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Detailed Service Manual

Detai l ed Test Procedures










Digital Multi-Service,
Data-Capable Portable










465 465cmf





























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iii
465





Digital Multi-Service,
Data-Capable Portable
Detailed Service Manual
Detailed Test Procedures
MAY 2009


6880401P39-O

iv

Manual Revisions
Changes that occur after this manual is printed are described in the Field Manual Revisions (FMRs). The FMRs
provide the most current instructions and component information.
Copyright Information
The Motorola products described in this manual may include Motorola computer programs stored in semiconductor
memories or other media that are copyrighted with all rights reserved worldwide to Motorola. Laws in the United
States and other countries preserve for Motorola, Inc. certain exclusive rights to the copyrighted computer programs,
including the exclusive right to copy, reproduce, modify, decompile, disassemble, and reverse-engineer the
Motorola computer programs in any manner or form without Motorolas prior written consent. Furthermore, the
purchase of Motorola products shall not be deemed to grant either directly or by implication, estoppels, or otherwise,
any license or rights under the copyrights, patents, or patent applications of Motorola, except for a nonexclusive
license to use the Motorola product and the Motorola computer programs with the Motorola product.
Trademarks
MOTOROLA, the Stylized M Logo, Message Mail, VibraCall, and iDEN are registered trademarks of Motorola,
Inc. Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners.
Copyright 2007, Motorola, Inc. All rights reserved.




6880401P39-O

v
SAFETY AND GENERAL I NFORMATI ON

SAFETY AND GENERAL INFORMATION
This section contains important information on the safe and efficient operation of
your mobile device. Read this information before using your integrated multi-service
portable radio.*
Exposure to Radio Frequency (RF) Energy
Your phone contains a transmiter and receiver. When it is ON, it receives and
transmits RF energy. When you communicate with your phone, the system
handling your call controls the power level at which your phone transmits.
Your Motorola phone is designed to comply with local regulatory requirements
in your country concerning exposure of human beings to RF energy.

Por t abl e Radi o Pr oduct Operation and
EME Exposure
Your Motorola radio product is designed to comply with the following national
and international standards and guidelines regarding exposure of human beings
to radio frequency electromagnetic energy (EME):

United States Federal Communications Commission, Code of Federal
Regulations; 47 CFR part 2 sub-part J.
American National Standards Institute (ANSI) / Institute of Electrical
and Electronics Engineers (IEEE). C95. 1-1992.
Institute of Electrical and Electronics Engineers (IEEE). C95. 1-2005
Edition.*
International Commission on Non-Ionizing Radiation Protection (ICNIRP)
1998.
Ministry of Health (Canada). Safety Code 6. Li mi t s of Human
Ex pos ur e t o Radiofrequency Electromagnetic Fields in the
Frequency Range from 3 kHz to 300 GHz, 1999.
Australian Communications Authority Radio communications
(Electromagnetic Radiation - Human Exposure) Standard 2003.
ANATEL, Brazil Regulatory Authority, Resolution 303 (July 2, 2002)
"Regulation of the limitation of exposure to electrical, magnetic, and
electromagnetic fields in the
* The information provided in this document supersedes the general safety
information in users guides published prior to May 1, 2006

radio frequency range between 9 kHz and 300 GHz." "Attachment to Resolution
303 from July 2, 2002.
Operational Precautions
To assure optimal radio product performance and to be sure that human exposure
to RF does not exceed the guidelines set forth in the relevant standards, always
follow these instructions and precautions :
Two-way radio operation
Your radio product has been designed and tested to comply with national and
international standards and guidelines regarding human exposure to RF
electromagnetic energy, when operated in the two-way mode (at the face, or at
the abdomen when using an audio accessory) at usage factors of up to 50%
talk/50% listen.
Transmit no more than the rated duty factor of 50% of the time. To transmit
(talk), push the Walkie-Talkie (WT) button. To receive calls, release the WT
button. Transmitting 50% of the time or less, is important because this radio
generates measurable RF energy only when transmitting (in terms of measuring
for standards compliance).
When using your radio product as a traditional
two-way radio, hold the radio product in a vertical
position with the microphone one to two inches (2.5
to 5 cm) away from the lips.


Product Operation
When placing or receiving a phone call, hold your radio product as you would a wire
line telephone. Speak directly into the microphone.

If you wear a radio product on your body when transmitting, always place the radio
product in a Motorola approved clip, holder, holster, case or body harness. If you
do not use a body-worn accessory supplied or approved by Motorola and are not
using the radio product in the intended use positions along side the head in
the phone mode or in front of the face in the two-way radio modeor if you hang
your device from a lanyard around your neckkeep the device at least 2.5
centimeters (1 inch) from your body when transmitting.
ALL MODELS WITH FCC ID IHDP56HS1 MEET THE
GOVERNMENT S REQUIREMENTS FOR EXPOSURE TO
RADIO WAVES.
Your wireless phone is a radio transmitter and receiver. It is designed and
manufactured not to exceed the emission limits for exposure to radiofrequency
(RF) energy set by the Federal Communications Commission of the U.S.
Government. These l imi ts are part of comprehensive guidelines and establish
permitted levels of RF energy for the general population. The guidelines are based
on standards that were developed by independent scientific organizations through
periodic and thorough evaluation of scientific studies. The standards include a
substantial safety margin designed to assure the safety of all persons, regardless of
age and health.
The exposure standard for wireless mobile phones employs a unit of measurement
known as the Specific Absorption Rate, or SAR. The SAR limit set by the FCC is
1.6W/kg.
1
Tests for SAR are conducted using standard operating positions
reviewed by the FCC with the phone transmitting at its highest certified power level
in all tested frequency bands. Although the SAR is determined at the highest
certified power level, the actual SAR level of the phone while operating can be
well below the maximum value. This is because the phone is designed to
operate at multiple power levels so as to use only the power required to reach
the network. In general, the closer you are to a wireless base station antenna, the
lower the power output.
Before a phone model is available for sale to the public, it must be tested and
certified to the FCC that is does not exceed the limit established by the
government-adopted requirement for safe exposure. The tests are performed in
positions and locations (e.g., at the ear and worn on the body) as required by the
FCC for each model. The highest SAR value for this model phone when tested
for use at the ear is 1.45 mW/g and when tested on the body, as described in this user
guide, is 1.35 mW/g during packet data transmission. (Body-worn measurements
differ among phone models, depending upon available accessories and FCC
requirements.)
2

While there may be differences between the SAR levels of various phones and at
various positions, they all meet the government requirement for safe exposure.
The FCC has granted an Equipment Authorization for this model phone with all
reported SAR levels evaluated as in compliance with the FCC RF exposure
guidelines. SAR information on this model phone is on file with the FCC and
can be found under the Display Grant section of http://www.fcc.gov/oet/fccid
after searching on FCC ID IHDP56HS1.
Additional information on Specific Absorption Rates (SAR) can be found on
the Cellular Telecommunications Industry Association (CTIA) web-site at
http://www.wow-com.com.

1 In the United States and Canada, the SAR limit for mobile phones used by the
public is 1.6 watts/kg (W/kg) averaged over one gram of tissue. The standard
incorporates a substantial margin of safety to give additional protection for the
public and to account for any variations in measurements.
2 The SAR information reported to the FCC includes the FCC-accepted
Motorola testing protocol, assessment procedure, and measurement
uncertainty range for this product.

6880401P39-O

vi
SAFETY AND GENERAL I NFORMATI ON
Appr oved Accessor i es
For a list of approved Motorola accessories call 1 -800-453-0920, or visit our
website at www.motorola.com/iden.
RF Energy Int er f er ence/Compat i bi l i t y
Nearly every electronic device is subject to RF energy interference from external
sources if inadequately shielded, designed or otherwise configured for RF energy
compatibility. In some circumstances your handset may cause interference with
other devices.
Follow Instructions to Avoid Interference Problems
Turn OFF your radio product where posted notices instruct you to do so.

In an aircraft, turn off your radio product whenever instructed to do so by
airline staff. If your radio product offers an airplane mode or similar feature,
consult airline staff about using it in flight.
Implantable Medical Devices
If you have an implantable medical devices, such as a pacemaker or defibrillator,
consult your physician before using this radio product.
Persons with implantable medical devices should observe the following
precautions:
ALWAYS keep the phone more than 20 centimeters (8 inches) from the
implantable medical device when the phone is turned ON.
DO NOT carry the phone in a breast pocket;
Use the ear opposite the implantable medical device to minimize the
potential for interference.
Turn OFF the phone immediately if you have any reason to suspect that the
interference is taking place.
Read and follow the directions from the manufacturer of your implantable
medical device. If you have any questions about using your wireless
phone with your implantable medical device, consult your health care
provider

Hearing Aids
Some mobile devices may interfere with some hearing aids. In the event of such
interference, you may want to consul t your heari ng ai d manufacturer or
physician to discuss alternatives.
Other Medical Devices and Health Care Facilities
If you use any other personal medical devices, consult your physician or the
manufacturer or your device to determine if it is adequately shielded from RF
energy. Turn off your radio product when instructed to do so in hospitals or health
care facilities that may be using equipment that is sensitive to external RF
energy.
Driving Precautions
Check the laws and regulations on the use of radio products in the area where you
drive. Always obey them.
When using your radio product while driving, please:
Give full attention to driving and to the road. Using a mobile device
may be distracting. Discontinue a call if you cant concentrate on driving.
Use hands free operation, if available.
Pull off the road and park before making or answering a call if driving
conditions so require.
Do not place a handset in the airbag deployment area.
Responsible driving practices can be found in the Smart Practices While Driving
section at the end of this guide and/or at the Motorola Web site:
www.motorola.com/callsmart.

Note: The use of wireless phones while driving may cause distraction.
Discontinue a call if you cant concentrate on driving. Additionally, the use of
wireless devices and their accessories may be prohibited or restricted in certain
areas. Always obey the laws and regulations on the use of these products.

Operational Warnings
Obey all posted signs when using mobile devices in public areas.
Potentially Explosive Atmospheres
Areas with potentially explosive atmospheres are often but not always posted,
and can include fueling areas such as below decks on boats, fuel or chemical
transfer or storage facilities, or areas where the air contains chemicals or
particles, such as grain, dust or metal powders.
When you are in such area, turn off your handset, and do not remove, install, or
charge batteries unless it is a radio product type especially qualified for use in
such areas as Intrinsically Safe (for example, Factory Mutual, CSA, or UL
approved). In such areas, sparks can occur and cause an explosion or fire
Batteries and Chargers
Caution: Improper treatment or use of batteries may present a danger of fire,
explosion, leakage, or other hazard. For more information, see the Battery Use
and Battery Safety section in this users guide.


Your battery, charger, or portable radio may contain symbols, defined as follows:


Symbol Definition

Important safety information follows.

Do not dispose of your battery or mobile device
in a fire.

Your battery or mobile device may require
recycling in accordance with local laws. Contact
your local regulatory authorities for more
information.

Do not throw your battery or mobile device in
the trash.

Your mobile device an internal lithium ion battery

Do not let your battery, charger, or mobile device
get wet.

Listening at full volume to music or voice through
a headset may damage your hearing
.
.

6880401P39-O

vii
SAFETY AND GENERAL I NFORMATI ON

Choking Hazards
Your portable radio or its accessories may include detachable parts, which
may present a choking hazard to small children. Keep your device and its
accessories away from small children.
Glass Parts
Some parts of your mobile device may be made of glass. This glass could break if
the product is dropped on a hard surface or receives a substantial impact. If
glass breaks, do not touch or attempt to remove. Stop using your mobile device
until the glass is replaced by a qualified service center.
Seizures/Blackouts
Some people may be susceptible to epileptic seizures or blackouts when
exposed to flashing lights, such as when playing video games. These may occur
even if a person has never had a previous seizure or blackout

If you have experienced seizures or blackouts, or if you have a family history of
such occurrences, please consult with your physician before playing video
games or enabling a flashing-lights feature (if available) on your mobile
device. Discontinue use and consult a physician if any of the following
symptoms occur: convulsion, eye or muscle twitching, loss of awareness,
involuntary movements, or disorientation. It is always a good idea to hold the
screen away from your eyes, leave the lights on in the room, take a 15-minute
break every hour, and stop use if you are very tired.



Caution About High Volume Usage
Listening at full volume to music or voice through a headset may
damage your hearing.

Repetitive Motion
When you repetitively perform actions such as pressi ng keys or enteri ng
fi nger-wri tten characters, you may experience occasional discomfort in your
hands, arms, shoulders, neck, or other parts of your body. If you continue to have
discomfort during or after such use, stop use and see a physician.

Service & Repairs
If you have questions or need assistance, were here to help.
Go to www.motorola.com/iden/support, where you can select from a number of
customer care options. You can also contact the Motorola Customer Support
Center at 1 -800-453-0920 (United States), 1-877-483-2840 (TTY/TDD United States for
hearing impaired)
































6880401P39-O

viii
SAFETY AND GENERAL I NFORMATI ON

Battery Use & Battery Safety
Motorola recommends you always use
Motorola-branded batteries and chargers. The warranty
does not cover damage caused by non-Motorola
batteries and/or chargers. Caution: Use of an
unqualified battery or charger may present a risk of fire,
explosion, leakage, or other hazard. Improper battery
use, or use of a damaged battery, may result in a fire,
explosion, or other hazard.
Battery usage by children should be supervised.
Important: Motorola mobile devices are designed
to work best with qualified batteries. If you see a
message on your display such as Invalid Battery or Unable
to Charge, take the following steps:
Remove the battery and inspect it to confirm that it
bears a Motorola Original Equipment hologram;
If there is no hologram, the battery is not a qualified
battery;
If there is a hologram, replace the battery and retry
charging it;
If the message remains, contact a Motorola Authorized
Service Center.
New batteries or batteries stored for a long time may
take more time to charge.

Charging precautions: When charging your battery,
keep it near room temperature. Never expose
batteries to temperatures below 0C (32F) or above
45C (113F) when charging. Always take your mobile
device with you when you leave your vehicle
When storing your battery, keep it in a cool, dry place.
It is normal over time for battery life to decrease, and
for the battery to exhibit shorter runtime between
charges or require more frequent or longer
charging times.
Avoid damage to battery and mobile device. Do not
disassemble, open, crush, bend, deform, puncture,
shred, or submerge the battery or mobile device. Avoid
dropping the battery or mobile device, especially on a
hard surface. If your battery or mobile device has
been subjected to such damage, take it to a Motorola
Authorized Service Center before using. Do not
attempt to dry it with an appliance or heat source, such
as a hair dryer or microwave oven.
Use care when handling a charged
batteryparticularly when placing it inside a pocket,
purse, or other container with metal objects. Contact
with metal objects (e.g., jewelry, keys, beaded chains)
could complete an electrical circuit (short circuit),
causing the battery to become very hot, which could
cause damage or injury.



Promptly dispose of used batteries in accordance with local regulations.
Contact your local recycling center for proper battery disposal.
Warning: Never dispose of batteries in a fire because they may explode.









6880401P39-O

ix
MOD E L I N F OR MAT I ON

MODEL INFORMATION
This manual applies to the following iDEN i465 Digital Portable models:
H02XAH6JR6AN 806-940 MHz, Multi-Service, Data-Capable Portable

MODEL NUMBERING SYSTEM























































Typical Model Number: H 9 8 X A H 6 J R 7 A N

Position: 1 2 3 4 5 6 7 8 9 10 11 12

Position 1 - Type of Unit

Position 12 - Unique
H = Hand-Held Portable
M = Mobile Product
Model Variations
N = Standard Package
Positions 2 and 3 - Model Series

Position 11 - Version

Version Letter (Alpha)
Major Change

Position 10 - Feature
level
01 = i365
02 = i776
40 = i85s/i55sr/i50sx Products
41 = i90c Products
45 = i265 Products
48 = i80s Products
56 = i30sx/i30s Products
57 = i95cl Products
58 = i88s/i58sr Products
59 = i60c Products
62 = i205/i305 Products
63 = i530/i730/i710 Products
68 = i325pro Products
69 = i31 5plus Products
73 = i860 Products
74 = i830 Products
75 = i285 Products
72 = i930 Products
85 = i870 Products ;
83 = i580 Products ;

92 = i877 Products
94 = i880/i885 Products
98 = i465



1 = Basic
2 = Limited Pkg
3 = Limited Plus
4 = Intermediate
5 = Standard Pkg
6 = Standard Plus
7 = Expanded Pkg
8 = Expanded Plus
9 = Full Feature
Programmable
Position 4 - Frequency Band
Position 9 - Primary System
T
U = 806 to 870 MHz
X = 806 to 941 MHz
*Values given represent range only;
they are not absolute.


R = iDEN Shared
Position 5 - Power Level

Position 8 - Primary
A = 0 to 0.7 Watts
B = 0.7 to 0.9 Watts
C = 1.0 to 3.9 Watts
D = 4.0 to 5.0 Watts
E = 5.1 to 6.0 Watts
F = 6.1 to 10.0 Watts



N = Digital Dispatch
Q = Low Profile - Basic Display
R = Digital Multi-Service
J = TDMA Digital Dual Mode
Position 6 - Physical Packages

Position 7 - Channel Spacing
F = Limited Keypad - With Display
H = Full Keypad - With Display
N = Enhanced Controls - Enhanced Display


1 = 5 kHz
2 = 6.25 kHz
3 = 10 kHz
4 = 12.5 kHz
5 = 15 kHz
6 = 25 kHz
7 = 30 kHz
9 = Variable Programmable
6880401P39-O

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MODEL SPECIFICATIONS

MODEL SPECIFICATIONS


GENERAL RECEIVER
TRANMITTER
FCC Designation: IHDT56KB1
Receiver Type
Direct Conversion
Transmitter Type Single Conversion
Operational Modes Phone Frequency Range 851-870 MHz Frequency Range 806-825 MHz
Private 935-940 MHz 896-901 MHz

Group

Circuit Data
Packet Data


Temperature Range Channel Spacing: Emission Designator 18K3D7W
Operating 10C to +60C iDEN 25kHz
Storage (w/o battery) 40C to +85C

Frequency Stability Modulation Type Quad 16QAM
Battery Type Lithium Ion Referenced to base Quad 64QAM
station 0.4 ppm Quad QPSK


Recommended Sensitivity (10%)BER Frequency Stability:
Battery (M-16 QAM) -111 dBm Referenced to base
High Performance SNN5823A Station 0.4 ppm
Max Capacity SNN5793
Spurious Emissions:
Battery Voltage Spurious Response Conducted -13 dBm
Nominal 3.7 Vdc Immunity: -51 dBm Radiated -13 dBm
Range 3.0 to 4. 2 Vdc

Dimensions (HxWxD) Spurious Radiation RF Pulse Avg Power:
w/950mAh 112.8 x 54 Above 960 MHz <500V/m iDEN (dynamically
x 14.9 mm 216960 MHz <200V/m adjusted) -6 to +28 dBm
88216 MHz <150V/m
3088 MHz <100V/m

Weight: Audio Output Power Adjacent Channel
With battery 96.0 g &Speakerphone Rating Power
(Private and Group iDEN (at 25 kHz in -55 dB
Modes only) into 18 kHz BW)
8 ohms at maximum
volume (nominal
battery voltage) 500mW

Distortion at Rated
Audio:
Electrical Acoustical 5% Max
Acoustical 10% Max
All Specifications +/- 5%
6880401P39-O

xi
PREFACE: Conventions Used in This Manual
PREFACE
The i465 Digital Multi-Service, Data-Capable Portable Field Service
Manual contains the information necessary to identify and fix problems in the Motorola
i465 Digital Portable. This unit is based on digital technology and is designed to
operate on iDEN systems.
Basic and field-level service for this unit as described in this manual includes troubleshooting,
testing, board swapping, and maintenance.
Service for this unit is based on the substitution method: a faulty part is replaced by a working one,
providing quicker service to the customer. For example, if the battery is faulty, it is replaced. If
the unit requires more complete testing or service than is available at the basic level, it is sent to
the field-level service facility, serviced, and returned to the iDEN Customer Care Center (ICC).
NOTE: Before operating or testing this unit, please read the Safety and General Information
section in the front of this manual.
Who Should Use This Manual
This manual is intended for service technicians who should be familiar with the test equipment
recommended in Appendix A. To help pinpoint basic problems with the unit, first perform the
mechanical checks and self tests as described in Chapter 5; then proceed to field level
troubleshooting and testing.
How This Manual Is Organized
This manual contains the following chapters and appendices:
Chapter 1 presents the theory and technology used by the iDEN system and unit.
Chapter 2 describes how to prepare test equipment setups for the iDEN system and how to operate
the test equipment. It also contains disassembly and reassembly instructions.
Chapter 3 describes the troubleshooting procedures.
Chapter 4 contains the component board layouts, schematic diagrams and component lists.
Appendix A Provides information on ordering kits and replacement parts. It also contains lists of
recommended test equipment.
















6880401P39-O

xii
PREFACE: Conventions Used in This Manual
Conventions Used in This Manual
The following conventions are used throughout this manual:
italics Used for emphasis and new terms
bo l d Defines menu items, fields, and buttons
c o d e Used for sample input and output
Related Publications
The following publications are available separately:
R-2660 Digital Communications System Analyzer Operators Manual 68P80386B72
i DEN i 465 Di gi t al Mul t i -Servi ce Dat a-Capabl e Phone Users Gui de:


















Carrier User Guide
Sprint Nextel
NTN2514A
Sprint Nextel MMI
NTN2514A
SOUTHERNLINC
NNTN7551A
TELUS
NTN2516A
INTL GENERIC
NNTN7550A
PERU
NNTN7552A
MEXICO
NNTN7552A
Israel
NTN2537A
Saudi
NNTN7683A
Asia Generic
NNTN7550A
Boost
NTN2515A
Argentina
NNTN7552A




6880401P39-O

xiii
CONTENTS
SAFETY AND GENERAL INFORMATION............................................v
MODEL INFORMATION...............................................................................ix
MODEL SPECIFICATIONS ......................................................................x
PREFACE ...................................................................................................xi
CONTENTS ................................................................................................xiii
Chapter 1 .................................................................................................19
SYSTEM OVERVIEW..................................................................................19
1.1 iDEN Digital Modulation Technology......................................................................................... 19
1.2 iDEN Voice Compression Technology ........................................................................................ 21
1.2.1 RF Transmission Bursts......................................................................................................................... 21
1.2.2 Calling Area Coverage........................................................................................................................... 22
1.2.3 Service Area........................................................................................................................................... 23
1.3 Radio Architecture Overview...................................................................................................... 24
1.4 Roadrunner Circuitry .................................................................................................................. 25
1.5 Audio Section .............................................................................................................................. 27
1.5.1 Acoustic Transducers............................................................................................................................. 27
1.5.2 Audio Amplifiers ................................................................................................................................... 27
1.5.3 Audio Modes.......................................................................................................................................... 29
1.5.4 Audio Paths............................................................................................................................................ 29
1.5.5 Transmit Paths ....................................................................................................................................... 30
1.5.6 Receive Paths......................................................................................................................................... 30
1.6 Digital Section ............................................................................................................................... 30
1.6.1 Patriot..................................................................................................................................................... 31
1.6.2 MCU Digital Phase Locked Loop (DPLL) ............................................................................................ 32
1.6.3 Host System Clock Synthesizer ............................................................................................................. 32
1.6.4 Power On/Off Circuitry ......................................................................................................................... 32
1.6.5 PATRIOT Digital Signal Processor ....................................................................................................... 33
1.6.6 DSP Phase Locked Loop (PLL)............................................................................................................. 33
1.6.7 Serial Peripheral Interface (SPI) ............................................................................................................ 33
1.6.8 Host Memories....................................................................................................................................... 34
1.6.9 Micro-USB Connector ........................................................................................................................... 34
1.6.10 Battery ID .............................................................................................................................................. 34
1.6.11 Keypad Block ........................................................................................................................................ 35
1.6.12 LCD Circuit ........................................................................................................................................... 36
1.6.13 VGA Camera ......................................................................................................................................... 36
1.6.14 Graphic Controller IC............................................................................................................................ 36
1.7 Transmitter Path Section............................................................................................................. 37
1.7.1 ROADRUNNER.................................................................................................................................... 38
1.7.2 Sledgehammer IC (RX Path) ................................................................................................................. 39
1.7.3 Phoenix Lite........................................................................................................................................... 39
1.7.4 Cartesian Feedback................................................................................................................................ 41
1.7.5 Level Set and Phase Training................................................................................................................. 42

6880401P39-O

xiv

1.8 Receiver Path Section................................................................................................................... 44
1.8.1 Rx Front End (RXPath) ..........................................................................................................................45
1.8.2 Sledgehammer IC (RXPath)...................................................................................................................45
1.8.3 Roadrunner IC (RX Path) .......................................................................................................................45
1.9 Frequency Generator (RF) Section............................................................................................. 46
1.10 Global Positioning System (GPS) Section............................................................................... 47
1.10.1 GPS Receiver .........................................................................................................................................47
1.10.2 GPS Antenna ..........................................................................................................................................48
1.10.7 GPS Down-Mixer...................................................................................................................................48
1.10.8 GPS A/D Conversion .............................................................................................................................48
1.10.9 GPS Digital Processing ..........................................................................................................................48
1.10.10 GPS Reference Oscillator...................................................................................................................48
1.11 Bluetooth Wireless System.................................................................................................... 49
Chapter 2 ................................................................................................ 51
PREPARING FOR FIELD LEVEL TESTING .............................................. 51
2.1 Preparing Equipment for Testing ............................................................................................... 51
2.1.1 Calibrating Equipment............................................................................................................................51
2.1.2 Checking the RF Cable...........................................................................................................................51
2.1.3 Strong-Signal Environments...................................................................................................................51
2.1.4 Protecting Static-Sensitive Devices........................................................................................................51
2.2 Using RSS...................................................................................................................................... 52
2.3 Connecting an i465 Unit to the R-2660....................................................................................... 52
2.4 Operating the R-2660 ................................................................................................................... 53
2.5 Dis-Assembly and Assembly of i465 Unit ................................................................................... 54
2.6 Disassembly Procedure ................................................................................................................ 54
2.6.1 Disassembly Sequence Flowchart ..........................................................................................................54
2.6.2 Battery Cover, Battery, and SIM Card Removal ....................................................................................55
2.6.3 Opening the Unit ....................................................................................................................................56
2.6.4 LCD Removal.........................................................................................................................................57
2.6.5 Keypad and Main Board Removal .........................................................................................................58
2.6.6 Vibrator and Main Board Removal ........................................................................................................59
2.7 Assembly Procedure ..................................................................................................................... 60
2.7.1 Assembly Flow Chart .............................................................................................................................60
2.7.2 Main Board Inspection ...........................................................................................................................61
2.7.3 Main Board Assembly............................................................................................................................62
2.7.4 Back Housing Inspection and Preparation..............................................................................................63
2.7.5 Vibrator Installation................................................................................................................................64
2.7.6 Keypad Board Installation......................................................................................................................65
2.7.7 Keypad Board Screw Installation...........................................................................................................66
2.7.8 Adhesive Application .............................................................................................................................67
2.7.9 Lens Installation .....................................................................................................................................68
2.7.10 LCD Installation.....................................................................................................................................69
2.7.11 Closing the Unit......................................................................................................................................70
2.7.12 Keypad Board Installation......................................................................................................................71
2.7.13 SIM Card, Battery, and Battery Cover Installation...............................................................................72

6880401P39-O

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Chapter 3 .................................................................................................73
TROUBLESHOOTING..............................................................................73
3.1 Digital Analysis Test ..................................................................................................................... 73
3.2 LO Output Test............................................................................................................................. 77
3.3 RX Main VCO Test ...................................................................................................................... 78
3.4 Keypad Failure Test. .................................................................................................................... 80
3.5 Sledgehammer Test....................................................................................................................... 81
3.6 RX Analysis Test........................................................................................................................... 83
3.7 TX Power Test............................................................................................................................... 88
3.8 TX Sledgehammer Test ................................................................................................................ 89
3.9 Reference Oscillator Test ............................................................................................................. 92
3.10 RF PA Module Test................................................................................................................... 93
3.11 Earpiece Test ............................................................................................................................. 96
3.12 High Audio Speaker Test.......................................................................................................... 97
3.13 Audio Loopback Level Test...................................................................................................... 98
3.14 DC Distribution (SW1) Test ................................................................................................... 100
3.15 DC Distribution (V2) Test ...................................................................................................... 101
3.16 DC Distribution (V3) Test ...................................................................................................... 102
3.17 DC Distribution (V4) Test ...................................................................................................... 103
3.18 DC Distribution (4.5 Pre-Reg) Test ....................................................................................... 104
3.19 DC Distribution (VMMC) Test .............................................................................................. 105
3.20 DC Distribution (VUSB) Test................................................................................................. 106
3.21 DC Distribution (VSIM) Test................................................................................................. 107
3.22 DC Distribution (V_VIB) Test ............................................................................................... 108
3.23 DC Distribution (V_HOLD) Test........................................................................................... 109
3.24 DC Distribution (VC REG) Test............................................................................................ 110
3.25 GPS Receiver Test................................................................................................................... 111
3.26 Mototalk................................................................................................................................... 114
3.27 Camera Test............................................................................................................................. 115
3.28 Bluetooth Test.......................................................................................................................... 116
3.29 Model Assembly (MA) Test Mode Test................................................................................. 118


6880401P39-O

xvi
Chapter 4 .............................................................................................. 121
4.1 Component Layout Main Board Front.................................................................................. 122
4.2 Component Layout Main Board Back................................................................................... 123
4.3 Component Layout Keypad Board Bottom.............................................................................. 124
4.4 Component Layout Keypad Board Top ................................................................................... 125
4.5 BLOCK HIERARCHY.............................................................................................................. 126
4.6 DIGITAL BLOCK - PATRIOT AND MEMORY.................................................................. 127
4.7 DIGITAL - ATI AND DISPLAY CONNECTOR ................................................................... 128
4.8 DIGITAL BLOCK - CONNECTORS, SIM, AND MISC. ..................................................... 129
4.9 ROADRUNNER - POWER SECTION.................................................................................... 130
4.10 ROADRUNNER - INTERFACE AND A/D ......................................................................... 131
4.11 ROADRUNNER - AUDIO BLOCK...................................................................................... 132
4.12 TRANSCEIVER...................................................................................................................... 133
4.13 BATTERY BLOCK................................................................................................................ 134
4.14 BLUETOOTH BLOCK.......................................................................................................... 135
4.15 USB BLOCK........................................................................................................................... 136
4.16 QWERTY BOARD................................................................................................................. 137
4.17 i465 Component Locations..................................................................................................... 138
APPENDIX A .......................................................................................... 151
A.1 Customer Service............................................................................................................................ 151
A.2 Replacement Parts.......................................................................................................................... 151
A.3 Domestic Orders ............................................................................................................................. 151
A.4 International Orders ...................................................................................................................... 151
A.5 Replacement Kits............................................................................................................................ 152
A.6 Recommended Test Equipment and Tools................................................................................... 154
A.7 Recommended Programming Equipment .................................................................................... 155








6880401P39-O


OVERVIEW: iDEN Digital Modulation Technology
Chapter 1
SYSTEM OVERVIEW
To achieve high spectrum efficiency, the i465 digital multi-service, data-capable portable unit uses
a unique modulation technology and sophisticated voice-compression algorithm. The voice of the
person speaking into the microphone is converted into a digital bit stream consisting of zeros
(0) and ones (1). The stream then is modulated into a radio-frequency (RF) signal, which is
transmitted over the air to another unit. This process is called digital modulation.

1.1 iDEN Digital Modulation Technology
The i465 digital portable is a dual band 806-870 MHz and 896-940 MHz unit. It operates in
multiple modes: phone, private, data, and group; and uses three digital modulation technologies:
Quad QAM, Quadrature Phase Shift Keying (QPSK), and Time Division Multiple Access (TDMA).
Quadrature Amplitude Modulation (QAM) is a modulation technique that transmits information by
altering the amplitude and phase of the radio frequency (RF) signal. Data is converted into complex
symbols, which alter the RF signal and transmit the information. When the signal is received, the
amplitude and phase are converted back into symbols and then into the original data.
There are three different QAM modes that are used for different applications: 64QAM, 16QAM, and
4QAM. In voice applications, 16QAM is used, while in data applications, 64QAM, 16QAM, and
4QAM are used.
NOTE: The 900 MHz band operates only in 16QAM modulation.
In 64QAM, 64 possible combinations of 6 bits are converted into a unique amplitude and phase. In
16QAM, there are 16 possible combinations of 4 bits, while in 4QAM, there are 4 possible
combinations of 2 bits.
The traditional 25 kHz channel used for two-way radios is split into four QAM signals (subcarriers)
that are transmitted simultaneously. This technique can transmit 64 Kbps in a single 25 kHz
channel
The iDEN system requires approximately 10 Kbps to transmit a compressed voice;
therefore, 64 Kbps can accommodate 6 voice channels or 3 voice channels in enhanced
systems.
The signal spectrum of the Quad 16QAM is shown in Figure 1-1




6880401P39-O 17


OVERVIEW: iDEN Digital Modulation Technology

















Frequency from Desired Channel Center (kHz)
Figure 1-1: Spectrum of iDEN Quad 16QAM




Quadrature Phase Shift Keying (QPSK) is one of the most common modulation techniques for satellite
communications. In QPSK, a digital data stream is taken two bits at a time to generate four possible phase
states of the transmitted carrier. A characteristic of this technique is its resistance to noise.
Time Division Multiple Access (TDMA) is used to allocate portions of the RF signal by dividing time into 6
slots, one for each unit. Time allocation enables each unit to transmit its voice information without
interference from another units transmission.
Transmission from a unit or base station is accommodated in time-slot lengths of 15 milliseconds and frame
lengths of 90 milliseconds (see Figure 1-2).
Note that Rx (outbound) indicates base-to subscriber transmissions; Tx (inbound) indicates
subscriber-to-base transmissions. The slots are paired and have a fixed offset of 19 milliseconds; their
timings are synchronized by the iDEN system. The TDMA technique requires sophisticated algorithms and
one digital-signal processor (DSP) to perform voice compression/decompression and RF
modulation/demodulation





18 6880401P39-O


OVERVIEW: iDEN Digital Modulation Technology










Portable Unit
When turned on, scans for control station, then transmits one slot every six slots.








Figure 1 iDEN TDMA Fo r ma t


1.2 iDEN Voice Compression Technology
Voice is converted into a digital bit stream by sampling the voice signal at a high rate and
converting the samples into numbers, which are represented by bits. A sample consists of 8 bits.
Approximately 8000 samples per second (64 Kbps) are required to maintain a reasonable quality.
Voice compression reduces the number of bits per second while maintaining the voice at an
acceptable quality level. The iDEN system uses a coding technique called Vector Sum Excited
Linear Prediction (VSELP) to compress voice to 4.2 or 8.0 Kbps. The compressed voice-data bits
modulate the RF signal. The compression rate is based on the type of call (dispatch or interconnect)
and the network configuration established by the local service provider.
Adding error-correction bits to the coded-voice bits increases the required RF-transmission bit rate
to approximately 7.4 Kbps for the 4.2 Kbps voice coder and 14.8 Kbps for the 8.0 Kbps voice
coder.
1.2.1 RF Transmission Bursts
RF transmissions within an iDEN system occur in 15 millisecond blocks called bursts. An iDEN
base station transmits bursts continuously on each RF frequency it uses. Transmission bursts from
the stations are synchronized in time by signals received from the global positioning satellite
(GPS) system. Each burst is numbered; the number is referred to as the slot number. All bursts
occurring at a given time carry the same slot number..
Inbound transmission bursts (sent from the unit) are offset 19 milliseconds from the outbound
burst; the inbound burst begins 4 milliseconds after the end of the outbound burst (see Figure 1-2
on page 3). This offset in time allows the unit to appear capable of transmitting and receiving at
the same time (it actually is switching rapidly back and forth between receiving and transmitting).
In current iDEN systems, outbound transmissions in the 800 MHz band range from 851-870 MHz;
inbound transmissions are 45 MHz lower in frequency. For the 900 MHz band, outbound
transmissions range from 935-940 MHz; inbound transmissions are 39 MHz lower in frequency.
.


6880401P39-O 19


OVERVIEW: iDEN Digital Modulation Technology

An iDEN channel is created by grouping bursts so that their slot numbers differ by a number
referred to as the repetition rate. The i465 unit uses two repetition rates for interconnect voice calls:
6:1 and 3:1. A single frequency can handle six calls using a 6:1 repetition rate with the 4.2 Kbps
coder. Dispatch calls always use this rate. However, the audio quality of the 3:1 repetition rate with
the 8.0 Kbps coder is superior to the 6:1 rate with the 4.2 Kbps coder. Most service providers
configure the system and unit to allow only the 3:1 rate for interconnect calls.
Calls are set up on a primary control channel (PCCH) in response to a request from a unit or a
regular telephone connected to the Public Switch Telephone Network (PSTN). The PCCH is
established by the base station equipment; typically, it is a 6:1 channel.
The outbound PCCH carries system information and pages to specific subscriber units and asks
them to respond if they are available for a call. Inbound PCCH transmissions carry responses to the
pages and requests by subscriber units to set up calls. Inbound transmissions on the primary
control channel only take 7.5 milliseconds and can be timed to occur in either half of a 15-
millisecond burst.
The dual band unit will power up in the 800 MHz band and will use these channels for control
channelsPrimary Control Channel (PCCH) and Broadcast Control Channel (BCCH). The 900
MHz mode will be used only during 3:1 interconnect calls. Every attempt will be made to assign
the unit to 900 MHz carriers during new 3:1 interconnect calls, handovers into a cell, and inter-cell
handovers. If no resources are available, or if available resources have insufficient channel quality
(in the case of a handover), then 800 MHz carriers will be evaluated.
Using the above techniques, the iDEN system can operate six voice channels simultaneously in dispatch
mode or 3 voice channels simultaneously in interconnect mode on a single RF carrier at 25 kHz bandwidth
1.2.2 Calling Area Coverage
Area coverage is obtained by dividing the area into a mosaic of cells. Coverage is controlled so that
frequencies can be reused with less distance between sites. Each cell is covered by a base station,
which is classified as Omni or Sectored. An Omni station connects base transceivers to antennas
that have a circular pattern centered at the site. A Sectored station connects base transceivers to
directional antennas that point in particular directions. Units that operate in a multi-site system
must be able to hand off from one coverage area to another as the user moves about during a call.
Handoff is controlled by the iDEN system.
In Figure 1-3, the area is divided into several cells, each containing a cell site (base station)
operating on a given set of channels, which interfaces radio-telephone subscribers to the switching
station.














Figure 1-3. Hypothetical iDEN Cell System


20 6880401P39-O


OVERVIEW: iDEN Digital Modulation Technology
The units are capable of operation on any channel in the system. This enables them to operate in any
cell. Due to the low power requirements for communications between radio telephones in a
particular cell and cell site, operating channels may be repeated in cells that are outside the coverage
area of each other.
For example, in Figure 1-3, each letter represents a given frequency. Notice that cells A1 and A2
operate on the same frequency because they are a certain distance apart. Users can simultaneously
occupy the same frequency without interfering with each other. This is known as frequency re-use.
The implementation of frequency re-use increases the cell handling capability of the system without
increasing the number of available channels. When re-using identical frequencies in a small area,
co-channel interference can be a problem. The iDEN system can tolerate higher levels of co-channel
interference than analog systems by incorporating digital modulation. This means that cells using
identical frequencies can be physically closer than similar cells in analog systems. Therefore, the
advantage of frequency re-use can be further enhanced in an iDEN system, enabling greater traffic
handling in high-use areas.
Because of TDMA, several calls can share the same carrier. The carrier is divided into a continuous
stream of TDMA frames, each of which is split into six time slots (see Figure 1-2 on page 3). When
a connection is required, the system allocates the subscriber a dedicated time slot within each
TDMA frame. User data (speech or data) for transmission is digitized and sectioned into blocks.
The user data blocks are sent as information bursts in the allocated time slot of each TDMA frame.
The data blocks are modulated onto the carrier via M16 QAM.
Each unit must be able to move from one cell to another with no detection by the user. The unit itself
carries out signal-strength measurements on adjacent cells, and the quality of the traffic channel is
measured by both the unit and the base station. The hand-over criteria can be much more accurately
determined, and the hand-over made before the channel quality deteriorates to a level that the
subscriber can notice.
When a unit is well within a cell, the signal strength measured will be high. As the unit moves
toward the edge of the cell, the signal strength and quality measurement decreases.
Signal information provides an indication of the subscriber's distance from the base station. As the
unit moves from cell to cell, its control is handed from one base station to another. The change is
handled by the unit and the base station, and is completely transparent to the user.
1.2.3 Service Area
Because this is a radio system, there are no exact boundaries that can be drawn on a map. If the unit
is outside the coverage area, No Service illuminates on the display and calls are unable to be
placed or received. If this happens during a conversation, the call will be lost. There also may be
small areas within a particular service area in which communications could be lost.
The units identity information is held by its local iDEN system in its Home Location Register
(HLR) and Visitor Location Register (VLR). The VLR contains identity information on all local
active radio telephones. Should the user roam to another area, the units identity information is sent
to the VLR in the new system. The new system will then check the unit's details with the home
system for authenticity. If everything is in order, the user will be able to initiate and receive calls
while in the new area.








