Drive N/A
s s s s s
CPU1:
4215 CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
4214 CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
4214C CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
4210 CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
4208 CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
3204 CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
CPU1:
70 W 4209T CPU1: 8 35 35 35 35 35 35 35 35 35 35
JYKMM
Table 22. Configuration Restrictions with Mellanox Navi Dual Port Card with Active (Optical) connectivity
No-BP
TDP Watts Chassis
12x HDDs 8x HDDs 4x HDDs 24x HDDs 16x HDDs 8x HDDs 4x HDDs N/A
Not Not Not Not Not Not Not
205 W 23
supported supported supported supported supported supported supported
Not Not Not Not Not Not Not

200 W 23
Not Not Not Not Not

173 W 24 24 28
supported supported supported supported supported
Not Not Not

165 W 24 25 25 26 29
supported supported supported
Not Not Not

160 W 24 25 26 26 30
Not Not Not

150 W 26 27 28 28 31
Not
140 W 23 25 28 29 29 30 33
supported
Not
135 W 24 25 29 30 30 31 33
supported
Not
130 W 24 26 30 31 31 31 34
supported
125 W 20 25 27 30 31 32 32 35

No-BP
TDP Watts Chassis
115 W 21 27 28 32 33 34 34 >35
113 W 21 27 28 32 33 34 34 >35
105 W 22 28 30 34 35 >35 >35 >35
85 W 23 32 33 >35 >35 >35 >35 >35
70 W 25 34 >35 >35 >35 >35 >35 >35
Table 23. Configuration Restrictions with Intel Rush Creek
No-BP
TDP Watts Chassis
205 W Not Not Not Not Not 20 20 23
200 W Not Not Not Not Not 21 21 24

173 W Not Not Not 20 20 23 24 28

165 W Not Not Not 22 22 24 25 29

160 W Not Not Not 22 22 24 26 29

150 W Not Not Not 24 24 26 27 30

140 W Not Not Not 26 26 27 28 31

135 W Not Not 20 26 26 28 29 32

supported supported
130 W Not Not 20 27 27 29 29 33

supported supported
125 W Not Not 21 28 28 30 30 33

supported supported
115W Not 21 23 29 31 31 32 34
supported
105 W 20 23 24 30 33 33 34 >35
85 W 24 26 27 34 >35 >35 >35 >35
70 W 25 28 29 >35 >35 >35 >35 >35

Table 24. Configuration Restrictions with Intel NVMe SSD AIC P4800X
No-BP
TDP Watts Chassis
205 W Not Not Not Not Not Not Not Not
supported supported supported supported supported supported supported supported
200 W Not Not Not Not Not Not Not Not

supported supported supported supported supported supported supported supported
173 W Not Not Not Not Not Not Not 20



150 W Not Not Not Not 20 20 20 25

supported supported supported supported
140 W Not Not Not 20 20 20 20 25

135 W Not Not Not 20 20 20 20 25

130 W Not Not Not 20 20 20 20 25

125 W Not Not Not 20 25 25 25 30

115 W Not Not Not 25 25 25 25 30

105 W Not Not Not 25 25 25 25 30

85 W Not Not Not 30 30 30 30 >35

70 W Not Not Not >35 >35 >35 >35 >35

Expanded operating temperature specifications

Table 25. Expanded operating temperature
Expanded operating temperature Specifications
Continuous operation 5°C–40°C at 5% to 85% RH with maximum 29°C dew point.

