Professional Documents
Culture Documents
Adhesive Bonded Single Lap Joint
Adhesive Bonded Single Lap Joint
Presented By: Roy Roshan Chandy M2 Machine Design, Roll No 1104 CET
CONTENTS
Introduction Adhesive bonding Vs Conventional mechanical bonding Adhesive bonded joints Configurations for adhesive bonds Causes of failure of adhesive bonds Failure mechanism of adhesive bonded joints Formulation of interfacial crack with void SERR calculation Sample problem Single notch specimen results Double notch specimen results Conclusions References
INTRODUCTION
Composite materials are being used and studied extensively today. Applications:
military aircrafts, commercial airliners, automobiles, robotics and repair of existing structures.
Composite parts are joined together using adhesives or mechanical fasteners. The transfer of load from the structure to the substructures is through the joints Strength and stress distribution of the joints need to be studied.
ADHESIVE BONDING
Adhesives can bond
most materials in common engineering use especially useful where the substrates are different materials. Adhesively bonded lap joints show smooth load transfer and have fewer points of stress concentration Such joints also show weight and cost reduction (aircraft industry) It provides good acoustic, thermal, electric insulation and liquid and gas tight sealing
Fig : (a) single lap (b) double lap (c) scarf (d) strap
FAILURE MODES
hU, hL thickness of upper and lower substrates in mm adhesive thickness in mm P applied tensile load per unit width in N/m on the right end of specimen Left end is fixed Adhesive is mostly deformed in shear. Assume that We assume that during use an interfacial crack of length Lc has developed right after the first notch there is a void where no adhesive exists between the two substrates A simplifying assumption is that prior to the application of the load P, the two substrates and the adhesive are stress free. hU, hL, are small as compared to their lengths and widths
VCCT
ASTM D3165 specimen with an initial interfacial crack of length a, virtual crack extension of length b.
SERR CALCULATION
W also equals the energy released during the virtual extension of the crack through distance b.
SERR CALCULATION
Thus for unit width of the specimen in the y-direction, the SERR is given
SAMPLE PROBLEM
Substrates are made of 2024-T3 aluminum (Eal=73 GPa, Al=0.33) bonded together with a 0.1 mm thick epoxy adhesive (Eadh=1.64 GPa, adh=0.35). Lo=50.8 mm The notch-size Ln=1.6 mm The lengths L1 and L8 of substrates outside the overlap equal to 25.4mm The length, Lv, of the void is varied hU=hL=1.6 mm. Two configurations considered: the double-notch and the single-notch( no right notch)
COMPARISON OF RESULTS
the inset labeled overlap configuration lists valuesof Li/Lo, Lv/Lo, (Lo-Li-Lv)/Lo.
the inset labeled overlap configuration lists values of Li/Lo, Lv/Lo, (Lo-LiLv)/Lo
CONCLUSIONS
SERR and the mode-mixity parameter found from results of the FSDT differ by less than 4% from the corresponding values computed from the solution of the problem by the finite element method The presence of a void and where it is located have minimal effects on values of the SERR and .
REFERENCES
Alireza Chadegani,Romesh C.Batra , Analysis of adhesive-bonded single-lap joint with an interfacial crack and a void, International Journal of Adhesion & Adhesives,2011;31:455-465 Da Silva LFM, das Neves PJC, Adams RD, Spelt JK. Analytical models of adhesively bonded jointspart I:literature survey. International Journal of Adhesion & Adhesives, 2009;29:319 30 Da Silva LFM, das Neves PJC, Adams RD, Spelt JK. Analytical models of adhesively bonded jointspart II: Comparative study. International Journal of Adhesion & Adhesives, 2009;29:331 41 Madhusudhana, K. S. and Narasimhan, R. Experimental and numerical investigations of mixed mode crack growth resistance of a ductile adhesive joint. Eng. Fract.Mech., 2002, 69(7), 865883. M D Banea and L F M da Silva, Adhesively bonded joints in composite materials: An overview, Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials Design and Applications 2009 223: 1