6880401P39-O 21


OVERVIEW: iDEN Digital Modulation Technology

1.3 Radio Architecture Overview
The digital section consists of the Patriot Baseband Processor, Host memories (FLASH and
PSRAM, and the iDEN power management (See Figure 1-4 below, i465 Block Diagram).





































Figure 1-4 i465 Block Diagram

The Spiffy Lite/Phoenix Lite front end module contains the TX output stage (including the power
amplifier, low-pass filter, coupler and antenna switch). The RX front end (including switches, SAWs,
LNA and the RX balun) and the GPS front end (including the pre-selector SAW, GPS LNA, SAW
and GPS balun) are all implemented discretely. The main RX VCO module, with all the
associated loop filter components, is placed on the radio board.
The SLEDGEHAMMER IC is a multi-band transceiver IC intended to support iDEN and WiDEN
protocols. The Sledgehammer IC contains RF and analog baseband paths for iDEN receive and
transmit, in addition to a GPS receive RF path. The SLEDGEHAMMER IC also contains two RF
synthesizers required to generate local oscillator signals for the iDEN receive and transmit and for
GPS receive, as well as an ESCORT loop required to prevent re-modulation of the transmit signal.
The SLEDGEHAMMER IC, utilizing a higher level of integration, serves as placement to the
TOMAHAWK, Half-Life, GRF2i and JAVELIN ICs. The SLEDGEHAMMER IC is used in
conjunction with the Roadrunner IC which will contain the transceiver signal path data converters
and digital filtering which were previously parts of TOMAHAWK.
The Roadrunner IC provides the entire radio DC distribution, audio functions, and digital portion of the
iDEN transceiver/GPS receiver. The DC distribution will consist of linear and switch mode
regulators.


512Mb
FLASH
800
900
ISM
Roadrunner
Sledgehammer
GPS DN CONV
CARTESIAN
LINEARIZED
UP-CONVERTER
GPS PLL & VCO
iDEN RX DN CONV
RX BB FLs RX BB
FRAC-N PLL
ESCORT PLL
TRANSMIT VCO
PATRIOT
Bravo ROM13
RX LO
Loop FL
Display
128 x 160
Balun
Balun
iDEN/GPS MODEM ADCs
iDEN RX DIG FL
TX DAC
CODEC
STEREO DAC
SPEAKER / MIC AMPS
BOOST REGULATOR
BUCK REGULATOR
LDOs
LED CONTROLLER
Xtal Osc
BATTERY CHARGER
VTERM
33.6 MHz
33.6 MHz Buffer
Bluetooth
128Mb
PSRAM
Mono
Speaker
PA T/R Coupler
Balun
VGA
Camera
ATI
GPS SAW Filter
Spiffy Lite
512Mb
FLASH
800
900
ISM
Roadrunner
Sledgehammer
GPS DN CONV
CARTESIAN
LINEARIZED
UP-CONVERTER
GPS PLL & VCO
iDEN RX DN CONV
RX BB FLs RX BB
FRAC-N PLL
ESCORT PLL
TRANSMIT VCO
PATRIOT
Bravo ROM13
RX LO
Loop FL
Display
128 x 160
Balun
Balun
iDEN/GPS MODEM ADCs
iDEN RX DIG FL
TX DAC
CODEC
STEREO DAC
SPEAKER / MIC AMPS
BOOST REGULATOR
BUCK REGULATOR
LDOs
LED CONTROLLER
Xtal Osc
BATTERY CHARGER
VTERM
33.6 MHz
33.6 MHz Buffer
Bluetooth
128Mb
PSRAM
Mono
Speaker
PA T/R Coupler
Balun
VGA
Camera
ATI
GPS SAW Filter
Spiffy Lite
512Mb
FLASH
800
900
ISM
Roadrunner
Sledgehammer
GPS DN CONV
CARTESIAN
LINEARIZED
UP-CONVERTER
GPS PLL & VCO
iDEN RX DN CONV
RX BB FLs RX BB
FRAC-N PLL
ESCORT PLL
TRANSMIT VCO
GPS DN CONV
CARTESIAN
LINEARIZED
UP-CONVERTER
GPS PLL & VCO
iDEN RX DN CONV
RX BB FLs RX BB
FRAC-N PLL
ESCORT PLL
TRANSMIT VCO
PATRIOT
Bravo ROM13
RX LO
Loop FL
Display
128 x 160
Balun
Balun
iDEN/GPS MODEM ADCs
iDEN RX DIG FL
TX DAC
CODEC
STEREO DAC
SPEAKER / MIC AMPS
BOOST REGULATOR
BUCK REGULATOR
LDOs
LED CONTROLLER
Xtal Osc
BATTERY CHARGER
VTERM
iDEN/GPS MODEM ADCs
iDEN RX DIG FL
TX DAC
CODEC
STEREO DAC
SPEAKER / MIC AMPS
BOOST REGULATOR
BUCK REGULATOR
LDOs
LED CONTROLLER
Xtal Osc
BATTERY CHARGER
VTERM
iDEN/GPS MODEM ADCs
iDEN RX DIG FL
TX DAC
CODEC
STEREO DAC
SPEAKER / MIC AMPS
BOOST REGULATOR
BUCK REGULATOR
LDOs
LED CONTROLLER
Xtal Osc
BATTERY CHARGER
VTERM
33.6 MHz
33.6 MHz Buffer
Bluetooth
128Mb
PSRAM
Mono
Speaker
PA T/R Coupler PA T/R Coupler T/R Coupler
Balun
VGA
Camera
VGA
Camera
ATI
GPS SAW Filter
Spiffy Lite
22 6880401P39-O


OVERVIEW: iDEN Digital Modulation Technology

The audio section is composed of microphone amplifiers, speaker amplifiers, a voice codec
and a stereo DAC. Previously such functionality was performed with the GCAP/PCAP IC. The
receiver ROADRUNNER portion includes circuitry supporting AGC, receiver sequence
management, signal path anti-aliasing filters, buffer amplifiers, high dynamic range sigma delta data
converters, digital filtering and the RX serial data interface to the baseband processor (previously
part of Tomahawk). The TX portion includes circuitry supporting Pulse Shaping FIR, TX DAC,
Smoothing filters, PA Gain Control DAC, and the TX serial data interface to the baseband processor
(previously part of TOMAHAWK). ROADRUNNER also includes circuitry to support additional
features such as GPS AD, USB, RS232, LEDs, etc.
Finally, the baseband processor utilized by i465 is the Zeus Processor.
1.4 Roadrunner Circuitry
The Roadrunner integrated circuit (IC) provides the following:
DC distribution
Audio CODEC and amplifiers
Control logic for power on/off
A/D converters for monitoring radio thermistors, battery level, LCD calibration, and the
Photosensor.
The Roadrunner IC used is a 223 I/O MAP BGA package.
The i465 unit has the following DC distribution:
SW1 is a BUCK step-down switching regulator set to 1.2 Vdc at 550 mA. It supplies the Zeus core.
SW2 is a BUCK switching regulator set to 1.875 Vdc at 250 mA. It supplies the Zeus and
memory.
SW3 is a BOOST switching regulator set to 5.6 Vdc at 200 mA. It supplies the LED backlights and
Vusb.
V1 - The V1_LDO is used to power the camera and photo sensor memories in a Zeus-based
platform.
V2 - 2.775 Vdc at 350 mA - will be used to power most of the RF circuits as well as the audio codec
and all audio amps.
V3 is a TRANSCEIVER digital supply set at 1.875Vdc at 50 mA.
V4 supplies 2.775 Vdc at 50 mA to the Thermistor Bias (Battery, Board ID) TCXO.
V_VIB supplies 3.0 Vdc at 200 mA to the vibrator
VMMC supplies 2.775 Vdc 350mA BTVCC I/O , Zeus UARTS, SD Card.
VSIM supplies 3.0 Vdc at 15 mA to the SIM card
VHOLD - 1.875 Vdc
VCO Superfilter is used for the transceiver VCOs. The SF_OUT supply is intended as the power
supply for the external VCO and the integrated Escort VCO on Sledgehammer. The input for the VCO
superfilter is V2.
The battery supplies Raw_B+ and Filtered_B+. RAW_B+ supplies the RF PA. Filtered_B+ directly supplies
Roadrunner and most of its regulators.


6880401P39-O 23


OVERVIEW: iDEN Digital Modulation Technology

The unit operates with a low-level battery voltage of 3.55 Vdc, nominal-level voltage of 3.7 Vdc, and high-level
voltage of 4.2 Vdc.
The Roadrunner IC has the following features:
Analog/digital portions of a real-time clock (RTC)
Battery charger
14-channel, 10-bit A/D converter
Control logic
Audio CODEC with serial interface
Transducer amplifier
Speaker amplifier (Hi Audio 0.5 watt into 8-ohm speaker)
Alert amplifier
Two amplifiers for (internal and external) microphone.
Auxiliary amplifier
SIM card level shifters
RS232 and USB support
Internal PMOS pass devices
Serial peripheral interface (SPI) read/write interface
Battery feedback switch
LED Controller













Figure 1-5 illustrates the DC power distribution in the i465 unit.



24 6880401P39-O


OVERVIEW: iDEN Digital Modulation Technology


The Roadrunner IC is designed to support the needs of portable iDEN cellular telephone products. It
provides the necessary control, audio, and regulator functions. The following functions are
provided:
Turn on control signals to properly activate the unit
Turn off control signals to turn off the unit if an error is detected
Audio amplification for the speaker
Audio amplification for the alert
Audio amplification for the external audio
Audio amplification of the microphone
13-bit, linear audio CODEC
Band-gap reference voltage
Linear regulation of DC voltages
Two switching regulators (BUCK/BOOST)
Operational amplifiers for use in the battery charger
Internal D/A conversion for the battery charger
14-channel, 10-bit A/D conversion
PA high-end regulation
Real-time clock
1.5 Audio Section
Audio components for the i465 consist primarily of the audio amplifiers, a coder/decoder
(CODEC), and acoustic transducers such as microphones and speakers. Other components include
active RC filters, digital filters, software controlled amplifiers and attenuators, an analog-to-digital
converter (ADC), and two digital-to-analog converters (DACs).

1.5.1 Acoustic Transducers
The i465 uses the following acoustic input and output transducers:
Active internal microphone requiring a DC bias
A dynamic 32-ohm earpiece speaker
A dynamic high audio 8-ohm speakers

1.5.2 Audio Amplifiers
The i465 uses five audio amplifiers as shown and further described in the Figure 1-6, Figure 1-7 and Figure
1-1.






6880401P39-O 25


OVERVIEW: iDEN Digital Modulation Technology










































































PGA
INPUT
Selector
Voice
Codec
Mic Bias
#2
Mic Bias
#1
AUDIG ( 2 :0 )
Rbias
2.2K
Rbias
2.2K
MIC_BIAS2
MIC_BIAS1
MIC_
INT
MIC_AUX
AUDIG(4:3)
V l
V l
26 6880401P39-O


OVERVIEW: iDEN Digital Modulation Technology
Table 1-1: Audio Amplifier Outputs and Acoustic Transducers


1.5.3 Audio Modes

The i465 audio circuitry has two basic modes of audio communication operation: interconnect and
dispatch. It also has digital audio and digital video with digital audio multimedia playback modes.
In standard interconnect mode, the i465 uses Roadrunner's internal amplifiers to directly drive the
dynamic earpiece speaker and drive mono high audio speakers if the speakerphone feature is
enabled.
In standard dispatch mode, the i465 uses Roadrunner's internal amplifiers to directly drive the high
audio speaker in mono. It can also drive the dynamic earpiece speaker.

1.5.4 Audio Paths

The i465 can accept audio from the internal microphone and the audio jack. Interconnect voice,
dispatch voice, dispatch tones, and ringer tones are also generated during audio communication
operation. These received audio signals can be transmitted or routed to the earpiece speaker, high audio
speaker, or audio jack output depending on the audio mode of operation and state of the High/Low
Speaker key and audio jack detect circuit.
The High/Low Speaker key toggles the audio output from the high audio speakers to the earpiece
speaker. The functionality of the High/Low Speaker key is disabled when there is an audio jack
connect detected.
The microphone input can also be muted and unmuted at any time during an interconnect call.









Outputs Acoustic Transducer
A1 (RR) Earpiece speaker output
A2 (RR) High audio speaker
A3 (RR) Internal microphone input
AL (Ext.)
Left channel output to left channel headset earpiece
AR (Ext.)
Right channel output to right channel headset earpiece
6880401P39-O 27


OVERVIEW: Digital Section
1.5.5 Transmit Paths
The average human voice signal has an audible frequency band of approximately 300 - 3400 Hz.
Low pass filters are utilized to provide the optimum voice signal response on the mic signal line by
filtering out unnecessary and potentially disruptive higher frequencies. The mic signal is then
amplified by the Roadrunner's internal op-amp and then converted from analog to digital in the
ADC. The digital mic signal is then digitally filtered, transferred to the DSP for necessary
processing, and then sent to SLEDGEHAMMER. Lastly, the data is sent to the RF Power
Amplifier and transmitted.
1.5.6 Receive Paths
The received voice signal is first converted to digital by SLEDGEHAMMER and then sent to the
DSP for necessary processing. The DSP sends the processed voice signal to the CODEC, where it
is converted from digital to analog in its internal DAC. The output of the DAC is then band-pass
filtered to attenuate any out-of-band noise.
Next, depending on the audio mode of operation and state of the High/Low Speaker key and audio
jack detect circuit, the speaker signal is either sent to the Roadrunner amplifier to drive the earpiece
speaker, the external 0.5W amplifier to drive the high audio speakers, or the audio jack output.
1.6 Digital Section
This section includes the Patriot-Bravo Baseband Processor and external memories and an ATI
graphics controller. The BRAVO controls the transmit, receive, and synthesizes operations of the
integrated circuits located in the RF section.
The digital section contains the following (see Figure 1-8):
Patriot-Bravo Baseband Processor
Host memories (FLASH and PSRAM)
uUSB Interface
Keypad block
ATI display / camera controller

















Figure 1-8: iDEN Digital Block Diagram


512Mb
FLASH
128Mb
PSRAM
PATRIOT
Bravo ROM13
Display
128 x 160
VGA
Camera
ATI
uUSB
Keypad
Block
512Mb
FLASH
128Mb
PSRAM
PATRIOT
Bravo ROM13
Display
128 x 160
VGA
Camera
ATI
uUSB
Keypad
Block
PATRIOT
Bravo ROM13
Display
128 x 160
VGA
Camera
VGA
Camera
ATI
uUSB
Keypad
Block
28 6880401P39-O


OVERVIEW: Digital Section
1.6.1 Patriot
The Patriot Dual-Core Baseband Processor (U801) integrates a reduced instruction-set
computer (RISC) microprocessor unit (MCU) and a general-purpose DSP on a single chip
(see Figure 1-9).
The following is a summary of the PATRIOT key features:
RISC integer processor capable of running at 52 MHz at 1.55 Vdc, a 32-bit RISC architecture,
high performance and high code density
ONYX 56600 DSP core running up to 133 MHz at 1.55 Vdc
Fully-programmable PLL for system clock generation with low-output clock drivers
16 KB x 32 on-chip MCU RAM
4 KB x 24 DSP program RAM
Queued serial peripheral interface (QSPI) to communicate with external peripherals
Serial communications interface with baud-rate generator
On-chip Emulator (OnCE) integrated with JTAG port compliance
Interrupt, general-purpose I/O, and keypad interface pins
Very-low power CMOS design
Wait, doze, stop, and deep sleep low-power standby modes.






























Figure 1-9. Patriot-Bravo Functional Block Diagram

6880401P39-O 29


OVERVIEW: Digital Section
The Patriot performs the following tasks:
Controls the power-up and power-down sequence of the unit
Programs the flash
Serially communicates with the factory Automated Test Equipment
Serially communicates via RS232
Communicates with the RF ICs (ROADRUNNER and SLEDGEHAMMER)
Memory maps and accesses flash ROM and PSRAM
Monitors battery voltage, as well as RF power-amplifier and battery temperature
Controls volume levels and enables beep tones
Modifies and stores user-selectable ergonomic preferences
Reads and writes radio-tuning parameters to the codeplug
Sends and receives commands with the base station through DSP
Re-channels the SLEDGEHAMMER synthesizer during hand off
Detects accessories connected to the radio
Programs the ATI display/camera controller
Decodes key presses from the keypad
Controls the display and keypad backlight
Controls the vibrator.
1.6.2 MCU Digital Phase Locked Loop (DPLL)
The MCU has a programmable, digital phase locked loop (DPLL) that uses the 16.8 MHz clock as
a reference. The MCU initially runs from the external reference at power up. Software programs
the MCU DPLL to 46 MHz and switches from the external reference to the MCU DPLL after it has
locked
1.6.3 Host System Clock Synthesizer
There are two system clocks that are generated by Roadrunner and Sledgehammer. The
Roadrunner generates 32.768 kHz using the Roadrunner PLL, and the Sledgehammer generates
33.6 MHz. The MCU Programmable Interrupt Timer (PIT) is run by the 32.768 kHz oscillator. The
33.6 MHz is divided by 2 in the Roadrunner to yield a 16.8 MHz signal, which serves as reference
frequency required by the MCU and DSP cores
1.6.4 Power On/Off Circuitry
The power-on circuitry uses the ROADRUNNER /ON_B pin and the power On/Off button to turn
on the unit. When the On/Off button is pressed to turn on the unit, the ON pin is shorted to ground,
which turns on ROADRUNNER. The low-voltage detector provides the initial, active low reset to
the MCU. When the ROADRUNNER voltages become stable (after a maximum of 2 ms),
ROADRUNNER de-asserts Reset. At this point, the MCU sets the defaults for all the ICs. For
instance, the SLEDGEHAMMER default clock is set to 8.4 MHz (16.8 MHz divided by 2). The
MCU must reprogram the SLEDGEHAMMER to run off the 16.8 MHz frequency. In addition, the
PATRIOT boots off of the High Clock, not the Low Clock (CKIL) like the REDCAP. At this point,
the PATRIOT begins running the subscriber code.

To turn off the unit, the On/Off button is pressed, causing the /ON B-pin of the ROADRUNNER to
short to ground. The ROADRUNNER drives ROADRUNNER SEL_INT on the PATRIOT and
tells the MCU to turn off. The MCU turns off by driving the STO (WDI input to ROADRUNNER)
line low, which shuts down the voltage regulators in the ROADRUNNER.






30 6880401P39-O


OVERVIEW: Digital Section
1.6.5 PATRIOT Digital Signal Processor
The PATRIOT SPS 56600 digital signal processor contains the new DSP Engine S_ONYXU,
which is capable of executing an instruction on every clock cycle. The DSP56600 consists of the
following:
Data ALU
Address generation unit
Program controller
Program patch detector
Bus interface unit
On-chip emulator
PLL-based clock generator
A standard interface between the DSP56600 core and the on-chip memory and peripherals support
many memory and peripheral configurations.
1.6.6 DSP Phase Locked Loop (PLL)
The DSP PLL is programmable and is used to generate a DSP internal clock that is
synchronized to the 16.8 MHz reference frequency. In low power mode, the DSP PLL is
disabled and the DSP operates directly from the 16.8 MHz clock. The DSP PLL runs at
110 MHz.
1.6.7 Serial Peripheral Interface (SPI)
This interface communicates with RF chips using a synchronous serial bus. This bus
includes the following:
Master Out Slave In (MOSI)
Master In Slave Out (MISO)
SPI clock
Specific chip-select lines

Table 1-2 shows a diagram of the Chip-Select Line States.
Table 1-2. Chip-Select Line States
IC Chip-Select Line Active State
ROADRUNNER Chip Enable SPI CS0 Low
SLEDGEHAMMER Chip Enable SPI CS6 Low
ROADRUNNER primary Chip Enable SPI CS7 Low

The MCU then sends data to the chip using MOSI and the SPI clock. The MCU also can
receive data from all chips by clocking it into MISO using the SPI clock and appropriate
chip select.






6880401P39-O 31


OVERVIEW: Digital Section
1.6.8 Host Memories
The following types of host memories are available:
FLASH memory. 512Mb (or 32M x 16) chip. The flash stores unit subscriber and DSP code. To
read from the flash, the MCU asserts CS0 low and OE high, and then drives EB1 high. For a write,
EB1 is driven low and OE is driven high.
Host PSRAM memory. 128Mb PSRAM (or 8M x16) is used by the MCU to load codeplug
information, program the FLASH, and store working parameters. To access PSRAM memory, the
MCU asserts both CS2 and OE low, and then drives EB1 high for reads. For a write, EB1 is driven
low and OE is driven high.

1.6.9 Micro-USB Connector
The bottom connector of the unit is a micro USB receptacle and is used to communicate to
external devices. There is no external hardware for switching from one protocol to another
because the Patriot handles the switching and line multiplexing functions internally.
The following table shows the bottom connector pin assignments:

Table 1-3. Bottom Connector Pin Assignments













1.6.10 Battery ID
The battery is equipped with a Dallas 2502 EPROM. A two-wire serial bus allows the
i465 unit or the battery charger to communicate with the battery and identify whether or not
the battery is compatible. If the battery is determined to be incompatible, the charger does
not enter charging mode.
Besides compatibility data, the EPROM also stores such information as the battery type,
capacity, fuel-gauging parameters, and voltage thresholds.









Pin Signal
1 Vbus
2 D-
3 D+
4 ID
5 GND
32 6880401P39-O


OVERVIEW: Digital Section
1.6.11 Keypad Block
The MCU is responsible for decoding key presses and displaying them properly on the
LCD. The keys are arranged into a matrix of five rows and seven columns, which includes
the Volume buttons. PTT is an external interrupt (INT0) that goes directly to Patriot. The
audio jack PTT goes to a Patriot general purpose input.
Table 1-4. Keypad Matrix












The On/Off button is not decoded by the MCU; it directly drives the ROADRUNNER, which
sends a signal to the MCU through INT1.

Pressing any key also generates the keypad internal interrupt. The PATRIOT de-bounces the keys by
reading them 25 milliseconds later.

The keypad decoding scheme works as follows:

1. PATRIOT sets the row pins to inputs; all columns pins are set as outputs and driven to
logic low.
2. Rows are pulled logic high. When a key is pressed, one row goes low, which
indicates a key press and sends an internal interrupt.
3. PATRIOT reads rows. A low on that row indicates a key press. All others are high.
4. PATRIOT sets all columns to output logic high.
5. One column at a time is set to output logic low. PATRIOT reads the rows to see which
one is now at a logic low level. (A low seen on a row indicates the correct column and
row.)










COLUMN0 COLUMN1 COLUMN2 COLUMN3 COLUMN5 COLUMN6 COLUMN7
ROW0 UP DOWN TXT SPKR UNUSED UNUSED SYM POWER/END
ROW1 ENTER ALT ILINK UNUSED CENTER UNUSED UNUSED PTT
ROW2 O RSK T SEND SPACE Z N
ROW3 F K Y B CAM MSG SHIFT
ROW4 W C VOL_DWN VOL_UP UNUSED PERIOD A
ROW5 LSK E RIGHT G S DEL M
ROW6 H R PLUS X I U P
ROW7 V Q LEFT J MENU D L
6880401P39-O 33


OVERVIEW: Digital Section
1.6.12 LCD Circuit
The LCD is a single glass main display. The main display has a resolution of 128x160 pixels.
The data lines for the display module are connected to a CPU control interface from the
graphics controller IC (ATI). The data lines for the graphics controller IC are connected to the
16-bit Patriot data bus.
The display module booster voltage is powered by VMMC (2.775 V), the I/O is powered by SW2
(1 .875 V). The display module connects to the Keypad PCB through a 21-pin connector and the
Keypad PCB connects to the main board through an 80-pin connector.
1.6.13 VGA Camera
i465 uses a VGA camera, the image sensor is a color CMOS image sensor with Bayer (Green, Red,
Green, and Blue) pattern filter. The sensor has the image resolution of 640x480.
The control interface configuration is based on standard mode I2C bus. Register settings can be
changed via I2C bus.
The device provides a finished image at 15fps for normal setting and variable frame rate of 7fps to
15 fps for low light setting.
1.6.14 Graphic Controller IC
This section and the one that follows describe the interface between the graphics controller IC and
Patriot, display, and VGA camera.
The i465 uses a graphics controller IC that offers 2D/advanced display graphics/video acceleration,
exceptional power management, MPEG/H263/JPEG decoding, video input port and JPEG encode,
H263 encoding. The block diagram of the graphic controller IC for i465 is shown in Figure 1-10.




















Figure 1-10. Graphics controller IC System Block Diagram
128Mbits
PSRAM

512Mbits FLASH
Memory
34 6880401P39-O


OVERVIEW: Transmitter Path Section
1.7 Transmitter Path Section
This section includes the following lineup Roadrunner (baseband D/A conversion),
SledgeHammer (Analog baseband to RF), and Phoenix Lite (TX RF back end: power
amplifier, etc) for linear modulation of the iDEN portables. When the unit is transmitting,
microphone audio is routed to the CODEC, where it is amplified and digitized by the A/D
converter in the CODEC. Digital voice is then sent from the CODEC to the DSP for
processing. (See i465 Block Diagram Figure 1-10 Below).































Figure 1-10. i465 Block Diagram









6880401P39-O 35


OVERVIEW: Transmitter Path Section

The Phoenix Lite transmitter module includes the following:
High Power Linear RFPA
Directional coupler.
Low pass harmonic filter.
Low-loss Transmit/Receive antenna switch.
The DSP performs VSELP data compression and generates digital I & Q words to be
transmitted to the ROADRUNNER. The signal then is sent at a rate of 48 K samples per
second. The ROADRUNNER provides the serial clock to the DSP and a frame sync pulse
to tell the DSP to send a sample. Each sample is sent as a 16-bit I word followed by a
16-bit Q word and then some meaningless fill bits.
The I word and the Q word are then converted to an analog differential pair by the
ROADRUNNER and amplified. The ROADRUNNER also sends a 4.2 MHz reference
clock signal to the SLEDGEHAMMER, together when a DMCS and TXE signal are
received from the DSP. The TXE transition starts the TX sequence with
SLEDGEHAMMER, which entails the training sequences as well as enabling the antenna
switch and PA.
DMCS signals the start of data being sent from DSP to ROADRUNNER. Once the
transmit burst is finalized, the TX shutdown is done by disabling TXE and DMCS.

1.7.1 ROADRUNNER
The ROADRUNNER IC is designed as a derivative of several other ICs previously used in
iDEN products. The ROADRUNNER IC includes the following blocks:
RX:
ADC
Digital Filtering
TX:
Digital interface (the transmitter receives inputs from the SSI. The SSI has a single
data line).
Pulse Shaping FIR (A programmable waveform generator "FIR" filter provides
interpolation of the pre shaped input words).
TX DAC (The transmit DACs have eleven bit resolution and are capable of supporting
8.4 Mbits). Fine step TX attenuation (cutback).
Smoothing filters (programmable RC smoothing filters limit the amount of far out
quantization noise and images due to aliasing. The filters incorporate a dc offset correction
block).





36 6880401P39-O


OVERVIEW: Transmitter Path Section

ROADRUNNER Transmit Operation. The transmitter implemented a Direct Conversion
Transmitter (DCT), where base band data is up-converted into RF with only one stage. The
ICs that perform the transmit operations are ROADRUNNER and SLEDGEHAMMER.
Power cutback control is shared between both ICs, the fine cutback step (1-> 4dB) is
performed by ROADRUNNER and the coarse cutback step (5 dB steps up to 35 dB) is
performed by SLEDGEHAMMER. To generate the RF signal, the SLEDGEHAMMER IC
uses a TX_LO that is centered at the carrier frequency. This TX_LO is generated INSIDE
SLEDGEHAMMER.
The digital samples are generated by the DSP and then sent to ROADRUNNER via
Transmit SSI (TX_S SI). ROADRUNNER then implements the Digital-to-Analog
Conversion function, which provides some power control function. The resulting I!Q
analog signals are then sent to the SLEDGEHAMMER IC, which up-converts the base
band signal to RF (similar to what the JAVELIN did on previous architectures).
The I/Q path circuits will be similar to the lineup used in the Tomahawk IC. The "main"
reconstruction filter for the I!Q paths will be located in the SLEDGEHAMMER IC, and
will have programmable BW options of 25, 50, and 100 KHz.
These functions of the IQ modulator consist of the interface to the digital baseband, the
digital baseband sub-block, the analog baseband sub-block, and the TX DAC bridging the
digital and analog sub-blocks. The ROADRUNNER IC will produce the baseband I and Q
signals needed for IQ modulation on the SLEDGEHAMMER IC.
1.7.2 Sledgehammer IC (RX Path)
The SLEDGEHAMMER is the heart of the transmitter; it incorporates all of the circuitry
necessary to implement a Cartesian feedback closed-loop system.
The differential baseband signals from the ROADRUNNER are input into the
SLEDGEHAMMER. They go through a variable attenuator and are then summed with the
down-converted I & Q feedback. The baseband signal is then amplified and sent to the up
mixers.
1.7.3 Phoenix Lite
Phoenix Lite is a cost-reduced RF front end module (FEM) intended to support iDEN and
WiDEN protocols. Many of the features of JANUS were removed, including the Rx
front-end and integrated Tx balun.
The Phoenix Lite transmitter module comprises a single lineup that support iDEN 800MHz,
iDEN 900MHz and Mototalk. The TX balun presents a differential impedance to the
modulator on the RFIC, and it also feeds RAW _B+ to the modulator via the TX_IN and
TX_INB pins. The nominal differential impedance to the TX balun is 200ohms.
The RFPA also features a 2.5dB load line select line as well as reduced quiescent current
mode for low output power operation.







6880401P39-O 37


OVERVIEW: Transmitter Path Section
1.7.3.1 TX BALUN
The TX BALUN transforms the RFPA 50ohms single ended input impedance into 200ohms
differential (SLEDGEHAMMER's output impedance is 200 ohms differential). The BALUN also
feeds RAW_B+ to the TX modulator portion of the RFIC that drives the RF PA through the TX_IN
and TX_INB pins.



Figure 1-11.TX Balun
1.7.3.2 POWER AMPLIFIER
The signal is then routed to the RF PA. All control signals will be asserted before TX_ENB is
asserted, and such control signals will be de-asserted after TX_ENB is de-asserted.
1.7.3.3 DIRECTIONAL COUPLER
The directional coupler samples the incident power going into the T/R switch and it feeds it back
to the RFIC for linearization and power control purposes.
1.7.3.4 HARMONIC FILTER
The harmonic filter is necessary to meet transmitter FCC emissions at the iDEN_ANT pin.
1.7.3.5 T/R SWITCH
The T/R switch selects the path that connects to the iDEN_ANT pin. The possible paths are iDEN
transmitter, iDEN receiver 800MHz, iDEN receiver 900MHz and Mototalk.
The switch should be able to maintain very high linearity under high VSWR conditions in order to
meet the stringent iDEN adjacent channel specifications as well as the harmonic emissions. The
lines SEL_1 and SEL_2 control the switch selection. The Figure 1-14 shows the diagram of the
switch.





Figure 1-12. T/R Switch







38 6880401P39-O


OVERVIEW: Transmitter Path Section
1.7.4 Cartesian Feedback
The iDEN transmitters use MQAM modulation, which requires a highly linear PA with wide
dynamic range. Linear PAs are highly inefficient, so a class AB PA is used for better efficiency and
longer battery life. The class AB PA is fairly linear, but not totally, and this causes splatter in the
RF spectrum around the transmitted frequency band. To reduce splattering into the adjacent
channels and to meet system specifications, the transmitter uses Cartesian feedback to linearize the
PA and reduce splatter. Negative feedback is a commonly used method to linearize circuits.
Cartesian feedback is the process of down converting the feedback signal to baseband and
summing it with the input signal in the I & Q paths separately. One can control the 180

phase shift
at baseband more precisely than at RF frequencies. The SLEDGEHAMMER is the heart of the
Cartesian feedback system, and as such, is the heart of the transmitter. There is a forward path and
a feedback path in the transmitter. This is a closed loop system and the loop cannot be opened
without drastic consequences






























6880401P39-O 39


OVERVIEW: Transmitter Path Section
The forward path includes the following:
SLEDGEHAMMER
Balun
Power amplifier
Coupler
The feedback path includes the following:
Coupler
Feedback attenuation network.
SLEDGEHAMMER
1.7.5 Level Set and Phase Training
Level set training is performed to ensure that the RF PA is not driven into clip, which would result
in excess splatter and out-of-band spurious emissions. During training, the DSP signal is
disconnected from the forward path and an internal analog ramp generator is connected. The
feedback is monitored and compared to the analog ramp. As the ramp amplitude increases and the
RF PA begins to clip, the error voltage increases. See Figure 1-16 on page 33.
The Javelin levelset circuit topology is modified slightly for Sledgehammer. The major difference
is that switches are not provided to select the I-channel training waveform to the Q-channel V-I
input. Instead, a programmable gain V-I is specified below on the Ichannel for boosting the
reference signal level during level training. The "cnrmp" control signal is output from the levelset
circuit to the I-channel V-I to control when the gain is changed.
V_TERM is a new signal input that will be OR'ed with the clip comparator output. This signal
causes a controlled signal ramp down when the battery current exceeds 3A during level training.
V_TERM OR'ed with the clip comparator output is sent back to the digital core to terminate the
counter used for the LEVEL _TRAIN read back value















40 6880401P39-O


OVERVIEW: Transmitter Path Section

Negative feedback is required to maintain system stability. Phase training is done to ensure that
the feedback is negative (180

). The phase shift of the loop consists of the sum of the delays
of several modules and components.
Operation of the Sledgehammer in a closed loop system requires the phase of the feedback
path to be adjusted with respect to the forward path such that the demodulated feedback
signal is the correct phase at the summing junction. This adjustment needs to take place
before the loop is closed and data is transmitted, and is referred to as the 'phase training
period'.
The maximum peak input signal to Sledgehammer is also scaled via the Roadrunner/DSP to
insure that the maximum input signal in the data will not cause clipping to occur in the
power amplifier output as a result of temperature/voltage gain variation in the forward path
(primarily the power amplifier). The scaling of the input signal is a result of 'level training'
which is performed in the transmit slot prior to data transmission. When level set training
was implemented on the Tranlin and ODCT IC, training was done autonomously on the IC.
Most of the level set circuitry was removed on the JANUS for cost savings.
SLEDGEHAMMER training methods will be based on the JANUS design. The scaling of the
input signal and the ramping is now performed by the DSP.The ramp signal will be applied
from the DSP, and will go through the signal path of the Roadrunner IC with the gain set
to maximum. The loop will be closed, but the slew rate limiter will be in a low gain (low
slew) mode. A counter on the Sledgehammer will begin counting from the beginning of the
timing event associated signal 'LAGC' and its' associated timing parameter "D". The loop
will perform an AGC function in the beginning portion of the ramp in order to set the loop
gain and then hold this gain value.
When the clip detect comparator determines that the loop can no longer compensate for the
PA, it will disconnect the Roadrunner input and allow the slew rate limiter to ramp the
signal down in a controlled manner to prevent splatter. After clip has been detected, and
before the beginning of data, a SPI read is necessary for the DSP to find out at what point
in time the clip occurred. Based on this information, a reference level will be set in the
Roadrunner. Providing level set in this manner will require at least two SPI activities. The
first activity is to read back the timing value "D" from the Sledgehammer IC. The second
is to write the gain setting for the Roadrunner.
Both phase and level training are required at least once before transmission of the data in
the first slot, but not necessarily performed in every transmit slot. DC training will be
performed at the start of every SLOT. All timer values associated with SLOT rising edge
will be increased with respect to JANUS program values to account for the DC training
time.
Unlike JANUS, Sledgehammer provides the ability to terminate the level training ramp by
either the internal Sledgehammer clip detector or an external control digital signal
V_TERM. V_TERM indicates when the battery current exceeds 3 Amps, which is used to
terminate the training ramp to avoid an early radio shutdown during level training.
Shutdown is avoided by lowering the transmit power when V_TERM is detected. This
signal goes directly to the levelset circuitry.


6880401P39-O 41


OVERVIEW: Receiver Path Section
1.8 Receiver Path Section
The receiver is a direct conversion receiver. It operates in the commercial portion of the
land-mobile receiver band (851-870MHz and 935-940). The receiver takes an incoming
RF signal, down-converts it to baseband where it is then amplified, filtered, digitized and
then provided to the DSP MODEM. The receiver has, automatic gain control (AGC) to
maintain good linearity over a wide range of incoming signals. The AGC circuitry also
prevents clipping of high-level signals.



Figure 1-14. i465 Block Diagram

42 6880401P39-O


OVERVIEW: Receiver Path Section
1.8.1 Rx Front End (RXPath)
The Phoenix Lite module (U501) contains the antenna switch. The antenna switch routes
the received signal from the antenna pin input to the receiver block. During transmit mode,
this switch disconnects the receiver path and connects the antenna to the transmit path. The
passive SAW filters and the associated switches, along with the active LNA and the balun
circuit, are all implemented as discrete components. The triple preselector SAW filters
protect the RF LNA from strong, out-of band signals. There are three filters (800MHz,
900MHz, and ISM) that are appropriately selected by the RF switches, for the appropriate
band of operation. The low-noise amplifier (U200) provides the gain to achieve the
necessary receiver system take over gain and the AGC stage provides continuous
attenuation to avoid overload of the receiver backend. Finally, the balun facilitates the
conversion of the single ended LNA output to a differential signal that is necessary to feed
the input block of the Sledgehammer IC.
1.8.2 Sledgehammer IC (RXPath)
The Sledgehammer IC (U2051) contains the frequency synthesizer, down-conversion
mixers, baseband amplification and filtering stages. The main function of the
Sledgehammer IC is to translate the RF input signal in to the two I and Q baseband
differential signals. The signal path has a fixed amount of gain and also contains the DC
offset correction circuitry. The IC contains basic analog anti-aliasing filtering. The IC also
supplies a digital control line to the Janus module that enables the LNA.
1.8.3 Roadrunner IC (RX Path)
The Roadrunner IC (U701) performs the digital conversion, digital filtering, and the AGC
control of the radio. The main function of the IC, from an RX perspective is the Analog to
Digital conversion performed by the Sigma Delta converter. This digitized output signal is
processed by FIR and IIR filtering and then the final output is framed and sent to the
Baseband Processor via the Receive Synchronous Serial Interface Bus. The IC also
controls both the RF step attenuator and the continuous AGC control lines. The RF step
attenuator is enabled via SW and the Roadrunner logic line signals the iDEN LNA to
enable the attenuator when the unit receives a desired signal stronger than -50dBm. The
continuous AGC functionality is controlled by an analog voltage line which feeds the LNA.
This voltage ranges from approximately 1.3875 V to 2.5 V and increases linearly for
signals greater than ~-60dBm at the antenna input.