Expanded operating temperature Specifications
NOTE: Outside the standard operating temperature (10°C–35°C), the system can
operate continuously in temperatures as low as 5°C and as high as 40°C.
For temperatures between 35°C and 40°C, derate maximum allowable temperature by 1°C
per 175 m above 950 m (1°F per 319 ft).
≤ 1% of annual operating hours –5°C–45°C at 5% to 90% RH with maximum 29°C dew point.
NOTE: Outside the standard operating temperature (10°C–35°C), the system can
operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating
hours.
For temperatures between 40°C-45°C, derate maximum allowable temperature by 1°C per
125 m above 950 m (1°F per 228 ft).
NOTE: When operating in the expanded temperature range, system performance may be impacted.
NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported in the System Event
Log.
Operating temperature derating specifications
Table 26. Operating temperature
Operating temperature derating Specifications

< 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft)
above 950 meters (3,117 ft).
35°C–40°C (95°F–104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above

950 meters (3,117 ft).
> 45°C (113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above
950 meters (3,117 ft).
Relative humidity specifications
Table 27. Relative humidity specifications
Relative humidity Specifications

Storage 5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere
must be noncondensing always.
Operating 10% to 80% relative humidity with 29°C (84.2°F) maximum dew
point.

Temperature specifications
Table 28. Temperature specifications
Temperature Specifications
Storage –40°C–65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C–35°C (50°F to 95°F) with no direct sunlight on the
equipment.
Fresh air For information about fresh air, see Expanded Operating
Temperature section.
Maximum temperature gradient (operating and storage) 20°C/h (68°F/h)
NOTE: Some configurations require a lower ambient temperature for more information, see the Standard operating temperature
specifications.
Particulate and gaseous contamination specifications

Table 29. Particulate contamination specifications
Particulate contamination Specifications

Air filtration Data center air filtration as defined by ISO
Class 8 per ISO 14644-1 with a 95% upper
confidence limit.
NOTE: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment
designed to be used outside a data center, in environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc

whiskers, or other conductive particles.
NOTE: This condition applies to data center and non-data center environments.
Corrosive dust Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data center environments.

Table 30. Gaseous contamination specifications
Gaseous contamination Specifications

Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Maximum vibration specifications

Table 31. Maximum vibration specifications
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum shock specifications

Table 32. Maximum shock specifications
Maximum shock Specifications

Operating 24 executed shock pulses 6 G in the positive and negative x, y, z
axis for up to 11 ms (four pulses on each side of the system).
Storage Six consecutively executed shock pulses of 71 G in the positive and

negative x, y, z axes for up to 2 ms (one pulse on each side of the
system).
Maximum altitude specifications

Table 33. Maximum altitude specifications
Maximum altitude Specifications

Operating 3048 m (10,000 ft)
Storage 12,000 m (39,370 ft)

Fresh Air Operation
Fresh Air operation restrictions
• Processors with a TDP greater than 105 W are not supported
• Support for processors of 85 W and below without PERC restrictions
• 3.5-inch drive configuration is not supported
• 114-mm heat sink is required for the processor in CPU1 socket
• Kerby-flat OCP is not supported
• M.2 card on DCS Mezzanine slot is not supported.
• NVMe SSD is not supported
• AEP DIMM and LRDIMM are not supported
• PCIe cards greater than 25 W are not supported
• H730 PERC and H330 support for 105-W processors
• No PERC restrictions for 85 W and lesser TDP processors

5
Troubleshooting your system
Safety first — for you and your system
NOTE: Solution validation was performed by using the factory shipped hardware configuration.
Topics:
• Troubleshooting a wet system

• Troubleshooting a damaged system
• Troubleshooting cooling problems
• System messages
Troubleshooting a wet system

1 Turn off the system and attached peripherals, and disconnect the system from the electrical outlet.
2 Remove the system cover.
3 Remove the following components (if installed) from the system:
• Power supply unit(s)
• Optical drive
• Hard drives
• Hard drive backplane
• USB memory key
• Hard drive tray
• Cooling shroud
• Expansion card risers (if installed)
• Expansion cards
• Cooling fan assembly (if installed)
• Cooling fan(s)
• Memory modules
• Processor(s) and heat sink(s)
• System board
4 Let the system dry thoroughly for at least 24 hours.
5 Reinstall the components you removed in step 3 except the expansion cards.
6 Install the system cover.
7 Turn on the system and attached peripherals.
8 If the system starts properly, turn off the system, and reinstall all the expansion cards that you removed.
9 Run the appropriate diagnostic test. For more information, see the Using system diagnostics section.
Troubleshooting a damaged system

