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Corresponding author. Tel.: +86 27 87542604 810; fax: +86 27 87557074.

Vitae
Mingxiang Chen was born in Yingcheng City, Hubei province in PR China in 1970. He received his BSc and MSc degree from Wuhan University of Technology, Wuhan, China, in 1993 and 1996, respectively, with major in material engineering. During 19962002, he has worked for Yangtze River Scientific Research Institute. He is currently working as a PhD candidate at the Institute of Microsystems in Huazhong University of Science and Technology, Wuhan, China. His research interests include the design and processes of MEMS packaging. Liulin Yuan was born in 1982. He received his BSc degree from Huazhong University of the Science and Technology (HUST) located in Wuhan, China, in 2004, with major in mechanical engineering. He is currently working as a master student at the Institute of Microsystems in Huazhong University of Science and Technology, Wuhan, China. Sheng Liu was born in Huangmei, Hubei province in PR China in 1963. He received his BSc and MSc degree from Nanjing University of Aeronautics and Astronautics, Nanjing, PR China in 1983 and 1986, respectively, and PhD degree from Stanford University, Mechanical Engineering in August 1992. From 1992 to 1995, he was an assistant professor of Mechanical and Aerospace Engineering, Florida Institute of Technology, Melbourne, FL. During 19951998, he worked as an assistant professor of Mechanical Engineering and Institute for Manufacturing Research (Joint Appointment), Wayne State University, Detroit, MI. Since 1998, he was an associate professor of Mechanical Engineering and Institute for Manufacturing Research (Joint Appointment), Wayne State University, Detroit, MI. and sabbatical leave at Tsinghua University, China and Huazhong University of Sciences and Technology, China from 2001 to 2004. His research interests are focused on reliability of electronic packaging and MEMS. He has win The White House/NSF Presidential Faculty Fellows Award in 1995 and ASME Electrical and Electronic Packaging Division's Young Engineer Award in 1996. He is a member of IMAPS, IEEE and ASME.