6880401P39-O 43


OVERVIEW: Frequency Generator (RF) Section
1.9 Frequency Generator (RF) Section
This section contains the following main components of the RF board:
TCXO based Reference Oscillator Circuit.
Host system clock synthesizer.
(SLEDGEHAMMER) Phase Locked Loop synthesizers (Main & Escort).
Main/RX Voltage Controlled Oscillator (VCO - U300). Note Main/RX VCO output
used as source to Main Prescaler input of SLEDGEHAMMER main synthesizer PLL.
All frequencies in the i465 originate from the 33.6 MHz reference frequency provided by
SLEDGEHAMMER synthesizer and the TCXO based reference oscillator circuit. The Y600
TCXO generates the 33.6 MHz signal, which is temperature compensated.
Figure 1-18 illustrates the frequency generator circuitry path:



























Figure 1-18. Frequency Generator




Reference Oscillator

The 33.6 MHz reference is generated by temperature compensated crystal oscillator
(TCXO) and fed to SLEDGEHAMMER IC (CLKOUT) output provides a stable and
accurate 33.6 MHz reference frequency for the synthesizers. This 33.6 MHz signal is sent
to Bluetooth, SLEDGEHAMMER and ROADRUNNER as a reference. This reference is
divided down to a 4.2 MHz reference for the transmitter (TCLK).





U300
U2051
Multi-Band Transceiver
Y600 TCXO
U1000
Bluetooth
U701
Power Management IC /
Digital / Audio IC
U801
DSP AFC
1702 - 1740 MHz
1870 - 1882 MHz
1804 - 1856
Loop Filter
R PFD
Loop

N
PFD
U300 RX
44 6880401P39-O


OVERVIEW: Global Positioning System (GPS) Section

1.10 Global Positioning System (GPS) Section
The U.S. Department of Defense (DoD) operates a constellation of 24-satellites, employed
for location and/or navigational purposes, on earth. These satellite vehicles (SV) operate
in circular orbits, round the earth every 12 hours, at an altitude of 20,200 km. The SVs
transmit earth-bound radio signals at a 1575.42 MHz fixed carrier frequencyan L1 band
for non-military applications. Since the SVs utilize one carrier frequency, by employing a
Spread Spectrum modulation technique, each SV can be uniquely identified from an
assigned Pseudo-random Noise (PN) Code.
To determine a location on earth, a receiver must be built that can receive the
simultaneous signals from the satellites that are in view of the receiver and use that
information to calculate the location of the receiver. The receiver must pick up the signals
from 4 satellites. Once the 4 satellites are located, the receiver measures the time it took for
the satellite signals to arrive. From this timing information, the distance between the
receiver and each satellite can be calculated. The four satellites ephemeris data provide
the satellites X, Y, and Z positions. The range, R, is the receiver measurement made by
calculating the time it took for the signal to reach the receiver. The users position, (Ux, Uy,
Uz), and the clock bias, Cb, is then calculated.
To use the GPS, a receiver that can receive the spread-spectrum signals must be built. The
detected signals are then converted from RF signals into appropriate digital input
formats. These digital inputs are processed and converted into position information.
1.10.1 GPS Receiver
A block diagram of the receiver for the i465 is shown in Figure 1-19. The GPS receiver is based on
the SiRF SiRFStarIII GPS chipset.
































6880401P39-O 45


OVERVIEW: Global Positioning System (GPS) Section
1.10.2 GPS Antenna
The GPS antenna is a unique part, tuned to the center of the GPS band at 1575.42MHz.
1.10.3 GPS Pre-selector
This pre-selector is used to isolate the GPS signal from the iDEN signal, as well as other
RF signals collected by the GPS antenna.
1.10.4 GPS LNA
The GPS LNA provides gain while introducing minimal noise, thus improving the
sensitivity of the GPS receiver. Expect about 20 dB of gain through this LNA.
1.10.5 SAW FILTER
This SAW filter enhances the iDEN to GPS isolation and attenuates all signals outside of
the GPS band.
1.10.6 BALUN
This Balun converts the single-ended signal to a differential signal.
1.10.7 GPS Down-Mixer
SLEDGEHAMMER IC is a multi-purpose IC that hosts a number of components in the
GPS lineup. For GPS, the SLEDGEHAMMER IC mainly mixes down the differential RF
signal to differential IF signal and provides the GPS clock to the next stage.
1.10.8 GPS A/D Conversion
The ROADRUNNER IC is mainly a DC management IC but also converts the analog
GPS IF signal to digital signal ready to be processed by the ZEUS IC.
1.10.9 GPS Digital Processing
The ZEUS IC is the main processor for the radio. The ZEUS IC also processes the GPS
signal to calculate the GPS locations and provides the GPS AGC control to the
Sledgehammer IC. The baseband digital signals are input to the SiRF processor circuit
(integrated in ZEUS) which in turn computes the position information. Once the position
is determined, it is communicated to the handset microprocessor and displayed on the
screen for personal use or transmitted to the base station for E911 as required.
1.10.10 GPS Reference Oscillator
A 33.6 MHz clock signal is used by the Sledgehammer RF circuit as the frequency reference
for its internal local oscillator. This clock is a temperature compensated crystal oscillator
whose frequency accuracy is held to within 0.5 ppm. The high accuracy of the clock
frequency plays a critical role in determining the time it takes to calculate the position
coordinates.


46 6880401P39-O


OVERVIEW: Bluetooth Wireless System

1.11 Bluetooth Wireless System
Bluetooth technology is used for short range wireless communications that do not require
high data rates. The original usage models included telephone, headsets, low-data rate
access point, file transfer, and automatic synchronization. The newer usage models have
added human interface devices, remote control, print capability, cable replacements and
personal area networks.
Bluetooth devices use GFSK modulation in the 2.4 to 2.4835 GHz band. The channels have
a bandwidth of 1 MHz. Frequency hopping is used to provide immunity to interference.
The master unit in a pico-net dictates the hopping sequence at a rate of 1600 hops per
second. This translates to a 625 uS transmission. The maximum data rate through a
Bluetooth device is 3 Mb per second.



































6880401P39-O 47
























This Page Left Blank Intentionally
























48 6880401P39-O


PREPARING FOR FIELD LEVEL TESTING: Preparing Equipment for Testing
Chapter 2
PREPARING FOR FIELD LEVEL TESTING
Field level testing requires external equipment and support. To conduct field level trouble-
shooting and testing of an i465 unit, you must become familiar with the screen readouts of
the recommended test equipment.
Display screens provide information that is useful for troubleshooting purposes. Refer to Chapter
3 for information on the displays, errors, alert tones, and messages associated with this unit.
2.1 Preparing Equipment for Testing
To ensure accurate testing of an i465 unit, it is important that the test equipment function properly.
2.1.1 Calibrating Equipment
Test equipment should be internally calibrated before being used for testing. Note that the internal
calibration does not substitute for a factory calibration. For more information, refer to R-2660
Digital Communications System Analyzer Operators Manual.
2.1.2 Checking the RF Cable
Check the cable connection and quality to ensure that the test results are true. Cable length is criti
cal to consistent Rx sensitivity and Tx power measurements. Use a high-quality, shielded,
50-ohm, coaxial cable that is approximately 1.5 feet in length. Place the unit to be tested at least 6
inches from the call box. The cable loss should be less than 2 dB.

2.1.3 Strong-Signal Environments
When using the R-2660 Communications System Analyzer to test a unit in a strong-signal
environment (75 dBm or stronger), change the bandmap of the unit.
For Registration/Call testing: Power up the unit. Immediately after hearing the beep, press Start
on the R-2660. The unit will lock onto the first strong signal.
2.1.4 Protecting Static-Sensitive Devices
This unit contains static-sensitive devices that must be protected when opening the unit, or storing and
transporting any printed-circuit board. Consider the following information to create a proper ground:
Ground the working surface of your service bench. If possible, use the Motorola Static
Protection Assembly (P/N 01803 86A82) to ground your service bench. This assembly
contains a wrist strap, two ground cords, a table mat, and a floor mat
Wear a conductive wrist strap in series with a 100 k resistor to ground.
Do not wear nylon clothing when handling any printed-circuit board.
Prior to touching any printed-circuit board, touch an electrical ground to remove any static
charge that might have accumulated.




6880401P39-O 49


PREPARING FOR FIELD LEVEL TESTING: Preparing Equipment for Testing
Refer to Service and Repair Note SRN-F 1052 for more information. This note is available
through:
Motorola Literature Distribution
Center 2290 Hammond Drive
Schaumburg, IL 60173
847-576-2826
The following should be considered when storing or transporting a circuit board:
Place the printed-circuit board in conductive, anti-static material.
Do not insert the printed-circuit board into conventional plastic snow trays used for
transporting other devices.
2.2 Using RSS
Use Radio Service Software (RSS) to program a new software version or to update user information
in the codeplug. Refer to Connecting the Unit to the RSS Workstation and the Radio Service
Software Read-Mes for information on the setup and use of RSS.
NOTE: You can use the RSS online Help for locating specific information about RSS dialog boxes
and fields. To access online Help, press F1 while you are viewing an RSS screen.
If you are using the R-2660A Communications System Analyzer in the iDEN mode, which is 6:1
capable, use RSS to program an i465 unit for Full Rate operation. Use the 6:1 Interconnect
softkey for all interconnect testing.
If you are using the R-2660B or later, which is 3:1 capable, use RSS to program an i465 unit for
Half Rate operation. Use the 3:1 Interconnect softkey for all interconnect testing.
In the carrier version of RSS (but not the agent version), you can change interleave values. To access
the fields where you can change these interleave values, go to the User Ergonomics dialog box, and
then click on the Interleave tab.
NOTE: After servicing an i465 unit, use RSS to reprogram the unit back to its original operating state.
Refer to the R-2660 Digital Communications System Analyzer Operators Manual for more
information on how to set up this equipment for iDEN mode testing.

2.3 Connecting an i465 Unit to the R-2660
The R-2660 Communications System Analyzer enables you to monitor and perform tests on an i465
unit. Figure 7-1 shows the i465/R-2660 test setup.
Equipment Required: R-2660, reference SIM card, SMA to N-type RF coaxial cable, battery
eliminator, 5.0-12.0 Vdc power supply.



50 6880401P39-O


PREPARING FOR FIELD LEVEL TESTING: Preparing Equipment for Testing






















Figure: 7-1. Typical R-2660 Setup
To connect the unit to the R-2660:
1. Ensure the unit is powered off, and then turn on the R-2660.
2. Remove the battery cover and battery from the unit, and insert the reference SIM card.
3. Attach the battery eliminator to the back of the unit.
4. Engage RF.
5. Connect the SMA connector of the RF cable to the RF connector on the battery eliminator.
6. Connect the N-type connector of the RF cable to the R-2660 RF In/Out connector.
7. Attach the power leads on the battery eliminator to the DC power supply.

8. Turn on the power supply, and adjust output between 5.0 and 12.0 Vdc. With the correct
setting, the regulated battery eliminator will provide 4.0 Vdc to the subject unit.
9. If power supply is capable, set current limit = 4.0 A.
10. Power up the subject unit.
2.4 Operating the R-2660
Refer to the R-2660 Digital Communications System Analyzer Operators Manual for more
information on how to use and operate this equipment.


CAUTION: Be very careful to observe polarity when connecting power to the battery eliminator.
6880401P39-O 51


PREPARING FOR FIELD LEVEL TESTING: Dis-Assembly and Assembly of i465
2.5 Dis-Assembly and Assembly of i465 Unit
Motorola recommends the service technician follow a prescribed disassembly sequence to access
specific items or components of the unit. This product is an efficiently designed package that
incorporates the physical overlap and integration of some modular components. Refer to the
Disassembly Sequence Flowchart for a suggested path to reach specific components.
NOTE: In some cases, the technician may not need to remove certain components to reach
others.
2.6 Disassembly Procedure
NOTE: Screws used to assemble the i465 main housing are: 6 housing assembly screws, T-6 drive.
2.6.1 Disassembly Sequence Flowchart
Note: i465 flip components include a Flex Connector ribbon which can be easily torn or damaged if not
handled properly. Handle the Flex Ribbon with care especially when working it through the front housing
slot.













Main Board
LCD Front Housing
Back Housing
Battery Cover
SIM Card
Battery
Keypad
52 6880401P39-O


PREPARING FOR FIELD LEVEL TESTING: Battery Cover, Battery, and SIM Card Removal

2.6.2 Battery Cover, Battery, and SIM Card Removal

1. Place Unit face down, open Audio Jack Seal, and slide Battery Door towards the bottom of the
unit.
2. Lift and remove Battery Door.
3. Lift the back of the battery with fingernail.
4. Lift the battery from the back and remove from the unit.
5. Depress the SIM card lock and push the SIM card from the back, through the opening using a
black stick.
6. Slide the SIM Card outward. Being careful not to touch the contacts.










































1 2
3
6 5
4
SIM card lock
BK70
6880401P39-O 53


PREPARING FOR FIELD LEVEL TESTING: Opening the Unit

2.6.3 Opening the Unit
Tools Required:
Torx Driver & #6 Torx Bit


1. Remove all six screws from the back of the unit
2. Separate the front housing from the back housing.
3. Remove the Kapton Tape from the Ziff connector.
4. Remove the Ziff flex from the Ziff board connector.














































1
2
3 4
54 6880401P39-O


PREPARING FOR FIELD LEVEL TESTING: LCD Removal
2.6.4 LCD Removal
Tools Required:
None required


1. Remove the LCD from the front housing. [Avoid touching the display glass with fingers].
2. Place a protective liner on the LCD to minimize debris collection on the display.




























































1
2
6880401P39-O 55


PREPARING FOR FIELD LEVEL TESTING: Keypad and Main Board Removal

2.6.5 Keypad and Main Board Removal
Tools Required:
Torx Driver & #5 Torx Bit

1. Remove the two screws holding the Keypad Board to the Back Housing
2. Lift the Keypad Board from the right side.
3. Remove the Camera Flex from the back housing carefully to avoid damage to the flex.





























3
1
2
56 6880401P39-O


PREPARING FOR FIELD LEVEL TESTING: Vibrator and Main Board Removal
2.6.6 Vibrator and Main Board Removal

Torx Driver & #5 Torx Bit

1. Remove the Vibrator and transducer from the keypad board.
2. Disconnect the 30pin BTB connector from the keypad board.
3. Remove the two main board screws and two micro USB Clip screws from the unit.
4. Remove the main board from the Back Housing (Ensure not to damage the battery contacts
or the FJA antenna contact).





























1 2
3 4
6880401P39-O 57


PREPARING FOR FIELD LEVEL TESTING: Assembly Flow Chart
2.7 Assembly Procedure
2.7.1 Assembly Flow Chart























Lens
Main Board
Keypad Board
Front Housing
Back Housing
Battery Cover SIM Card Battery
LCD
58 6880401P39-O


PREPARING FOR FIELD LEVEL TESTING: Main Board Inspection
2.7.2 Main Board Inspection

Inspect the main board to verify that the following parts are not damaged, bent, or defective




































S SI IM M C CO ON NN NE EC CT TO OR R A AU UD DI IO O J JA AC CK K
U US SB B C CO ON NN NE EC CT TO OR R
W WA AT TE ER R I IN ND DI IC CA AT TO OR RS S R RF F C CO ON NN NE EC CT TO OR R
M MA AI IN N B BO OA AR RD D L LA AB BE EL L
M MI IC CR RO O U US SB B C CL LI IP P
S SP PA AC CE ER R A AD DH HE ES SI IV VE E
C CO ON NN NE EC CT TO OR R
6880401P39-O 59


PREPARING FOR FIELD LEVEL TESTING: Main Board Assembly
2.7.3 Main Board Assembly
Tools Required:
Main board screw driving fixture: D309-22


1. Place the main board into Back Housing (Ensure not to damage the battery contacts or the FJA
antenna contact).
2. Open the top cover of the fixture and place the assembly into fixture and close the fixture cover.
3. Drive two main board screws and two micro USB Clip screws in the order shown.

























































3
1
3 4
2
1
2
60 6880401P39-O


PREPARING FOR FIELD LEVEL TESTING: Back Housing Inspection and Preparation
2.7.4 Back Housing Inspection and Preparation
Inspect the Back Housing to verify that the parts are not damaged, bent, or defective. Ensure
The printing on the label clear and straight.




















1. Assemble the transducer into transducer seal.
2. Apply the poron backer on camera flex.
3. Remove the adhesive liner of the main board and rear housing.
4. Assemble side key into back housing.










































1 2
3
4
6880401P39-O 61


PREPARING FOR FIELD LEVEL TESTING: Vibrator Installation
2.7.5 Vibrator Installation
Tools Required:
None Required

1. Assemble seal, vibrator to the reciprocal location of the keypad board assemble
transducer assembly to keypad board slot.
2. Connect 30pin BTB connector to keypad board.
3. Remove the liner on camera and back housing and Apply the flex to back housing




























































1
2
3
62 6880401P39-O


PREPARING FOR FIELD LEVEL TESTING: Keypad Board Installation

2.7.6 Keypad Board Installation
Tools Required:
Keypad Connector Press Fixture:D309-23


1. Locate the keypad board to main board, push the transducer subassembly to keypad board. Press
the keypad over the location of connector and adhesive manually.
2. Place the assembly into the nest, push nest under the press, then press.


























































1
2
(Pressure:0.65+/-0.05Mpa, Press time:5S)
6880401P39-O 63


PREPARING FOR FIELD LEVEL TESTING: Keypad Board Screw Installation
2.7.7 Keypad Board Screw Installation
Tools Required:
Keypad Screw Driving Fixture:D309-24



1. Open the top cover of the fixture, place the assembly into fixture
2. Close the fixture cover.
3. Drive two keypad board screws.

















































1
2 3
2
1
Torque: 0.63-0.77Ibf *in (0.72-0.88Kgf *cm)
64 6880401P39-O


PREPARING FOR FIELD LEVEL TESTING: Adhesive Application
2.7.8 Adhesive Application
Tools Required:
Front Hsg. Alignment Adhesive Fixture:D309-42
Lens Adhesive Alignment Fixture:D309-39


1. Position the adhesive on fixture with sticky side upward.
2. Align the front housing onto fixture.
3. Position the Lens adhesive on fixture with sticky side upward.
4. Align front housing onto the lens fixture.







































1 2
3 4
6880401P39-O 65


PREPARING FOR FIELD LEVEL TESTING: Lens Installation
2.7.9 Lens Installation
Tools Required:
Lens Press Fixture:D309-40
Felt to Lens Fixture:D309-44


1. Stick the felt port transducer on lens in the recess area, and press it in the fixture.
2. Place the lens onto the front housing.
3. Apply the protective liner to the inside of the lens.
4. Put front housing into the nest, then press the button of nest two side at the same time, press
lens to activate the adhesive, take front housing out of nest after press complete.























































(Pressure:0.35+/-0.05Mpa, press time: 5S)
1 2
3
4
66 6880401P39-O


PREPARING FOR FIELD LEVEL TESTING: LCD Installation
2.7.10 LCD Installation


1. Remove the inside liner of the lens
2. Remove the liner of the LCD.
3. Place LCD into front housing. [Keep the top edge of the LCD close to the top edge of the front
housing assembly].
4. Remove the liner of the front housing adhesive.






























































1 2
3 4
6880401P39-O 67


PREPARING FOR FIELD LEVEL TESTING: Closing the Unit
2.7.11 Closing the Unit
Tools Required:
Front housing to keypad press fixture:D309-26


1. Connect ZIF connector.
2. Place the Kapton tape on the connector.
3. Alignment the front & back housing and press it together.
4. Place the unit into the nest.
5. Slide nest under the press.
6. Apply pressure using Fixture: D309-26. Pressure:0.2+/- 0.05Mpa Press time:5S
























































1 2
3 4
5 6
68 6880401P39-O


PREPARING FOR FIELD LEVEL TESTING: Keypad Board Installation

2.7.12 Keypad Board Installation
Tools Required:
Main screw driving fixture:D309-27


1. Open the top cover of the fixture and place the unit into fixture.
2. Close the fixture cover.
3. Torque the 6 screws in the order shown


























































1
2 3
Torque: 1.2-1.4Ibf *in (1.38-1.61Kgf *cm)
2
1
3
4
5
6
6880401P39-O 69


PREPARING FOR FIELD LEVEL TESTING: Keypad Board Screw Installation
2.7.13 SIM Card, Battery, and Battery Cover Installation

1. Follow the diagram on the back housing to ensure proper alignment
2. Push the SIM card in toward the middle of the unit
3. Angle the Battery (Approx. 45 degrees) into the back housing with the battery contacts toward
the bottom of the unit.
4. Slide the battery in and push the back of the battery down
5. Align the Battery Door on the Unit
6. Slide toward the top of the unit.
7. Close the Micro-USB/Audio Jack Cover.










































1 2
3
6
5
4
BK70
7
70 6880401P39-O


TROUBLESHOOTING: Digital Analysis Test
Chapter 3
TROUBLESHOOTING
3.1 Digital Analysis Test
Use this test for troubleshooting the digital section.





























































Did
the unit pass the
Initialize RCE
test?
Check the test
points, TP-RX and TP-TX,
for proper communication
between the
ROADRUNNER and
PATRIOT.
Apply 7.8V at J7
pin 4 (EMU_ID)
Assert MOD,
and then power on
the unit.
Check EMU connector
continuity, and visually
inspect for excess plastic
blocking contacts.
Initialize RCE.
Check the voltages on the ROADRUNNER.
Check 32 kHz (CKIL).
Check 16.8 MHz (CKIH)
ROADRUNNER generates 32 kHz. and
SLEDGEHAMMER generates 16.8 MHz.
Defective
ROADRUNNER.
Is the unit drawing
10-250 mA?
Defective
PATRIOT.
No TX, with RX No RX
Pass
Fail
Pass
Fail
Continued
on next
page
6880401P39-O 71


TROUBLESHOOTING: Digital Analysis Test
Digital Analysis Test (Continued)


























































Did
the unit pass the
Initialize DSP
test?
Initialize
the DSP.
Load Setfiles to configure the
chip selects.
Test the
external SRAM.
Check for a
defective PATRIOT.
Check for a
defective PATRIOT.
Pass
Fail
Did
the unit pass the
Load Setfiles
test?
Pass
Fail
Continued
on next
page
Continued
from previous
Page
72 6880401P39-O


TROUBLESHOOTING: Digital Analysis Test
Digital Analysis Test (Continued)



































Test the DSP memory, internal
SRAM, and ROM-all cells.
The DSP
inside the PATRIOT
is defective.
Check for a
defective PATRIOT.
Pass
Fail
Did
the unit pass the
Initialize DSP
test?
Did the
unit pass the 8M
x16 SRAM test all
cells?
Did
the unit pass the
DSP Memory
test?
The Flash or the PATRIOT is
defective. Also, check for
opens and shorts on the Main
Board and PATRIOT.
Check the PATRIOT
and Main Board for
opens or shorts.
Pass
Fail
Continued
on next
page
Continued
from previous
Page
6880401P39-O 73


TROUBLESHOOTING: Digital Analysis Test
Digital Analysis Test (Continued)































Did the vibrator
Turn on?
Replace or repair,
as needed.
The Digital section
successfully passed
all tests.
Test the
vibrator.
Pass
Fail
Pass
Fail
Did
the backlight
turn on?
Replace or repair,
as needed.
Test the backlight by
turning it on.
Continued
from previous
Page
74 6880401P39-O


TROUBLESHOOTING: LO Output Test
3.2 LO Output Test






























Is there a
signal at MAIN VCOIN
port?
Check for opens, shorts,
or wrong parts in the
main VCO loop filter
C301, C303, C305, C306,
C307, C308, C309, C310,
R601, R602 ,R603
RX Main VCO injection to
SLEDGEHAMMER. Using a high
impedance probe on the spectrum analyzer,
check the LO output at junction of C312 and
the SLEDGEHAMMER MAIN VCOIN port.
The RX Main VCO FGU
is working properly.
Probe for the LO
signal at U300 pin 1.
Check U300 pin 5,
C690, C300, L300
for shorts to ground.
Repair as necessary
and retest. Check
U701 for proper
supplies and mode
programming. If all is
correct, replace U701.
Check VCO band select lines
for 800 band U300 pin 7 is
high, pin 8 is low. For 900
band U300 pin 8 is high, pin 7
is low. (Sel1-8;Sel2-7
Replace U300
and retest.
Check for opens,
shorts, or missing
components on R600,
L301, L304, C312.
Check for a bad
connection from the
U300 to the radio board.
Check for a bad connection from
the U300 to the radio board.
Pass
Fail
Is the
correct band
select line high
(2.775 Vdc)?
Is the
LO signal at
U300 pin 1?
Is SFout
Voltage (2.5 Vdc)
at U300 pin 5 or
C690.
Is
the signal level
at least -10 dBm or
70mV Rms?
Is
the signal at
1702.025 MHz
(851.0125) or 1870.0375
MHz (935.01875)
?
Is
control V @
U300 pin 8 between
0.5 and 2.1
Vdc?
B
C
B
C
Check for opens,
shorts,at C302 or
L302,C304 or L303
(pins 8 or 7). Verify
proper programming
commands. If all is
correct replace U300.
Pass
Fail
Pass
Fail
Note: Run the RX BER
851.0125 Test before
beginning this test. (Run
the RX BER 935.01875
Test before beginning to
test the 900 MHz band.)
Use this test on a unit with the following symptom: no RX.
LO Frequency Range:
1699.535 MHz to 1740 MHz (800 band)
1869.9 to 1882.4 MHz (900 band).
Fail
Fail
Fail
Fail
Pass
Pass
Pass
Pass
Pass
6880401P39-O 75


TROUBLESHOOTING: RX Main VCO Test
3.3 RX Main VCO Test























































Is there
a signal at the
SLEDGEHAMMER
VCO_IN port
?
Using a high impedance probe on
the spectrum analyzer, check the LO
output at the junction of C312 on the
SLEDGEHAMMER VCO_IN port.
Probe for the LO signal by placing
the probe on the VCO module pin 1.
The level will be low. Adjust the
spectrum analyzer accordingly.
Check for opens,shorts, or
missing components
on the Sfout line.
Check band select lines. For 800
band, voltage at C302 is low and
voltage at C304 is high. For 900
band, voltage at C302 is high
and voltage at C304 is low.
Check for opens, shorts, or missing
components on the RX VCO out
path. Check for a bad connection
from the VCO module to the radio
board or a bad VCO module.
The FGU is working properly.
Further investigation in the
FGU requires noise
performance or locktime
testing, such as
H&N or SBN.
Check for opens, shorts, or missing
components on R600, L301, and L304.
Check for a bad connection from the
VCO module to the radio board.
Pass
Fail
Is
Level >2.5 V
?
Is
the LO signal at
VCO output
?
Is
SFout voltage
(2.55 Vdc) at U300
pin 5
Is
the signal level at
least 70mV Rms
?
Is
the signal at
1702.250 MHz
(800 band) or
1870.0375 MHz
(900 band)
?
Check for opens, shorts,
or missing components
On C302, C304, L302, L304,
U300, and U701.
If OK, see Digital Analysis Tests.
Pass
Fail
Pass
Fail
Note: Run the RX BER
851.0125 Test before
beginning this test. (Run
the RX BER 935.01875
Test before beginning to
test the 900 MHz band.)
Use this test on a unit with the following symptom: no RX.
LO Frequency Range: 2x RX Freq.
851.0125 MHz = 1702.025 MHz (800 band)
935.01875 = 1870.0375 MHz (900 band).
Fail
Fail Fail
Fail
Pass
Pass
Pass
If no opens/shorts or
missing components are
found, on SFout line,
Replace the
ROADRUNNER.
Continued
on next
page
76 6880401P39-O


TROUBLESHOOTING: RX Main VCO Test
RX Main VCO Test (Continued)
































Is the
voltage between
0.5 and 2.1 Vdc
?
Check that the voltage
at R603 is between
0.5 and 2.1 Vdc.
Check that the TCXO oscillator
frequency is 33.6 MHz +84 Hz.
There is no issue with
the control voltage.
Ensure the correct band select is chosen.
For 800 band, U300 pin 8/C302 is low and
pin 7/C304 is high. For 900 band U300 pin
7/C304 is low and pin 8/C302 is high.
Check for a problem in
the TCXO oscillator
circuit. Refer to the
TCXO Oscillator
flowchart.
Check for a problem in the
VCO module. Replace the
module and test again.
Correct band is
selected.
Pass
Fail
Is
the voltage
railed low
(<0.5 Vdc)
?
Is the
TCXO frequency
within range
?
Is
the voltage railed
high (>2.1 Vdc)
?
Fail
Pass
Fail
Fail
Pass
Check for opens, shorts, or missing
components in the loop filter. Ensure SEL1
and SEL2 voltage levels are programmed
properly.Ensure SLEDGEHAMMER
commands are proper.
Continued
from previous
Page
6880401P39-O 77


TROUBLESHOOTING: Keypad Failure Test

3.4 Keypad Failure Test.






























Only
one key
failed?
Replace the
Patriot-U801.
Ohm out the
keypad row/column.
Check for opens
or shorts under
FL1 and FL2 or
FL401 and FL402.
No keys are
functioning. Check
for opens or shorts
under FL1 and FL2 or
FL401 or FL402.
Press each key
on the keypad
one key at a time.
Check keypad switch.
Ohm out key to other
keys in the same row
and columns.
Check if holding down
three buttons in a row
puts the unit in MA
Test Mode.
Pass
Fail
Other
keys in same row/
column failed?
Use this test on a unit with the following symptom: keypad failure.
78 6880401P39-O


TROUBLESHOOTING: SLEDGEHAMMER Test
3.5 Sledgehammer Test






























Is the
voltage at R6000
2.775 Vdc
(V2_GPS)
Go to the
test flowcharts for
voltage regulator
verification.
Check
L204 for
2.775 Vdc (V2-RX).
Go to the
test flowcharts for
voltage regulator
verification.
Pass
Fail
Is
the voltage
at L204
correct 10%?
Is the
voltage at C620
and L605 at 1.875Vdc
10%?
Pass
Fail
Is the
voltage at E600
(SF_OUT) at 2.56 Vdc
10%?
The problem is in the
SLEDGEHAMMER.
Repair or replace, as
necessary.
Go to the
test flowcharts for
voltage regulator
verification.
Use this test to check the SLEDGEHAMMER circuitry.
Pass
Fail
Pass
Fail
Continued
on next
page
6880401P39-O 79


TROUBLESHOOTING: SLEDGEHAMMER Test
Sledgehammer (Continued)
































Is
the voltage
at C302
~ 0 Vdc and voltage at
C304 ~ 2.775 Vdc?
Remove U300,
and check
the voltage again.
1. In BERBUG, type the
following: >rx static
>mode rx (Ignore the
message returned).
2. Check the voltage
on C302 and C304.
The SLEDGEHAMMER
is functional.
Pass
Fail
Is the
voltage at C302
~ 0 Vdc and voltage at
C304 ~ 2.775 Vdc?
Replace
ROADRUNNER IC.
The problem is in the
VCO module. Replace
the module and run the
test again.
Pass
Fail
80 6880401P39-O


TROUBLESHOOTING: RX Analysis Test
3.6 RX Analysis Test































Use this test on a unit to perform a RX analysis in iDEN mode.
1. Set up the R-2660 as follows: Mode: iDEN Test, Meter: RF DISPLAY, RF Control: GENERATE, FREQ: (See
Table) MHz, Gen: OUT6/6, Gen: -60 dBm, RF I/O.
2. Set the spectrum analyzer to Center Freq: 851.000 MHz (935.01875 MHz for 900), Span: 100 kHz, Amplitude:
-30 dBm reference level. Set marker to test frequency, and use Trace and Max. Hold to obtain readings. Use Clear
before taking each reading.
3. Except as noted, use a 50-ohm probe for all RF measurements. The probe ground must make contact with the
board ground during the measurements.
4. Check that signal measurement levels are 3dB at each test point, unless otherwise stated. A low RSSI level will
result in higher BER as the signal becomes weaker.
5. The RF cable from the R-2660 to the unit under test (UUT) should be <18 inches for these measurements in this
flowchart.
6. Be sure to check for any defects, such as unsoldered connections, shorts, broken or defective components.
7. Remove the antenna from the UUT before beginning these tests.
Do voltages
agree with
table +- 5%?
Inject a -50 dBm CW tone into the RF
jack at the selected frequency from the
table with a frequency offset (+ 2KHz).
Place Radio into BERBUG, and send the
following commands:
RX STATIC
RX FREQ XXX ( XXX is one of the
frequencies from the table)
MODE RX
For the programmed frequency,
measure voltages on the capacitors in
the table.
Check U3003, U3004, C203, C60054 and C252 for S,
US, MP and DFP then if no faulty remove U3003 and U3004
Pass
Fail
Were all
frequencies from
table tested?
Pass
Fail
Abbreviations:
S - check for Shorts
US - check for unsoldered parts / open connections
MP - check for missing parts
DFP - check for defective parts
Do voltages
agree with
table +- 5%?
Measure voltages on the Roadrunner side.
Replace U3003 and U3004
Check C203, C60054 and C252.
Check DC section, then if no fault
found replace the
Roadrunner IC (U701).
Frequency GP03 GP04 GP05
(MHz) C252 C60054 C203
806 0 0 2.775
915.525 2.775 0 0
937.49375 0 2.775 0
6880401P39-O 81


TROUBLESHOOTING: RX Analysis Test
RX Analysis Test (Continued)































Test
851.0125 MHz
(935.01875 MHz for 900)
for -61.5 dBm at C204
(C60057)
If within +/-4 dBm, use this
as an offset factor for all
subsequent readings.
Otherwise, recalibrate the
R-2660.
At the antenna connector
M500, test for a -60 dBm
(+/-1 dBm) 851.0125 MHz,
935.01875 MHz for 900
Quad 16QAM signal.
Is
the Quad 16QAM
signal correct
?
Check U3003 for
US, MP, DFP, etc.
Check antenna input
switch or connector for
US, MP, DFP, etc.
Test
851.0125 MHz
(935.01875 MHz for 900)
for -61 dBm at
C201.
Pass
Fail
Abbreviations:
US = Unsoldered components or connections
MP = Missing parts
DFP = Defective parts
Continued
on next
page
Pass
Fail
Pass
Fail
Test
851.0125 MHz
(935.01875 MHz for
900) for -63.5 dBm at C60059
(C60058)
Check components
from FL201 for US,
MP, DFP, etc.
Fail
Pass
82 6880401P39-O


TROUBLESHOOTING: RX Analysis Test
RX Analysis Test (Continued)











































Check on U200,
C60060, C202, L200, C205,
R201, L201, C60056, C206, R200,
L202, C207, C60055 and R204 for
US, MP, DFP, etc.
Check U3004
US, MP, DFP, etc.
Test
851.0125 MHz
(935.01875 MHz for
900) for -64 dBm at U3004 at
Pin1 or C60060
Check on the DC
section, then if not
faulty, replace
Sledgehammer IC
(U2051).
Measure voltage on
pin 3 of LNA Life.
Test
851.0125 MHz
(935.01875 MHz for 900)
for -50 dBm at L202
output.
Pass
Fail
Abbreviations:
US = Unsoldered components or connections
MP = Missing parts
DFP = Defective parts
Continued
on next
page
Pass
Fail
Pass
Fail
Continued
from previous
Page
Replace the part
Fail Is
the voltage
2.775.
Pass
6880401P39-O 83


TROUBLESHOOTING: RX Analysis Test

RX Analysis Test (Continued)










































Check C621, C622, R204, L204, C222 , C223, C623,
C624, C221, R609 E602, C629, C630, C212, C213,
for S, US, MP, DFP. Check DC section, then if no fault
found replace the Sledgehammer IC (U2051).
Are
voltages
1.4V +/-10%?
Check C621, C622, R204, L204, C222 C223,
C623, C624, C221, R609, E602, C629, C630,
C212, C213, for S, US, MP, DFP.
Check DC section, then if no fault found
Replace the Sledgehammer IC (U2051).
Check the voltage on
TP_LNA_EN.
Is a
tone at the
injected
frequency offset
~ 500 mVpp
+-10%?
Pass
Fail
Abbreviations:
US = Unsoldered components or connections
MP = Missing parts
DFP = Defective parts
Continued
on next
page
Pass
Fail
Pass
Fail
Continued
from previous
Page
Measure AC voltages on TP_RXI,
TP_RXIX, TP_RXQ, TP_RXQX.
Fail
Is voltage
2.775V +- 5%?
Pass
Check R6011, C6012, C6011, R660, C501, C229, C228,
C224, L653,C222, C303, R325, C677, E601, C676,
R655, R656, C219, C217, C216 for S, US, MP, DFP.
Check DC sections, then if no fault found
Replace the Sledgehammer IC (U2051).
Check FGU (VCO) section for proper operation.
With Hi impedance RF probe (Hi-Z) check
RF level on either pad of C207.
Is
RF level -
53 dBm +-
Check R204, C60055, C60056, C205,
R202, C210 C211 for S, US, MP, DFP.
Check DC section, then if no fault found
Replace the LNA Module (U200)
84 6880401P39-O


TROUBLESHOOTING: RX Analysis Test
RX Analysis Test (Continued)











































Does
TP_RXFS
have a square
waveform at
~ 1.875Vpp
+-20%?
Check DC and Bravo section,
then if no fault found replace the
Bravo IC (U801).
Is voltage on
TP_RX_AC
Q ~ 1.875V
+-10%?
Does
BBP_RXCLK
have a square waveform at
3.36MHz at ~ 1.875Vpp +-
20%?
Pass
Fail
Abbreviations:
US = Unsoldered components or connections
MP = Missing parts
DFP = Defective parts
Pass
Fail
Pass
Fail
Does
TP_SRDB
have a square
waveform at
~ 1.875Vpp
+-20%?
Fail
Pass
Continued
from previous
Page
Check R627, R608, C626, C610, C217,
C218, C216 and C215 for S, US, MP, DFP.
Check DC section, then if no fault found
replace the Roadrunner IC (U701).
Check R627, R608, C626, C610, C217,
C218, C216 and C215 for S, US, MP, DFP.
Check DC section, then if no fault found
replace the Roadrunner IC (U701).
Check C627, R608, C626, R610, C217,
C218, C216 and C215 for S, US, MP, DFP.
Check DC section, then if no fault found
replace the Roadrunner IC (U701).
Problem can not be determined without
further extensive analysis.
6880401P39-O 85


TROUBLESHOOTING: TX Power Test
3.7 TX Power Test






























With the unit in the Open Loop Power Test,
measure the RF level at the PA input (C520)
Do the following:
1.Set the unit to the TX
Power Tune Test.
2.Measure the RF level at
the antenna port.
Transmit power
is OK.
Is the
power level
between 11 and
24 dBm
?
Pass
Pass
Fail
Pass
Fail
Perform the
SLEDGEHAMMER Test.
Fail
Is
power
> -26 dBm
?
Perform RF PA
Module Test.
Set the unit to the Open
LoopPower Test at
813.5125 MHz or
898.51875 MHz.
Is
power
between 27
and 28.5 dBm
?
Use this test to check the transmit power circuitry.
86 6880401P39-O


TROUBLESHOOTING: RF PA Module Test
3.8 TX Sledgehammer Test






























Do the following:
Measure the DC voltage
at L503.It should be equal
to the supply voltage.
The SLEDGEHAMMER IC
is functioning properly.
Is
the power level
> - 26 dBm?
Pass
Pass
Fail
Pass
Fail
Fail
Run the
TX Power Test again.
Fail
Pass
Perform the PA
Module Test.
Do the following:
1. Set the unit to the Open Loop
Power Test at 813.5125 MHz.
2. Measure the RF level at
the PA input
Re-measure the RF level
at the PA input.
Is
the power level
> 27 dBm?
Do the following:
1. Set the unit to the
TX Power Tune Test.
2. Set the Power Tune
softpot to Max power
3. Measure the RF level
at the antenna port.
Is the DC voltage
equal to the supply
voltage?
Is
the power level
> - 26 dBm?
Continued
on next
page
Do the following:
1. Monitor the RF waveform
at the antenna port.
2. Check for the correct phase
and amplitude train waveform.
3. Check that the modulation
peaks are lower than the
Amplitude training ramp peak.
Are the
training waveform
and modulation
OK?
Set the unit to the
Open Loop Power Test.
Pass
Fail
6880401P39-O 87


