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LEDTECH ELECTRONICS CORP.

SPECIFICATION
PART NO. : LA(C) 4341-11 EWRN 0.43"(10.92mm)SINGLE DIGIT DISPLAY

Approved by

Checked by

Prepared by

Tung

Andy

Feng

LA(C)4341-11
Dimensions
10
1

0.43" SINGLE DIGIT DISPLAY

MARK

7.01
14

7.72 1.1

0.5 DIA.

10.92

19.05

2.54x6= 15.24

1.5 DIA.

12.7
A F G E D LHDP C RHDP B

3.5 MIN. 7.62

Notes:
1. The slope angle of any PIN may be 5.0 Max. 2. All dimensions are in mm, tolerance is 0.25mm unless otherwise noted.

Internal Circuit Diagram

LA4341-11
A B C

PIN. 3,14
D E F G LHDP RHDP

PIN 4,5,12 : NO PIN PIN. 1 13 10 8 7 2 11

LC4341-11
A B C

PIN. 3,14
D E F G LHDP RHDP

PIN 4,5,12 : NO PIN PIN. 1 13 10 8 7 2 11

VER.: 01

Date: 2007/01/16

Page: 1/5

LA(C)4341-11
Description
LED Chip Part No.
Material GaAsP/GaP GaAsP/GaP

0.43" SINGLE DIGIT DISPLAY

Face Color
Surface Grey Grey Segments White White

Emitting Color Orange Orange

LA 4341-11 EWRN LC 4341-11 EWRN

Absolute Maximum Ratings at Ta=25

Parameter
Power Dissipation Per Segment Pulse Current(1/10Duty Cycle,0.1ms Pulse Width.) Per Chip Forward Current Per Chip Reverse (Leakage)Current Per Chip Reverse Voltage Per Chip Operating Temperature Range Storage Temperature Range Soldering Temperature.

Symbol
PD IFP IF Ir VR Topr. Tstg. Tsol.

Rating
78 100 30 100 5 -25 to +85 -40 to +100

Unit
mW mA mA uA V

Dip Soldering: 260 for 5 sec. Hand Soldering: 350 for 3 sec.

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Date: 2007/01/16

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LA(C)4341-11
Electrical and Optical Characteristics:
Parameter
Luminous Intensity Per Segment Forward Voltage Peak Wavelength Dominant Wavelength Reverse Current Per Chip (Leakage Current Per Chip) Spectrum Line Halfwidth Response Time

0.43" SINGLE DIGIT DISPLAY

Symbol
IV Vf p d Ir

Condition
If=10mA/seg. If=20mA/seg. If=20mA/seg. If=20mA/seg. Vr=5V If=20mA/seg. -----------

Min.
1.15

Typ.
3.3 2.1 635 626

Max.

Unit
mcd

2.6

V nm nm

100 35 250

A nm ns

Note: Customers special requirements are also welcome.

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Date: 2007/01/16

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LA(C)4341-11
Typical Electrical/Optical Characteristic Curves

0.43" SINGLE DIGIT DISPLAY

(25 Ambient Temperature Unless Otherwise Noted)

Ratio of Maximum Operating Peak Current to Temperature Derated DC Current
1.0

100

Relative Intensity

OPERATION IN THIS REGION REOUIRES TEMPERATURE DERATING OF IDC MAXIMUM

0.5

10

IF PEAK IDC MAX

Z 0H 10

HZ 3K Z KH 10

H 1K

Z 0H 30

565

635

705

775

Wavelength (nm)

10 100 1000 tp - Pulse Duration - s

10000

Fig.1 RELATIVE INTENSITY VS. WAVELENGTH

50
Forward Current IF(mA)

Fig.2 MAXIMUM TOLERABLE PEAK CURRENT VS. PULSE DURATION

50
Forward Current IF(mA)

40 30 20 10

40 30 20 10 0 20 40 60 80 100

1.6

1.8 2.0 2.2 2.4 Forward Voltage VF(V)

2.6

Fig .3 FORWARD CURRENT VS. FORWARD VOLTAGE PER CHIP

Ambient Temperature Ta (C) Fig.4 FORWARD CURRENT VS. DERATING CURVE

10

Relative Luminous Intensity Normalized at 10mA

8.0 6.0 4.0 2.0

Relative Luminous Intensity

2.0 1.0 0.5 0.2 0.1 -30 -20 -10 0 10 20 30 40 50 60 70

10

20

30

40

Forward Current (mA)

Ambient Temperature Ta (C) Fig.6 LUMINOUS INTENSITY VS. AMBIENT TEMPERATURE

Fig.5 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT

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Date: 2007/01/16

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LA(C)4341-11
Precautions in Use:

0.43" SINGLE DIGIT DISPLAY

PLEASE PAY SPECIAL ATTNTION TO THE NEXT POINT TO INCORPORATE OPTO DEVICE TO HIGH RELIABILITY
1. Do not bend the lead. Bending leads could cause breakage of leads or the degradation of the chip. When bending is unavoidable, strictly follow the cautionary instruction below. (1)Bend the leads before soldering. (2)Bending a lead must be done by fixing a lead tightly and applying no stress on the resin part. (3) The lead bending point must be more than 1.6mm away from the edge or the resin part. (4)When a pin is tested for its endurance, bending degree should be 45and repeated no more than two times.

2. Setting a product by using tool such as a holder should be avoided. When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board etc. 3. The hole pitch of a circuit board must fit into the lead pitch of products. 4. When soldering, care the followings: (1)Do not heat a product under any stress (i.e.: twist) to leads. (2)Do not heat ( for example, by soldering ) a product while out side force is applied the resin part. (3 The lead bending point must be more than 1.6mm away from the edge or the resin part. (4)Soldering with PC Board should be conducted with following conditions. (a) For dip soldering Pre-heating : 90 Max. for within 60 Sec. Soldering Max. : 2605(Solder Temp.) for within 5 Sec. (b) Soldering iron : 350(Soldering iron tip) for within 3 Sec.

5. Flux could corrode the leads.Use flux that contains as little chlorine as possible (RA, RMA, less than 0.2 wt%) and need not be washed way. When, however, washing is necessary, partially wash around the leads, instead of the entire LED, by the following conditions. Cleaning agent : Methyl Alcohol Cleaning temp : 45Max.

Cleaning

time

: 30Sec. Max.

6. Minimum amount of soldering flux should be used. Soldering flux should be applied only to the pin portion. 7. The following may damage products or LED chips: Attachment or contact of residual flux solvent onto the product surface or to LED chips, or invasion of the same into the product.

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Date: 2007/01/16

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