William A. Donson 9802 Maple Dr. Aubrey,TX 76227 607-624-9825 Cell 607-748-0528 Home wd1188482@westpost.

net OBJECTIVE To excel as engineer on high tech processes, manage engineering teams, transfer processes to manufacturing, administer costing and pricing methods. SUMMARY OF QUALIFICATIONS * BS Graduate, Photo Science (Engineering) Rochester Institute of Technology * Co-Developed Product program for High Tech Printed Circuit Boards * Co-Developed Product costing and pricing methods for Printed Circuit Boards * Managed Engineering Teams at IBM Endicott,NY, Research and Development * Managed Research and Development manufacturing technology transfer teams * Prime Engineer QTAT line for high tech printed circuit boards * Editor, Publisher of IBM Endicott,NY Technology News * Quality Assurance 3M Photo Products Division EXPERIENCE AND ACCOMPLISHMENTS EDUCATION * Bachelor of Science degree in Photo Science, chemistry, optics, statistics. * High School three year major in electronics and electrical. ENGINEERING AND MANAGEMENT EXPERIENCE * Managed development of special copper etching technique called "Fluid Head," w ith 9 engineers and 3 technicians, currently being sold. * Clean room installation: $1M UV expose tool equipment, as process engineer for UV expose. * Process development optimization between three process, coating, expose, etchi ng for most effective process. * Managed development of thin film product for US Navy, copper on polyimide proc ess, 6 engineers, 4 technicians. * Managed R&D engineering team and manufacturing team to transfer new products t o manufacturing, 10 engineers, 2 techs. * Authored and trained 700 engineers on Continuous Improvement Process Teams. * Editor of Technology News circulation of 1,500 worldwide engineers. * Award history: 12 monetary awards from technology, invention, and management. * Technical Disclosures and Patent Files: 25 separate publications and 2 patent filings. TOOLING EXPERIENCE * Ultraviolet expose tooling. * Particle measurement and room monitoring tooling. * Laser thickness measurement tooling. * Thin film electrical resistance measurement. * Nikon stereo metrology. * Radiation measurement tooling. * Fluorescent microscopy. * Chemistry, pH, AA, viscosity, auto titrate, etc. COMPUTER SKILLS * Use and knowledge of MS Word, Excel, Project Management, Power Point, Lotus 12-3, Adobe products including video editing, used and exported tables from SAP. EMPLOYMENT HISTORY

Engineer & Manager IBM Endicott, and Endicott Interconnect Quality Assurance 3M References for William Donson: Voya Markovich Sr. VP, Chief Technology Officer Endicott Interconnect 607-755-1978 voya.markovich@eitny.com Michael Hills Sr. VP Endicott Interconnect 607-755-7400 Michael.hills@eitny.com Atkins Odofin Engineering Scheduler Lockheed Martin Atkins.odofin@lmco.com 607-751-6392 Robert House Engineering Scheduler Lockheed Martin robert.house@lmco.com 607-751-4788 Brad VanBrunt VP Endicott Interconnect 607-755-6675 vanbrunt@eitny.com Anita Ballard Account Manager Endicott Interconnect 607-755-3489 anita.ballard@eitny.com Robert Matson Program Manager Endicott Interconnect 607-755-2353 robert.matson@eitny.com Peter Hobert Product Costing Specialist Endicott Interconnect 607-755-1309 peter.hobert@eitny.com My former manager Kevin Shaw Product Manager Endicott Interconnect manager: 152 Riverside Dr. Binghamton, NY 607-755-1166

Kevin.shaw@eitny.com Jack Rood Jr. Project Tracking, Team Leader Lockheed Martin, Owego,NY jack.rood@lmco.com 607-751-4633 Kathy Nowak Program Manager Rockwell Collins 607-352-1285 kmnowak@rockwellcollins.com