TROUBLESHOOTING: RF PA Module Test
TX Sledgehammer Test (Continued)






























Is the RF
Level > -19 dBm at
1735.4933 MHz?
Pass
Fail
Do the following:
1. Remove the SLEDGEHAMMER shield.
2. Visually check all components and
solder connections.
3. Check R506 for 2.795V dc.
Perform the
Main VCO Test.
Continued
on next
page
Continued
from previous
Page
Measure the RF level at C312
(Main VCO Injection to
SLEDGEHAMMER).
With the oscilloscope measure the
ROADRUNNER baseband Modulation
output at the TP_TXI and TP_TXQ
testpoints.
Note:
Baseband modulation output is approx. 11 Hz
at 1.77V dc offset during the TX slot
88 6880401P39-O


TROUBLESHOOTING: SLEDGEHAMMER TX Test

TX Sledgehammer Test (Continued)






























Continued
from previous
Page
Is
DMCS high
during the
TX slot?
Pass
Fail
Using the
Oscilloscope, verify DMCS
(TP_DMCS) is high
during the TX slot.
Verify INDY
operation
and replace as
necessary.
Verify the
TX_SSI lines for activity.
Replace
ROADRUNNER.
Is
ASW low
During the
TX slot?
Pass
Fail
With the oscilloscope measure REFCLK_IN to
SLEDGEHAMMER at C614 (33.6 MHz clock to
SLEDGEHAMMER).
Perform the
SLEDGEHAMMER
test again.
With the oscilloscope
measure
test point TP_ASW
Check all associated circuits
and SLEDGEHAMMER and
repair and replace
as necessary.
Is the
Signal 770 mVp-p
during the
TX slot?
Is
there any
activity?
Replace
SLEDGEHAMMER.
Perform the 33.6 MHz
TCXO Test.
Is the
Signal 33.6 MHz
at > 200 mVp-p
during the
TX slot?
Pass
Fail
Pass
Fail
Pass
Fail
Note:
Baseband modulation output is approx. 11 Hz
at 1.77V dc offset during the TX slot
6880401P39-O 89


TROUBLESHOOTING: Reference Oscillator Test
3.9 Reference Oscillator Test






























Fail
Check 33.6 MHz at
the TCXO output
at C614 (high
impedance probe).
The TCXO
is functioning
correctly.
Is
the voltage
P-P 0.6 < Vp-p
< 1Vpp?
Pass
Check
voltage at
R605.
Replace Y600
Is
the voltage
2.775V +10%
?
Go to DC distribution
flow charts for V4.
Fail
Pass
Use this test to check the reference oscillator circuitry.
90 6880401P39-O


TRUBLESHOOTING: RF PA Module Test
3.10 RF PA Module Test































Note: Perform the Transmit Power Test before beginning the RF PA Module Test.
Use this test to check the RF PA (Radio-Frequency Power Amplifier) circuitry.
Measure the RF
power level at C520
(RF PA input).
Do the following:
1. Set the unit to the TX
Power Tune Test.
2. Set the Power Tune
softpot to max auto power.
3. Measure the RF
level at J500 (RF PA output).
The RF PA Module
is OK.
Is
the power level
between 11 and
24 dBm
?
Pass
Pass
Fail
Pass
Fail
Perform the
SledgeHammer Test.
Fail
Is
the
power level
> -26 dBm
?
Replace the PA (U501),
Then perform the
RF PA Test again.
Set the unit to the PA Gain
Test at 813.5125 MHz or
898.51875 MHz.
Is
the power level
between 25 and 30
dBm?
Measure the
RF power level
at J500 (RF PA output).
Continued
on next
page
6880401P39-O 91


TROUBLESHOOTING: RF PA Module Test
RF PA Module Test (Continued)






























Check U501 (RF PA
Module)
pin 1, 5, and 15 for
(RAW B+).
Do the following:
1. Set the unit to the TX
Power Tune Test.
2. Set the Power Tune to
auto power.
3. Measure the RF level
at J500.
The RF PA Module
is OK.
Is
the
power level
> 11 dBm
?
Pass
Pass
Fail
Pass
Fail
Fail
Is
VCON
present
?
Replace the RF PA (U501),
and then perform the
RF PA Test again.
Perform
ROADRUNNER
test
Is
the power level
between 25 and 30
dBm?
Check U501 VCON pin 2
for voltage between 0.5 and
2.2 Vdc in the TX slot.
Continued
on next
page
Continued
from previous
Page
Do the following:
1. Check U501 for bad
solder connections.
2. Check for open traces.
3. Check C509, C510,
C511, C512, C513,
C514, and C517 for
Defective components.
Is
RAW B+
present at U501 pins
1, 5, and 15?
Fail
Pass
92 6880401P39-O


TRUBLESHOOTING: RF PA Module Test

RF PA Module Test (Continued)










































Check Q500 pin 2 for a voltage
of 5 V during a TX slot.
Replace the
RF PA (U501).
Is
the correct
voltage present at
U501 pin 16
?
Pass
Fail
Fail
Pass Pass
Fail
Perform the
SLEDGEHAMMER test.
Check Q500 pin 4 for
2.775 Vdc (V2_TX).
Continued
from previous
Page
Is
Q500 pin
at 5 V 0.2Vdc
?
Fail
Pass
Repair or replace Q500
and associated circuitry
(U500) then perform
the RF PA test again.
Check Q500 pin 5
(ASW) for low during TX slot.
Check U501 pin 16 with a scope
for > 5.0 V during a TX slot.
Check for open traces.
Repair or replace E519
and associated circuitry.
Check for open traces
and perform DC tests.
Is
the correct V2_TX
voltage present
?
Is
the correct signal
present
?
6880401P39-O 93


TROUBLESHOOTING: Earpiece Speaker Test
3.11 Earpiece Test






























Is the correct
voltage and
signal present?
Remove the front housing and Keypad
PCB. Check J779 pins 79 and 80 for
1.38VDC and the 1KHz audio signal.
Reconnect Keypad PCB and check
J3 pins 27 and 28 for 1.38VDC and
the 1KHz audio signal.
Is The
Correct voltage
and signal present at
E781 andE782?
Check flex traces for
opens. Replace flex
assembly if necessary.
Check E781 and E782 for 1.38 Vdc
and an audio signal of 1 kHz at
approx. 1Vp-p (loaded).
Is
the correct
voltage and
signal present
?
In the Model Assembly
Test Mode, set the unit for
Earpiece Tone Test.
Check R470,R471, C470,
C471 for US, MP,
OPP, DFP, etc.
Abbreviations:
US = Unsoldered components or connections
MP = Missing parts
DFP = Defective parts
Use this test on a unit with the following symptom: no earpiece speaker audio.
Check the earpiece contacts for
1.38VDC and the 1KHz audio
signal. IF OK, replace earpiece.
Pass
Fail
Fail
Pass
Fail
Pass
Check continuity from E781 to
R471 and from E782 to R470.
Replace PCB if Open.
Fail
Are
RX and clock
test signals correct
?
Pass
Replace
ROADRUNNER
(U701) and retest.
Check RX and clock
test points for a
Digital signal.
Check
PATRIOT.
94 6880401P39-O


TROUBLESHOOTING: High Audio Speaker Test
3.12 High Audio Speaker Test































Is there continuity?
Remove the front housing and Keypad
PCB. Disconnect the speaker flex and
measure the speaker impedance through
the flex. Impedance should be approx. 8
ohms.
Check continuity from J3 pin 1 to J1
pin 2, and from J3 pin 2 to J1 P3.
Are the paths OK?
Check C30, C31, C32,
R67, R68 for US, MP,
DFP. If OK, Replace
Keypad PCB
Replace speaker and flex assembly
Is
the impedance correct?t
?
Check
C765,C763,E751,E752
for US, MP,
OPP, DFP, etc.
Abbreviations:
US = Unsoldered components or connections
MP = Missing parts
DFP = Defective parts
Use this test on a unit with the following symptom: No High Audio Speaker .
Check continuity from J779 pin 1 to
E751 and from J779 pin 2 to E752.
Pass
Fail
Fail
Pass
Fail
Pass
Replace PCB
Are
RX and clock
test signals correct
?
Pass
Replace
ROADRUNNER
(U701) and retest.
Check RX and clock
test points for a
Digital signal.
Check
PATRIOT.
6880401P39-O 95


TROUBLESHOOTING: Audio Loopback Level Test
3.13 Audio Loopback Level Test






























Is there continuity?
Ensure that the microphone is
properly soldered.
Place the unit in MA
Test Mode, and
proceed to the
Earpiece Tone test.
Remove front housing and
Keypad PCB. Check for
continuity fromP1 pin 74 to
E8, and from P1 pin 76
toL17.
Check E30, C29, E8, C27, C28, VR2,
L17, R21 for US, MP, etc. If OK,
replace Keypad PCB
Is
there a
Tone?
Go to the
Earpiece Speaker
Test flowchart.
Continued
on next
page
Use this test to check the audio path on a unit with the following symptom: no audio loopback.
A
Pass
Fail
Pass
Fail
96 6880401P39-O


TROUBLESHOOTING: Audio Loopback Level Test
Audio Loopback Level Test (Continued)






























Is there
continuity?
Check continuity from J779
pin 76 to C780.
Check L752, C751, C754, and VR701
for US, MP, DFP, etc. Also, check the
trace from L752 to MIC_+.
Continued
from previous
Page
Replace mic cartridge.
Mic audio OK?
Repair complete.
Replace
ROADRUNNER
(U701) and retest.
A
Pass
Fail
Pass
Fail
6880401P39-O 97


TROUBLESHOOTING: DC Distribution (SW1) Test
3.14 DC Distribution (SW1) Test






























Is
1.55 Vdc
present?
Check the
components
for US, DFP, etc.
Repair, as necessary.
Check E8910,
repair as necessary.
Refer to other DC test
flow charts.
Check E8910 for
1.55 Vdc.
Replace
ROADRUNNER
U701.
Is
3.60 Vdc
present
?
Is
1.55 Vdc
present at the specified
Component?
Go to
Filter B+
flow chart.
Check the
Filt_B+
(3.60 Vdc) @ E8911.
Check C2053 for 1.55 Vdc.
Use this test on a unit with the following symptom: no SW1 (1.2 Vdc).
Check for SW1 after L702 from U701.
Pass
Fail
Pass
Fail
Pass
Fail
Check C2054,
R8122,Q1411,
VR802, L1500
for US, DFP, etc.
Repair, as necessary.
98 6880401P39-O


TROUBLESHOOTING: DC Distribution (V2) Test
3.15 DC Distribution (V2) Test






























Check C782 and C716 for 2.775 Vdc.
Go to
FILT_B+
flow chart.
Is
2.775 Vdc
at the parts?
Check FILT_B+(3.6
Vdc) at C724 or
E702
Is
3.6 Vdc
present
?
Check for US, DFP,
etc. Repair as
necessary.
Replace U701
ROADRUNNER
Use this test on a unit with the following symptom: no V2 (2.775 Vdc).
Pass
Fail
Pass
Fail
Check C741 and Q704
for US, DFP,
etc. Repair as
necessary.
6880401P39-O 99


TROUBLESHOOTING: DC Distribution (V3) Test
3.16 DC Distribution (V3) Test






























100 6880401P39-O


TROUBLESHOOTING: DC Distribution (V4) Test
3.17 DC Distribution (V4) Test











































6880401P39-O 101


TROUBLESHOOTING: DC Distribution (4.5 Pre-Reg) Test
3.18 DC Distribution (4.5 Pre-Reg) Test






























Check
R719 for
3.1v to 5.0v
Insert charger and
battery into phone.
Pass
Fail
Use this test on a unit with the following symptom: no charger.
Check Q701 and
ROADRUNNER.
Check
R715 and Q703
Check bottom
connector, and E971
Check
R789 for
4.5v to 4.7v
Pass
Fail
102 6880401P39-O


TROUBLESHOOTING: DC Distribution (VMMC) Test
3.19 DC Distribution (VMMC) Test






























Check C790 for 2.775
Vdc
Check R787 for US,
DFP, etc.
Repair, as necessary.
Is
2.775 Vdc
present at
the parts?
Check FILT_B+
(3.6 Vdc) at C724
or E702.
Go to
FILT_B+
flowchart.
Is
3.6 Vdc
present
?
Replace U701
ROADRUNNER
Fail
Pass
Pass
Fail
Use this test on a unit with the following symptom: no VMMC (2.775 Vdc).
Check C742, Q705, C718, C790 for
US, DFP, etc.
Repair, as necessary.
6880401P39-O 103


TROUBLESHOOTING: DC Distribution (VUSB) Test
3.20 DC Distribution (VUSB) Test






























Check C713 tor 3.3
Vdc.
Check for US, DFP, etc.
Repair, as necessary.
Go to
FILT_B+
flowchart.
Is
3.3 Vdc
present at
the parts?
Check FILT_B+
(3.6 Vdc) at C724
or E702.
Is
3.6 Vdc
present?
Use this test on a unit with the following symptom: no VUSB (3.3 Vdc).
Replace U701
ROADRUNNER
Pass
Fail
Pass
Fail
104 6880401P39-O


TROUBLESHOOTING: DC Distribution (VSIM) Test
3.21 DC Distribution (VSIM) Test































Check C714
for 3.0 Vdc.
Check for US, DFP, etc.
Repair, as necessary.
Is
3.0 Vdc
present at
the parts?
Check FILT_B+
(3.6 Vdc) at C724
orE702.
Go to
FILT_B+
flowchart.
Is
3.6 Vdc
present?
Replace U701
ROADRUNNER
Use this test on a unit with the following symptom: no VSIM (3.0 Vdc).
Pass
Fail
Pass
Fail
6880401P39-O 105


TROUBLESHOOTING: DC Distribution (V_VIB) Test
3.22 DC Distribution (V_VIB) Test































Check L405
and C497 for 3.0 VDC.
Go to
FILT_B+
flowchart.
Is
3.0 Vdc
present at
the parts
Check FILT_B+
(3.6 Vdc) at R724.
Is
3.6 Vdc
present
?
Check for US, DFP, etc.
Repair, as necessary.
Replace U701
ROADRUNNER
Use this test on a unit with the following symptom: no V_VIB (3.0 Vdc).
Pass
Fail
Pass
Fail
106 6880401P39-O


TROUBLESHOOTING: DC Distribution (V_HOLD) Test
3.23 DC Distribution (V_HOLD) Test































Check C704 for 1.88 Vdc
Check for US, DFP, etc.
Repair, as necessary.
Is
1.88 Vdc
present at
this part?
Check FILT_B+
(3.6 Vdc) at C724
or E702.
Go to
FILT_B+
flowchart.
Is
3.6 Vdc
present
?
Replace U701
ROADRUNNER
Fail
Pass
Fail
Use this test on a unit with the following symptom: no VHOLD (1.88 Vdc).
Pass
6880401P39-O 107


TROUBLESHOOTING: DC Distribution (VC REG) Test
3.24 DC Distribution (VC REG) Test






























Check C704 for 1.88 Vdc
Check for US, DFP, etc.
Repair, as necessary.
Is
1.88 Vdc
present at
this part?
Check FILT_B+
(3.6 Vdc) at C724
or E702.
Go to
FILT_B+
flowchart.
Is
3.6 Vdc
present
?
Replace U701
ROADRUNNER
Fail
Pass
Fail
Use this test on a unit with the following symptom: no VHOLD (1.88 Vdc).
Pass
108 6880401P39-O


TROUBLESHOOTING: GPS Receiver Test
3.25 GPS Receiver Test

The Conducted signal testing described below can be performed to analyze or root cause an issue
along the GPS RF subsystem, using a CW signal. The following tests are implemented in Factory
Test Mode (BERBUG Mode).

Test Setup
1. Set up the CW generator as follows: Frequency = 1575.42 MHz, Amplitude level = -80
dBm. Amplitude levels above -76 dBm will compress the back end GRF2M RFIC.
2. Power up the Unit Under Test (UUT), and connect the CW generator to the UUT.
3. Using Hyper Terminal, GPS is turned on as follows:
BERBUG > gps on
4. Set the Spectrum Analyzer to Center Frequency = 1575.42 MHz, Span = 1 MHz,
Amplitude Reference Level = -50 dBm.
5. Use a High Impedance Probe to follow the signal flow along the GPS RF subsystem, block
by block.

Block Level Testing of Critical Stages

Below is a list of Critical Stages/Blocks, and their respective RF test points:

1. GPS (FL2050): GPS port.

2. GPS SAW filter (FL2050): Output port .

3. GPS external LNA (U2000): Input and output port.

4. GPS SAW filter (FL2000): Input and output port.

5. GPF2M RF IC (U2003): IF frequency test pad.



DC Power Supply
When testing, it is advisable to utilize an external DC Power supply set at 4 Volts and a current
level of 2 Amps. In BERBUG Mode, the UUT is expected to draw 165 mA to 170 mA at power
up. By entering gps on the UUT should draw 215 mA to 220mA




6880401P39-O 109


TROUBLESHOOTING: GPS Receiver Test (Continued)
GPS Receiver Test (Continued)































Is
UUT Drawing
~165 mA?
While in
BERBUG Mode,
type gps on
Pass
Continued
on next
page
Pass
Fail
Pass
Fail
Check
Baud Rate
of Unit.
Fail
Is RF Signal
~40 dBm
(+2 dBm)?
TP_GPS_IFout
TP_GPS_IFoutX
Probe iDEN/GPS
R1401 Diplexer
Common Port.
Place UUT in BERBUG
MODE and Power up.
Connect UUT to CW
Generator
(M1401 @ -90dBm).
Is RF Signal
~-95 dBm
(+2 dBm)?
Is UUT
responding
?
Is
Data Cable
Connected?
Check Antenna Coax
Connecting, grounding, US, MP.
Problem
in DC Block
of Unit.
Check FL200
for US, DFP.
Connect
Data Cable
and Retest.
Notes:
1. US = Unsoldered component/connection.
2. MP = Missing part(s).
3. DFP = Defective part(s).
Pass Pass
Fail Fail
110 6880401P39-O


TROUBLESHOOTING: GPS Receiver Test (Continued)
GPS Receiver Test (Continued)































Probe
TP_ANA_CLK
Check U2051-1
Sledgehammer.
Is clock signal
49.107mHz 1.875 vpp?
Fail
Continued
from previous
Page
End GPS testing
Pass
6880401P39-O 111


TROUBLESHOOTING: Mototalk Test
3.26 Mototalk



Since the iDEN Receiver and Transmitter Hardware are used for Dispatch (PTT),
Phone Call, and MOTOtalk modes of operation; Hardware failures that occur
during MOTOtalk will also occur in Dispatch (PTT) and Phone Call modes.
Therefore, the electrical troubleshooting guide for MOTOtalk, Dispatch (PTT), and
Phone Call are the same.























112 6880401P39-O


TROUBLESHOOTING: Camera Test
3.27 Camera Test











































Verify
that the viewfinder
shows the captured
image correctly.
Power up
the unit.
Pass
Fail
Use this test to check camera module. Symptoms: Bad view finder (noise, poor color,
synchronization error).
Unit passed test. Look for
system, coverage,
accessory,
or software problems.
Enter the
Model Assembly
(MA) Test Mode.
Replace
the camera module
and repeat the
test.
Fail
Pass
Replace
the Keypad board
and repeat the test.
6880401P39-O 113


TROUBLESHOOTING: Bluetooth Test
3.28 Bluetooth Test











































Continued
on next
page
Using instructions supplied with
the headset, put the headset
into discoverable mode.
Pass
Fail
Is
Successful
Bluetooth audio
in phone call?
Extend handset antenna
And power up handset.
Pass
Fail
Headset found
under scan
results?
Obtain Motorola HS820 or similar
Motorola Bluetooth headset.
Pass
Fail
Use this test on a unit to check the functionality of the Bluetooth headset.
On the handset under Bluetooth;
Hands Free; Find Devices;
scan for the headset.
Successful
Bluetooth
Link?
Make a phone call with
Bluetooth headset.
Bluetooth not
working
Bluetooth is
working
114 6880401P39-O


TROUBLESHOOTING: GPS Receiver Test
Bluetooth Test (Continued)











































Continued
from previous
Page
Open radio and
check antenna
and antenna
contacts for
proper fit and
contact with
antenna launch
on main PCB.
Is
Antenna present
and contact
adequate?
Using Berbug
type: BT TX ON.
The Bluetooth device
is good. Close radio
and try to bond with
Bluetooth headset.
Using a 50 ohm
probe, measure
Output Power at BT
antenna launch
Is
signal level
Between -6 dBm to
+4 dBm?
Replace
antenna,
close radio
and retest.
Is
2441 MHz
signal present?
Check 33.6
MHz TCXO
signal at
R1001.
Check R1001 for
open, or damaged
part.. Do Reference
Oscillator Test.
Is 33.6MHz
signal present?
Check voltage
at R1023.
Check voltage
at R1020
Check voltage
at L1000.
Check VMMC
voltage at
L1005.
Replace Bluetooth
IC and retest.
Check L1000, L1002, R1030,
C1025, C1026, C1006,
C1031, C1032 for open,
shorts, or damaged parts.
Repair if necessary and
retest
Check L1005 for
open, or damaged
part. Do DC Dist.
test for VMMC
voltage supply.
Check R1020 for
open, or damaged
part. Do DC Dist.
test for V2.775 filter
voltage supply.
Check R1023 for
open, or damaged
part. Do DC Dist.
test for SW2 filter
voltage supply.
Is voltage
approx. 1.77
volts?
Is voltage
approx. 2.8
volts?
Is voltage
approx. 2.775
volts?
Is voltage
approx. 1.8
volts?
Pass
Pass
Fail
Pass
Fail
Pass
Fail
Pass
Fail
Pass
Fail
Pass
Fail
Pass
Fail
6880401P39-O 115


TROUBLESHOOTING: Model Assembly (MA) Test Mode Test
3.29 Model Assembly (MA) Test Mode Test
Model Assembly Test Mode is an embedded series of operational tests of the unit's user
interface and functional features.
Motorola iDEN recommends MA Test Mode be performed after any servicing of the unit.
An Audio Test Cable is required to complete test mode correctly. See the Required Tools
section or contact Motorolas Aftermarket Accessories Division.
MA Test mode is achieved by starting from a power-down condition:
1. Press and hold three keys in a row such as 1-2-3, 4-5-6, 7-8-9, -O-#. Simultaneously, press
the Power key
2. Release all keys once the opening screen appears in the main display.
3. Follow instructions as they appear pressing the indicated keys.
4. No instruction? Press any key or Scroll right.
5. No reaction? Power down the unit, check battery condition, and start MA Test again.
Screen displays are depicted as follows:




The LCD
manufacturer and
size are displayed
on the Main LCD.
Press OK key
Here we test the
LCD display with
Color Bars. Press
any key to advance
Ellipses are
displayed on the
main screen for
Crosstalk test. Press
any key to advance
The gray scale test
image is from total
black to white
indicates that the
display has no
issues. Press any
key to advance
Flicker test screen
to check for flicker.
Press any key to
advance.







Test the LCD with
Checkerboard test.
Press any key to
advance.

Check for camera
I2C address,
camera device ID,
and camera vendor
ID. Press any key to
advance.
Viewfinder test
screen to verify
image. Press any
key to advance.
Then, the camera
data lines will be
analyzed.
When the data lines
test passed, press
OK to advance.





116 6880401P39-O


TROUBLESHOOTING:: Model Assembly (MA) Test Mode Test

Model Assembly (MA) Test Mode Test (cont.)
Bluetooth LED on
Blink MSG LED
Blink VM LED
SC Button LED on
SOL LED on
Blink PTT LED
Backlight On
Vol Up Key
Vibrator On


The 4 internal
borders are
one-pixel wide and
white. The rest
(except text) are
black. Press Speaker
to advance.
Check for LED
functionality. Press
any key to advance.
Verify backlight
and vibration. Press
volume up key to
advance.
Phone generates a
1004Hz audio tone
to the audio
speaker. Press the
Volume down key
to advance.
Phone generates a
1004Hz audio tone
to the earpiece.
Press PTT key to
advance.







KEYPAD TEST:
<M
MNU ^
SND < >
v
1 2 3 WEB
4 5 6 MSG
7 8 9 TXT
* 0 #

Speak into the
internal microphone
and listen to the
earpiece.
If microphone has
been detected,
press any key to
advance.
If microphone not
detected, press any
key to retest.

If SIM card is
absent, power off
the phone.
When a key is
pressed, the
corresponding key
symbol will
disappear. Press
all the keys to
advance.
QWERTY KEY TEST:
Q W Y U
I O P A S
H J K L
N M PRD
SPC CR DEL ALT
CAPS SYM
























Key Verify
Power Off


When a key is
pressed, the
corresponding key
symbol will
disappear. Press all
the keys to advance.
Insert audio jack
test cable
Test audio cable
button and audio
jack channels.
If the audio jack
channel test
succeeds and the
audio cable button
is detected
If the audio not
detected or audio
jack malfunctions,
this screen will
appear for retest.
Test completed,
press power off to
exit the MA mode.


Insert Audio
Jack
Audio Jack
Not Detected
Generating Tone
AUD LV = 026E
Test Passed
Press audio
Jack BUTTON
6880401P39-O 117


















This page left blank intentionally














118 6880401P39-O


Schematic Diagrams and COMPONENT LOCATION
Chapter 4
SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

When ordering component parts, the part number and reference designator should be included.

If the correct numbers cannot be located, call Motorola Parts Identification at 1-847-538-0021.


















































6880401P39-O 119


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.1 Component Layout Main Board Front

















































120 6880401P39-O


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.2 Component Layout Main Board Back








































6880401P39-O 121


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.3 Component Layout Keypad Board Bottom

























































122 6880401P39-O


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.4 Component Layout Keypad Board Top
























































6880401P39-O 123


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.5 BLOCK HIERARCHY

























































A/D
CLK OUT
USB
SUPPLIES
(AUDIO/DC/CLK)
SPI
AUDIO
SAP
ROADRUNNER
BLUETOOTH
BLOCK
MODULE
TRANSCEIVER
BLOCK
BATTERY BLOCK
ACCESSORY CONNECTOR BLOCK
AUDIO
BLUETOOTH
AUDIO
USB
Digital/Keypad/LCD Block
I/O
I/O
RF CONTROL
RR
MISC I/O
SPI A
BBP
C
E

B
O
T
T
O
M

C
O
N
N
E
C
T
O
R
RS232
I/O
GPS I/O
MOTOROLA INTERNAL USE ONLY
Architecture is Bravo, ATI, Roadrunner, Sledgehammer, Janus and Bluetooth.
DC Supply
Other
RF
Sensitive
Digital
SDTX
SPI_CLK
SPI_DR
SPI_DW
TCXO_33_6MHz
T
C
X
O
_
V
4
TXCLK
TXE
TXFS
VCON X
C
V
R
_
D
I
G
_
1
_
8
7
5
_
l
i
n
X
C
V
R
_
D
I
G
_
1
_
8
7
5
_
p
w
m
X
C
V
R
_
V
2
B
G
_
B
Y
P
CE_SH
DMCS
G
P
S
_
A
C
Q
_
C
L
K
G
P
S
_
A
G
C
G
P
S
_
C
L
K
G
P
S
_
M
A
G
B
I
T
G
P
S
_
S
I
G
N
B
I
T
P
A
_
I
D
P
A
_
T
E
M
P
RSTB
RXACQ
RXFS
SCLK_OUT
SDR
NC
BT
BT_OSC_EN
BT_UART_CTS
BT_UART_RTS BT_UART_RX
BT_UART_TX
PSKEY_UART_HOST_WAKE
RESET_BT
RR_PCM_CLK
RR_PCM_SYNC
RR_RX RR_TX
STANDBY
TCXO_33_6MHz
TRANSCEIVER
USB_ID USB_SE0IN
USB_TXENB
USB_VM
USB_VP
USB_XRXD
USEROFF
V2
V3
V4
VCC_OUT
VHOLD_EXT_EN
VPP_OUT
VSIM_EN
WDI
RR_BATTI
RX0 RX1
SECONDARY_INT
SEC_CE
SEC_SPI_CLK
SEC_SPI_MISO
SEC_SPI_MOSI
SINGLE_PATH_CHARGE
SOL_LED2_PWM
SPKR_R_MINUS
SPKR_R_PLUS
STANDBY
TX
USB_D+
USB_D- USB_DIN
MICROPHONE
MOD_OUT
MUX_OUT
ON
PA_ID
PA_TEMP
POWER_FAIL
PRIMARY_INT
PRI_CE
PRI_SPI_CLK
PRI_SPI_MISO
PRI_SPI_MOSI
RAW_B_PLUS
RESETMCU_B
RMT_CONTROL
BITCLK0 BITCLK1
CI_BLUE
CI_GREEN
CI_RED
CS_OUT
DISP_LED_PWM
EARPHONE_MINUS
EARPHONE_PLUS
EOL_INTERRUPT
EXT_B+
FSYNC0 FSYNC1
LI_CELL
LVS
LV_DETECT
NC
NC
NC
V4
ROADRUNNER
16.8MHZ
32KHZ
ACT_CURR_EN
ADTRIG
AUDIO_IN
AUDIO_OUT
BATTERY_TEMP
BG_BYP
SPKR_R_PLUS
SRDB
STDB
SW_B+_EN
TXCLK
TXE
TXFS
UART2_CTS
UART2_RTS
USB_EOP
USB_TXENB
USB_VPIN VCON
VPP_OUT
VSIM_EN
WDI
RS232_TX_USB_DIN
RXCLK
RXFS
RX_ACQ
SINGLE_PATH_CHARGE
SOL_LED2_PWM
SPIA_CLK
SPIA_CS6_SH_CE
SPIA_CS7_RR
SPIA_MISO
SPIA_MOSI
SPIB_CLK
SPIB_CS0_RR
SPIB_MISO
SPIB_MOSI
SPKR_R_MINUS
MODE_SELECT
MUX_CTRL
ON_OFF_SWITCH
OSC_EN_STBY
RESET_OUT
RMT_CONTROL
RR_AD_TRIGGER
RR_BATTI
RR_DCLK
RR_FSYNC
RR_PRM_INT
RR_RX
RR_SEC_INT
RR_TX
RS232_RTS_USB_XRXD
RS232_RX_USB_VM
CI_RED
CLKGPS
DISP_LED_PWM
DMCS
EARPHONE_MINUS
EARPHONE_PLUS
EOL_INT_B
GPS_AGC_DAT
GPS_CLKACQ
GPS_MAG
GPS_PECLREF
GPS_SIGN
LV_DETECT
MICROPHONE
MOD
D-
EXTB+
USB_ID
NC
DIGITAL
16.8MHz_CLK
32KHz_CLK
ACT_CURR_EN
BATT_ID
BT_RESET_B
BT_UART_RX
BT_UART_TX
BT_UART_WAKE
CI_BLUE
CI_GREEN
TP_RX_ACQ
1 V2
ACC_CONN
D+
1
SW2
NC NC
V4
BATTERY_BLOCK
BATT_ID_FLTR
BATT_THERMISTOR_FLTR
RAW_B_PLUS
SPIA_MISO
1
TP_SRDB
1
V2
TP_SH_CS
NC
TP_RXFS
1
1
NC
V3
NC
NC
V3
1
SPIA_MOSI
1
NC
NC
SPIA_CLK
1
NC
TP_TXE
VCON
TP_TXFS
SPIA_CLK
SPIA_CLK
SPIA_CLK
SPIA_MISO
SPIA_MISO
SPIA_MISO
SPIA_MOSI
SPIA_MOSI
SPIA_MOSI
BBP_TXCLK
TXE
BBP_TXFS
SIGN_BIT
PA_ID
PA_ID
PA_TEMP
PA_TEMP
DIG_RESET_OUT
SLEDGEHAMMER_RX_ACQ
BBP_RXFS
BBP_RXCLK
BBP_SRDB
BBP_STDB
USB_D_PLUS
USB_D_MINUS
USB_D_MINUS
BG_BYP
BG_BYP
SPIA_CS6_TOMAHAWK_CE
SLEDGEHAMMER_DMCS
ACQ_CLK
AGC_DAT
CLK_GPS
MAG_BIT
NC_EXT_MIC
PCAP_AD_TRIGGER
ACT_CURR_EN
32KHZ_CLK
16_8MHZ
NC_LI__CELL
EXT_BPLUS
EXT_BPLUS
MUX_CTRL
USB_D_PLUS
EARPHONE_MINUS
RR_CS_OUT
CI_RED
CI_GREEN
CI_BLUE
RR_BITCLK1
RR_DCLK
RR_DCLK
RR_DCLK
BATTERY_TEMP
EXT_SPEAKER
MICROPHONE
MICROPHONE
LV_DETECT
NC_RR_LVS
SOL_LED2_PWM
RR_FSYNC1
RR_FSYNC0
RR_FSYNC0
RR_FSYNC0
EOL_INT_B
EARPHONE_PLUS
RR_RX
RR_RX
RR_BATTI
RR_BATTI
RMT_CONTROL
RMT_CONTROL
RR_RESETMCU_B
RAW_B_PLUS
RAW_B_PLUS
DISP_LED_PWM
SPIA_CS7_RR
RR_PRM_INT
RR_POWER_FAIL
ON_OFF
MOD_OUT
SPKR_R_PLUS
SPKR_R_MINUS
SPKR_R_MINUS
SINGLE_PATH_CHARGE
SPIB_MOSI
SPIB_MISO
SPIB_CLK
SPIB_CS0_RR
RR_SEC_INT
RR_RX1
RR_RX
USB_VP
USB_VM
USB_TXENB
USB_SE0IN
USB_ID
USB_ID
USB_DIN
RR_TX
RR_TX
RR_TX
STANDBY
STANDBY
STANDBY
SPKR_R_PLUS
BT_RESET_B
BATTERY_ID
SOFT_TURN_OFF_WDI
VSIM_EN
VPP_OUT
RR_VHOLD_EXT_EN
VCC_OUT
VCC_OUT
USB_XRXD
TCXO_33_6MHZ
BT_OSC_EN
BT_OSC_EN
NC_SW_B+_EN
PSKEY_UART_HOST_WAKE
BT_UART_CTS
BT_UART_RTS
NC_MODE_SELECT
GPS_PECLREF
BT_UART_RX
BT_UART_RX
BT_UART_TX
124 6880401P39-O


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.6 DIGITAL BLOCK - PATRIOT AND MEMORY
























































