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O 22 Murakami
O 22 Murakami
O 22 Murakami
Outline
Lithography roadmap Performance of EUV1
Evaluation of flare Ultimate resolution Contamination control
Summary
Katsuhiko Murakami
Outline
Lithography roadmap Performance of EUV1
Evaluation of flare Ultimate resolution Contamination control
Summary
Katsuhiko Murakami
NA
32nm hp 22nm hp
22nm hp 16nm hp
16nm hp 11nm hp
11nm hp 8nm hp
Our target
ArF immersion will cover 22nm-hp node with double patterning. EUV with NA0.32 - 0.35 can cover 16nm-hp node. Single generation? EUV with NA>0.4 can cover 11nm-hp node. Multiple generation
NGL Workshop 2011 Katsuhiko Murakami
July 12, 2011 4
Outline
Lithography roadmap Performance of EUV1
Evaluation of flare Ultimate resolution Contamination control
Summary
Katsuhiko Murakami
10% 6%
NA=0.25
July 12, 2011 6
PO#1
On dark area
PO#2
PO#1
On clear area
PO#2
NGL Workshop 2011 Katsuhiko Murakami
July 12, 2011 7
8.3%
MSFR
(pmRMS)
HSFR
(pmRMS)
100~140 70~130 51
70~130 70~120 50
Kirk Flare
5%
3.4% 2.6%
0%
EUV1 PO#2
HVM PO
Expectation for current best mirror
28nm
26nm
24nm
23nm
22nm
21nm
Target
20nm
19nm
18nm
17nm
16nm
Modulation down to 16nm HP is evident, however, ultimate resolution is expectedly limited by resist performance. Reference
Target
Dipole
25nm
24nm
23nm
22nm
Katsuhiko Murakami
21nm
20nm
19nm
July 12, 2011 9
BL 18 at SAGA LS SR facility
8W/cm2
1 0.98
1W/cm2
Relative reflectance
0.95
Relative reflectance
0.9
1W/cm2
8W/cm2
0.1W/cm2 0.01W/cm2
0.85
0.1W/cm2
0.002W/cm2
0.8 0 200 400 2 Cumulative dose [J/mm ] 600
Contamination modeling
Dominant contamination Dominant cleaning
Cleaning
1E-2
C6F14 (5e-5 Pa) FC3283 (5e-5 Pa) C10H22 (5e-5 Pa) (2e-2 Pa)
Modeling
Cleaning
1E-3
Contaminant
1E-4
Contamination
1 10 100 1000 EUV intensity [mW/cm2] mW/cm2 10000
1E-5
Contamination/cleaning modeling was established using data obtained from experiments in SAGA LS.
Details were presented by M. Shiraishi in the previous session as A simple modeling of carbon contamination on EUV exposure tools based on contamination experiments with synchrotron source. NGL Workshop 2011 Katsuhiko Murakami
July 12, 2011 11
EUVpower[arb.unit(log)]
Source maintenance Source maintenance Replace partial IU mirror Cleaning partial IU mirror
Source maintenance
10
11
12
13
14
15
16
NumberofpulsesirradiatedtoIU[billionpulses]
After the optimization of O2 in-situ cleaning, rapid degradation of EUV intensity was not observed.
NGL Workshop 2011 Katsuhiko Murakami
July 12, 2011 12
IUtransmittance[arb.unit] IUtransmittance[arb.unit]
MirrorCleaning
8
10
11
12
13
14
15
16
NumberofpulsesirradiatedintoIU[billionpulses] NumberofpulsesirradiatedtoIU[billionpulses]
After the optimization of O2 in-situ cleaning, transmittance of illumination optics was improved, and didnt show further degradation.
NGL Workshop 2011 Katsuhiko Murakami
July 12, 2011 13
Outline
Lithography roadmap Performance of EUV1
Evaluation of flare Ultimate resolution Contamination control
Summary
Katsuhiko Murakami
14
Imaging simulation
11 nm hp, Conv.
Conventional illumination
14nm hp, Conv.
Simulation conditions: Aerial image simulation; Dipole (R=0.2), delta CD +/10% of CD, Mask CD error +/-3% of CD, Mask contrast 1:100, Flare 5%, TIS 10%, EL+/-2%
Katsuhiko Murakami
15
Imaging simulation
11 nm hp, Dipole
Dipole illumination
14nm hp, Dipole
Dipole =0.2
D
16nm hp can be achieved with NA>0.3 and off-axis illumination. NA>=0.4 with OAI will be necessary for 11nm hp.
Simulation conditions: Aerial image simulation; Dipole (R=0.2), delta CD +/10% of CD, Mask CD error +/-3% of CD, Mask contrast 1:100, Flare 5%, TIS 10%, EL+/-2%
Katsuhiko Murakami
16
Wave front
PO trans. 4% Wave front 33m
Conventional illumination
Obscuration No Obscuration
6 mirror
EUV1
NA0.35 NA0.4X
NA0.4X
hp (nm)
Dipole illumination
Obscuration No Obscuration
1.2 1 Contrast
NA0.4X
8 mirror
NA
0.30
0.40
0.50
Design with central obscuration (CO) has advantage to increase NA. However, impact on imaging should be considered.
NGL Workshop 2011 Katsuhiko Murakami
July 12, 2011 17
6 mirror system: Relatively large WFE 6 mirror system w/co: Low WFE, high transmittance, impact of central obscuration 8 mirror system: Low WFE, low transmittance, need high-power EUV source Nikon investigation of the optimal high-NA PO design continues.
NGL Workshop 2011 Katsuhiko Murakami
July 12, 2011 18
DTI
PDI
8.21 nm
Illuminator
1.32 nm RMS
1.79 nm RMS
-4.83 nm
Supported by NEDO
July 12, 2011 19
MISTI
Test optics
Grating CCD
DR
grating pitch
DG
Periodical arrangement of pinhole groups makes fringe intensity 106 times brighter than that in a single pinhole interferometer.
NGL Workshop 2011 Katsuhiko Murakami
Demonstration of MISTI
Multi-incoherent source Talbot interferometer (MISTI)
Improved DTI method was developed so that low-brightness EUV source can be applied in collaboration with Canon and Univ. of Electro-Communications . Its good accuracy was demonstrated using 2-mirror projection optics. This method can be applied to on-body wavefront metrology of EUV exposure tools.
Measured wavefront Interferogram Repeatability: 0.02nmRMS Accuracy: 0.25nmRMS Experimental setup of MISTI using 2-mirror projection optics (HiNA-3)
1st measurement
2nd measurement
Wavefront controllability
Wavefront was intentionally changed using active mirror control system of PO. Measured wavefront change: 0.378nmRMS Predicted wavefront change: 0.369nmRMS Difference: 0.041nmRMS
Measured wavefront change Predicted wavefront change
NGL Workshop 2011
Katsuhiko Murakami
Field
R1
After the adjustment, the measured wavefront L3 was in good agreement with predicted wavefront. Wavefront error [Arb. unit]
Measured point
Summary
Lithography roadmap
Target of EUVL is 16-11nm hp node with NA>0.4.
Performance of EUV1
Flare impact on imaging was confirmed. Modulation of 16nmL/S was observed using PSM. Carbon contamination has been successfully suppressed.
Acknowledgments
EUVA NEDO METI Selete Intel SAGA Light Source Canon University of Hyogo University of Electro-Communications
Katsuhiko Murakami
25