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HVIC/IGBT Half-Bridge Converter Evaluation Circuit

Application Note May 1992 AN9105.1


Author: George Danz
The HVIC high voltage integrated circuit is designed to drive n-channel IGBTs or MOSFETs in a half-bridge conguration up to 500VDC. Power supply and motor control inverters can be congured for voltages up to 230VAC using the HVIC, IGBTs and a few other components. A few precautions should be taken in using the circuit. Lead lengths between the external power circuit (including gate and pilot leads), the 15V bypass capacitor (CDD), the bootstrap diode (DF) and capacitor (CF) and the HVIC should be minimized. The basic components required to evaluate the features of the SP601 are shown in the simplied schematic. The recommended load is largely resistive so that the largest current component will ow through the IGBTs, IGT1 and IGT2. The yback diodes, D1 and D2, rated 8A, will carry a much smaller yback current component. A small amount of load inductance will cause the switching waveforms to simulate the conditions which would normally be observed with motor or transformer loads, while limiting the current carried by the lower rated yback diodes in this circuit. The values for RPUa, RPUb, etc., have been chosen to result in overcurrent trip at approximately 25Apk. At this level of current, heat sinking for the IGTs and yback diodes is required. The series resistance of the upper and lower pilot resistor dividers would be approximately 1K; the divider ratio should cause 0.1V at the tap at the desired trip current. When first energizing your evaluation circuit, begin with a reduced bus voltage of about 20VDC to 30VDC to verify proper circuit operation before proceeding to higher voltages. More specic information can be found in File Number 2428 and File Number 2429 Half-Bridge 500VDC Driver data sheets and in the Application Note, AN-8829.1.

Simplied Schematic
25VDC VLINK 3 500VDC DF IGT1 D1 VDF VBS D1U G1U + 15V PULSE GEN +15V UP/DOWN VBIAS G2U PHASE VOUT TRIPU FAULT FAULT LED +15V G2L ENABLE VDD VSS CL1 TRIPL RPLb VLINK 2 CL2 D1L IGT2 D2 50 100 RPLa + LL 1mH RPUb C1 50 100 VLINK 2 RL 20 3KW + 0.22 + CF RPBa

HVIC

G1L

CDD 10F

HVIC - Intersil Part # SP601 (Formerly GS601) IGT1, 2 - Intersil Part # HGTA24N60D1C

D1, 2 - Intersil Part # RUR860 DF - Intersil Part # A114M

RPUa, RPLa - 910, 1.8W RPUb, RPLb - 68, 1.8W

C1 - 0.1F, 600VDC RL - 20, 3KW 13 -50

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Copyright

Intersil Corporation 1999

Application Note 9105

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certication.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com

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