MMC GPS
JTAG
REAL TIME TRACE
MISCELLANEOUS
GPIO
CCM/WDOG/EGPT/CLK
MEMORY_BLOCK
PRIMARY UART
SECONDARY UART
BBP
SAP
MQSPI
SIM
DSC AND ONE_WIRE
INTERRUPTS LAYER 1 TIMERS
KEY PAD I/O
RR Audio Serial Port Tx
I/O
INT4 - Option_Select_1
B
B
P
(
1.8
7
5
V
)
iCRANE_SPIB_CLK
TRST
RTS
DNP
RX
INPUTS
For 32MB - place R811, unplace R810
BRAVO POWER BLOCK
SC2A
RTS
SYMBOL
L
1 T
im
e
r
,Q
S
P
I (
1.8
7
5
V
)
ESSI
iCRANE_SPIB_MISO
Bravo ROM13
MOTOROLA INTERNAL USE ONLY
M
M
C
(
2
.7
7
5
V
)
SH Serial Port STD
GPCR = xxxxxxxx x11xxx11
BUSY_OUT
iCRANE_SPIB_MOSI
INTERRUPT
TCK
To Test Connector
MUX_CTRL =1 AND THE 8-WIRE INTERFACE IS THUS SET TO JTAG MODE
INT6
P
a
t
r
io
t
C
o
r
e
(
1.5
5
V
)
VCC TRUTH TABLE
MCU_DE
ROW6
SB9600
GPCR (Bit7)=1
RI
MQSPI
AND LED
DNP
RR Audio Serial Port Rx
SRDA
SW2 = 1.875V GPIO (RR Switcher)
S
IM
2
,S
A
P
, B
o
t
C
o
n
n
(
1.8
7
5
V
)
FROM RR
SC2A
TDO
ATI I/O
DNP
TX
KEYPAD
BUSY_IN (IC2)
RR @ 1.8V, Indy @ 2.7V
U802
4-Wire RS232
SH Serial Port RXFS
L
1 T
im
e
r
,Q
S
P
I (
1.8
7
5
V
)
LAYER1 TIMER
CTS
Gen Port Ctrl Reg (GPCR)
PC5 - Used on DualMode - USB Detect
TMS
RR Audio Serial Port Clock
MUX_CTRL=1
PIN NAME
For 16MB - place R881, unplace R880
TO RR
INT5 - Option_Select_2
GPCR = xxxxxxxx x00xxx00
VMMC = 2.800V GPIO (RR linear)
SCKA
RX
V1 = 1.55V Core (RR linear)
5175772B32
DNP
RTS
CTS
Unplace R853 for CS1 as CS
GPCR (Bit7)=0
RR Audio Serial Port FS
INT1 - Pwr_ON/OFF / RTC
TDI
Internal Pulldown
DSP_DE
SCKA
For 32MB - place R880, unplace R881
DNP
RESET_IN
RX
RESERVED IRQB, DO NOT CONNECT
NOTE: RESETS FROM THE BOTTOM CONNECTOR WILL ONLY BE POSSIBLE IF
C
l
o
c
k
A
m
p
(
1.5
5
V
)
JTAG
E
IM
(
1.8
7
5
V
)
DCD
Low_Voltage_Detect (RR RESETB Pin)
U801
TX
RX
U
A
R
T
,S
IM
1 (
2
.7
7
5
V
)
DNP
8-Wire RS232
To Test Connector
SLEDGEHAMMER
INT0 - PTT
ESSI
CTS
5185594F15
TX
Requires level shift
DSR
DTR
K
e
y
p
a
d
(
2
.7
7
5
V
)
STDA
For Stack Flash
Place R853 for CS1 as ADDR
INT2 - EOL INTERRUPT
SRDA
TX
U
A
R
T
,G
P
IO
(
2
.7
7
5
V
)
JTAG
32.768 kHz Input
For 64MB - place R810, unplace R811
16.8 MHz Input
Gen Port Ctrl Reg (GPCR)
INT3 - FLIP SENSE
SH Serial Port RXCLK
INT7
BATTERY
ROW7
MUX_CTRL=0
STDA
K20
WDOG_N
22
4 1 3 A
K17
STBY_PD14
TCK
D15
TDI
B17
TDO
B16
TEST
D14
TIME_MARK
E20
TMS
C15
TRST
D16
L21
PC9_URXD1_URXD2
D21
PECLREF
W3
PWM_PE13_DMAC_CS
Y2
PWM_PE14_DMAC_D4
D19
PWRCTL
Y3
RESET_IN
L17
RESET_OUT
SIGN
C21
J20
W4
OC3_PC13_FRAME_TICK
AA2
PA2_USB_VPIN
R16
PC0_USB_VMOUT
L20
PC11_OC1_USBCLK_DMAC_D3
B3
PC12_STO_DMAC_D5
U22
PC1_USB_TXENB
L22
PC8_UTXD1_UTXD2
G14
C22
MAG
C14
MCU_DE
L4
MMC_CLK
MMC_CMD
L3
MMC_DAT
L2
MMC_OD_EN
K4
U7
MOD
MUX_CTL
C20
AGCDAT
D3
CKIH
V3
CKIL
K21
CKOH_SCC_CLK
CKO_PA3
Y22
CLKACQ
E21
CLKGPS
D22
B11
CLKSEL_PD15
DSP_DE
MISC_BLOCK
*U801-3*
NC
5
TP_LBAN
0
R869
11
SW2_FLTR
11
iC
R
N
E
_
C
S
D
8
7
1
NC
SPIB_MISO
USB_VPIN
6
8
TP_RWN
R870
TP_BCLK
NC
0
8
10
T
P
_
E
O
L
NC
S
P
IB
_
C
L
K
10
NC
NC
NC
L
7
V
S
S
7
V
S
S
8
L
8
G7
WAIT
WE_
F5
WP_
E4
17
V
C
C
Q
_
2
L
3
V
C
C
Q
_
3
D
4
V
P
P
V
S
S
1
B
4
V
S
S
2
C
4 L
1
V
S
S
3
V
S
S
4
L
2
L
5
V
S
S
5
L
6
V
S
S
6
S_CS2
C5
S_VCC
K4
B
5
V
C
C
1_
1
L
4
V
C
C
1_
2
V
C
C
2
_
1
B
6
V
C
C
2
_
2
K
6
V
C
C
Q
_
1
J
8
K
7
K2
RFU1
K3
RFU2
RST_
F4
R_LB_
C2
R_OE_
H1
F3
R_UB_
D5
R_WE_
J1
S_CS1_
DU6
M7
DU7
M8
DU8
F_DPD
OE_1
J2
H8
OE_2
D6
P_CS_
K8
P_MODE
K5
P_VCC
H7
D7
G2
D8
J3
D9
DU1
A1
DU2
A2
A7
DU3
DU4
A8
M1
DU5
M2
G6
D13
H6
D14
J7
D15
D2
G3
H4
D3
J5
D4
G5
D5
J6
D6
CE_1
K1
G8
CE_2
CLK
C6
D0
H2
H3
D1
G4
D10
J4
D11
H5
D12
D1
A3
B1
A4
C1
A5
A6
F2
E2
A7
F6
A8
D7
A9
E5
ADV_
A19
B3
E1
A2
A20
E6
A21
B7
C7
A22
C3
A23
D3
A24
E3
A25
B8
A11
C8
A12
D8
A13
F7
A14
E8
A15
F8
A16
D2
A17
A18
B2
25
NC
MEMORY
A0
G1
F1
A1
E7
A10
23
47K
TP_CKO
NC
R878
10K
NC
16
13
R856
R828 0
R895
33pF
C809
4
20
10
SW1_FLTR
4
21
5.6K
R820
NC
11
SW2_FLTR
13
18
8
2
NC
NC
C871
0.10uF
0.10uF
C810
TP_CKOH
NC
11
NC
62pF
C820
15
NC
TP_CS2
20 33pF
1.0uF
C806
C807
R806 0
C805
33pF
1
SW2_FLTR
19
NC
NC
R894
D866
NC
22K
R855
11
14
NC
7
13
NC
C873
4.7uF
7
TP_EB0
0 R810
6
12
15
13
17
SW2_FLTR
TP_OEN
C808
0.10uF
BT_UART_TX
C818
33pF
URXD1_PA15_USB_VMIN_TDI
U20
URXD2_PB1
F21
UTXD1_PA14_USB_VPOUT_ITXD_TDO
T16
UTXD2_PB0
F20
SRDB
B13
SRDB2_PC4_OC2
C11
STDA
R21
STDB
G12
UCTS1_PA12_USB_FSEN_MCU_DE
J21
UCTS2_PB2
B21
T21
URTS1_PA13_USBXRXD_IPWR_RESET_IN_IC2A
URTS2_PB3
B20
SPICS3_PE6
K3
SPICS4_PE7
K7
C7
SPICS5_PE11
C6
SPICS6_PE0_DMAC_D3
C5
SPICS7_PE1_DMAC_D4
B4
SPICS8_PE2_DMAC_D6
SPICS9_PE3_DMAC_D7
D5
SRDA
T22
SC2A
T20
SC2B_PC3
C12
SCKA
P21
SCKB
B12
SCKB2_PC5
D11
SDI_D_C_PE5_SPICS1
J4
J3
SPICS0_PE10
SPICS2_PE4
K8
MOSIB
H4
QSCKA
C8
QSCKB
H3
RIA_PA9_USBSUSP_TCK_SCKA_UTXD1
G20
SC0A_PC7_DMAC_D1_DMAC_SCK
M21
SC0B_PC2
D13
M22
SC1A_PC6_DMAC_D0_DMAC_MOSI
SC1B
C13
*U801-2*
DCDA_PA8_DSP_DE_SC2A
H21
DSRA_PA10_TRST_STDA_URXD1_INT6
H20
DTRA_PA11_TMS_SRDA_INT7
H22
MISOA
D7
H2
MISOB
MOSIA
D6
2
SERIAL_PORTS_BLOCK
GPSTIMESYN
NC
TP_D0
1
4
3
6
7
4
R
8
9
7
33pF
NC
R853
10K
C801
13
NC
R811
0
TP_ADTRIG
5
24
NC
8
NC
0
R
8
8
2
C870
0.33uF
1.0uF
L801
FHB1M1005JT
14
C804
R835 0
D802
Q855
47K
47K
C877
0.10uF
6
9
5
2
D
8
7
2
R880 0
R827 0
R824
10K
NC
3
5
NC
24
1
3
23
NC
D855
TP_EB1
D9
TOUT3
C9
TOUT4_PD0
E3
TOUT5_PD1
E4
TOUT6_PD2
F3
TOUT7_PD3
F4
TOUT8_PD4
H7
TOUT9_PD12
G3
TOUT0
C10
TOUT1
D10
TOUT10_PD13
G2
TOUT11_PD7
G4
TOUT12_PD8_DMAC_D5
B8
TOUT13_PD9
G8
TOUT14_PD10_DMAC_RS
D8
TOUT15_PD11_DMAC_D2
B7
TOUT2
C18
SIM_D1RX_PB11 SIM_D1TX_PB10
C19
SIM_PD0_PB9
R20
SIM_PD1_PB15_DSP_DBG_PAW
C16
SIM_RST0_PB6
P20
SIM_RST1_PB12_TIN0
D18
SIM_SVEN0_PB8
P17
SIM_SVEN1_PB14_DSP_DBG_XDW
D17
ROW4_PG12
T4
ROW5_PG13
T2
ROW6_PG14
T3
ROW7_PG15
U4
SIM_CLK0_PB7
N21
SIM_CLK1_PB13_DSPYDW
C17
SIM_D0RX_PB5
N22
SIM_D0TX_PB4
N20
INT5_PA7_OPTION_SELECT_2_IC1B
G22
OWIRE_DAT_PA10
M2 C4
PD5_DMAC_D0
PD6_DMAC_D1
C3
ROW0_PG8
R4
ROW1_PG9
R3
ROW2_PG10
R7
ROW3_PG11
T8
N3
COLUMN6_PG6_QSCKA_SPICS8
P4
COLUMN7_PG7_SPICS9_URTS1
P7
INT0_PE8
U2
INT1_PE9
U3
INT2_PC14
T7
INT3_PC15
V4
INT4_PA6_OPTION_SELECT_1_IC1A
G21
SIM_INT_TOUT_BLOCK
*U801-4*
COLUMN0_PG0
M3
COLUMN1_PG1
N4
COLUMN2_PG2
N2
COLUMN3_PG3
N7
COLUMN4_PG4_IC2B_SPICS6
P3
COLUMN5_PG5_MOSIA_SPICS7
NC
NC
TP_USB_EOP
0
15
TP_CS0
NC
12
2
RS232_RX
3
G
N
D
2
IN_A
1
NC1
4
OUT_Y
5
V
C
C
14
R881
U805
NL17SZ07
19
0
0.10uF
C816
TP_WDOG
TP_A1
NC
TP_16_8MHz
6
21
10
3
15
9
0
5
9
TP_CS4
C802
1.0uF
7
V1
3
NC
TP_WAITB
47K
R877
1
TP_32kHz
2
NC
NC
C814
0.10uF
1
SW1
NC
BT_UART_RX
C803
33pF
23
W
2
0
E
C
B
_
N
_
P
A
4
A
A
2
2
L
B
A
_
N
O
E
_
N
U
2
1
R_W_N
Y18
S
E
B
_
N
_
P
A
5
V
2
0
W
2
1
S
O
E
_
N
_
P
E
15
D4
AB8
AB7
D5
AA7
D6
D7
Y7
Y6
D8
AA6
D9
A
A
18
E
B
0
_
N
V
2
1
E
B
1_
N
AA5
D10
D11
Y5
AA4
D12
D13
AB4
AA3
D14
AB3
D15
D2
Y8
AA8
D3
CS0_N
AA21
CS1_N
AA16
CS2_N
AB20
CS3_N
AA20
Y19
CS4_N
CS5
U14
AA9
D0
D1
Y9
A3
AB16
A4
AB21
A5
Y16
AA15
A6
A7
AA19
A8
Y15
A9
Y14
Y
2
1
B
U
R
S
T
C
L
K
A17
AB11
A18
AA11
A19
Y11
A2
AB17
A20
Y10
A21
AA10
A22_PA1_DSP_DBG_XDW
U11
U10
A23_PA0_DSP_DBG_YDW
A1
AA17
A10
T13
A11
AA14
A12
AB13
A13
AA13
A14
Y13
A15
AB12
A16
AA12
EIM_BLOCK
*U801-1*
Y17
A0
C811
33pF
C872
0.1uF
9
NC
12
R896
FHB1M1005JT
L803
RS232_TX
0
16
4
18
NC
1
N
C
N
C
15 7
0
10
0
NC
C824
33pF
14
SW2_FLTR
14
SW2
R829 0
FHB1M1005JT
L802
NC
V2_775_FLTR
25
V2_775_FLTR
V2_775_FLTR
S
P
IB
_
M
O
S
I
0.10uF
NC
TP_RRA_CS
NC
12
C812
47K
R850
TP_RTS
NC
H
9
L
16
V
S
S
2
NC
9
8
22
Q
3
_
Q
1V
D
D
U
12
Q
4
V
D
D
T
12
Q
4
V
S
S
G
11
Q
6
V
D
D
H
11
Q
6
V
S
S
G
16
Q
7
V
D
D
H
14
Q
7
V
S
S
C
2
V
C
C
A
V
S
S
1
L
7
K
_
Q
V
S
S
M
8
H
17
L
V
D
D
L
V
S
S
H
16
G
17
P
V
D
D
H
15
P
V
S
S
Q
2
_
Q
8
V
D
D
N
17
M
16
Q
2
_
Q
8
V
S
S
M
7
G
7
J
8
I1V
S
S
J
7
I2
V
D
D
L
8
I2
V
S
S
J
1V
D
D
N
8
J
1V
S
S
P
8
R
8
J
2
V
D
D
J
2
V
S
S
T
9
K
V
D
D
D
V
S
S
G
13
E
V
D
D
H
12
E
V
S
S
G
N
D
A
D
2
H
1V
D
D
G
10
H
10
H
1V
S
S
G
9
H
2
V
D
D
H
2
V
S
S
H
8
I1V
D
D
N
16
M
17
B
2
V
D
D
K
16
B
2
V
S
S
C
1V
D
D
J
17
C
1V
S
S
J
16
G
15
C
2
V
D
D
C
2
V
S
S
H
13
D
V
D
D
T
17
P
16
A
2
V
S
S
U
13
A
3
V
D
D
T
14
A
3
V
S
S
U
15
A
4
V
D
D
U
16
A
4
V
S
S
U
17
A
5
V
D
D
T
15
A
5
V
S
S
R
17
B
1V
D
D
B
1V
S
S
IC_PWR_GND
*U801-5*
U
8
A
1V
D
D
T
10
A
1V
S
S
A
2
V
D
D
U
9
T
11
33pF
12
NC
NC
C813
KP_LED_ZONE1_PB7
KP_LED_ZONE2_PB8
USB_TXENB
Data_2
Data_1
Data_0
Data(0:15) Data(0:15)
BT_UART_RX
BT_UART_RX
BT_UART_RX
SHORTCUT_BUTTONS_LED_PB5
BT_OR_PTT_LED_PB6
KEYPAD_ROW5
KEYPAD_ROW6
KEYPAD_ROW7
KEYPAD_COLUMN6
Data_8
Data_7
Data_6
Data_5
Data_4
Data_3
SIM_DATA_PAT
SIM_RST_PAT
SIM_RST_PAT
SIM_RST_PAT
V
P
P
_
O
U
T
_
O
R
FLASH_CE2
P
A
T
_
L
B
A
_
N
PAT_LBA_N
OLD_MOD OLD_MOD
PAT_MOD
32KHZ_CLK
32KHZ_CLK
32KHZ_CLK
PAT_CS5
PAT_CS5
PAT_CS4_N
PAT_CS3_N
PAT_CS3_N
RESET_OUT
R
E
S
E
T
_
O
U
T
RESET_OUT
RESET_OUT
JTAG_TRST
JTAG_TRST
RESET_OUT_2_7
SIM_CLK_PAT
SIM_DATA_PAT
SIM_DATA_PAT
DISPLAY_ID
JTAG_TDO
JTAG_TCK
JTAG_TDI
JTAG_TMS
PAT_MUX_CTL
OPT_SEL_1
MUX_CTRL
MOD
DSP_DE
DSP_DE
MCU_DE
MCU_DE
VDD_PAT_2_775
VDD_PAT_2_775
$P
VDD_PAT_1_55
VDD_PAT_1_55
VDD_PAT_1_875
VDD_PAT_1_875
EOL_INT_B2
DISPLAY_ID
SPIB_MOSI
SPIB_CLK
SPIB_CLK
RR_FSYNC
RR_FSYNC
RR_DCLK
RR_DCLK
RR_TX
RR_TX
SPIB_MISO
SPIB_MISO
SPIA_MISO
SPIA_MISO
SPIB_CS0_RR
SPIB_CS0_RR
SPIB_CS0_RR
ACT_CURR_EN
DISPLAY_INTERRUPT
DISPLAY_INTERRUPT
DISPLAY_INTERRUPT
Address_23
OPT_SEL_1
SPIA_CLK
SPIA_CLK
SPIA_MOSI
SPIA_MOSI
SPIB_MOSI
Data_13
Data_12
Data_11
Data_10
Data_9
Address(0:25) Address(0:25)
RR_INT
RR_INT
RS232_RX_USB_VM
RS232_RX_USB_VM
SPIA_CS6_SH_CE
SPIA_CS6_SH_CE
SPIA_CS6_SH_CE
P
A
T
_
E
B
1_
N
PAT_OE_N
P
A
T
_
O
E
_
N
PAT_OE_N
PAT_OE_N
PAT_OE_N
PAT_RW_N
PAT_RW_N
PAT_RW_N
PAT_RW_N
Address_0
Data_15
Data_14
RR_RX
RR_RX
FLIP_SENSE_1
KPLED_ZONE2_GPIO_PE13
PAT_EB0_N
PAT_EB0_N
P
A
T
_
E
B
0
_
N
PAT_EB1_N
PAT_EB1_N
VPP_OUT
OSC_EN_STBY_1
OSC_EN_STBY_1
VSIM_EN
VSIM_EN
XIP_FLASH_VCC
BT_UART_WAKE
P
A
T
_
S
E
B
_
P
A
5
P
A
T
_
S
O
E
_
P
E
15
SINGLE_PATH_CHARGE
A25_SIBLEY
A25_SIBLEY
A25_SIBLEY
PC8_UTXD1_UTXD2
ZZ
SRAM_VCC
UART2_RTS
RR_PRM_INT
SPIA_CS7_RR
SPIA_CS7_RR
RR_SEC_INT
RR_SEC_INT
VCON
VCON
BT_RESET_B
VDD_PAT_GPS
ZZ
PAT_WAITB
P
A
T
_
W
A
IT
B
P
A
T
_
B
C
L
K
PAT_BCLK
PAT_CS0_N
PAT_CS0_N
PAT_CS0_N
PAT_CS1_N
PAT_CS1_N
PAT_CS2_N
PAT_CS2_N
RXCLK
RXFS
GPS_AGC_DAT
GPS_AGC_DAT
GPS_CLKACQ
GPS_CLKACQ
CLKGPS
CLKGPS
GPS_MAG
GPS_MAG
GPS_PECLREF
GPS_PECLREF
GPS_SIGN
GPS_SIGN
KEYPAD_COLUMN7
RS232_RTS_USB_XRXD
RS232_TX_USB_DIN
UART2_CTS
BT_UART_TX
BT_UART_TX
STDB
USB_TXENB
USB_TXENB
PAT_WDOG_N
USB_EOP
USB_EOP
SW_B+_EN
KEYPAD_COLUMN3
KEYPAD_ROW4
RS232_RX_USB_VM
KEYPAD_COLUMN5
BATT_ID
BATT_ID
RR_SEC_INT_b
GPS_TIME_SYNC
TXFS
iCRNE_CS
UART2_RTS_PAT
TXCLK
SRDB
RX_ACQ
DMCS
RR_AD_TRIGGER
PTT
KEYPAD_ROW0
KEYPAD_COLUMN0
KEYPAD_ROW1
KEYPAD_COLUMN1
KEYPAD_ROW2
KEYPAD_COLUMN2
KEYPAD_ROW3
CKO
MODE_SELECT
MODE_SELECT
USB_VPIN WDI
WDI
OSC_EN_STBY
OSC_EN_STBY
CKOH_SCC_CLK 16.8MHz_CLK
16.8MHz_CLK
LV_DETECT
LV_DETECT
LV_DETECT
EOL_INT_B TXE
6880401P39-O 125


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.7 DIGITAL - ATI AND DISPLAY CONNECTOR

























































R
E
D
G
R
E
E
N
B
L
U
E
ATI W2282
MAIN_CS
RESETB
DNP
R/W
D/C
PINS FOR 8-BIT LCD
LCDD8 - LCDD15
17
NC
NC 8
NC
NC
15
9
15
FLTR2
12
FLTR3
11
FLTR4
FLTR5
10
FLTR6
14
9
FLTR7
13
FLTR8
G
1
G
N
D
2
FLTR2
5
FLTR3
6
FLTR4
7
FLTR5
3
FLTR6
FLTR7
8
FLTR8
4
16
FLTR1
NUF8001MU
FL3012
1
FLTR1
0
R8126
NC
17
R8127
0
NC
R8128
0
8
12
13
FLTR2
15
FLTR3
14
FLTR4
FLTR5
11
FLTR6
12
10
FLTR7
9
FLTR8
G
1
G
N
D
4
FLTR2
2
FLTR3
3
FLTR4
6
FLTR5
5
FLTR6
FLTR7
7
FLTR8
8
16
FLTR1
NC
NUF8001MU
FL3011
1
FLTR1
LCDD7
L1
LCDD8
K5
LCDD9
L5
LS
R1 SS
R2
LCDD15
P2
LCDD16
N4
LCDD17
P4
LCDD2
K4
LCDD3
H4
LCDD4
N2
J5
LCDD5
L4
LCDD6
GS
T1
LCDD0
J4
LCDD1
M2
LCDD10
M1
LCDD11
M5
LCDD12
M4
N1
LCDD13 N5
LCDD14
*U403-3*
DCLK
P1
DINV
H5
FRAME
G5
K1
GCLK G4
GOE
LCD_INTERFACE
16 10
NC
12
16
8
13
NC
NC
NC
13
13
NC
NC
11 NC
NC
12
14
9
NC
16
NC
NC
10
10
14
11
11
NC
14
NC
15 15
17
NC
NC 9
FLTR3
16
FLTR4
11
12
FLTR5
13
FLTR6
FLTR7
14
FLTR8
15
G
N
D
G
1
FLTR3
1
FLTR4
6
FLTR5
5
FLTR6
4
3
FLTR7
2
FLTR8
FLTR1
10
FLTR2
9
FL3010
NUF8001MU
FLTR1
7
FLTR2
8
LCD_SPI_DATA
LCD_SPI_CS
LCD_DC
LCD_SPI_CLK
LCD_DATA(0:17)
SD_CD_F
LCD_18D17_CS_F
LCD_18D16_RESETB LCD_18D16_RESETB_F
LCD_18D15_8D7 LCD_18D15_8D7_F
LCD_18D9_8D1 LCD_18D9_8D1_F
LCD_DATA_F(0:17)
SD_D2_F
SD_D3_F
SD_CMD_F
SD_WP_F
SD_CLK_F
LCD_DC_F
LCD_RW_F LCD_RW
LCD_DC
LCD_18D8_8D0_F LCD_18D8_8D0
SD_CD
SD_CMD
SD_D2
SD_D3
SD_WP
LCD_18D17_CS
LCD_18D10_8D2
LCD_18D11_8D3
LCD_18D12_8D4
LCD_18D14_8D6
LCD_18D10_8D2_F
LCD_18D11_8D3_F
LCD_18D12_8D4_F
LCD_18D14_8D6_F
SD_D1
SD_D0
LCD_18D13_8D5_F
SD_CLK
LCD_18D13_8D5
SD_D1_F
SD_D0_F
LCD_RW
ATI W2282
ATI W2282
CORE CPU LCD RAM VIP0 GPIOC GPIO GPIOD EXT RAM IO EXT RAM CORE
SDIO JTAG
ATI W2282
ATI W2282
1.8V
DNP
DNP
NC
0:WAITb ACTIVE LOW, 1:WAITb ACTIVE HI
1.8V
NC
NC
NA
DNP
2.8V
NC
NC
NC
QSPI_SSb
1.8V
NC
NC
NA
NC
NC
LCD SPI CS (CS)
NC
CPU DATA BUS
0:MLINK DISABLED, 1:MLINK ENABLED
NC
NC
1.8V
DNP DNP
Indirect Addressing
2.8V 1.8V
NC
FLASH ENABLE
NC
DNP
NA
0:16-BIT DATA BUS, 1:8-BIT DATA BUS
NC
1.8V
NC
LCD P/S
LCD SPI DATA (D0)
NC
NC
NC
2.8V
NC
DNP
NC
1.8V
NC
NC
NC
NC
DNP
NC
NA
FLASH T_F
NC
NA NA
DNP
NC
QSPI_MISO
Disable test mode
DNP
2.8V
NA NC
NC
NC
QSPI_MOSI
MOTOROLA INTERNAL USE ONLY
NC
NC
NC
0:MR PIN LOW, 1:MR PIN RD/WRb
NC
DNP
NC
NC
NC
LCD SPI CLK (D/C)
NC
NC
NC
ESD POWER:
PLL/XTAL POWER:
NC
NC
NA
NC
NC
NC
NC
0:ATI WAITb, 1:PAT WAITb
NC
NC
NC
NC
NC
NC
DNP
DNP
NA
1.8V 1.55V
NC NC
NC
DNP
NC
NC
NA
QSPI_SCK
NA
NC
0:32kHz SRCCLK, 1:5-20MHz SRCCLK
NC
DNP
NC
DNP DNP
DNP DNP
DNP
DNP
DNP
NC NC
NC
NC
DNP DNP
1.55V
NC
NC
3
7
8
NC
R453 0
R8078
0
NC
NC
C2051
5
R8076
0
12pF
C 8
L 2
MEA1608
FL3008-2
0
R8113
3
2.2K
R8071
FL3007-3
MEA1608
7 C
L
FL3008-4
C 6
L 4
12
MEA1608
R8109
10K
C
3 L
11
NC
VMMC
13
FL3006-3
MEA1608
7
SW2_FLTR
NC
NC
FHB1M1005JT
E8884
R8117
0
15
NC
1
NC
NC
0
13
0
NC
NC
R401
NC
3
NC
11
B19
SDC0DQ3
A18
SDC0WP
NC
V3
GPIOD5 V4
GPIOD6
SDC0CD
B18
E19
SDC0CLK
SDC0CMD
D14
SDC0DQ0
D19
D15
SDC0DQ1 C19
SDC0DQ2
E16
GPIOC5 B15
GPIOC6
GPIOC7
A15
W2
GPIOD0 V1
GPIOD1 V2
GPIOD2
GPIOD3
W3
W4
GPIOD4
E5
GPIO7 E2
GPIO8 E1
GPIO9
F15
GPIOC0
GPIOC1
F16
E18
GPIOC2 D18
GPIOC3 E15
GPIOC4
J2
GPIO17 K2
GPIO18 L2
GPIO19
B3
GPIO2 B1
GPIO3 D5
GPIO4 D1
GPIO5 D4
GPIO6
C1
GPIO1
E4
GPIO10 F2
GPIO11 F1
GPIO12 G2
GPIO13 G1
GPIO14 H2
GPIO15 H1
GPIO16
GPIO_SD_INTERFACE
*U403-2*
B2
GPIO0
NC
NC
ATI_1_55
NC
5
1
5
NC
0
R8080
7
5
GND1
10
GND2
GND
FL3006-5
2
NC
NC
1.0uF
SW2_FLTR
NC
SW2_FLTR
C2058
5
7
SW2_FLTR
C480
0.1uF
NC
10K R8107
MEA1608
FL3006-2
C 8
L 2
NC
NC
C 9
L 1
1
NC
NC
NC
MEA1608
FL3006-1
C479
0.1uF
NC
NC
SW2_FLTR
C463
0.1uF
4
R8112
VIP0DATA8
R5
VIP0DATA9
W5
VIP0HREF
W8
VIP0VSYNC
V8
0
VIP0DATA0
R6
VIP0DATA1
T6
VIP0DATA2
T7
VIP0DATA3
V6
VIP0DATA4
R7
VIP0DATA5
T8
VIP0DATA6
R8
VIP0DATA7
R9
I2C_SCL
W7
I2C_SDA
V7
VIP0CLK
W9
VIP0CLKO
W6
C
L 4
*U403-4*
CAMERA_INTERFACE
FL3006-4
MEA1608
6
1
6
9
0.1uF
0
2
ATI_1_55
NC
4
C481
0
R8079
GND
FL3008-5
5
GND1
10
GND2
C60062
1.0uF
NC
6
VMMC
4
3
0.1uF
C460 C464
NC
0.1uF
C475
9
NC
0.1uF
0
R8110
SW2_FLTR
C462
0.1uF
R8123
ATI_1_55
NC
NC
NC
0
VMMC
0
C2049
E12
3
33pF
T10
VSS_34
T15
VSS_35
T16
VSS_4
E7
VSS_5
E8
VSS_6
E9
VSS_7
E10
VSS_8
E11
VSS_9
L7
VSS_27
L8
VSS_28
L9
VSS_29
L13
VSS_3
D16
VSS_30
N10
VSS_31
N13
VSS_32
P5
VSS_33
H12
VSS_2
D10
VSS_20
J8
VSS_21
J9
VSS_22
J12
VSS_23
K8
VSS_24
K9
VSS_25
K13
VSS_26
F10
VSS_12
F11
VSS_13
G8
VSS_14
G9
VSS_15
G10
VSS_16
G11
VSS_17
H8
VSS_18
H9
VSS_19
F13
VDDR6_1
F7
VDDR6_2
F8
VDDR6_3
G7
VDDR7_1
M7
VDDR7_2
N7
VSS_1
C18
VSS_10
F9
VSS_11
D9
VDDR3_5
D11
VDDR3_6
D12
VDDR3_7
D13
VDDR4_1
M8
VDDR4_2
M9
VDDR4_3
N8
VDDR5_1
E13
VDDR5_2
M11
VDDR1_8
M12
VDDR2_1
H7
VDDR2_2
J7
VDDR2_3
K7
VDDR3_1
D6
VDDR3_2
D7
VDDR3_3
D8
VDDR3_4
L10
VDDC_8
L11
VDDR1_1
F12
VDDR1_2
G12
VDDR1_3
G13
VDDR1_4
K12
VDDR1_5
L12
VDDR1_6
M10
VDDR1_7
R19
PVSS
T19
VDDC_1
H10
VDDC_2
H11
VDDC_3
J10
VDDC_4
J11
VDDC_5
K10
VDDC_6
K11
VDDC_7
A6
NC4
A7
NC5
A8
NC6
A9
NC7
A10
NC8
A11
NC9
A12
PESD
V19
PVDD
B13
NC22
B14
NC23
F4
NC24
R4
NC25
T4
NC26
T5
NC27
U1
NC28
V5
NC3
B6
NC15
B7
NC16
B8
NC17
B9
NC18
B10
NC19
B11
NC2
A5
NC20
B12
NC21
T11
I_VDD_7
V18
I_VTST
R13
NC1
A4
NC10
A13
NC11
A14
NC12
B4
NC13
B5
NC14
N11
I_VDDQ_5
N12
I_VDDQ_6
T9
I_VDD_1
A3
I_VDD_2
A16
I_VDD_3
B16
I_VDD_4
M13
I_VDD_5
N9
I_VDD_6
V9
I_TEST
R11
I_VBB
R10
I_VCCP
W17
I_VDDA
V17
I_VDDQ_1
A2
I_VDDQ_2
A17
I_VDDQ_3
B17
I_VDDQ_4
POWER_GROUND
*U403-5*
I_DVC2
R8111
NC
GND1
5
GND2
10
0
8 C
2 L
FL3007-5
GND
VMMC
0
FL3007-2
MEA1608
R8125
NC NC
V3
SW1_FLTR
10K
10K
C2059
R8124
6
NC
1.0uF
0
R8077
R8116
0
12
NC
NC
2
4
L 1
1
MEA1608
FL3007-1
C 9
C478
1.0uF
C461
NC
7
delete,.
0.1uF
14
NC
5
4
TP_GPIO6
1
6
P19
WEB
10
0
SW2_FLTR
NC
N16
MR
N19
OEB
H16
RESETB
SLEEP
W18
J1
SPKG
U19
SRCCLK
F5
TESTEN
G16
WAITB
DQ4
J15
J16
DQ5 K16
DQ6
DQ7
K15
J13
DQ8 L15
DQ9
E14
INT0B
INT1B
G15
DQ1
DQ10
K19
DQ11
L16
L19
DQ12 M15
DQ13
DQ14
M16
DQ15
N15
DQ2
H13
DQ3
J19
AD7
V13
AD8
T14
W14
AD9
F19
BE0
BE1
G19
M19
CSB
DQ0
H19
H15
AD2
V16
AD20
R15
R14
AD21
AD22
P16
W15
AD3
AD4
V15
AD5
V14
AD6
R12
T13
AD12
W13
W12
AD13
AD14
T12
AD15
V11
W11
AD16 V10
AD17
AD18
W10
AD19
R16
*U403-1*
P15
AD0 W16
AD1
AD10
V12
AD11
2
NC
CPU_INTERFACE
10K
14
6 C
4 L
NC
R8106
NC
NC
FL3007-4
MEA1608
C484
0.1uF
NC
2.2K
NC
NC
2
3
NC
R8070
C476
0.1uF
NC
NC
NC
C2029
12pF
NC
MEA1608
FL3008-3
C 7
L 3
10
6
C60063
0.1uF
SW2_FLTR
NC
R8108
10K
7
NC
NC
NC
TP_GPIO10
1
0.1uF
C482
R8083
100K
Q1410
0.1uF
C483
8
10K
MEA1608
FL3008-1
C 9
L 1
R8102
ATI_VDD_CORE_1_5
LCD_SPI_CLK
LCD_SPI_CS
15
ATI_VDDR4_CAMERA
CAM_MCLK
RESET_OUT RESET_OUT
I2C_DAT
I2C_DAT
CAM_STBY
CAM_STBY
CAM_RESET
CAM_RESET
I2C_CLK
I2C_CLK
CAM_RESET
CAM_STBY
CAM_DATA(0:7)
CAM_DATA(0:7)
SD_D1
SD_D0
SD_D2
SD_D3
SD_CD
SD_WP
SD_CMD
CAM_VSYNC_F
CAM_HSYNC_F
I2C_CLK
I2C_CLK
SD_CLK
I2C_DAT
I2C_DAT
ATI_VDDR3_RAM
ATI_VDDR7_GPIOD
Data_12
Data_13
Data_14
Data(0:15)
Data_15
PAT_CS3_N PAT_CS3_N
PAT_RW_N PAT_RW_N
PAT_OE_N PAT_OE_N
LCD_P_S
MR_PIN_SEL LCD_SPI_DATA
WAIT_PIN_SEL
DISPLAY_INTERRUPT DISPLAY_INTERRUPT
Data_0 Address_23 Address_23
Data_1
Data_2
Data_3
Data_4
Data_5
Data_6
Data_7
Data_8
Data_9
Data_10
Data_11
CAM_DATA6_F
CAM_DATA6_F
CAM_DATA2_F
CAM_DATA2_F
CAM_DATA7_F
CAM_DATA7_F
CAM_DATA3_F
CAM_DATA3_F
32KHZ_CLK_1 32KHZ_CLK
CAM_DATA_F(0:7)
ATI_VDDR2_CAMERA
ATI_VDDR2_CAMERA
ATI_VDDR2_CAMERA
ATI_VDDR1_1_8
CAM_PCLK_F CAM_DATA5_F
CAM_DATA5_F
CAM_DATA1_F
CAM_DATA1_F
CAM_MCLK_F
CAM_DATA4_F
CAM_DATA4_F
CAM_DATA0_F
CAM_DATA0_F
ATI_VDD_EXT_RAM_CORE
ATI_VDDQ_EXT_RAM
126 6880401P39-O


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.8 DIGITAL BLOCK - CONNECTORS, SIM, AND MISC.
























































80-pin BTB 9009261001
DNP
DNP DNP
DNP
CHANGE BACK TO CAM_RESET_F AFTER TESTING FL3008
CHANGE BACK TO I2C_CLK_F AFTER TESTING FL3008
CHANGE BACK TO CAM_STBY_F AFTER TESTING FL3008
DNP
CHANGE BACK TO I2C_DAT_F AFTER TESTING FL3008
DNP
R8089
0
J779-22
C2039
0.1uF
J779-32
C2048
18pF
7
J779-33
J779-29
J779-17
C470
C2044
10pF
18pF
33pF
J779-72
C403
15
J779-61
V2
FHB1M1005JT
E8889
SW2_FLTR
J779-80
J779-36
J779-49
C406
J779-12
J779-59
J779-14
33pF
J779-54
J779-56
J779-31
J779-63
33pF
C2040
18pF
C404
J779-82
J779-2
J779-23
J779-39
10
11
J779-28
C405
33pF
J779-73
J779-1
J779-50
J779-52
J779-77
0 R8119
R8099
0
J779-20
J779-25
L405
J779-35
J779-40
TP_EAR_M
1
J779-81
R8100
0
10pF
17
J779-44
C2050
J779-66
J779-42
12
9
J779-30
E8886
FHB1M1005JT
0 R8094
1
0
J779-79
J779-69
J779-21
J779-51
4
J779-65
J779-45
2
14
J779-9
J779-47
0
0
R8093
VR405
16.2V
R8082
10pF
C2045
J779-27 C2055
0.1uF
E8893
FHB1M1005JT
E8890
FHB1M1005JT
FLTR2
10
FLTR3
11
FLTR4
12
16
FLTR5
15
FLTR6
FLTR7
14
FLTR8
13
G
N
D
G
1
FLTR2
7
FLTR3
6
FLTR4
5
FLTR5
1
FLTR6
2
3
FLTR7
4
FLTR8
FLTR1
9
FL402
NUF8001MU
FLTR1
8
15.4
R470
J779-71
C2057
J779-4
0.1uF
J779-84
J779-55
R8087
0
J779-24
0
R8086
C2047
J779-26
TP_EAR_P
1
18pF
TP_VIB
1
J779-53
J779-48
J779-57
J779-67
J779-46
E405
FLTR4
13
12
FLTR5
11
FLTR6
FLTR7
10
FLTR8
9
G
N
D
G
1
FLTR4
4
FLTR5
5
FLTR6
6
7
FLTR7
8
FLTR8
FLTR1
16
FLTR2
15
FLTR3
14
FL401
NUF8001MU
FLTR1
1
FLTR2
2
FLTR3
3
0 J779-18
R8090
33pF
C2038
R8088
J779-3
0
J779-43
J779-19
J779-75
J779-11
J779-68
J779-70
0.1uF
C2056
33pF
C471
J779-13
FHB1M1005JT
E8887
J779-41
16
13
J779-60
8
J779-37
J779-74
J779-76
V_VIB
J779-15
J779-10
3
J779-64
SW3
V2_775_FLTR
J779-5
J779-78
J779-6
0
R8091
J779-8
J779-58
J779-7
C2046
10pF
14.7
R471
5
6
R8084
0
E8885
FHB1M1005JT
FHB1M1005JT
E8888
C2037
33pF
J779-34
J779-16
C430
18pF
0
R8085
J779-83
J779-38
CAM_HSYNC_F CAM_VSYNC_F
LCD_P_S
SHORTCUT_BUTTONS_LED_PB5
KP_COL0_F
KP_ROW1_F
ON_OFF_F
KP_ROW3_F
KP_ROW7_F
KP_COL2_F
J779-62
KP_COL5_F
KP_LED_ZONE1_PB7
DISP_LED_PWM_FILT
CAM_DATA(0:7)
CAM_DATA(0:7)
KP_LED_PWM_FILT
LCD_18D15_8D7_F
LCD_DATA_F(0:17)
LCD_DC_F
LCD_RW_F
VIB_PLUS
EAR_PLUS_F
CAM_PCLK
KEYPAD_COLUMN5
KEYPAD_COLUMN7
CAM_HSYNC
KEYPAD_ROW6
KP_COL7_F
KP_COL3_F
KP_COL1_F
DISP_LED_PWM
EAR_MINUS_F
SD_D3_F
SD_D2_F
KP_LED_ZONE2_PB8
KP_ROW5_F
KP_COL6_F
KP_ROW6_F
CI_BLUE
MICROPHONE
MICROPHONE
SPKR_R_PLUS
SPKR_R_PLUS
LCD_18D8_8D0_F
SD_CD_F SD_D0_F
SD_D1_F SD_CLK_F
SD_CMD_F
KEYPAD_COLUMN1
KEYPAD_COLUMN3
CAM_PCLK_F
SPKR_R_MINUS
SPKR_R_MINUS
KP_ROW0_F
KP_ROW2_F
KP_ROW4_F
LCD_18D9_8D1_F
LCD_18D10_8D2_F
LCD_18D11_8D3_F
LCD_18D12_8D4_F
LCD_18D13_8D5_F
LCD_18D14_8D6_F
LCD_18D16_RESETB_F
LCD_18D17_CS_F
I2C_CLK
I2C_DAT
CAM_STBY
CAM_RESET
CAM_MCLK_F
SOL_LED2_PWM
CI_RED
ON_OFF_SWITCH KEYPAD_ROW0
KEYPAD_ROW2
KEYPAD_ROW4
PTT
CI_GREEN
CI_GREEN
EARPHONE_MINUS EARPHONE_PLUS
VIB_MINUS
BT_OR_PTT_LED_PB6
KEYPAD_ROW3
KEYPAD_ROW7
KEYPAD_COLUMN2
KEYPAD_ROW1
KEYPAD_ROW5
KEYPAD_COLUMN0
KEYPAD_COLUMN6
6880401P39-O 127


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.9 ROADRUNNER - POWER SECTION

























