1 Turn off the system and attached peripherals, and disconnect the system from the electrical outlet.
2 Remove the system cover.
118 Troubleshooting your system

3 Ensure that the following components are properly installed:
• cooling shroud
• expansion card risers (if installed)
• expansion cards
• power supply unit(s)
• cooling fan assembly (if installed)
• cooling fan(s)
• processor(s) and heat sink(s)
• memory modules
• drive carriers or cage
• drive backplane
4 Ensure that all cables are properly connected.
5 Install the system cover.
6 Run the appropriate diagnostic test. For more information, see the Using system diagnostics section.
Troubleshooting cooling problems

Ensure that the following conditions exist:
• System cover, cooling shroud, EMI filler panel, memory module blank, or back filler bracket is not removed.
• Ambient temperature is not higher than the system specific ambient temperature.
• External airflow is not obstructed.
• A cooling fan is not removed or has not failed.
• The expansion card installation guidelines have been followed.
Additional cooling can be added by one of the following methods:
From the iDRAC web GUI:
1 Click Hardware > Fans > Setup.

2 From the Fan Speed Offset drop-down list, select the cooling level required or set the minimum fan speed to a custom value.
From F2 System Setup:
1 Select iDRAC Settings > Thermal, and set a higher fan speed from the fan speed offset or minimum fan speed.
From RACADM commands:
1 Run the command racadm help system.thermalsettings
For more information, see Integrated Dell Remote Access User’s Guide at Dell.com/poweredgemanuals
System messages
For information about the event and error messages generated by the system firmware and agents that monitor system components, see
the Error Code Lookup page at qrl.dell.com
Troubleshooting your system 119

6
Documentation resources
This section provides information about the documentation resources for your system.
To view the document that is listed in the documentation resources table:
• From the Dell EMC support site:

a Click the documentation link that is provided in the Location column in the table.
b Click the required product or product version.
NOTE: To locate the product name and model, see the front of your system.
c On the Product Support page, click Manuals & documents.
• Using search engines:
– Type the name and version of the document in the search box.
Table 34. Additional documentation resources for your system
Task Document Location

Setting up your system For more information about installing and securing Dell.com/poweredgemanuals
the system into a rack, see the Rail Installation
Guide included with your rack solution.
For information about setting up your system, see

the Getting Started Guide document that is
shipped with your system.
Configuring your system For information about the iDRAC features, Dell.com/poweredgemanuals
configuring and logging in to iDRAC, and managing
your system remotely, see the Integrated Dell
Remote Access Controller User's Guide.
For information about understanding Remote
Access Controller Admin (RACADM)
subcommands and supported RACADM interfaces,
see the RACADM CLI Guide for iDRAC.
For information about Redfish and its protocol,

supported schema, and Redfish Eventing
implemented in iDRAC, see the Redfish API Guide.
For information about iDRAC property database

group and object descriptions, see the Attribute
Registry Guide.
For information about earlier versions of the iDRAC Dell.com/idracmanuals

documents.
To identify the version of iDRAC available on your

system, on the iDRAC web interface, click ? >
About.
For information about installing the operating Dell.com/operatingsystemmanuals

system, see the operating system documentation.
120 Documentation resources

Task Document Location
Managing your system For information about systems management Dell.com/poweredgemanuals
software offered by Dell, see the Dell OpenManage
Systems Management Overview Guide.
For information about setting up, using, and Dell.com/openmanagemanuals > OpenManage
troubleshooting OpenManage, see the Dell Server Administrator
OpenManage Server Administrator User’s Guide.
For information about installing, using, and Dell.com/openmanagemanuals > OpenManage

troubleshooting Dell OpenManage Essentials, see Essentials
the Dell OpenManage Essentials User’s Guide.
For information about installing and using Dell Dell.com/serviceabilitytools

