Fine Pitch Bumping Formation Application - PPS & Micro ball -

Sep.08.2011 SenjuMetalIndustry R&Dcenter Kaichi Tsuruta

Copyright 2011 SENJU METAL INDUSTRY CO.,LTD.

Role of Senju Micro Soldering Material Support for The Development of High Density Packaging Technology

Trend of Semiconductor Packaging

Demand for The Development of Micro Soldering Technology

Solder Material for Semiconductor

Fine Pitch Trend and Micro Soldering Methods

Y2005 Y2010 Y2015 Y20XX

120um Pitch

100um Pitch

80um Pitch

60um Pitch

35um Pitch

25um Pitch

Solder Paste Printing The Current Method Micro Solder Ball Mounting

Senju PPS Method

PPS: Pre-coated by Powder Sheets

Micro-Solder Precoat Technology by Precoat by Powder Sheet (PPS)

Copyright 2011 SENJU METAL INDUSTRY CO.,LTD.

Micro solderbumpbyPPS 25umPitch

35umPitch
SamplebyNAGASE&CO.,LTD

MicrosolderbumpforPeripheralPCBbyPPS

Peripheral PCB

SamplebyHitachichemical

ComparisonofMicroSolderBumpTechnologies SolderPaste (ScreenPrint) Ballmount Plating VariationofThickness Printabilityforfinepitchpatterns Voids Expensivemountingtool Accuracyofmounting Limitationofmetalcompositions

ThoseissuesmayberesolvedbyPPS
PPS=PrecoatbyPowderSheet

FeaturesofPPSmethod FeaturesofPPS method 1. Applicabletofinepitch(25m Pitch) 2. Solderbumpheightisusuallyapx.46mwith1stPPSand apx.10mheightwith2ndPPSforawaferwith40 mpitch. 3. SmallvariationofBumpHeight <1forawaferwith40mpitch 4.Noneedofsoldermaskoralignmenttools 5.Applicableforavarietyofsolderalloycomposition

StructureofPPSsheet
Crosssectionview
BasesheetPET Adhesivelayer SolderPowder 5um~10um

Topview ofPPSsheet

Powdersize510um Powdersizeandalloycomposition areselectiveforeachapplication

Viewfromtopside

SolderBumpbyPPS
AfterUBM Surface500
Bird eyeview

AfterSolderbump Surface500
Birdseyeview

XSection2.0k
25um

25um Pitch
SiSub

SolderBump UBM

35um

35um Pitch
SiSub

SolderBump UBM

SamplebyNAGASE&CO.,LTD

PPSprocess1 1.ContactPPSsheetwithworkthenpresswithheat
PPStransfertemperatureshouldbelowerthanthemelting pointofsolderalloy.

Presswithheat

Under plate(40)

PPSprocess2 2.RemovingPPSsheet

PPSprocess3 3.Flux+Reflow,Cleaning
Reflowtemperatureishigherthanthemeltingpointofsolderalloy

Reflow Cleaning

flux

PPSbonder320mmMax

Upperheat plate

Lowerheat plate

PPSprocessforperipheralPCB

Crosssectionof PPSbump

VoidsofPPSBump VoidinspectionbyXrayviewer

TestBoard
PCBsize 30300.8mm #ofElectrodes 6060=3600pads Pitch Diameterof eachpad 200m 120m

Lessvoids

MechanismofPPSmethod
PET Adhasive layer Solderpowder

PPSsheet Fts
Solderbump IMC Electrode,pad

Fimc

Fts <Fimc Selectivetransfer,Selectivesolderbump

Senju Micro Ball Technology

Copyright 2011 SENJU METAL INDUSTRY CO.,LTD.

The Success Factor for Micro Soldering

50um

30um

Micro Solder Ball

DELTALUX MB-T100 Flux for Micro Soldering

SNR-850MB

CX-430 /for Clean Room

Reflow Oven for Micro Soldering

Senju Micro Ball Joint Experience

Work Size

wafer Pitch # of Bumps

8 inch 85 um 3200K

Soldering Materials and Equipment

85um Pitch/50um Ball Bumping

Solder Ball Flux Reflow Oven

M705-50um MB-T100 SNR-850MB

Advantage of Micro Solder Ball Bumping

Paste
Void Coplanarity Repair Pitch size Solder composition variation For Environment Operation cost

Micro Ball

Plating

Senju Solder Ball Lineup

The diameter range of Senju solder products is from 40um to 1mm. Senju can supply various size of ball answering the needs of customer.

Ball Diameter
0.1mm 0.04mm 0.3mm 0.2mm 0.7mm 0.8mm 1.0mm

Micro Ball

BGA Ball

Senju standard Micro Ball tolerances is +/-3um.

Micro Ball Process Capability

Control Cpk, Cir Trend & SPC. at RFC, DRB, MRB System Completely
* LAS M705 70um
I nd ivid ua l Me a su re m e nt of AV G(D ia )
0.07075 UCL=0.070645 0.0705 0.07025 0.07 0.06975 0.0695 3 6 9 12 15 18 21 24 27 30 33 Sample LCL=0.069694

I nd ivid ua l M e a su re m e nt of Sig m a(D ia )

0.0004 UCL=0.000374 0.00035 Sigma(Dia) 0.0003 0.00025 0.0002 0.00015 LCL=0.000123 0.0001 3 6 9 12 15 18 21 24 27 30 33 Sample Avg=0.000248

AVG(Dia)

Avg=0.070169

Diameter Mean.