P
N
47K
47K
4
7
K
Q2 Q1
47K
4
7
K
4
7
K
47K
Q
2
Q
1
4
7
K
E
D
MOTOROLA INTERNAL USE ONLY
VMMC used for BT and Digital
2.775V
1.875V
2.775V
SUPPLIES TO RF BLOCKS
then parts must
FILT_BATTI connects only to
then parts could be placed
then "Alternate SW1" parts must be placed
OVIC FET
then "Alternate VMMC" parts
Additional 1.875V - V1
be placed
If SW1 is placed and an additonal 1.875V is desired
If VMMC is DNP
1.55V
3.0V
M4 - Logic FET
If VMMC is DNP
DNP
Replace C724 to 2175181C01
R1443
"Alternate SW1"
RR_BATTI connects only to RF PA
5V
M3 - Main FET
M1 & M2 - Charge & Dis-Charge FETs
1.55V
must be placed
3.0V
"Alternate VMMC"
DNP
DNP
2.775V
SW1 used for Patriot Core and ATI
DNP
DNP DNP
DNP
DNP
DNP
1.875V
If SW1 is DNP
FAKE REF DE
REAL REF DE
DNP
If SW1 is DNP
then parts must be placed
Replace C797 to 2175181C01
DNP
High Power Audio Amps and ALERT_VCC
2.8V
DNP
2.775V
1.875V
Consider Changing C786 to 10uF
P
lace by P
A
D1 - Logic Diode
DNP
1.875V
SW3
FILT_BPLUS
4 1 3 A
C713 4.7uF
C711
1.0uF
NZQA5V6XV5T1
VOLTAGE
4813979B24
N
C
0.10uF
VR702
C727 0
R
7
1
6
R787
6
SW1
N
C
FILT_BPLUS
0
VR704
4813978M23
3 4
1 2 5
SHORT
E716
2
1
SW2
1
*C797*
22uF
USB_VBUS
R768
0
C708
1.0uF
C757
FILT_BPLUS
R793 0
1.0uF
*C782*
22uF
R724
C1
C2
C3
A
1
0
4809807C45
*Q702*
replace,4813970M62
FHB1M1005JT
E706
RR_BATTI
*C717*
22uF
D
1
A
8
D
1
B
7 6
D
2
A
D
2
B
5
G
1
2
G
2
4
S
1
1
S
2
3
6
FILT_BPLUS
Q703
4813970M54
VOLTAGE
VR755
3
4
1
2
5
E714
SHORT
2 1
R710
0613952N01
E713
2
1
10K
V2
SHORT
22uF
FILT_BPLUS
N
C
*C716*
R775
200K
15pF
C2054
4
.
7
u
F
C
7
8
6
7605821Z02
E703
1
R1441 200K
2
1
BAT_DET_IN
RR_BATTI
SHORT
E720
*C755*
22uF
C729
2.2uF
56pF
C732
C704 2.2uF
EN
3
G
N
D
2
NC
4
VIN
1
VOUT
5
SW3
5114014A82
U703
R778
0
2
.
2
u
F
C
7
1
9
VUSB_IN
G18
V_VIB
E7
F6
V_VIB_IN
E8911
FHB1M1005JT
VHOLD_EXT_EN
E11
B11
VHOLD_EXT_IN
C11
VHOLD_OUT
C7
VMMC
VMMC_DRV
D7
C9
VSIM
VSIM_EN
D9
G16
VUSB
V2_DRV
C2
B2
V2_FB
V3
C8
D8
V3_VSIM_IN
R5
V4
V4_IN
R4
VCC_OUT
B15
VDRV4_5
R16
T18
RAWEXTBPLUS
H16
SW1ISNSN
SW1ISNSP
H14
H17
SW1NDRV
SW1PDRV
H18
USB_VBUS_URTSI
G17
V1
B10
C10
V1_IN
A
1
8
N
C
4
_
1
A
1
9
N
C
4
_
2
B
1
9
N
C
4
_
3
J15
PGND1
J14
PGND2
PGND3
L14
PSRC2
J18
H15
PWR_VDD
A
2
N
C
1
_
2
B
1
N
C
1
_
3
V
1
N
C
2
_
1
W
1
N
C
2
_
2
W
2
N
C
2
_
3
W
1
8
N
C
3
_
1
W
1
9
N
C
3
_
2
N
C
3
_
3
V
1
9
FB1
J16
K15
FB2
FB3
K16
ISENSE
R17
LX2
J17
LX3
K18
MOBPORTB
P15
A
1
N
C
1
_
1
K17
BST_IN
P16
CHRGC
DCHARC
P17
D
G
N
D
1
_
1
T
1
4
D
G
N
D
1
_
2
U
1
5
D
5
D
G
N
D
2
D
G
N
D
3
F
1
5
D
G
N
D
_
T
E
S
T
F
1
1
A
G
N
D
_
E
S
D
2
_
1
E
8
G
6
A
G
N
D
_
E
S
D
2
_
2
P
7
A
G
N
D
_
E
S
D
2
_
3
A
G
N
D
_
E
S
D
2
_
4
R
1
1
BATTI
V14
P18
BATTP
BATT_DET_IN
N18
E12
BPLUS
A
G
N
D
2
B
1
6
A
G
N
D
3
E
9
A
G
N
D
4
F
1
7
A
G
N
D
5
T
1
2
A
G
N
D
6
M
1
5
A
G
N
D
7
P
5
A
G
N
D
8
R
1
8
A
G
N
D
_
E
S
D
1
F
1
2
POWER
*U701-5*
A
G
N
D
1
E
5
4805286Z07
D705
.05
R8122
0
R750
V3
N
C
R776
0
C734
2113945A09
1000pF
C
7
7
9
4
.
7
u
F
FILT_BPLUS
22uF
N
C
N
C
*C724*
0
R772
R712 9.76K
SW2_UNDELAYED
100nH
R746
1K
2413954B25
R758
V4
SHORT
E712
2
1
E732
200K
R735
2
2
u
F
C
7
9
0
56pF
C706
0613952N82
R713
69.8K
FILT_BPLUS
VOLTAGE
VR802
2
2
u
F
C
7
1
8
Q1411
Q
7
0
8
D
G S
4
1 2 3 6 7 8
5
FILT_BPLUS
RAW_B_PLUS
4809607E17
Q705
S
1
S
2
4.7uH
L755
4813972A34
Q706
D
1
D
2
G
1
G
2
D1B
D2A
D2B
2 G1
5 G2
S1
S2
Q1408
4871432M01
D1A
R752
0
VMMC
C
7
3
9
0
R709
V_VIB
.
0
1
u
F
V1
D700
4805656W95
R719
1
R
7
2
2
SW2_UNDELAYED
*R777*
0
0
2
.
2
u
F
*
C
7
1
4
*
2 1
E8910
FHB1M1005JT
2
1
SHORT
E718
S
H
O
R
T
E
7
1
7
*C787*
22uF
N
C
FHB1M1005JT
E731
1K
C746
.01uF
R789
C731
SW2_FLTR
C742
SW1
56pF
0.10uF
10uH
L1500
124
4805656W85
D702
1K
R726
E
7
1
1
2
1
R751
E715
SHORT
2 1
S
H
O
R
T
NC
1000pF
C736
R748
4.42
C
7
0
5
1
0
u
F
C
7
4
1
0
.
1
u
F
2.2uF
C725
0
R780
180K
replace,4813970M62
C1
C2
C3
A
1
*R784*
N
C
4809807C45
*Q701*
N
C
R759
.05
0
R757
2
.
2
u
F
C
7
0
9
V2
N
C
V4
R732
200K
*R783*
180K
7605821Z02
Q700
E702
1K
R770
R781
200K
USB_VCC
N
C
*C789*
22uF
R749
30K
10K
R788
R700
1K
FILT_BPLUS
R8120
0
56pF
C707
66.5K
0613952N80
R711
SW2_UNDELAYED
2 B2
4
C1
C2 5
3 E1
1 E2
V3
FILT_BPLUS
Q707
200K
R782
V3
C2053
N
C
C2052
22uF
B
2
C
1
C
2
E
1
E
2
22uF
Q709
C518
330uF
R769
R771
0
10K
10K
20m
N
C
R704
N
C
FILT_BPLUS
VMMC
0688044N02
R714
3
4
INPOS
2
V
C
C
1
V
C
C
2
5
1
V
E
E
6
VOUT
VSIM
SHORT
2 1
5109817F82
NCS2200
U700
INNEG
7 8
5
E719
4809607E17
Q704
4
1 2 3 6
D701
4805656W85
D704
0
C730
0.10uF
2360567A11
C535
68uF
10uH
*L754*
R727
10K
N
C
0685512E01
4.7uF
C726
R715
0.16
1000pF
2113945A09
C735
0
R790
*R701*
0.16
0
6
8
5
5
1
2
E
0
1
2
1
C799
1.0uF
S
H
O
R
T
E
7
1
0
C728
C756
56pF
RAW_B_PLUS
RAW_B_PLUS
0.10uF
RR_FB1
V1_RR_V1OUT
RR_SW1ISNSN
RR_SW1NDRV
RR_SW1PDRV
MOBPORTB_DIODE
MOBPORTB_DIODE
MAIN_FET_SOURCE
RR_SW1ISNSP
MOB_PORTB
M
O
B
_
P
O
R
T
B
LOGIC_FET_GATE
USB_RR_VBUS_URTSI
VMMC
VMMC_RR
V2
LOGIC_FET_OVER_RIDE
ACTIVATION_CURRENT_ENABLE
ACTIVATION_CURRENT_ENABLE
NC_ACTIVATION_CHARGER_PIN4
SINGLE_PATH_CHARGE
LOGIC_FET_CONTROL
LOGIC_FET_OFF
MOB_PORTB
BATTI
SW2_RR_FB2
COMP_POS
INTERNAL_MAIN_FET_COMPARATOR
INTERNAL_MAIN_FET_COMPARATOR
MAIN_FET_COMPARATOR
MAIN_FET_COMPARATOR
DIS_CHARGE_FET_GATE_DIODE
DIS_CHARGE_FET_GATE
MOB_PORTB
ACT_CURR_EN
EXT_B+
EXT_B+
CHARGE_SOURCE
C
H
A
R
G
E
_
S
O
U
R
C
E
ISENSE
ISENSE
MOBPORTB_SENSE_RR
MOBPORTB_SENSE_RR
ACTIVATION_CURRENT_NMOS_DRAIN
CHARGE_FET_GATE
CHARGE_FET_GATE
MAIN_FET_GATE
RR_BATTI
RR_BATTI
COMPARATOR_NEG
EXT_BPLUS_SENSE
G
R
O
U
N
D EXT_COMPARATOR_SUPPLY
SW2_ISENSE_P
SW2_ISENSE_N
USB_RR_VUSB_IN
VHOLD_EXT_IN_RR
VHOLD_EXT_EN
VCC_OUT
VSIM_EN
VHOLD_OUT
B
A
T
T
P
_
S
E
N
S
E
_
R
R
RR_BATTP
B
A
T
T
I
_
S
E
N
S
E
_
R
R
LOGIC_FET_CONTROL2
SW2_RR_LX2
SW2_FB2
RR_VDRV4_5
V2_IN
VMMC_IN
SW3_RR_LX3
V_RR_VIB_IN
SW3_RR_FB3
SW2_RR_PSRC2
V4
V1_RR_V1IN
BATT_DET_IN_RR
RR_PWR_VDD
V2
V3
V2_RR_DRV V2_RR_DRV
RR_VMMC_DRV
CHARGE_D
EXT_BPLUS_STABILITY_RC
V3_RR_VSIM_IN
RR_BATTI
GROUND
NC_RR_NC4_3 NC_RR_NC4_2 NC_RR_NC4_1 NC_RR_NC3_3 NC_RR_NC3_2 NC_RR_NC3_1 NC_RR_NC2_3 NC_RR_NC2_2 NC_RR_NC2_1 NC_RR_NC1_3 NC_RR_NC1_2 NC_RR_NC1_1
RR_DGND_TEST
RR_BPLUS
ACTIVATION_REGULATOR_VIN
VR702_NC1
FILT_BATTI
CHARGE_FET_CONTROL
GROUND
SW3_L
SW3_CAPS
128 6880401P39-O


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.10 ROADRUNNER - INTERFACE AND A/D

































































Place R734 when not using signal
DNP U3005 and R8121 PLACE R762
DNP -- 47K -- Balboa
determined by HSID document
Place R702 when powering
Place C798 and C796 when using dual path charger in RR V2.2 or after
Zeus DAT_SE0 USB mode - Connect PGM to GND
This is VICR for charge Control
DNP
DNP
Replace C798 to 2175181C01
Values on R707 and R708 are
47K -- 47K -- Tarpon
RF Board Alone
There is an internal 200K +/- 30% Pull Up resistor between USB_ID and LCELL
PLACE XTAL CIRCUIT FOR NOW
This is no longer an LED Sync pin
MOTOROLA INTERNAL USE ONLY
DNP R762 PLACE U3005 and R8121
100K -- 47K -- Blackstone
Supervisory Circuit
ON2B can tolerate 14V, USB_ID can only tolerate 4.65V.
Default Option:
Enter Factory Test Mode if 5V comes in on USB_ID. This is to be scaled and detected by AD5
47K -- 100K --
faisal- change r766 to 392k
Separate Isolated Grounds
DNP
There is a 200K internal pull up resistor between ON2B and V2 or B+.
Alternate:
DNP
R707 -- R708 -- Product
47K -- 10K --
47K -- DNP -- Cobia
INDY USB VP_VM mode - Connect PGM4 to FILT_B+
R765
75K
200K
R721
2.2uF
2113956B33 C796
10K
R731
R786
0
C785
18pF
0.1uF
V4
C733
22uF
*C798*
0
V4
R785
0 R723
22uF
C788
2175034B01
R766
390K
1.0uF C722
SW2
47K
4816402H01
D711
V4
SW2
R720
0.1uF
C777
100uF
C783
R702 2.7K
4816402H01
1MEG
D712
R773
R708
47K
4.7uF C715
SW2
R730
V4
V2
121K
G12
VPP_OUT
WDI
C16
XRXD_URTSO
F16
X
T
A
L
1
U
1
1
X
T
A
L
2
U
1
2
D18
TX_ENB
USB_DIG_VCC
E18
USB_DM_URXDI
G14
USB_DP_UTXDO
G15
USB_ID
C18
USB_VM_URXDO
E17
USB_VP
G13
L13
USR_OFF
SEC_CE
M14
SEC_DIG_VCC
N14
SEC_MISO
V17
SEC_MOSI
U16
SEC_SPI_CLK
U17
SEQ_IN
E16
STANDBY
E14
TX
D6
U18
PRI_MISO
PRI_MOSI
T15
PRI_SPI_CLK
T17
RESETB
C14
E13
RESETMCU_B
R
T
C
_
G
N
D
T
1
1
RX0
E6
RX1
C5
ON2B
C17
ONB
B18
PGM0
R2
R3
PGM1
PGM4
T5
POWER_FAIL
E15
PRI_CE
T16
PRI_DIG_VCC
R15
B14
LI_CELL
R12
LVS
LVS2
K14
MAIN_DIG_GND
N16
N15
MAIN_DIG_VCC
MCLK
F5
MOD
F14
D16
MUX_CTRL
C15
LCELL_BYP_1
LCELL_BYP_2
D14
LED1_DRV
L16
LED2_DRV
L17
LED3_DRV
L15
M16
LEDB
LEDG
M17
M18
LEDR
CS_OUT
D15
D17
DIN_UTXDI
F13
EOLI
FSYNC0
G5
B5
FSYNC1
M13
INT_PRI
V18
INT_SEC
KHZ32
P11
INTERFACE
B17
BG_BYP
B6
BITCLK0
BITCLK1
C6
CD_CAP
C3
CLK16_8
M2
SW2
FILT_BPLUS
*U701-1*
R729
90.9K
V2_775_FLTR
C738
75pF
R745
10K
R741
1K
0 R734
20K
R764
1.0uF
C764
R796 0
Y1
CC5V
4809995L13
32.768KHz
2 1
0613952R01
R725
10K
100K
SW2
2
RESET
3
V
C
C
V2
R8121 MAX803
U3005
1
G
N
D
C60061
0.1uF
0 R762
V16
AD_TRIG
P12
TSX1
V13
TSX2
U13
TSY1
T13
TSY2
TS_BYP
R13
P13
AD4
U14
AD5
N13
AD6
V15
AD7
R14
AD8
P14
AD9
*U701-4*
A_D_CONVERTER
*R707*
100K
392K
R728
10K R739
SW2
0.1uF C723
18pF
C784
SW2_ISENSE_N
BATTERY_TEMP
RMT_CONTROL
VICR
USB_ID_AD7
USB_ID
RR_USB_ID
USB_ID_AD5
RX1
RX1
CI_BLUE
CI_BLUE
LV_DETECT
LI_CELL
LI_CELL
USEROFF
USEROFF
VPP_OUT
VPP_OUT
RR_TX TX
TX
RX0
RX0
RMT_CONTROL_ON2B
16.8MHZ
16.8MHZ
PGM_0
SW2_ISENSE_P
SEC_SPI_CLK
SEC_SPI_CLK
PRI_CE
PRI_CE
PRIMARY_INT
PRIMARY_INT
SEC_CE
SEC_CE
SEC_SPI_MISO
SEC_SPI_MISO
SECONDARY_INT
SECONDARY_INT
ON
ON
MOD_OUT
MOD_OUT
BG_BYP_pin_B17_RR
PA_TEMP
BG_BYP
PA_ID
AUDIO_JACK_PTT_DET
AUDIO_JACK_PTT_DET_SCALED
RR_RESETB
LVS
LVS
POWER_FAIL
POWER_FAIL
RESETMCU_B
RESETMCU_B
FSYNC1
FSYNC1
BITCLK1
BITCLK1
FSYNC0
FSYNC0
BITCLK0
BITCLK0 ADTRIG
SEC_SPI_MOSI
SEC_SPI_MOSI
PRI_SPI_CLK
PRI_SPI_CLK
PRI_SPI_MOSI
PRI_SPI_MOSI
PRI_SPI_MISO
PRI_SPI_MISO
USB_VM
RR_LCELL_BYP
Shielded Shielded
CS_OUT
CS_OUT
SOL_LED2_PWM
SOL_LED2_PWM
DISP_LED_PWM
DISP_LED_PWM
EOL_INTERRUPT
EOL_INTERRUPT
CI_RED
CI_RED
CI_GREEN
CI_GREEN
CD_CAP_U701
MUX_OUT
MUX_OUT
32KHZ
32KHZ
STANDBY
STANDBY
WDI
WDI
USB_D-
USB_D-
USB_D+
USB_D+
USB_VP
USB_VP
USB_SE0IN
USB_SE0IN
USB_DIN
USB_DIN
USB_TXENB
USB_TXENB
USB_XRXD
USB_XRXD
USB_VM
6880401P39-O 129


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.11 ROADRUNNER - AUDIO BLOCK

























































DNP
Keypad PCB on Dig Sheet 2
Microphone connects to the
DNP COMPONENTS IN BOX FOR STEREO
DNP COMPONENTS IN BOX FOR MONO
MOTOROLA INTERNAL USE ONLY
PLACE COMPONENTS IN BOX FOR STEREO
DNP COMPONENTS IN BOX FOR MONO PLACE COMPONENTS IN BOX FOR MONO
AUDIO JACK
4 1 3 A
DNP COMPONENTS IN BOX FOR STEREO
PLACE COMPONENTS IN BOX FOR MONO
If This version does not work, place back L756, C791, C792
PLACE COMPONENTS IN BOX FOR STEREO
R760
5.6K
100nH L752
2414017P25
E745
SPARK_GAP
1 2
L753
7685268E01
1 2
E742
SPARK_GAP
1 2
33pF
C794
E753
SPARK_GAP
100nH
L751
VAG
B3
5
6
p
F
C
7
7
1
SPKRM
F2
SPKRP
F3
S
P
K
R
_
G
N
D
1
_
1
G
4
S
P
K
R
_
G
N
D
1
_
2
H
4
S
P
K
R
_
G
N
D
2
E
2
C4
STDACBG
E10
STDACREF
STDACVDG
B4
MIC_INM
J2
PGA_INL
K5
PGA_INR
K4
P
H
A
N
T
O
M
1
E
4
P
H
A
N
T
O
M
2
E
3
PLL_GND
D11
D10
PLL_LPF
PTT_DET
G3
A
L
R
T
_
G
N
D
H
6
ARIGHT_OUT
D2
AUDIO_VCC
F4
AUX_MICM
K3
EXTOUT
H5
EXT_MIC
J5
MIC_BIAS1
J4
MIC_BIAS2
J3
A1_INT
D4
ALEFT_OUT
D3
H2
ALERT_VCC
ALRTM
H3
ALRTP
G2
E752
*U701-2*
AUDIO
7685268E01
V2
C754
56pF
0.1uF C702
D753
C769
56pF
1
TP_MIC
33pF
C753
S
P
K
R
_
R
_
M
1
56pF
C751
C703 0.1uF
E754
1 2
100nH
SPARK_GAP
7685268E01
E782
L1501
33pF
7685268E01
E709
2
NC1
3
NC2
6
NC3
7
NC4
C758
1
FLTR1
4
FLTR2
5
FLTR3
8
FLTR4
G
1
G
N
D
1
G
N
D
2
G
2
G
3
G
N
D
3
E743
SPARK_GAP
1 2
NUF2450MU
FL751
5
6
p
F
C
7
6
5
1 2 C766
10uF
E757
SPARK_GAP
5.6V VR750
4.7uF
C710
0.47uF C780
.01uF
C720
43K R706
L750
100nH
1500pF
C721
E756
SPARK_GAP
1 2
D752
NC
NC
NC
T1 1
T2 2
T3 3
T4 4
T5 5
T6 6
1 2
NC
J752
C778
SPARK_GAP
E758
7685268E01
E781
0.1uF
7685268E01
R755
C701
1 2
4.7uF
33pF
C752
SPARK_GAP
E750
S
P
K
R
_
R
_
P
1
C759
E755
7685268E01
33pF
SPARK_GAP
E741
1 2
2.7K
VR703
R754
R792
R791
30
1 2
30
5
6
p
F
SPARK_GAP
E740
C
7
6
3
5
6
p
F
C
7
7
0
7685268E01
E751
C781 0.47uF
R753
10uF
0
1 2
C760
SPARK_GAP
E744
AUX_MIC
AUX_MIC
ALEFT_OUT_RR ALEFT_OUT_RR
ARIGHT_OUT_RR ARIGHT_OUT_RR
AUDIO_JACK_PTT_DET
AUDIO_JACK_PTT_DET
AUDIO_JACK_INT
RAW_PTT_DET
A1_INT A1_INT
ALERT_M
AUDIO_JACK_AUX_MIC
AUDIO_JACK_LEFT AUDIO_JACK_LEFT AUDIO_JACK_LEFT
AUDIO_JACK_RIGHT
PHANTOM_GND
SW3_CAPS
AUX_MIC
AUDIO_RIGHT_FILT
SPKR_R_MINUS
SPKR_R_MINUS
SPKR_R_PLUS
SPKR_R_PLUS
SPEAKER_M
FILT_BATTI
AUDIO_VCC
AUDIO_LEFT_FILT
ALERT_P
PHANTOM_VAG_PIN PHANTOM_VAG_PIN
SW3_FLT
MICROPHONE
PHANTOM_VAG_PIN
AUDIO_IN
AUDIO_IN
MIC_BIAS_1
MIC_BIAS_1
MIC_INM
MIC_BIAS2
AUX_MICM
EARPHONE_MINUS
EARPHONE_MINUS
SPEAKER_P
VAG_OUT_B3
VAG_OUT_B3
VAG_OUT_B3
EARPHONE_PLUS
EARPHONE_PLUS
STDACREF
STDACBG
STDACVDC
Shielded
PLL_LPF_RC
Shielded
RR_PLL_LPF
AUDIO_OUT
AUDIO_OUT
130 6880401P39-O


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.12 TRANSCEIVER
























































4
7
K
4
7
K
4
.7
K
10
K
MFG CTR
QA CHK:
Enginee
Drawn b
R&D CHK
DOC CTR
Changed
G
P
S
_
R
F
A
_
V
C
C
G
P
S
_
C
P
_
V
C
C
Place by Pin 1
Replace C616 to 2175181C01
900MHz RF2,RF1,100-010,GPO4
R
X
_
A
V
C
C
GPS RX(1400s)
M
IX
E
R
_
V
C
C
5175772B65
1.875 to 2.775V level shifter
Inductor
10-dB PAD
Resistive Dividers placed on RR sheet
VCON control
G
P
S
_
V
C
O
_
V
C
C
RX COMPONENTS (200s)
Place by PA
Place by Pin 5&7
Blackstone
5185633C78
P
R
2
_
V
C
C
Faisal A
for
Place by Pin Battery Contact
800MHz RF1,RF3,010-001,GPO5
V1=1, V2/V3=0 -> RFC-RF2
TCXO
V2=1, V1/V3=0 -> RFC-RF1
(500s)
V
C
O
_
B
U
F
_
V
C
C
of U501
Replace
Place by Pin 5&7
iD
E
N
5
0
o
h
m
R
F
J
a
c
k
GPS test pad
P
l
a
c
e
b
y
V
2
r
e
g
u
l
a
t
o
r
.
floor contact
DIGITAL
RX, TX and GPS lines are matched length Diff_Pairs
Place as close as possible to RR pin PAGAIN_DAC
Thermistor
TX COMPONENTS (500s)
BLUETOOTH
SF_REF_BYP requirement: 8uF to 12uF>22uF
E
S
C
_
C
P
_
V
C
C
R
X
_
C
H
P
_
V
C
C
Ground away from VCO
Place by RR
G
P
S
_
M
IX
_
V
C
C
PA
E
S
C
_
V
C
C
Need X7R Part
TP Poh
Place R599 for no VCON control, DNP U502, R598
2nd battery
Place U502, R598 for VCON control, DNP R599 Place C527/8 close to pin 15
DNP
ROADRUNNER
Printed
TP Poh
FGU COMPONENTS (300s)
G
P
S
_
A
V
C
C
SHIELDS
Place jumper by RR pin
Anthony
Anthon
Anthon
SF_OUT Requirement 3.8uF to 12uF
R
X
_
Q
G
E
N
_
V
C
C
DNP
Mauricio
SLEDGEHAMMER
M
A
IN
_
C
P
_
V
C
C
TP Poh
TP Poh
DNP
ANTENNA MATCH
C
L
E
A
N
_
V
C
C
T
X
_
Q
G
E
N
_
V
C
C
Battery Floor ground contact
T
.C
. =
2
5
0
P
P
M
/C
ISM RF3,RF2,001-100,GPO3
VCO
T
X
_
D
M
IX
_
V
C
C
Place by Pin 1
Replace
M
A
IN
_
V
C
C
V3=1, V1/V2=0 -> RFC-RF3
4 1 3 A
0
R605
C201
56pF
12pF
0
.10
u
F
C
2
2
2
2
113
9
4
6
K
0
2
C689
56pF
C204
56pF
C520
G
P
S
S
IG
N
B
IT
1
56pF
DNP
R600
0613952Q43
56
C290
L303
56.05nH
0
R1414
C60060
2113944A11
2.7pF
G
P
S
IF
O
U
T
X
1
22nH
C310
L1499
7
IN_800
5
IN_900
1
OUT_800
3
OUT_900
0.1uF
FL201
G5ED-938M00
G
N
D
1
2
G
N
D
2
4
G
N
D
3
6
G
N
D
4
8
1
V
2
_
T
X
V
_
1_
8
7
5
_
D
T
P
_
A
N
A
_
C
L
K
NC
27nH
L202
2488090Y18
C1425
2.0pF
M500
3987977Y02
0.10uF
2113946K02
C300
2113944E15
18pF C313
56pF
C508
2113944A34
1
C530
T
P
_
R
X
I
7
5
8.2pF
R
5
18
0
6
13
9
5
2
K
8
5
0685660C01
R503
47K
TP_AGC_DAC
1
.0
1u
F
2
113
9
4
5
B
0
2
C
3
11
C291
56pF
DNP
T
P
_
D
M
C
S
1
0
E600
2113944E15
18pF
TEST1_SL
1
C312
0
56pF
R204
0613952R66
C
O
N
T
A
C
T
M
14
0
1
P
IN
1
1
P
IN
2
2
C617
C1499
18pF 2113946D02
R506
10
1
V
2
_
G
P
S
1.0uF
C215
*SH600*
SHIELD
1
2113946C02
C214
0.22uF
6
8
0
0
p
F
TP_LNA_EN
1
V
_
1_
8
7
5
_
D
C
5
2
1
2
113
9
4
5
B
0
1
150nH
SH1000
SHIELD
2415429H39
L201
L605
0
.01uF C206
1 2
C1423
18pF
SH800
SHIELD
2113945A12
C212
3300pF
C517
68pF
2113944A36
2488090Y10
L301
5.6nH
10nH
L1410
0
C502
0613952R66
delete,.
3.3nH
V
2
_
G
P
S
C308
R1440
1 2
SH301
SHIELD
1
0.1uF
SH700
SHIELD
C
5
2
4
2
2
0
0
p
F
2
113
9
4
5
A
11
V
2
_
R
X
C288
1
18pF
NC
T
P
_
T
X
I
1
C213
2113945A12
3300pF
T
P
_
S
T
D
2
113
9
4
4
A
2
6
C
2
0
0
5
12
p
F
V2_RX
NC
G
P
S
IF
O
U
T
1
T
P
_
G
P
S
_
C
L
K
1
7685268E01
FHB1M1005JT
E602
NC
R598
10K
2113946K02
C219
82
R602
0613952Q47
0.10uF
18
n
H
SF
E519
L
5
0
3
1.2pF
L1412
2115153H05
TP_RF_ATTN
1
C251
56pF
V
2
_
T
X
.01uF
NC
2113945B02
C202
C500
2488158Y10
C1450
5.6nH
.0
3
3
u
F
33pF
C
5
2
5
2
113
9
4
5
B
0
5
T
P
_
T
X
C
L
K
1
C1498
18pF
2488090Y10
V2_GPS
L304
5.6nH
0
.10
u
F
2
113
9
4
6
K
0
2
C
2
2
1
10uF
2113956B54
C526
15pF
C1453
C309
0.1uF
0613952Q52
130
R601
.047uF
2113946B02
DNP
C305
2
113
9
4
4
A
3
4
10uF
2113956B54
C60053
NC
56pF
C301
L1420
100nH
56pF
C519
2
18
7
8
9
3
N
0
1
1.0
u
F
C
6
2
3
V_1_875_D
C60059
56pF
SHORT
R6000
2 1
C511
56pF
2113944A34
6
BIAS
2
D
E
G
3
G
N
D
7
PON
4
V
C
C
5
3987977Y02
M501
*U1420*
replace,51007599001
AI
1
AO
12
G
N
D
8
6
1
RF_OUT
SEL1
8
SEL2
7
V
C
C
5
9
V_TUNE 5164015H68
*U300*
G
N
D
1
2
G
N
D
2
3
G
N
D
3
4
G
N
D
5
10
G
N
D
6
11
G
N
D
7
0
1804MHz
UCVA5XV02
56pF
R610
F12
PKG_GND7
G6
PKG_GND8
G7
PKG_GND9
C203
K
3
P
K
G
_
G
N
D
4
7
P
K
G
_
G
N
D
4
8
M
3
N
3
P
K
G
_
G
N
D
4
9
F10
PKG_GND5
P
14
P
K
G
_
G
N
D
5
0
R
13
P
K
G
_
G
N
D
5
1
R
14
P
K
G
_
G
N
D
5
2
F11
PKG_GND6
PKG_GND4
C
6
P
K
G
_
G
N
D
4
0
C
8
P
K
G
_
G
N
D
4
1
C
9
P
K
G
_
G
N
D
4
2
D
4
P
K
G
_
G
N
D
4
3
D
15
P
K
G
_
G
N
D
4
4
E
15
P
K
G
_
G
N
D
4
5
J
3
P
K
G
_
G
N
D
4
6
P
K
G
_
G
N
D
3
2
L
12
P
K
G
_
G
N
D
3
3
M
6
P
K
G
_
G
N
D
3
4
M
8
P
K
G
_
G
N
D
3
5
M
9
P
K
G
_
G
N
D
3
6
M
10
P
K
G
_
G
N
D
3
7
M
11
P
K
G
_
G
N
D
3
8
M
12
P
K
G
_
G
N
D
3
9
F9
K
11
P
K
G
_
G
N
D
2
5
K
12
P
K
G
_
G
N
D
2
6
L
6
P
K
G
_
G
N
D
2
7
L
7
P
K
G
_
G
N
D
2
8
L
8
P
K
G
_
G
N
D
2
9
F8
PKG_GND3
L
9
P
K
G
_
G
N
D
3
0
L
10
P
K
G
_
G
N
D
3
1
L
11
H
12
P
K
G
_
G
N
D
18
J
6
P
K
G
_
G
N
D
19
F7
PKG_GND2
J
7
P
K
G
_
G
N
D
2
0
J
11
P
K
G
_
G
N
D
2
1
J
12
P
K
G
_
G
N
D
2
2
K
6
P
K
G
_
G
N
D
2
3
K
7
P
K
G
_
G
N
D
2
4
G8
PKG_GND10
G9
PKG_GND11
G10
PKG_GND12
G
11
P
K
G
_
G
N
D
13
G
12
P
K
G
_
G
N
D
14
H
6
P
K
G
_
G
N
D
15
H
7
P
K
G
_
G
N
D
16
H
11
P
K
G
_
G
N
D
17
B1
NC3
A16
NC4
A17
NC5
B17
NC6
T1
NC7
U1
NC8
U2
NC9
F6
PKG_GND1
PKG_GND
U2051-2
A1
NC1
T17
NC10
NC11
U16
U17
NC12
A2
NC2
C
5
2
7
0
.10
u
F
OUT_Y
5
V
C
C
V
_
1_
8
7
5
_
D
2
113
9
4
6
K
0
2
U502
NL17SZ07
3
G
N
D
2
IN_A
1
NC1
4
C250
56pF
22uF
2175034B01
V
2
_
G
P
S
V
_
1_
8
7
5
_
D
*C616*
100K
R505
1
C209
56pF
*SH300*
SHIELD
L204
82nH
PLACE 82nH for ESD
2414017P24
56.05nH
L500
1
680
R201
B
B
P
_
R
X
C
L
K
1
T
P
_
T
X
Q
X
V
2
_
T
X
.0
2
2
u
F
C
5
2
3
2
113
9
4
5
B
0
4
2113945B02
C216
1.0uF
2113946D02
C514
.01uF
*SH500*
SHIELD
1
2
113
9
4
5
A
13
C
2
10
4
7
0
0
p
F
TEST2_SL
1
C
6
2
1
470pF
2
113
9
4
4
E
15
18
p
F
C1422
11
R
F
_
V
C
C
RSET
10
NC
R608
0
G
N
D
12
G
N
D
1
G
1
LNA_E
2
6
LNA_I
LNA_IN
1
LNA_OUT
7
L
N
A
_
V
C
C
8
RF_ATTN
4 U200
MAX2373
5115443H01
AGC
5
9
A
G
C
_
B
Y
P
3
EN_RX
SF
V4_TCXO
SF
2113945A05
C513
470pF
12pF
2113944A26
C304
2585130E03
CT 2
GND 5
NC 6
PORT1 1
PORT2 3
PORT3
4
2
G
N
D
1
4
G
N
D
2
1
IN
3
OUT
T500
SLT-087G
C217
DF75MF0
FL1420
V_1_875_D
2113946K02
0.10uF
C289
18pF
0613952Q74
R200
1.1K
T
P
_
R
X
Q
1
56pF
2113944A34
C60054
56pF
C205
56pF
56pF
C252
R
X
E
N
_
S
T
R
O
B
1
C60057
C200
18pF
2175035B01
C629
10uF
L200
6.8nH
2471237B04
C302
12pF
2113944A26
C614
2113944A42
V2_TX
R609
0
150pF
0
.10
u
F
C
6
2
5
2
113
9
4
6
K
0
2
TXCLK
M5
TXI
V3
TXIX
V4
U4
TXQ
TXQX
U3
T
X
_
D
A
C
_
G
N
D
T
4
T
X
_
D
A
C
_
V
C
C
V
5
V_TERM
R8
SDTX
M3
U9
SELECT1
SELECT2
V9
N6
SFTX
SF_OUT
T2
SF_REF_BYP
U2
SF_VIN
V2
SIGN
N2
R
X
_
S
D
M
_
V
S
S
A
R
10
R
X
_
S
D
M
_
V
S
S
A
1
R
7
SCLK_OUT
L3
V8
SDM_BIAS
SDM_VAG
U10
SDM_VDAC
V10
SDM_VDAC0
T10
SDR
L2
RXI_AD_IN
V7
RXQX_AD_IN
U7
RXQ_AD_IN
U6
R
6
R
X
T
X
_
A
G
N
D
R
X
T
X
_
A
V
C
C
U
5
RX_EN_STROBE
T7
R
X
_
S
D
M
_
V
D
D
A
P
10
R
X
_
S
D
M
_
V
D
D
A
1
T
6
PAGAIN_DAC
T3
PHCLK
U8
RFSTEPA
T9
K
6
R
F
_
S
S
I_
G
N
D
R
F
_
S
S
I_
V
C
C
M
6
RXACQ
L5
RXFS
L4
RXIX_AD_IN
V6
D13
GPO3
C13
GPO4
B13
GPO5
P4
GPS_49_IN
GPS_IFIN
P3
GPS_IFINX
P2
INCR_DECR
T8
MAG
N3
N4
ACQ_CLK
AGC_DAC
R9
CLK33_6
L6
CLK_OUTGPS
N5
DMCS
M4
GPO0
D12
GPO1
B12
GPO2
C12
*U701-3*
TRANSCEIVER
C626
DNP
12pF
1
UNBAL_PORT
NC
5
6
p
F
2
113
9
4
4
A
3
4
C
2
2
3
LBD211G6020
T1400
3
BAL_PORT1
4
BAL_PORT2
2
G
N
D
1
5
G
N
D
2
NC
6
V2_TX
NC
C
5
2
2
C218
12pF
2
113
9
4
5
B
0
4
.0
2
2
u
F
C
5
2
9
5
6
p
F
56pF
C60055
2113946B04
0.1uF
C303
1.5
p
F
V2_SF
D
N
P
2
113
7
4
3
N
0
7
C
5
16
2175035B01
C615
10uF
5185633C78
33.6MHz
MTE3073C
Y600 1
G
N
D
1
G
N
D
2
2
OUT
3
V
C
C
4
2414017P08
L1405
3.9nH
2113944A13
3.3pF
2414017G18
C207
PIN1
2
PIN2
L502
82nH
CONTACT
M1400
1
7
V
V
E
N
R202
2.7K
RFANT
12
4
RFIN
10
RX
1
V
B
A
T
1
5
V
B
A
T
2
15
V
B
A
T
3
2
V
C
O
N
16
V
R
E
G
A
S
W
14
CPL_RFOUT
9
C
T
G
N
D
17 3
G
N
D
1
6
G
N
D
2
8
G
N
D
3
11
G
N
D
4
G
N
D
5
13
U501
5185633C54
L1498
4.7nH
SHORT
R507
2 1
56pF
C60056
R501
0613952L01
100
R599
10K
V2_SF
G
N
D
1
2
G
N
D
2
4
G
N
D
3
6
G
N
D
4
8
GPS_IN
5
GPS_OUT
3
ISM_IN ISM_OUT
1
C507
2113944A34
FL200
G6ED-1G5754
56pF
C590
12pF
R
5
0
0
0
6
13
9
5
2
K
8
5
7
5
1
L300
56.05nH
T
P
R
X
Q
X
V2_GPS
0.10uF
2113946K02
C620
C628
2113944A34
C630
56pF
V
2
2187893N01
1.0uF
1000pF
C510
0
R606
0613952R66
1.82K
L501
0.10uF
0613952Q36
2113946K02
C627
7
V3
30
R603
C
G
N
D
9 2
N
C
4
RF1
5
RF2
8
RF3
1
RFC
3
V1
6
V2
U3003
SKY13251
1pF
C501
2113944A63
DNP
0985502E02
J500
2 A
1 C
3 G1
4 G2
3
BAL_PORT1
4
BAL_PORT2
2
G
N
D
1
G
N
D
2
5
6
NC
1
UNBAL_PORT
1
2585130E05
LDB18896M05G
T200
5
6
p
F
TP_ASW
C
2
11
2
113
9
4
4
A
3
4
SW3
4813973A82
Q500
18
p
F
C
14
5
1
V2_TX
L302
56.05nH
NC
0
.10
u
F
2
113
9
4
6
K
0
2
C
5
2
8
2113945A09
1000pF
C307
C531 56pF
0
.10
u
F
2
113
9
4
6
K
0
2
C
6
2
2
1%
C690
12pF
NC
3K
0613952Z43
R604
P
2
V_TERM
B13
M513
TX_DM_RFIIN
TX_DM_RFINB
G16
T
X
_
Q
G
E
N
_
V
C
C
B
6
TX_RFOUT
B3
TX_RFOUTB
B4
T
X
_
R
F
_
G
N
D
C
4
T
X
_
V
C
O
_
G
N
D
C
7
T
X
_
V
C
O
_
V
C
C
B
7
V
C
O
_
B
U
F
_
V
C
C
TEST1
M16
TEST2
L16
C14
TXI
TXIX
D14
TXQ
B15
TXQX
B14
T
X
_
D
M
IX
_
V
C
C
D
16
F16
J2
RX_MIX_INX
K2
R
X
_
Q
G
E
N
_
V
C
C
G
3
SCAN_MODE
L15
R4
SLT
SPI_CLK
T6
SPI_DR
T5
SPI_DW
R6
S
P
I_
V
C
C
T
8
E3
RXQX_WBP
B2
RXQ_NBP
E2
RXQ_WBP
C2
R
X
_
A
V
C
C
G
15
R
X
_
C
H
P
_
V
C
C
L
2
RX_EN_OUT
L3
RX_EN_STROBE
K15
RX_MIX_IN
H16
RXIX
H15
RXIX_NBP
F3
RXIX_WBP
D2
F2
RXI_NBP
RXI_WBP
D3
RXQ
J16
RXQX
J15
RXQX_NBP
H
2
MN_ADAPT_CP
T3
MN_CP
T2
PHCLK
T7
P
R
1_
V
C
C
G
2
P
R
2
_
V
C
C
E
16
REFCLK_IN
T9
RSTB
R9
RXI
B12
L
V
C
C
R
8
M
A
IN
_
C
P
_
G
N
D
1
P
3
M
A
IN
_
C
P
_
G
N
D
2
P
4
M
A
IN
_
C
P
_
V
C
C
T
4
M
A
IN
_
V
C
C
R
2
MAIN_VCO_IN
N2
MAIN_VCO_INX
M2
M
IX
E
R
_
V
C
C
T
12
G
P
S
_
V
C
O
_
V
C
C
T
13
INCR_DECR
R7
LCAP
F15
L
G
N
D
M
7
LP1I
C12
LP1IB
B11
LP1Q
C13
LP1QB
T
11
GPS_IFOUT
P16
GPS_IFOUTX
N16
GPS_LNA_EN
K16
G
P
S
_
M
IX
_
V
C
C
R
12
G
P
S
_
R
F
A
_
V
C
C
R
16
GPS_RFIN
T14
T15
GPS_RFINB
G
P
S
_
S
Y
N
T
H
_
V
C
C
C
10
E
S
C
_
C
P
_
V
C
C
B
10
E
S
C
_
V
C
C
B
9
GPS_AGC
M15
G
P
S
_
A
V
C
C
T
16
GPS_CLK
P15
G
P
S
_
C
P
_
G
N
D
1
R
10
G
P
S
_
C
P
_
G
N
D
2
R
11
G
P
S
_
C
P
_
V
C
C
B16
CAPOC
C16
CEX
R5
CIAP_BIAS
H3
C
L
E
A
N
_
V
C
C
N
15
C
L
K
_
V
C
C
T
10
CP_BIAS
B8
E
S
C
_
C
P
_
G
N
D
1
C
11
E
S
C
_
C
P
_
G
N
D
2
SLEDGEHAMMER
U2051-1
ASW
C5
CAPM
B5
CAPO
R203
100K
G
P
S
M
A
G
B
IT
1
V
2
_
G
P
S
0613952R25
T
P
_
A
C
Q
_
C
L
K
1
RR_BATTI
T
P
_
T
X
Q
1
NC
V2_RX
C1441
18pF
1
RFC
3
V1
6
V2
7
V3
V
2
_
R
X
U3004
SKY13251
C
G
N
D
9 2
N
C
4
RF1
5
RF2
8
RF3
2
113
9
4
4
A
3
4
C
6
2
4
T
P
_
R
X
IX
1
5
6
p
F
.01uF
C1452
56pF
V
2
_
R
X
C515
2113944A34
1
C60058
56pF
1
2
T
P
_
T
X
IX
V
2
S
P
A
R
K
_
G
A
P
E
5
0
0
2113944A23
8.2pF
C509
2113945A09
C306
1000pF
56pF
C506
C
2
0
0
6
12
p
F
2113944A34
0.10uF
C512
2
113
9
4
4
A
2
6
SHIELDED
RF_50_OHM
RF_50_OHM
2113946K02
VCON
PA_TEMP
PA_ID
P
A
_
ID
SPI_DR
TXE
GPS_AGC
RF_50_ohm
RSTB
CE_SH
SPI_CLK
SPI_DW
ASW
TXFS
SDTX
BG_BYP
TCXO_33_6MHz
TCXO_33_6MHz
GPS_MAGBIT
GPS_SIGNBIT
DMCS
TXCLK
SCLK_OUT
RXFS
SDR
GPS_CLK
GPS_ACQ_CLK
RXACQ
XCVR_V2
RF_50_OHM
XCVR_DIG_1_875_pwm
RF_50_OHM
XCVR_DIG_1_875_lin
TCXO_V4
6880401P39-O 131