SupportAssist, see the Dell EMC SupportAssist
Enterprise User’s Guide.
For information about partner programs enterprise Dell.com/openmanagemanuals

systems management, see the OpenManage
Connections Enterprise Systems Management
documents.
Working with the Dell For information about understanding the features Dell.com/storagecontrollermanuals
PowerEdge RAID controllers of the Dell PowerEdge RAID controllers (PERC),
Software RAID controllers, or BOSS card and
deploying the cards, see the Storage controller
documentation.
Understanding event and error For information about the event and error Dell.com/qrl
messages messages generated by the system firmware and
agents that monitor system components, see the
Error Code Lookup.
Troubleshooting your system For information about identifying and Dell.com/poweredgemanuals

troubleshooting the PowerEdge server issues, see
the Server Troubleshooting Guide.
Documentation resources 121

7
Document history
Table 35. Document history
Document History
Date Owner Page
Requested By Reviewed By Approved By
Change
Date: 2018-05-02 Owner: Mario Ranjit Page: All
Requested By: Reviewed By: Approved By: George Cherian
Changes: Initial Release
Date: 2018–08–06 Owner: Allen C Fredrick Page: All
Changes: Block update
Date: 2018–18–12 Owner: Karthik Sarvi C Page: All
Requested By: Fusion Ticket 39381396 Reviewed By: Approved By: George Cherian
Date: 2019–15–04 Owner: Mohammed Samruddin Page: All
Changes: MLK update
122 Document history

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Field Service Manual

Regulatory Model: E43S Series

2 Field service information.............................................................................................................................. 14

3 Technology and components........................................................................................................................83

5 Troubleshooting your system...................................................................................................................... 118

7 Document history....................................................................................................................................... 122

The PowerEdge C6400 chassis is available in two versions:

• 12 x 3.5-inch SAS/SATA drive

Figure 1. PowerEdge C6400 chassis with 12 x 3.5-inch hard drives

Figure 2. PowerEdge C6400 chassis with 24 x 2.5-inch hard drives

Supported USB peripherals on the sled

Internal hard drives

Orientation Support 4 x 1U nodes in 2U chassis.

Feature C6400 C6300

Orientation Support 4 x 1U nodes in 2U chassis. Support 4 x 1U nodes in 2U chassis.

Supported operating systems

• Canonical Ubuntu LTS

Figure 3. Sled service information

Figure 4. Cable routing

Figure 5. Mechanical overview

Figure 6. Link board and Drive cage

Figure 7. Jumper settings

Figure 8. System tasks

• Field service overview

Field service overview

14 Field service information

Figure 9. Front view of the enclosure with 24 x 2.5-inch drives

1 Left control panel 2 Drive bay

Figure 10. Front view of the enclosure with 12 x 3.5-inch drives

1 Left control panel 2 Drive bay

Field service information 15

Figure 11. Rear view of the enclosure with sleds

1 Sled 3 2 Power supply unit (2)

Inside the enclosure

16 Field service information

1 sled 2 right midplane

Figure 13. Inside the PowerEdge C6420 sled

1 sled handle 2 mezzanine card

Field service information 17

• Power off the system and all attached peripherals.

18 Field service information

NOTE: Catastrophic failures represent approximately 20 percent of ESD-related failures.

Figure 15. Intermittent, latent damage to a wiring trace

To avoid an ESD damage, ensure you:

• Use a wired ESD Wrist Strap that is properly grounded.

Field service information 19

Figure 16. Incorrect handling of components without ESD protection

ESD field service kit

Figure 17. ESD field service kit

20 Field service information

• Your wrist and bare metal of the hardware

ESD Wrist Strap tester

Figure 19. Wrist Strap tester

Field service information 21

Table 3. Placement of insulator elements

Unacceptable placement Acceptable placement

Consider the working environment

22 Field service information

Transporting sensitive components

ESD protection summary

Adhere to the following guidelines when lifting equipment:

Field service information 23

Recommended tools Optional tools