Diameter Stdev. Stdev.

I nd ivid ua l M e a su re m e nt of Cp K(D ia )
6 5 CpK(Dia) 4 3 2 1 3 6 9 12 15 18 21 24 27 30 33 Sample LCL=2.04 Avg=3.88 UCL=5.73

Senju Micro Solder Ball Development

Technical Roadmap

2011

2012

2013

Micro Ball Manufacturing (HVM Method) 45um 40um

Under 30um

Micro Ball Technology (Special Method) 20um Under 20um Micro Solder Alloy SAC,SC SAC

Low Temp.Bi,In,Zn

New Micro Soldering Materials Cu,Ni core Ball

Aug. 2011

Micro Ball Recyclable PBF Package

Demand for LAS ( Low Alpha Solder ) Product

Miniaturization and High density Soft error model chart Wafer Memory Cell
Alpha particle

Soft error

Solder

Soft error
ITRS 2009 Edition Year of production DRAM Pitch(nm) 2011 2012 2013 1014 2015

Ionization effect is strong

40

36

32

28

25

Substrate

The alpha particle discharged from solder is an incidence in the memory cell. It ionizes and electron-hole pair is generated. The hole is pulled to the substrate side and the electron is pulled to the memory cell side. It is information 0 as for the state that the electron is filled in the memory cell part, the electron is information 1 in the memory cell part as for empty. The malfunction of information 10 occurs.

Senju LAS Materials LAS Solder Paste

For fine pitch bumping for substrate, wafer

LAS Solder Ball

For super fine pitch & stable volume bumping on substrate, wafer

LAS Super Fine Solder Powder

For flexible wiring, bumping, research material for future
D50

25 20 15 10 5 5umTarget 7umTarget 9umTarget Raw powder D 0207 D 0308 D 0409 D 0510

Dis tribution

Senju LAS Material

Senju Low Alpha Grade

LAS G4
(G4<0.002)

G3
(0.002<G3<0.005)

G2
(0.005<G2<0.010)

G1
(0.010<G1<0.020)

0.002

0.005

0.010

0.020
( cph/cm^2 )

Senju LAS Micro Ball Standard Diameter and Tolerance : 40-110um 3um Alpha count : 0.02cph/cm^2 or less Solder Composition : M705(SAC305), M200(SnCu), SnPb

Gas Proportional Alpha Particle Counter

Senju can provide low alpha solder material. We have many experiences of low alpha product manufacturing (Solder Ball, Solder Paste, Solder Powder, etc). Raw materials may be sourced internally or externally to best meet customers preferred low alpha limitations.

LACS-4000M(SUMIKA) Sample area9001000cm^2 Counting time7299hour Counting gasPR-10(Ar90%+CH410%)

Model 1950(Alpha Sciences) Sample area9001000cm^2 Counting time72100hour Counting gasPR-10(Ar90%+CH410%)

LACS-4000M

Model 1950

Senju Low Alpha Control Ability

Reference : LAS (Low Alpha Solder) Material
Alpha count, cph/cm2 0.020 0.015 0.010 0.005 0.000 1 2 3 4 5 6 7 8 9 101112131415161718192021222324252627282930 Lot No. LAS material

Ex. 0.005cph/cm^2 grade of SAC Solder

LAS material

Senju Product Standard G1 : < 0.02cph/cm2 G2 : < 0.01cph/cm2 G3 : < 0.005cph/cm2 G4 : < 0.002cph/cm2

Reference : HAS (High Alpha Solder) Material

Alpha count, cph/cm2 20 15 10 5 0 1 2 3 4 5 6 7 8 9 101112131415161718192021222324252627282930 Lot No. HAS material

Ex. HAS SAC Solder

HAS material

Alpha count revel about 7~12cph/cm2

LAS Blending, Inspection Flow

The Senju-LAS product is blended and inspected by itself.
RM incoming Alloy casting Inspection

Selected RM group
Multi Vendor

LAS RM
(With alpha count CofC)

Melting blending

Alpha count inspection

OK

Solder Sheet

Rare Sn, Pb or alloy (Sn/Pb, SA,SAC..etc)

Composition inspection
OK

Ag, Cu

Pure metal

LAS product manufacturing

Sphere, powder, others

Senju Micro Ball Business Continuity Plan

SMIC has the Policy Securing Capacity at the HVM Factory Micro Ball Shall be Shipped from Tochigi or Miyazaki
Manufacturing Sales HQ

Iwate Plant
(HVM Plant for BGA/CSP Sphere)
Hanamaki Akita Sendai Koriyama

Tochigi Plant (R & D)

(Initial Sphere Build & Mother Plant)

Senju System Technologies Hokuriku Suwa Kansai Kyoto Hiroshima Fukuoka Oita Nagoya Osaka

Saitama Technical Center

Senju Giken, Miyazaki

(HVM Plant for Micro Sphere
Micro Sphere & Powder Mfg and Developt Established on 2006/12/ 01

Miyazaki

If you have any question for our products, please feel free contact us. Thank you.
Contact Person: Sneju Taiwan Branch Clement Chang (clement@senju.com.tw) Lewis Huang (lewis@senju.com.tw)

Senju Metal Industry Co., LTD.