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.13 BATTERY BLOCK

























































SHIELD CONNECTIONS SPARK GAPS FOR AUDIO JACK
Breakaways Tabs- Do Not Delete
BATTERY CONTACTS
Batt_B+
proportional to temp
analog voltage
AND FOR ANTENNA
MOTOROLA INTERNAL USE ONLY
BRKAWY 1
VR107
BRK
BRK1
5.6K
R101
16.2V
BRK4
BRK
1 BRKAWY
BRK3
BRKAWY 1
V4
BRK
C102
75pF
0
R104
FBM3216HS800
E101
NC NC NC
RAW_B_PLUS
VR109
5.73V
C103
75pF
VR106
5.73V
BRK2
BRK
1 BRKAWY
C104
2113944A23
C105
2113944A23
8.2pF
PIN1
1
PIN2
2
PIN3
3
PIN4
4
8.2pF
C101
M104
CONTACT
75pF
RAW_B_PLUS
NC
0
R103
BATT_ID_FLTR
BATT_ID_FLTR
BATT_THERMISTOR_FLTR
BATT_THERMISTOR
BATTERY
BATTERY
BATTERY_ID
BATTERY_ID
RAW_B_PLUS
132 6880401P39-O


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.14 BLUETOOTH BLOCK

























































1.875 V
MOTOROLA INTERNAL USE ONLY
DNP
DNP
1.875 V
OSC enable from host
Internal Regulator Option
Place when BT DNP
2.8 V
DNP when BT placed
DNP
DNP
1.875 V
Place components within box
DNP components from External Regulator box
External Regulator Option
Place components within box
DNP components from Internal Regulator box
R1005
BT_SPIMISO
1
0
*C1008*
NC
2113944A09
2.2pF
15pF
C1011
2113944A27
BT_SPI_CSB
1
R1099
0
G
N
D
2
IN0
3
IN1
1
IN2
6
V
C
C
5
Y
4
U1001
SN74LVC1G98
DNP
2113946B04
C1004
0.1uF
CONTACT
M1011
PIN1
1
PIN2
2
BT_SPIMOSI
1
1.0uF
C1031
2113946D02
N
C
VMMC
BT_SPI_CLK
1
NC
NC
2113946D02
C1003
1.0uF
SW2
0
0
R1012
DNP
R1024
L1002
82nH
2113743N03
C1010
DNP
delete,.
1pF
R1023
C1021
68pF
47K
R1010
0
SW2
2.2nH
R1011
2.2uF
C1026
2113956B33
2
R1030
0613952Q08
TEST_POINT
BT_BECLK
1
R1009
0
R1001
0
0
L1003
0613952R66
BT_BYPRX
1
V
S
S
_
D
I
G
A
6
V
S
S
_
P
A
D
S
E
2
V
S
S
_
P
I
O
D
2
V
S
S
_
R
A
D
I
O
B
2
V
S
S
_
V
C
O
A1
XTAL_IN
A3
XTAL_OUT
NC
NC
E
7
V
D
D
_
P
A
D
S
F
1
V
D
D
_
P
I
O
C
1
V
D
D
_
R
A
D
I
O
B
4
V
D
D
_
U
S
B
B
1
V
D
D
_
V
C
O
A2
VREG_IN
B
3
V
S
S
_
A
N
A
C
7
D1
TX_A
E1
TX_B
C4
UART_CTS
A7
UART_RTS
B5
UART_RX
D4
UART_TX
A
4
V
D
D
_
A
N
A
C
6
V
D
D
_
C
O
R
E
D7
PIO6
D6
PIO7
E6
RESETB
F5
SPI_CLK
F6
SPI_CSB
SPI_MISO
F7
F4
SPI_MOSI
F3
TEST_EN
D5
PCM_OUT
C5
PCM_SYNC
D3
PIO0
C3
PIO1
E3
PIO2
F2
PIO3
E5
PIO4
E4
PIO5
U1000
C2
AIO0
A5
AIO2
B6
PCM_CLK
B7
PCM_IN
2113944A27
C1006
5103535B46
BC313143A18
15pF
R1020
0
5
BAL1
BAL2
7 2
DC
G
N
D
1
4
G
N
D
2
6 8
G
N
D
3
3
N
C
1
UNBAL
9175824C01
DEA202450BT-7099A1
FL1000
0613952R66
L1001
0
2.2pF
*C1007*
NC
NC
0
R1022
.01uF
C1001
V2_775_FLTR
2488090Y05
L1005
2.2nH
delete,.
2.0pF
C1023
2.0pF
C1024
1nH
L1004 delete,.
C1032
.01uF
.01uF
C1025
2113945B02
.01uF
C60052
2113945B02
22nH
SW2
TCXO_33_6MHz
BT_ANT_MATCH
RF_50_OHM
BT_DC_FEED
BT_RF_OUT2
RF_50_OHM
BT_RF_OUT1
RF_50_OHM
L1000
BT_CLK_AND_BUFFER_EN
RF_50_OHM BT_RF_PLUS
RF_50_OHM
BT_RF_MINUS
STANDBY
BT_OSC_EN
BT_DC_SUPPLY_OUTPUT
BT_DC_REGULATOR_2775V_IN
BT_DC_SUPPLY_INPUT
BT_VDD_PIO_PADS
BT_XTAL_IN_A1
BT_ANTENNA
BT_UART_CTS
PSKEY_UART_HOST_WAKE
N
C
_
B
T
_
S
A
W
_
P
I
N
1
BT_UART_TX
BT_PI00_PIN
BT_UART_RTS
B
T
_
V
D
D
_
C
O
R
E
RR_PCM_SYNC
BT_VDD_VCO_RADIO_ANA
RR_RX
RR_TX
RR_PCM_CLK
BT_UART_RX
BT_PIO7_PIN
RESET_BT_pin_E6_U1000
RESET_BT
BT_AIO2_PIN
BT_SPI_MISO_PIN
6880401P39-O 133


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.15 USB BLOCK

























































MOTOROLA INTERNAL USE ONLY
uUSB Connector
E944
SPARK_GAP
1
2
22 R901
R902
22
16.2V
VR801
SPARK_GAP
E941
1
2
7685268E01
FHB1M1005JT
E973
E972
FHB1M1005JT
7685268E01
C2022
56pF
12pF
C2021
56pF
C2023
7686949J14
BLM21PG221SN1
E971
D
8
7
6
2
C2024
12pF
E942
SPARK_GAP
1
SPARK_GAP
E943
1
2
D_POS
3
G
N
D
1
5
G
1
G
N
D
2
ID
4
VBUS
1
N
C
EMU_CONN_PIN1_EXTBPLUS
J7
D_NEG
2
EMU_CONN_D-
D+
D-
EMU_CONN_D+
EXTB+
USB_ID
USB_ID
EMU_CONN_PIN3_D+
EMU_CONN_PIN2_D-
134 6880401P39-O


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.16 QWERTY BOARD

























































PLACE THESE COMPS CLOSE TO MICROPHONE
NOT USED SW_VOL_DWN SW_VOL_UP
NOT USED
NOT USED
KEYPAD LEDS
PTT SWITCH
POWER/END SWITCH
25-PIN ZIF LCD CONNECTOR
BLACKSTONE QWERTY BOARD
28009255001
1
SHORTCUT BUTTONS LEDS
LCD_RD_STRAP
P/S (HIGH=SPI; LOW=PARALLEL)
80-PIN BTB
VIBRATOR MOTOR
IN TRIODE MODE
MICROPHONE
SPEAKER CONNECTOR
SD_D0_F
SD_D2_F
SD_CLK_F
LCD_RESETB
KEYPAD BOARD BREAKAWAYS
SD_D1_F
30-PIN CAMERA/EARPIECE CONNECTOR
0971726C05
CI_BLUE SHALL BE CONTROLLED
0988141Y01
GND
ANCHOR
GROUND CONTACTS NEAR EARPIECE
GROUND CONTACTS FOR DISPLAY FRAME
GROUND CONTACTS
KEYPAD BOARD TO MAINBOARD
0971928M01
SPKR_PLUS
SPKR_MINUS
GND
1
2
ANCHOR
NOT USED
NOT USED
2
LCD_RESETB
VOICEMAIL
SD_CMD_F
LCD_CS
NOT USED
BLUETOOTH MESSAGING
2.775V
SD_D3_F
PTT LEDS
LCD_CS
SD_CD_F
VOL UP/DWN SWITCHES
KEYPAD LEDS
4888112M36
1
220
D29
NC
NC
NC
NC
NC
NC
NC
IN
GND2
OUT
GND1
GND3
IN
GND2
OUT
GND1
GND3
IN
GND2
OUT
GND1
GND3
FLTR1
FLTR2
FLTR3
FLTR4
FLTR5
FLTR6
GND
FLTR1
FLTR2
FLTR3
FLTR4
FLTR5
FLTR6
FLTR7
FLTR8
FLTR7
FLTR8
FLTR1
FLTR2
FLTR3
FLTR4
FLTR5
FLTR6
GND
FLTR1
FLTR2
FLTR3
FLTR4
FLTR5
FLTR6
FLTR7
FLTR8
FLTR7
FLTR8
GND3
GND2
GND1
POWER
OUTPUT
GND4
POS NEG
GND3
GND1
GND2
NC
NC
NC
L53
L50
L52
L51
6
4
1
3
5 2
D3
6
4
1
3
5 2
D2
L49
1 M10
1 M9
1 M8
1 TP_CAM_MCLK
1 TP_CAM_RST
1 TP_CAM_SCK
1 TP_CAM_SDA 1 TP_CAM_STBY
L48
L47
L46
L45
L40 L39
L42 L41
L44 L43
2
1
VR13
2
1
VR11
2
1
VR12
2
1
VR10
2
1
VR9
2
1
VR8
2
1
VR7
2
1
VR6
2
1
VR5
2
1
VR4
1 TP_LCD_D0
1 TP_LCD_WR
1 TP_LCD_CS
1 TP_LCD_DC
1 TP_LCD_RST
R74
R73
R72 R71
1 M7
1 M6
R8
R12 R11
C10
E10
C9
E9
R14
C14
R13
C13
C23
2
1 E12
1 2
3
VR3
C22
2
1 E11
G2 J3
2 J3
6 J3
4 J3
10 J3
8 J3
12 J3
14 J3
16 J3
18 J3
20 J3
22 J3
26 J3
24 J3
28 J3
30 J3
G3 J3
5 J3
3 J3
1 J3
G1 J3
15 J3
11 J3
9 J3
7 J3
13 J3
25 J3
23 J3
17 J3
19 J3
21 J3
27 J3
29 J3
G4 J3
R68
R67
C30
C31
C32
R57
2
3
5
4
1 6
Q4
R56
2
3
5
4
1 6
Q3
C29
E30
R40 R41
2
1 D40
2
1 D41
R24
2
1
D24
C28 C27
D1
C26
L34
L33
L32
L31 2
1
D48
2
1
D47
R47 R48
R44
R45
2
1
D44
2
1
D45
2
1
E29
E8
2 1
5 4 3
M1
4
1
6 5 3 2
MK1
G
1
9
10
11
12
13
14
15
16
8
7
6
5
4
3
2
1
FL2
G
1
9
10
11
12
13
14
15
16
8
7
6
5
4
3
2
1
FL1
1 M5
1 M4
1 M3
1 M2
L25 L26
L22 L21
L23 L24
L30 L29
L27 L28
2
1 E28
2
1 E27
2
1 E22
2
1 E23
2
1 E24
2
1 E25
2
1 E26
2
1 E21
2
1 E20
2
1 E19
2
1 E18
2
1 E17
2
1 E16
2
1 E15
2
1 E14
2 1
5 4 3
SW_PTT
2 1
5 4 3
SW_VOL_UP
2 1
5 4 3
SW_VOL_DWN
C25
R9
C12 C11
G2 J2
G1 J2
2 J2
3 J2
4 J2
5 J2
6 J2
7 J2
8 J2
9 J2
10 J2
11 J2
12 J2
13 J2
14 J2
15 J2
16 J2
17 J2
18 J2
19 J2
20 J2
21 J2
22 J2
23 J2
24 J2
25 J2
1 J2
2
1
D26
2
1
D25
C24
C2 C6
C5
C1
R26
R38
2
3
5
4
1 6
Q2
2
1
D28
C7
E7
2
D31
2
1
D30
R31 R30
2
1
R29
R28
2 1
SW_PWR_END
2 1
SW_SYM
2 1
SW_N
2 1
SW_Z
2 1
SW_SPKR
2 1
SW_CENTER
2 1
SW_SPACE
2 1
SW_SEND
2 1
SW_SHIFT
2 1
SW_A
2 1
SW_M
2 1
SW_MSG
2 1
SW_PERIOD
2 1
SW_DEL
2 1
SW_P
2 1
SW_L
2 1
SW_U
2 1
SW_D
2 1
SW_CAM
2 1
SW_S
2 1
SW_B
2 1
SW_G
2 1
SW_I
2 1
SW_MENU
2 1
SW_X
2 1
SW_J
2 1
SW_TXT
2 1
SW_DOWN
2 1
SW_ILINK
2 1
SW_T
2 1
SW_ALT
2 1
SW_RSK
2 1
SW_UP
2 1
SW_ENTER
2 1
SW_O
2 1
SW_Y
2 1
SW_RIGHT
2 1
SW_K
2 1
SW_C
2 1
SW_E
2 1
SW_PLUS
2 1
SW_LEFT
2 1
SW_R
2 1
SW_Q
2 1
SW_F
2 1
SW_W
2 1
SW_LSK
2 1
SW_H
2 1
SW_V
L17
2
1
E13
1 J1
2
1
VR2
C20
R21
C21
2 J1
3 J1
4 J1
G1 J1
G2 J1
L20 C19
2
1
VR1 C4
C3
G2 P1
2 P1
4 P1
6 P1
E2
E3
8 P1
10 P1
12 P1
14 P1
16 P1
18 P1
20 P1
22 P1
24 P1
26 P1
28 P1
30 P1
32 P1
34 P1
36 P1
38 P1
40 P1
42 P1
44 P1
46 P1
E6
48 P1
50 P1
52 P1
54 P1
56 P1
58 P1
62 P1
60 P1
64 P1
66 P1
68 P1
70 P1
72 P1
74 P1
76 P1
80 P1
78 P1
G4 P1
G1 P1
1 P1
3 P1
5 P1
E1
E4
9 P1
7 P1
11 P1
13 P1
15 P1
17 P1
19 P1
21 P1
23 P1
25 P1
27 P1
29 P1
31 P1
35 P1
33 P1
39 P1
37 P1
41 P1
43 P1
45 P1
47 P1
49 P1
51 P1
53 P1
55 P1
57 P1
59 P1
61 P1
63 P1
65 P1
71 P1
69 P1
67 P1
73 P1
75 P1
77 P1
G3 P1
79 P1
SW2_FLTR
SW2_FLTR
SW3
V_VIB
V2_775_FLTR
SW3
V2_775_FLTR
V2
V_VIB
V2
SW2_FLTR
SW3
SW3 V2_775_FLTR
V2_775_FLTR
SW3
V2_775_FLTR SW2_FLTR
SW3
MIC_AUDIO_A_F1
100K
220
220
FDG6331L
DNP
DNP
GPIO_PB7
KEYPD_4DOME_5X2_9PAD
KEYPAD_ROW7
KEYPAD_COLUMN2
KEYPAD_COLUMN6
100NH
KP_LED_ZONE1_SUPPLY
4888112M36
SB_LED_SUPPLY
100NH
2.775V
SWITCH
PTT
KEYPAD_COLUMN2
KEYPAD_COLUMN3
CAM_DATA<7..0>
GPIO_PB5
GPIO_PB5
.1UF
CDZT2R5_6B
DISPLAY_ID
1.875V
15 14
LCD_LED1_SUPPLY_M1
DNP
LED1_PWM
V2_775_SUPPLY
LCD_WR_F
LCD_WR_F
LCD_DC_F
1.875V
0
.1UF
0
5.6V
LCD_SUPPLY_VCI
LCD_SUPPLY_VDDIO
SPARK_GAP
DNP
EARPHONE_MINUS
33PF
SPARK_GAP
CAM_PCLK_F
EARPHONE_PLUS
EARPHONE_MINUS
SPKR_R_MINUS
FDG6331L
4888112M36
4888112M36
220
220
DNP
33
33
0
.1UF
KEYPAD_ROW4
1UF
MIC_AUDIO_A_F2
CAM_MCLK_F
10PF
DNP
KEYPAD_ROW2
I2C_DAT_F
100NH
KEYPAD_COLUMN0
GPIO_PB6
CAM_MCLK_F
GPIO_PB6
9
10PF
4870370A83
CDZT2R5_6B
14
15
LED1_PWM
CAM_VSYNC_F
SW3_SUPPLY_UF
4809653F09
LCD_DATA<17..8>
5V
CDZT2R5_6B 5.6V
CI_GREEN
CAM_PCLK_F
GPIO_PB7
NZL5V6AXV3T1
LCD_LED1_SUPPLY_M2
.1UF
5
6
CAM_HSYNC_F
4
100NH
KEYPAD_ROW5
DNP
3
DNP
DNP
100NH
DNP
DNP
DNP
DNP DNP
DNP
DNP
KEYPAD_ROW1
DNP
DNP
DNP
DNP
KEYPAD_ROW4
100NH
DNP
KEYPAD_ROW6
3.0V
MICROPHONE
2K
15PF
5
1
DNP
1
16
DNP
KEYPAD_COLUMN3
NUF8001MU
SPARK_GAP
2.775V
4
17
DNP
DNP DNP DNP DNP
DNP
SPARK_GAP
DNP DNP
SPARK_GAP
DNP
DNP
DNP
SPARK_GAP
DNP
DNP
DNP
SPARK_GAP SPARK_GAP
DNP
DNP
KEYPAD_COLUMN1
KEYPAD_ROW2
SPARK_GAP
KEYPAD_COLUMN7
DNP
DNP
KEYPAD_ROW0
5.6V
0
.1UF
DNP
DNP
0
DNP
0
7
15PF
1UF
6
2.775V
DNP
KEYPAD_ROW4
9
15
SWITCH
3
KEYPAD_ROW3
ON_OFF_SWITCH
3.0V
BAS52
0
0
22NH
SPARK_GAP
33PF
13
14
12
8
5.6V
5.6V CDZT2R5_6B
0
430
DNP
SPARK_GAP
100NH
DNP DNP
100NH
KEYPAD_ROW3
SPARK_GAP
100NH
DNP
100NH
DNP
DNP
DNP
DNP
DNP
DNP
100NH
100NH
100NH
DNP
DNP
DNP
DNP
100NH
KEYPAD_COLUMN5
KEYPD_4DOME_5X2_9PAD
100NH
.1UF
100K
200
CDZT2R5_6B
430
8
5.6V .1UF
GPIO_PB8
KEYPAD_COLUMN0
KEYPAD_COLUMN1
7
0
.1UF
KEYPAD_ROW1
2
SPKR_R_MINUS
SPKR_R_PLUS
15PF
2.775V
33PF
DNP
DNP 33PF 33PF
SPKR_M_F
10 .1UF
16V
1.875V
LCD_DC_F
BT_LED_SUPPLY
V2_SUPPLY_UF
SPARK_GAP
12 5V
2.775V
CDZT2R5_6B DNP
5V
CDZT2R5_6B
5.6V
5V
CI_RED
4888112M12
430
2.775V
5.6V
180
CI_BLUE
CI_BLUE
CAM_VSYNC_F
SPARK_GAP
KEYPAD_ROW0
100NH
DNP DNP
DNP
DNP
100K
.1UF
SPARK_GAP
5V
KEYPAD_ROW6
KEYPAD_ROW7
SPARK_GAP
DNP
DNP
DNP
DNP
DNP
DNP
DNP
100NH
4888112M10
4870370A83
CDZT2R5_6B
4888112M10
4888112M10
SPKR_P_F
2
.1UF 5.6V
CDZT2R5_6B 5.6V .1UF
SPARK_GAP
200
5.6V
4870370A83
5.6V CDZT2R5_6B
CI_GREEN
NUF8001MU
SPKR_R_PLUS
2.775V
11
10
8 9
13 12 11
4809653F09
KEYPAD_ROW5
11
13
V_VIB_SUPPLY_UF
PTT
33PF
CAM_MCLK_UF
CAM_HSYNC
AVDD
CAM_RESET_F
I2C_CLK_F
I2C_DAT_F
0
CAM_STBY_F
DVDD
DISPLAY_ID
CDZT2R5_6B
VIB_MINUS
ON_OFF_SWITCH
KEYPAD_COLUMN2
KEYPAD_COLUMN3
DNP
33NH
SWITCH
DNP
100NH
SPARK_GAP
1.875V
10PF
CAM_DATA<7..0>
CAM_VSYNC
.1UF
CI_RED
CAM_RESET_F
CAM_STBY_F
CAM_HSYNC_F
10 16
17
FDG6331L
EARPHONE_PLUS
SPARK_GAP
SPU0409LE5H
MIC_SUPPLY_A_F
VIB_MINUS
SW2_SUPPLY_UF
MM5Z16VT1
I2C_CLK_F
RS-3025AA
MICROPHONE
LCD_DATA<17..8>
DNP
KEYPAD_COLUMN5
KEYPAD_COLUMN6
KEYPAD_COLUMN7
DNP
100NH
DNP
100NH
DNP
220
100NH
5V
100NH
100NH
100NH 100NH
V2_775_FLTR
0
0
0
0
0
4888112M36
4888112M36
NC
NC
NC
GND2
GND1
GND3
NEG POS
GND4
OUTPUTPOWER
GND1
GND2
GND3
FLTR8
FLTR7
FLTR8
FLTR7
FLTR6
FLTR5
FLTR4
FLTR3
FLTR2
FLTR1
GND
FLTR6
FLTR5
FLTR4
FLTR3
FLTR2
FLTR1
FLTR8
FLTR7
FLTR8
FLTR7
FLTR6
FLTR5
FLTR4
FLTR3
FLTR2
FLTR1
GND
FLTR6
FLTR5
FLTR4
FLTR3
FLTR2
FLTR1
GND3
GND1
OUT
GND2
IN
GND3
GND1
OUT
GND2
IN
GND3
GND1
OUT
GND2
IN
NC
NC
NC
NC
NC
NC
NC
6880401P39-O 135


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
4.17 i465 Component Locations



Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description
BAT_DET_IN NOTPLACED 64AM DUMMY PART NUMBER C1023 NOTPLACED 64AM DUMMY PART NUMBER C2022 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0
BBP_RXCLK NOTPLACED 64AM DUMMY PART NUMBER C1024 NOTPLACED 64AM DUMMY PART NUMBER C2023 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0
BRK1 NOTPLACED 64AM DUMMY PART NUMBER C1025 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C2024 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0
BRK2 NOTPLACED 64AM DUMMY PART NUMBER C1026 2113956B33 CAP,FXD,2.2UF,+10%,-10%,16V-DC C2029 2113944E13 CAP,CHIP,12PF,+5%,-5%,25V-DC,0
BRK3 NOTPLACED 64AM DUMMY PART NUMBER C103 2113944A37 CAP,CHIP,75PF,+5%,-5%,50V-DC,0 C203 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0
BRK4 NOTPLACED 64AM DUMMY PART NUMBER C1031 2113946D02 CAP,CHIP,1UF,+10%,-10%,6.3V-DC C2037 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0
BT_BECLK NOTPLACED 64AM DUMMY PART NUMBER C1032 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C2038 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0
BT_BYPRX NOTPLACED 64AM DUMMY PART NUMBER C104 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C2039 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC
BT_SPI_CLK NOTPLACED 64AM DUMMY PART NUMBER C105 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C204 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0
BT_SPI_CSB NOTPLACED 64AM DUMMY PART NUMBER C1422 2113945A05 CAP,CHIP,470PF,+10%,-10%,50V-D C2040 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0
BT_SPIMISO NOTPLACED 64AM DUMMY PART NUMBER C1423 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C2044 2113944E12 CAP,CHIP,10PF,.5PF+/-,25V-DC,0
BT_SPIMOSI NOTPLACED 64AM DUMMY PART NUMBER C1425 2115153H10 CAP,FXD,2PF,.1PF+/-,50V-DC,040 C2045 2113944A25 CAP,CHIP,10PF,.5PF+/-,50V-DC,0
BT_UART_RX NOTPLACED 64AM DUMMY PART NUMBER C1441 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C2046 2113944A25 CAP,CHIP,10PF,.5PF+/-,50V-DC,0
BT_UART_TX NOTPLACED 64AM DUMMY PART NUMBER C1450 2488158Y10 IDCTR,WW,5.6NH,340MA,.19OHM,CE C2047 2113944E15 CAP,FXD,18PF,+5%,-5%,25V-DC,02
C1001 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C1451 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C2048 2113944E15 CAP,FXD,18PF,+5%,-5%,25V-DC,02
C1003 2113946D02 CAP,CHIP,1UF,+10%,-10%,6.3V-DC C1452 2113945F07 CAP,FXD,.01UF,+10%,-10%,6.3V-D C2049 NOTPLACED 64AM DUMMY PART NUMBER
C1004 NOTPLACED 64AM DUMMY PART NUMBER C1453 2113944E14 CAP,CHIP,15PF,+5%,-5%,25V-DC,0 C205 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0
C1006 2113944A27 CAP,CHIP,15PF,+5%,-5%,50V-DC,0 C1498 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C2050 2113944E12 CAP,CHIP,10PF,.5PF+/-,25V-DC,0
C1007 NOTPLACED 64AM DUMMY PART NUMBER C1499 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C2051 2113944E13 CAP,CHIP,12PF,+5%,-5%,25V-DC,0
C1008 NOTPLACED 64AM DUMMY PART NUMBER C200 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C2052 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6.
C101 2113944A37 CAP,CHIP,75PF,+5%,-5%,50V-DC,0 C2005 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C2053 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6.
C1010 NOTPLACED 64AM DUMMY PART NUMBER C2006 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C2054 2113944A27 CAP,CHIP,15PF,+5%,-5%,50V-DC,0
C1011 2113944A27 CAP,CHIP,15PF,+5%,-5%,50V-DC,0 C201 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C2055 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC
C102 2113944A37 CAP,CHIP,75PF,+5%,-5%,50V-DC,0 C202 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C2056 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC
C1021 NOTPLACED 64AM DUMMY PART NUMBER C2021 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C2057 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC
136 6880401P39-O


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
i465 Component Locations [Continued]




Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description
C2058 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%, C300 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C438 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0
C2059 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%, C301 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C460 2113946U01 CAP,FXD,.1UF,+10%,-10%,6.3V-DC
C206 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C302 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C461 NOTPLACED 64AM DUMMY PART NUMBER
C207 2113944A13 CAP,CHIP,3.3PF,.25PF+/-,50V-DC C303 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC C462 2113946U01 CAP,FXD,.1UF,+10%,-10%,6.3V-DC
C209 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C304 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C463 2113946U01 CAP,FXD,.1UF,+10%,-10%,6.3V-DC
C210 2113945A13 CAP,CHIP,4700PF,+10%,-10%,50V- C305 2113946B02 CAP,CHIP,.047UF,+10%,-10%,10V- C464 NOTPLACED 64AM DUMMY PART NUMBER
C211 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C306 2113945A09 CAP,CHIP,1000PF,+10%,-10%,50V- C470 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0
C212 2113945A12 CAP,CHIP,3300PF,+10%,-10%,50V- C307 2113945A09 CAP,CHIP,1000PF,+10%,-10%,50V- C471 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0
C213 2113945A12 CAP,CHIP,3300PF,+10%,-10%,50V- C308 2185419D28 CAP,CHIP,.1UF,+10%,-10%,10V-DC C475 2113946U01 CAP,FXD,.1UF,+10%,-10%,6.3V-DC
C214 2113946C02 CAP,CHIP,.22UF,+10%,-10%,10V-D C309 2185419D28 CAP,CHIP,.1UF,+10%,-10%,10V-DC C476 NOTPLACED 64AM DUMMY PART NUMBER
C215 2113946D02 CAP,CHIP,1UF,+10%,-10%,6.3V-DC C310 2185419D28 CAP,CHIP,.1UF,+10%,-10%,10V-DC C478 NOTPLACED 64AM DUMMY PART NUMBER
C216 2113946D02 CAP,CHIP,1UF,+10%,-10%,6.3V-DC C311 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C479 NOTPLACED 64AM DUMMY PART NUMBER
C217 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C312 2113944E15 CAP,FXD,18PF,+5%,-5%,25V-DC,02 C480 NOTPLACED 64AM DUMMY PART NUMBER
C218 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C313 2113944E15 CAP,FXD,18PF,+5%,-5%,25V-DC,02 C481 NOTPLACED 64AM DUMMY PART NUMBER
C219 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C403 NOTPLACED 64AM DUMMY PART NUMBER C482 NOTPLACED 64AM DUMMY PART NUMBER
C221 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C404 2113944E15 CAP,FXD,18PF,+5%,-5%,25V-DC,02 C483 2113946U01 CAP,FXD,.1UF,+10%,-10%,6.3V-DC
C222 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C405 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0 C484 NOTPLACED 64AM DUMMY PART NUMBER
C223 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C406 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0 C492 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC
C250 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C430 2113944E15 CAP,FXD,18PF,+5%,-5%,25V-DC,02 C500 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0
C251 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C432 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C501 NOTPLACED 64AM DUMMY PART NUMBER
C252 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C433 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C502 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
C288 NOTPLACED 64AM DUMMY PART NUMBER C434 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C506 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0
C289 NOTPLACED 64AM DUMMY PART NUMBER C435 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C507 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0
C290 NOTPLACED 64AM DUMMY PART NUMBER C436 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C508 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0
C291 NOTPLACED 64AM DUMMY PART NUMBER C437 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C509 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC,
6880401P39-O 137


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

i465 Component Locations [Continued]






Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description
C510 2113945A09 CAP,CHIP,1000PF,+10%,-10%,50V- C60053 NOTPLACED 64AM DUMMY PART NUMBER C630 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0
C511 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C60054 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C689 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0
C512 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C60055 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C690 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0
C513 2113945A05 CAP,CHIP,470PF,+10%,-10%,50V-D C60056 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C701 2187906N01 CAP,CHIP,4.7UF,940000PF+/-,+20
C514 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C60057 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C702 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC
C515 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C60058 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C703 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC
C516 NOTPLACED 64AM DUMMY PART NUMBER C60059 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C704 2175511A01 CAP,CER,2.2UF,+20%,-20%,6.3V-D
C517 2113944A36 CAP,CHIP,68PF,+5%,-5%,50V-DC,0 C60060 2113944A11 CAP,CHIP,2.7PF,.25PF+/-,50V-DC C705 2113956B54 CAP,FXD,10UF,+20%,-20%,6.3V-DC
C518 2360567A12 CAP,TANTALUM,330UF,+20%,-20%,1 C60061 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC C706 NOTPLACED 64AM DUMMY PART NUMBER
C519 NOTPLACED 64AM DUMMY PART NUMBER C60062 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%, C707 NOTPLACED 64AM DUMMY PART NUMBER
C520 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C60063 NOTPLACED 64AM DUMMY PART NUMBER C708 NOTPLACED 64AM DUMMY PART NUMBER
C521 2113945B01 CAP,CHIP,6800PF,+10%,-10%,25V- C614 2113944A42 CAP,CHIP,150PF,+5%,-5%,50V-DC, C709 2175511A01 CAP,CER,2.2UF,+20%,-20%,6.3V-D
C522 2113945B04 CAP,FXD,.022UF,+10%,-10%,25V-D C615 2175035B01 CAP,CER CHIP,10UF,+20%,-20%,6. C710 2187906N01 CAP,CHIP,4.7UF,940000PF+/-,+20
C523 2113945B04 CAP,FXD,.022UF,+10%,-10%,25V-D C616 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C711 NOTPLACED 64AM DUMMY PART NUMBER
C524 2113945A11 CAP,CHIP,2200PF,+10%,-10%,50V- C617 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C713 2175036B01 CAP,CER CHIP,4.7UF,+20%,-20%,6
C525 2113945B05 CAP,FXD,.033UF,+10%,-10%,25V-D C620 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C714 2175511A01 CAP,CER,2.2UF,+20%,-20%,6.3V-D
C526 2113956B54 CAP,FXD,10UF,+20%,-20%,6.3V-DC C621 2113944E15 CAP,FXD,18PF,+5%,-5%,25V-DC,02 C715 2175036B01 CAP,CER CHIP,4.7UF,+20%,-20%,6
C527 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C622 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C716 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6.
C528 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C623 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%, C717 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6.
C529 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C624 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C718 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6.
C530 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C625 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C719 2175511A01 CAP,CER,2.2UF,+20%,-20%,6.3V-D
C531 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C626 NOTPLACED 64AM DUMMY PART NUMBER C720 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D
C535 2360567A11 CAP,TANTALUM,68UF,+20%,-20%,10 C627 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C721 2113945A10 CAP,CHIP,1500PF,+10%,-10%,50V-
C590 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C628 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%, C722 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%,
C60052 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C629 2175035B01 CAP,CER CHIP,10UF,+20%,-20%,6. C723 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC
138 6880401P39-O


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
i465 Component Locations [Continued]



Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description
C724 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C758 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0 C796 2113956B33 CAP,FXD,2.2UF,+10%,-10%,16V-DC
C725 2175511A01 CAP,CER,2.2UF,+20%,-20%,6.3V-D C759 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0 C797 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6.
C726 2175036B01 CAP,CER CHIP,4.7UF,+20%,-20%,6 C760 2175035B01 CAP,CER CHIP,10UF,+20%,-20%,6. C798 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6.
C727 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C763 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C799 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%,
C728 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C764 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%, C801 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0
C729 2175511A01 CAP,CER,2.2UF,+20%,-20%,6.3V-D C765 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C802 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%,
C730 NOTPLACED 64AM DUMMY PART NUMBER C766 2113956B54 CAP,FXD,10UF,+20%,-20%,6.3V-DC C803 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0
C731 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C769 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C804 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%,
C732 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C770 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C805 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0
C733 2113946U01 CAP,FXD,.1UF,+10%,-10%,6.3V-DC C771 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C806 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%,
C734 2113945A09 CAP,CHIP,1000PF,+10%,-10%,50V- C777 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC C807 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0
C735 2113945A09 CAP,CHIP,1000PF,+10%,-10%,50V- C778 2113945C31 CAP,FXD,.1UF,+10%,-10%,50V-DC, C808 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC
C736 2113945C13 CAP,CHIP,1000PF,+10%,-10%,50V- C779 2175036B01 CAP,CER CHIP,4.7UF,+20%,-20%,6 C809 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0
C738 2113944A37 CAP,CHIP,75PF,+5%,-5%,50V-DC,0 C780 2113946D01 CAP,CHIP,.47UF,+10%,-10%,6.3V- C810 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC
C739 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C781 2113946D01 CAP,CHIP,.47UF,+10%,-10%,6.3V- C811 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0
C741 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC C782 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C812 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC
C742 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C783 2371735M01 CAP,TANTALUM,100UF,+20%,-20%,6 C813 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0
C746 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C784 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C814 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC
C751 2113944E20 CAP,CHIP,56PF,+5%,-5%,25V-DC,0 C785 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C816 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC
C752 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0 C786 2175036B01 CAP,CER CHIP,4.7UF,+20%,-20%,6 C818 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0
C753 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0 C787 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C820 2113944A35 CAP,CHIP,62PF,+5%,-5%,50V-DC,0
C754 2113944E20 CAP,CHIP,56PF,+5%,-5%,25V-DC,0 C788 NOTPLACED 64AM DUMMY PART NUMBER C824 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0
C755 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C789 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C870 2113946L05 CAP,FXD,.33UF,+80%,-20%,16V-DC
C756 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C790 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C871 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC
C757 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%, C794 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0 C872 2113946U01 CAP,FXD,.1UF,+10%,-10%,6.3V-DC
6880401P39-O 139


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

i465 Component Locations [Continued]




Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description
C873 2175036B01 CAP,CER CHIP,4.7UF,+20%,-20%,6 E703 7605821Z02 FLTR,FERRITE BEAD,4A,SM,0805,C E753 NOTPLACED 64AM DUMMY PART NUMBER
C877 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC E706 NOTPLACED 64AM DUMMY PART NUMBER E754 NOTPLACED 64AM DUMMY PART NUMBER
D700 4805656W95 DIODE,RSX101M-30,SOD-123,SOD-1 E709 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E755 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
D701 4805656W85 DIODE,SWG,RB520CS-30,SM,100MA, E710 NOTPLACED 64AM DUMMY PART NUMBER E756 NOTPLACED 64AM DUMMY PART NUMBER
D702 4805656W85 DIODE,SWG,RB520CS-30,SM,100MA, E711 NOTPLACED 64AM DUMMY PART NUMBER E757 NOTPLACED 64AM DUMMY PART NUMBER
D704 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, E712 NOTPLACED 64AM DUMMY PART NUMBER E758 NOTPLACED 64AM DUMMY PART NUMBER
D705 4805286Z07 DIODE,SWG,SOD-523/SC-79,SCHOTT E713 NOTPLACED 64AM DUMMY PART NUMBER E781 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
D711 4816402H01 DIODE,SWG,RB751S-40,SOD-523/SC E714 NOTPLACED 64AM DUMMY PART NUMBER E782 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
D712 4816402H01 DIODE,SWG,RB751S-40,SOD-523/SC E715 NOTPLACED 64AM DUMMY PART NUMBER E8880 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA
D752 4805656W99 DIODE,ZEN,SM,5.6V,5.6V,.1W,ZEN E716 NOTPLACED 64AM DUMMY PART NUMBER E8881 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA
D753 4805656W99 DIODE,ZEN,SM,5.6V,5.6V,.1W,ZEN E717 NOTPLACED 64AM DUMMY PART NUMBER E8882 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA
D802 4805656W85 DIODE,SWG,RB520CS-30,SM,100MA, E718 NOTPLACED 64AM DUMMY PART NUMBER E8883 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA
D855 4805656W85 DIODE,SWG,RB520CS-30,SM,100MA, E719 NOTPLACED 64AM DUMMY PART NUMBER E8884 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
D866 4805656W85 DIODE,SWG,RB520CS-30,SM,100MA, E720 NOTPLACED 64AM DUMMY PART NUMBER E8885 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
D871 4805656W85 DIODE,SWG,RB520CS-30,SM,100MA, E731 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E8886 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
D872 4805656W85 DIODE,SWG,RB520CS-30,SM,100MA, E732 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E8887 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
D876 4875676A01 DIODE,SUPR,NUP4060AXV6T1G,V SU E740 NOTPLACED 64AM DUMMY PART NUMBER E8888 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
E101 7605821Z03 FLTR,FERRITE BEAD,4A,SM,1206,C E741 NOTPLACED 64AM DUMMY PART NUMBER E8889 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
E405 NOTPLACED 64AM DUMMY PART NUMBER E742 NOTPLACED 64AM DUMMY PART NUMBER E8890 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
E474 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E743 NOTPLACED 64AM DUMMY PART NUMBER E8893 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
E500 NOTPLACED 64AM DUMMY PART NUMBER E744 NOTPLACED 64AM DUMMY PART NUMBER E8910 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
E519 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E745 NOTPLACED 64AM DUMMY PART NUMBER E8911 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
E600 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, E750 NOTPLACED 64AM DUMMY PART NUMBER E941 NOTPLACED 64AM DUMMY PART NUMBER
E602 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E751 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E942 NOTPLACED 64AM DUMMY PART NUMBER
E702 7605821Z02 FLTR,FERRITE BEAD,4A,SM,0805,C E752 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E943 NOTPLACED 64AM DUMMY PART NUMBER
140 6880401P39-O


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

i465 Component Locations [Continued]


Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description
E944 NOTPLACED 64AM DUMMY PART NUMBER J7 0971529E05 CONN USB,RCPT,5CONT,GLD,MICRO, L303 2414017P22 IDCTR,CHIP,56NH,5%,200MA,2OHM,
E971 7686949J14 FLTR,FERRITE BEAD,2A,SM,0805,C J752 0964372H01 CONN,BRD TO WR,RCPT,5CONT,GLD, L304 2488090Y10 IDCTR,CHIP,5.6NH,5%,300MA,CER,
E972 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 J779 09009261001 CONN,RCPT,80CONT,CONNECTOR, HI L405 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
E973 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 J780 NOTPLACED 64AM DUMMY PART NUMBER L500 2414017P24 IDCTR,CHIP,82NH,5%,150MA,2.5OH
FL1000 9175824C01 PASSIVE FILTER,CER,BANDPASS,2. L1000 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA L501 0613952M26 RES,MF,1.82KOHM,1%,.0625W,SM,0
FL1420 9185284E01 FLTR,SAW L1001 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, L502 2414017G18 IDCTR,CHIP,82NH,5%,300MA,2OHM,
FL200 9105849W17 FLTR,SAW,BANDPASS,50OHM,SM,FLT L1002 2415429H35 IDCTR,WW,82NH,5%,400MA,.54OHM, L503 2413954B16 IDCTR,FXD,18NH,5%,320MA,.6OHM,
FL201 9105849W18 FLTR,SAW,BANDPASS,50OHM,SM,FLT L1003 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, L605 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
FL3006 NOTPLACED 64AM DUMMY PART NUMBER L1004 2414017P01 IDCTR,CHIP,1NH,300MA,.1OHM,CER L750 2414017G19 IDCTR,CHIP,100NH,5%,300MA,2.5O
FL3007 NOTPLACED 64AM DUMMY PART NUMBER L1005 2488090Y05 IDCTR,CHIP,2.2NH,5%,300MA,CER, L751 2414017G19 IDCTR,CHIP,100NH,5%,300MA,2.5O
FL3008 NOTPLACED 64AM DUMMY PART NUMBER L1405 2414017P08 IDCTR,CHIP,3.9NH,300MA,.22OHM, L752 2414017P25 IDCTR,CHIP,100NH,5%,100MA,5.5O
FL3010 4885534E14 FLTR,EMI FILTER,LOWPASS,110MHZ L1410 NOTPLACED 64AM DUMMY PART NUMBER L753 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
FL3011 4885534E14 FLTR,EMI FILTER,LOWPASS,110MHZ L1412 2115153H05 CAP,FXD,1.2PF,.1PF+/-,50V-DC,0 L754 2571104B10 IDCTR,PWR,10UH,20%,580MA,.355O
FL3012 NOTPLACED 64AM DUMMY PART NUMBER L1420 2414017P25 IDCTR,CHIP,100NH,5%,100MA,5.5O L755 2571104B04 IDCTR,WW,4.7UH,20%,850MA,.155O
FL401 4885534E14 FLTR,EMI FILTER,LOWPASS,110MHZ L1498 2489828Y09 CHIP INDUCTOR,RF,4.7NH,30MA,.2 L801 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
FL402 4885534E14 FLTR,EMI FILTER,LOWPASS,110MHZ L1499 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA L802 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
FL751 9176000B01 EMI FILTER,EMI,6V-DC,PI,AU 2 L L1500 2571104B10 IDCTR,PWR,10UH,20%,580MA,.355O L803 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040
GPSIFOUT NOTPLACED 64AM DUMMY PART NUMBER L1501 2414017G19 IDCTR,CHIP,100NH,5%,300MA,2.5O M1011 NOTPLACED 64AM DUMMY PART NUMBER
GPSIFOUTX NOTPLACED 64AM DUMMY PART NUMBER L200 2471237B04 IDCTR,6.8NH,5%,430MA,.2OHM,CER M104 NOTPLACED 64AM DUMMY PART NUMBER
GPSMAGBIT NOTPLACED 64AM DUMMY PART NUMBER L201 2415429H39 IDCTR,WW,150NH,5%,280MA,.92OHM M1400 NOTPLACED 64AM DUMMY PART NUMBER
GPSSIGNBIT NOTPLACED 64AM DUMMY PART NUMBER L202 2488090Y18 IDCTR,CHIP,27NH,5%,300MA,CER,S M1401 NOTPLACED 64AM DUMMY PART NUMBER
GPSTIMESYN NOTPLACED 64AM DUMMY PART NUMBER L204 2414017P22 IDCTR,CHIP,56NH,5%,200MA,2OHM, M500 3987977Y02 CONT,CONN,1CONT,ANT UNIV 4.5MM
ICRNE_CS NOTPLACED 64AM DUMMY PART NUMBER L300 2414017P22 IDCTR,CHIP,56NH,5%,200MA,2OHM, M501 3987977Y02 CONT,CONN,1CONT,ANT UNIV 4.5MM
J492 3971599M01 CONT,PIN,6CONT,CONN, SIM L301 2488090Y10 IDCTR,CHIP,5.6NH,5%,300MA,CER, M513 NOTPLACED 64AM DUMMY PART NUMBER
J500 0985502E02 RF CONNECTOR,MISC,F,SM L302 2414017P22 IDCTR,CHIP,56NH,5%,200MA,2OHM, PCB 8475171D01 PWB,PCB BLACKSTONE
6880401P39-O 141


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

i465 Component Locations [Continued]



Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description
Q1408 NOTPLACED 64AM DUMMY PART NUMBER R1024 NOTPLACED 64AM DUMMY PART NUMBER R505 0613952R25 RES,MF,100KOHM,5%,.0625W,SM,04
Q1410 4888695V01 XSTR,FET GEN PURPOSE SMALL SIG R103 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R506 0613952Q25 RES,MF,10OHM,5%,.0625W,SM,0402
Q1411 4809807C45 XSTR,FET GP PWR,MOSFET,P-CH,FD R1030 0613952Q08 RES,MF,2OHM,5%,.0625W,SM,0402, R507 NOTPLACED 64AM DUMMY PART NUMBER
Q500 4813973A82 XSTR,BIP GP SS,DIG,NPN AND PNP R104 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R518 0613952K85 RES,MF,75OHM,1%,.0625W,SM,0402
Q700 4809807C45 XSTR,FET GP PWR,MOSFET,P-CH,FD R1099 NOTPLACED 64AM DUMMY PART NUMBER R598 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040
Q701 4809807C45 XSTR,FET GP PWR,MOSFET,P-CH,FD R1414 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R599 NOTPLACED 64AM DUMMY PART NUMBER
Q702 4809807C45 XSTR,FET GP PWR,MOSFET,P-CH,FD R1440 2414017P07 IDCTR,CHIP,3.3NH,300MA,.19OHM, R600 0613952Q43 RES,MF,56OHM,5%,.0625W,SM,0402
Q703 4813970M54 XSTR,FET GP PWR,MOSFET,P,ENHN, R1441 0613952R32 RES,MF,200KOHM,5%,.0625W,SM,04 R6000 NOTPLACED 64AM DUMMY PART NUMBER
Q704 4809607E17 XSTR,BIP GP POWER,PNP,NSS35200 R1443 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R601 0613952Q52 RES,MF,130OHM,5%,.0625W,SM,040
Q705 4809607E17 XSTR,BIP GP POWER,PNP,NSS35200 R200 0613952Q74 RES,MF,1.1KOHM,5%,.0625W,SM,04 R602 0613952Q47 RES,MF,82OHM,5%,.0625W,SM,0402
Q706 4813972A34 XSTR,FET GP SS,MOSFET,N AND P, R201 0613952Q69 RES,MF,680OHM,5%,.0625W,SM,040 R603 0613952Q36 RES,MF,30OHM,5%,.0625W,SM,0402
Q707 4885316E06 XSTR,BIP GP SS,SLCN,NPN AND PN R202 0613952Q83 RES,MF,2.7KOHM,5%,.0625W,SM,04 R604 0613952Z43 RES,MF,3KOHM,1%,.0625W,SM,0402
Q708 4885316E36 XSTR,FET GP PWR,N,SOT-723,20V, R203 0613952R25 RES,MF,100KOHM,5%,.0625W,SM,04 R605 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
Q709 NOTPLACED 64AM DUMMY PART NUMBER R204 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R606 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
Q855 4885316E13 XSTR,BIP GP SS,NPN,DTC144,XSTR R401 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R608 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
R1001 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R430 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA R609 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
R1005 NOTPLACED 64AM DUMMY PART NUMBER R431 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA R610 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
R1009 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R432 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA R700 0613952Q73 RES,MF,1KOHM,5%,.0625W,SM,0402
R101 0613952X91 RES,MF,5.6KOHM,5%,.05W,SM,0201 R453 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R701 0613958J74 RES,MF,0OHM,5%,.125W,SM,0805,P
R1010 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R470 0613952S19 RES,MF,15.4OHM,1%,.05W,SM,0201 R702 NOTPLACED 64AM DUMMY PART NUMBER
R1011 2488090Y05 IDCTR,CHIP,2.2NH,5%,300MA,CER, R471 0613952S17 RES,MF,14.7OHM,1%,.05W,SM,0201 R704 0613952Y01 RES,MF,10KOHM,5%,.05W,SM,0201,
R1012 NOTPLACED 64AM DUMMY PART NUMBER R492 0613952Q91 RES,MF,5.6KOHM,5%,.0625W,SM,04 R706 0613952R16 RES,MF,43KOHM,5%,.0625W,SM,040
R1020 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R500 0613952K85 RES,MF,75OHM,1%,.0625W,SM,0402 R707 0613952R25 RES,MF,100KOHM,5%,.0625W,SM,04
R1022 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R501 0613952L01 RES,MF,100OHM,1%,.0625W,SM,040 R708 0613952R17 RES,MF,47KOHM,5%,.0625W,SM,040
R1023 0613952R17 RES,MF,47KOHM,5%,.0625W,SM,040 R503 0685660C01 RES,THRM,47KOHM,AT 25DEG C,3%, R709 NOTPLACED 64AM DUMMY PART NUMBER
142 6880401P39-O


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
i465 Component Locations [Continued



Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description
R710 0613952N01 RES,MF,10KOHM,1%,.0625W,SM,040 R745 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 R776 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
R711 0613952N80 RES,MF,66.5KOHM,1%,.0625W,SM,0 R746 0613952Q73 RES,MF,1KOHM,5%,.0625W,SM,0402 R777 NOTPLACED 64AM DUMMY PART NUMBER
R712 0613952M96 RES,MF,9.76KOHM,1%,.0625W,SM,0 R748 0613958K63 RES,MF,4.42OHM,1%,.25W,SM,1206 R778 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
R713 0613952N82 RES,MF,69.8KOHM,1%,.0625W,SM,0 R749 NOTPLACED 64AM DUMMY PART NUMBER R780 NOTPLACED 64AM DUMMY PART NUMBER
R714 0688044N02 RES,METAL STRIP,.02OHM,1%,.125 R750 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R781 NOTPLACED 64AM DUMMY PART NUMBER
R715 0685512E01 RES,CER,.16OHM,1%,.25W,SM,0805 R751 0613952Q73 RES,MF,1KOHM,5%,.0625W,SM,0402 R782 NOTPLACED 64AM DUMMY PART NUMBER
R716 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R752 NOTPLACED 64AM DUMMY PART NUMBER R783 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
R719 0613952Q01 RES,MF,1OHM,5%,.0625W,SM,0402, R753 NOTPLACED 64AM DUMMY PART NUMBER R784 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
R720 0613952R17 RES,MF,47KOHM,5%,.0625W,SM,040 R754 0613952Q83 RES,MF,2.7KOHM,5%,.0625W,SM,04 R785 NOTPLACED 64AM DUMMY PART NUMBER
R721 0613952R32 RES,MF,200KOHM,5%,.0625W,SM,04 R755 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 R786 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
R722 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R757 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R787 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
R723 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R758 2413954B25 IDCTR,FXD,100NH,5%,170MA,2.1OH R788 NOTPLACED 64AM DUMMY PART NUMBER
R724 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R759 0689057L01 RES,CHIP,.05OHM,1%,0805,2X1.27 R789 0613952Q73 RES,MF,1KOHM,5%,.0625W,SM,0402
R725 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 R760 0613952Q91 RES,MF,5.6KOHM,5%,.0625W,SM,04 R791 0613952X36 RES,MF,30OHM,5%,.05W,SM,0201,2
R726 0613958C10 RES,MF,124OHM,1%,.125W,SM,0805 R762 NOTPLACED 64AM DUMMY PART NUMBER R792 0613952X36 RES,MF,30OHM,5%,.05W,SM,0201,2
R727 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 R764 0613952Y08 RES,MF,20KOHM,5%,.05W,SM,0201, R793 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
R728 0613952P58 RES,MF,392KOHM,1%,.0625W,SM,04 R765 0613952Y22 RES,MF,75KOHM,5%,.05W,SM,0201, R796 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
R729 0613952N93 RES,MF,90.9KOHM,1%,.0625W,SM,0 R766 0613952Y39 RES,MF,390KOHM,5%,.05W,SM,0201 R806 NOTPLACED 64AM DUMMY PART NUMBER
R730 0613952P09 RES,MF,121KOHM,1%,.0625W,SM,04 R768 NOTPLACED 64AM DUMMY PART NUMBER R8070 0613952X81 RES,MF,2.2KOHM,5%,.05W,SM,0201
R731 0613952Y01 RES,MF,10KOHM,5%,.05W,SM,0201, R769 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 R8071 0613952X81 RES,MF,2.2KOHM,5%,.05W,SM,0201
R732 NOTPLACED 64AM DUMMY PART NUMBER R770 0613952Q73 RES,MF,1KOHM,5%,.0625W,SM,0402 R8076 NOTPLACED 64AM DUMMY PART NUMBER
R734 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R771 NOTPLACED 64AM DUMMY PART NUMBER R8077 NOTPLACED 64AM DUMMY PART NUMBER
R735 0613952R32 RES,MF,200KOHM,5%,.0625W,SM,04 R772 NOTPLACED 64AM DUMMY PART NUMBER R8078 NOTPLACED 64AM DUMMY PART NUMBER
R739 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 R773 0613952P97 RES,MF,1MOHM,1%,.0625W,SM,0402 R8079 NOTPLACED 64AM DUMMY PART NUMBER
R741 0613952Q73 RES,MF,1KOHM,5%,.0625W,SM,0402 R775 NOTPLACED 64AM DUMMY PART NUMBER R8080 NOTPLACED 64AM DUMMY PART NUMBER
6880401P39-O 143


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
i465 Component Locations [Continued]





Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description
R8082 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R8116 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R878 0613952Y17 RES,MF,47KOHM,5%,.05W,SM,0201,
R8083 0613952R25 RES,MF,100KOHM,5%,.0625W,SM,04 R8117 NOTPLACED 64AM DUMMY PART NUMBER R880 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
R8084 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R8119 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R881 NOTPLACED 64AM DUMMY PART NUMBER
R8085 NOTPLACED 64AM DUMMY PART NUMBER R8120 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R882 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,
R8086 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R8121 NOTPLACED 64AM DUMMY PART NUMBER R894 NOTPLACED 64AM DUMMY PART NUMBER
R8087 NOTPLACED 64AM DUMMY PART NUMBER R8122 0689057L01 RES,CHIP,.05OHM,1%,0805,2X1.27 R895 NOTPLACED 64AM DUMMY PART NUMBER
R8088 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R8123 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R896 NOTPLACED 64AM DUMMY PART NUMBER
R8089 NOTPLACED 64AM DUMMY PART NUMBER R8124 0613952Y01 RES,MF,10KOHM,5%,.05W,SM,0201, R897 NOTPLACED 64AM DUMMY PART NUMBER
R8090 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R8125 0613952Y01 RES,MF,10KOHM,5%,.05W,SM,0201, R901 0613952Q33 RES,MF,22OHM,5%,.0625W,SM,0402
R8091 NOTPLACED 64AM DUMMY PART NUMBER R8126 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R902 0613952Q33 RES,MF,22OHM,5%,.0625W,SM,0402
R8093 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R8127 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB RS232_RX NOTPLACED 64AM DUMMY PART NUMBER
R8094 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R8128 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB RS232_TX NOTPLACED 64AM DUMMY PART NUMBER
R8099 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R820 0613952Q91 RES,MF,5.6KOHM,5%,.0625W,SM,04 RXEN_STROB NOTPLACED 64AM DUMMY PART NUMBER
R810 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R824 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 SH1000 2671785L02 SHLD,SMOOTH,SHLD , BLU
R8100 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R827 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, SH300 26009257001 SHLD,SHLD , VCO
R8102 0613952Y01 RES,MF,10KOHM,5%,.05W,SM,0201, R828 NOTPLACED 64AM DUMMY PART NUMBER SH301 2671768L02 SHLD,SMOOTH,SHLD , TCXO
R8106 0613952Y01 RES,MF,10KOHM,5%,.05W,SM,0201, R829 NOTPLACED 64AM DUMMY PART NUMBER SH500 26009256001 SHLD,SHLD , PA
R8107 0613952Y01 RES,MF,10KOHM,5%,.05W,SM,0201, R835 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB SH600 26009254001 SHLD,SHLD , SLDG
R8108 NOTPLACED 64AM DUMMY PART NUMBER R850 0613952R17 RES,MF,47KOHM,5%,.0625W,SM,040 SH700 26009216001 SHLD,SHLD PM
R8109 NOTPLACED 64AM DUMMY PART NUMBER R853 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 SH800 26009215001 SHLD,SHLD DIG
R811 NOTPLACED 64AM DUMMY PART NUMBER R855 0613952R09 RES,MF,22KOHM,5%,.0625W,SM,040 SPIA_CLK NOTPLACED 64AM DUMMY PART NUMBER
R8110 NOTPLACED 64AM DUMMY PART NUMBER R856 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 SPIA_MISO NOTPLACED 64AM DUMMY PART NUMBER
R8111 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R869 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, SPIA_MOSI NOTPLACED 64AM DUMMY PART NUMBER
R8112 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R870 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, SPIB_CLK NOTPLACED 64AM DUMMY PART NUMBER
R8113 NOTPLACED 64AM DUMMY PART NUMBER R877 NOTPLACED 64AM DUMMY PART NUMBER SPIB_MISO NOTPLACED 64AM DUMMY PART NUMBER
144 6880401P39-O


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

i465 Component Locations [Continued]





Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description
SPIB_MOSI NOTPLACED 64AM DUMMY PART NUMBER TP_DMCS NOTPLACED 64AM DUMMY PART NUMBER TP_TXCLK NOTPLACED 64AM DUMMY PART NUMBER
SPKR_R_M NOTPLACED 64AM DUMMY PART NUMBER TP_EAR_M NOTPLACED 64AM DUMMY PART NUMBER TP_TXE NOTPLACED 64AM DUMMY PART NUMBER
SPKR_R_P NOTPLACED 64AM DUMMY PART NUMBER TP_EAR_P NOTPLACED 64AM DUMMY PART NUMBER TP_TXFS NOTPLACED 64AM DUMMY PART NUMBER
T1400 2585130E04 XFMR,BALUN,SM,BALUN 1500 MHZ 5 TP_EB0 NOTPLACED 64AM DUMMY PART NUMBER TP_TXI NOTPLACED 64AM DUMMY PART NUMBER
T200 2585130E05 XFMR,BALUN,SM,BALUN 800-900 MH TP_EB1 NOTPLACED 64AM DUMMY PART NUMBER TP_TXIX NOTPLACED 64AM DUMMY PART NUMBER
T500 2585130E03 XFMR,BALUN,XFMR RF BALUN TP_EOL NOTPLACED 64AM DUMMY PART NUMBER TP_TXQ NOTPLACED 64AM DUMMY PART NUMBER
TEST1_SL NOTPLACED 64AM DUMMY PART NUMBER TP_GPIO10 NOTPLACED 64AM DUMMY PART NUMBER TP_TXQX NOTPLACED 64AM DUMMY PART NUMBER
TEST2_SL NOTPLACED 64AM DUMMY PART NUMBER TP_GPIO6 NOTPLACED 64AM DUMMY PART NUMBER TP_USB_EOP NOTPLACED 64AM DUMMY PART NUMBER
TP_16_8MHZ NOTPLACED 64AM DUMMY PART NUMBER TP_GPS_CLK NOTPLACED 64AM DUMMY PART NUMBER TP_VIB NOTPLACED 64AM DUMMY PART NUMBER
TP_23 NOTPLACED 64AM DUMMY PART NUMBER TP_LBAN NOTPLACED 64AM DUMMY PART NUMBER TP_WAITB NOTPLACED 64AM DUMMY PART NUMBER
TP_24 NOTPLACED 64AM DUMMY PART NUMBER TP_LNA_EN NOTPLACED 64AM DUMMY PART NUMBER TP_WDOG NOTPLACED 64AM DUMMY PART NUMBER
TP_32KHZ NOTPLACED 64AM DUMMY PART NUMBER TP_MIC NOTPLACED 64AM DUMMY PART NUMBER TPRXQX NOTPLACED 64AM DUMMY PART NUMBER
TP_A1 NOTPLACED 64AM DUMMY PART NUMBER TP_OEN NOTPLACED 64AM DUMMY PART NUMBER U1000 5103535B46 IC,XCVR,BT,BC313141A18-IXF-E4M
TP_ACQ_CLK NOTPLACED 64AM DUMMY PART NUMBER TP_RF_ATTN NOTPLACED 64AM DUMMY PART NUMBER U1001 5175813M01 IC,CONFIGURABLE MULTIPLE-FUNCT
TP_ADTRIG NOTPLACED 64AM DUMMY PART NUMBER TP_RRA_CS NOTPLACED 64AM DUMMY PART NUMBER U1420 51007599001 AMP,20.0DB,1.58GHZMIN,1.58GHZM
TP_AGC_DAC NOTPLACED 64AM DUMMY PART NUMBER TP_RTS NOTPLACED 64AM DUMMY PART NUMBER U200 5115443H01 IC,RF AMPLIFIER,QFN12,QFN,15.5
TP_ANA_CLK NOTPLACED 64AM DUMMY PART NUMBER TP_RWN NOTPLACED 64AM DUMMY PART NUMBER U2051 5164852H14 IC,CUST,RF TRANSCEIVER,BGA,IC,
TP_ASW NOTPLACED 64AM DUMMY PART NUMBER TP_RX_ACQ NOTPLACED 64AM DUMMY PART NUMBER U300 5175772B65 OSC,VCO,1.8824GHZ MAX,1.6996GH
TP_BCLK NOTPLACED 64AM DUMMY PART NUMBER TP_RXFS NOTPLACED 64AM DUMMY PART NUMBER U3003 5171972L01 IC,SW,SP3T RF SW
TP_CKO NOTPLACED 64AM DUMMY PART NUMBER TP_RXI NOTPLACED 64AM DUMMY PART NUMBER U3004 5171972L01 IC,SW,SP3T RF SW
TP_CKOH NOTPLACED 64AM DUMMY PART NUMBER TP_RXIX NOTPLACED 64AM DUMMY PART NUMBER U3005 5175772B22 IC,VDET,MAX803,SC70-3,1PER PKG
TP_CS0 NOTPLACED 64AM DUMMY PART NUMBER TP_RXQ NOTPLACED 64AM DUMMY PART NUMBER U403 5170200A43 IC,ASIC,W2240,TFBGA,GRAPHICS A
TP_CS2 NOTPLACED 64AM DUMMY PART NUMBER TP_SH_CS NOTPLACED 64AM DUMMY PART NUMBER U501 5185633C54 IC,AMP,LOW TIER ADJUSTABLE GAI
TP_CS4 NOTPLACED 64AM DUMMY PART NUMBER TP_SRDB NOTPLACED 64AM DUMMY PART NUMBER U502 5189153N01 IC,BUFFER AMPLIFIER,,N-I,,,OPE
TP_D0 NOTPLACED 64AM DUMMY PART NUMBER TP_STD NOTPLACED 64AM DUMMY PART NUMBER U700 5109817F82 IC,COMPTR,NCS2200,SM,LOW V W18
6880401P39-O 145


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
i465 Component Locations [Continued]



Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description
U701 5175771A73 IC,CUST,BGA,IC, ROADRUNNER (PM Y600 5185633C78 OSC,TCXO,33.6MHZ,SM,M3.2LX2.5W
U703 5114014A82 IC,LNR V REGLTR,FXD,3.7V,100MA
U801 5185594F15 IC,CUST,DIGITAL PROCESSING,BAS
U802 51009305001 IC,FLASH/PSRAM,512/128MBIT,X16
U803 NOTPLACED 64AM DUMMY PART NUMBER
U805 5189153N01 IC,BUFFER AMPLIFIER,,N-I,,,OPE
USB_TXENB NOTPLACED 64AM DUMMY PART NUMBER
USB_VBUS NOTPLACED 64AM DUMMY PART NUMBER
USB_VPIN NOTPLACED 64AM DUMMY PART NUMBER
VR106 4805656W99 DIODE,ZEN,SM,5.6V,5.6V,.1W,ZEN
VR107 4805656W46 DIODE,ZEN,SM,16V,SNGL
VR109 4805656W99 DIODE,ZEN,SM,5.6V,5.6V,.1W,ZEN
VR405 4805656W46 DIODE,ZEN,SM,16V,SNGL
VR430 4805656W65 DIODE,ZEN,SM,SC-89,5.6V,DL ZEN
VR432 4805656W99 DIODE,ZEN,SM,5.6V,5.6V,.1W,ZEN
VR433 NOTPLACED 64AM DUMMY PART NUMBER
VR434 4805656W99 DIODE,ZEN,SM,5.6V,5.6V,.1W,ZEN
VR702 4813979B24 DIODE ARRAY,TRNSNT PROT,SM,SOT
VR703 4805656W99 DIODE,ZEN,SM,5.6V,5.6V,.1W,ZEN
VR704 4813978M23 DIODE,SWG,SM,SOT-563,1A,23V,.2
VR750 4805656W65 DIODE,ZEN,SM,SC-89,5.6V,DL ZEN
VR755 4813978M23 DIODE,SWG,SM,SOT-563,1A,23V,.2
VR801 4805656W46 DIODE,ZEN,SM,16V,SNGL
VR802 4813978M23 DIODE,SWG,SM,SOT-563,1A,23V,.2
Y1 4809995L13 RESON,QRTZ,.032768MHZ,,,,SM,,F
146 6880401P39-O


SCHEMATIC DIAGRAMS AND COMPONENT LOCATION
i465 Component Locations]



Ref. No. Part No. Description
Ref.
No.
Part No. Description Ref. No. Part No. Description

























6880401P39-O 147



































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148 6880401P39-O


ORDERING REPLACEMENT PARTS AND KITS: Ordering Replacement Parts and Kits
APPENDIX A
ORDERING REPLACEMENT PARTS AND KITS
Parts should be replaced with identical replacement parts. Replacement parts and kits for i465 units
can be ordered directly from the Motorola Accessories and Aftermarket Division (AAD) at
1-800-422-4210 and listen to the prompts; or FAX 800-622-6210.
A.1 Customer Service
For warranty and customer service assistance, call:
1-800-453-0920 U.S./Canada
1-954-723-3000 FAX
1-954-723-4910 International (outside U.S ./Canada)
A.2 Replacement Parts
When ordering replacement and accessory parts, the complete part number should be included.
If the correct part number cannot be located, call Motorola Parts Identification at 1-800-422-4210.
A.3 Domestic Orders
Send written orders for replacement parts, test equipment, or manuals to:
Motorola, Inc.
Accessories and Aftermarket Division
Attn: Order Processing 1313 E.
Algonquin Road Schaumburg, IL
60196
Call, fax, or telex orders to:
1-800-422-4210
1-847-538-8198 FAX
280 127 TELEX
A.4 International Orders
For international orders:
Motorola, Inc.
Accessories and Aftermarket Division Attn:
International Order Processing 1313 E.
Algonquin Road
Schaumburg, IL 60196
Call, fax, or telex orders to:
1-847-538-8023
1-847-576-3023 FAX
403305 TELEX



6880401P39-O 149


ORDERING REPLACEMENT PARTS AND KITS: Replacement Kits
A.5 Replacement Kits
When ordering replacement kits, the complete kit number should be included. If the correct
number cannot be located, call Motorola Parts Identification at 1-800-422-4210. Refer to the
exploded view and parts list in Chapter 7.

Automotive & Navigation
IHF1700 Music OEM BT Carkit CKG181xxxx
Bluetooth Car Kit, T307 Portable Hands-Free Speaker SYN2715
TN30 GPS Navigation System (4.3" PND) SYN2847
Bluetooth Car Kit / Speakerphone - High Tier, Self Install, T505 SYN1717
Bluetooth Car Kit, T305 Portable Hands-Free Speaker SYN1716
Bluetooth ProInstall Carkit IHF1700 OEM CKG171V010
BT Pro-Install CarkIt IHF1000r 98676L
Pro Install Bluetooth Carkit T605 Americas 98799N
Universal Dash Mount System (iDEN) NNTN7295
MobileVoice (Wireless BT Headsets)
ASSY,MOB/VOICE,BT HSET,H390 , BLACK SYN2644
Bluetooth Headset Black H375 ROM BLK SYN2162
Bluetooth Headset H350 Black SYN1439
Bluetooth Headset H550 Silver (SLVR) SYN1822
Bluetooth Headset H560 Black SYN2518
Bluetooth Headset H620 Black SYN2259
Bluetooth Headset H710 SYN2305
Bluetooth Mono Headset, Nickel- H500 SYN1290
BT Headset and Charging case H680 Midnight SYN2168
H15, BT,HIGH TIER,BOOM FLIP MONO HS Midnight SYN2530A
H690 Bluetooth Headset Kit SYN2616
H780 Kit Contains Mono Bluetooth headset kit and Cushions SYN2708
ASSY, Mob/Voice, BT Hset, H270 SYN2646
MOTOPURE H12 Bluetooth headset KIT SYN2487
Music & Entertainment
2-wire Surveillance Hdst Kit (iDEN) NNTN5211
3 wire surveillance headst kit (iDEN) NNTN6312
Headst PTT, Earbud (iDEN) NNTN5330
Personalization
Blackstone Holster NNTN7627A










150 6880401P39-O


ORDERING REPLACEMENT PARTS AND KITS: Replacement Kits (continued)
Replacement Kits (Continued)

Power
Battery BK10 Li-Ion 1750mAh SNN5793
Battery BK70 Li-Ion 1100mAh SNN5823A
Battery Door -Standard (BK70) TBD
Battery Door -Extended (BK10) TBD
Charger Adapter - Aust/NZ Plug SYN8127
Charger Adapter - Euro Plug SYN7456
Charger Adapter - UK Plug SYN7455
Charger Adapter REFRESH - EMU/MU SKN6252
Data cable Micro USB SKN6238
Data cable Micro USB -w/2 pc USBA charger SKN6254
Data cable Micro USB (heat sealed) -w/2 pc USBA charger SKN6268
P313 Standard Car Charger Micro Connector SYN1830
P513 VPA MicroUSB High Performance "Loop" SPN5400
Travel Charger MicroUSB Fast Rate Fixed Blade- ARG SPN5370
Travel Charger MicroUSB Fast Rate Fixed Blade- Brazil SPN5403
Travel Charger MicroUSB Fast Rate Fixed Blade- EURO SPN5383
Travel Charger MicroUSB Fast Rate Fixed Blade- INDIA SPN5372
Travel Charger MicroUSB Fast Rate Fixed Blade- KOREA SPN5373
Travel Charger MicroUSB Fast Rate Fixed Blade- MEX SPN5362
Travel Charger MicroUSB Fast Rate Fixed Blade- SPRINT SPN5374
Travel Charger MicroUSB Fast Rate Fixed Blade- US SPN5358
Travel Charger MicroUSB Rapid - ARG SPN5327
Travel Charger MicroUSB Rapid - MEX SPN5329
Travel Charger MicroUSB Rapid - SPRINT SPN5355
Travel Charger MicroUSB Rapid - US SPN5328
Travel Charger MicroUSB Standard- ARG SPN5339
Travel Charger MicroUSB Standard- Brazil US Blades SPN5402
Travel Charger MicroUSB Standard- EURO SPN5342
Travel Charger MicroUSB Standard- INDIA SPN5346
Travel Charger MicroUSB Standard- KOREA SPN5343
Travel Charger MicroUSB Standard- MEX SPN5337
Travel Charger MicroUSB Standard- SPRINT SPN5356
Travel Charger MicroUSB Standard- US SPN5334
Travel Charger USBA Fast Rate Fixed- ARG SPN5508
Travel Charger USBA Fast Rate Fixed- Brazil BREURO SPN5506
Travel Charger USBA Fast Rate Fixed- EURO SPN5507
Travel Charger USBA Fast Rate Fixed- India SPN5510
Travel Charger USBA Fast Rate Fixed- Korea SPN5511
Travel Charger USBA Fast Rate Fixed- MEX SPN5517
Travel Charger USBA Fast Rate Fixed- Sprint Heat Sealed SPN5505
Travel Charger USBA Fast Rate Fixed- US SPN5504

6880401P39-O 151


ORDERING REPLACEMENT PARTS AND KITS: Recommended Test Equipment

A.6 Recommended Test Equipment and Tools
The following table lists the standard test equipment recommended for troubleshooting i465 units at
the field level of service.
Table: A-2. Recommended Test Tools

Description
Part Number
Battery Eliminator, Regulated NNTN5590A
Black Stick SLN7223A
Cable, Audio Jack Test NNTN5171A
Cable, SMA to N-Type RF Contact Motorola
Communications System Analyzer Motorola R-2660
Data Cable, Flash MYA2003B
Data Cable, Micro-USB SKN6238
Digital Volt-Ohm Meter Keithley 2001 or eq.
Power Supply, 0-15VDC, 0-3A S1348D
SIM Card, Reference 5185956E60
Torx Bit, T-4 Commercially available
Torx Bit, T-6 6680387A70
Torx Driver, calibrated RSX4043
Wrist Strap, Static ground NTN98 12


















152 6880401P39-O


ORDERING REPLACEMENT PARTS AND KITS: Recommended Programming Equipment
A.7 Recommended Programming Equipment
The following tables list the programming equipment and software recommended for
troubleshooting i465 units at the field level of service.

Table: A-3. Recommended Programming Equipment
Name Part Number
Description
Cable, Data, codeplug
Cable, Data, USB
RJD2005A
SKN6371A
Connects unit to the computer
for monitoring the codeplug.
Table A-3. Recommended Programming Equipment (Continued)
Cable, Data (2.5mm) TTY
Connects unit to a teletypewriter
(TTY) device for making phone
calls.
Cable, Data (for GPS interface) GPS
Connects unit to a laptop or other
device for sending location
information.
Computer, IBM PC-Compatible N/A Pentium microprocessor with:
(RSS Workstation) 32MB RAM min.; 4MB hard disk
space min.; Two serial ports and
one par al l el por t ; net wor k-
capability;
Microsoft Windows 2000,
Windows 98, or Windows NT
3.5.1 or later
Table: A-4. Recommended Software
Name Part Number
Description
Radio Service Software (RSS)
Carrier Version
Super Agent Version RVN4 121
RVN4 122
Monitors the units code plug
parameters.

iDEN Wireless Data Services Software

Programs a laptop, handheld
device, or desktop computer to use
the i465 unit as a modem to
transfer circuit or packet data.
Interactive Map Software (such as
that made by DeLorme or Microsoft)
that supports NEMA 3.0 format

Allows i465 units GPS feature to
provide approximate location data
to a laptop computer or other
device.




6880401P39-O 153




















































2007 by Motorola, Inc. 8000 W. Sunrise
Blvd. Ft. Lauderdale, FL 33322
All Rights Reserved.

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