Professional Documents
Culture Documents
MEMS Fabrication
MEMS Fabrication
By Thomas Szychowski
MEMS overview
Micron Made
Van
Intermolecular
Fabrication Techniques
Mask
Lithography Injection molding Microstereolithography Silicon Surface Micromachining Silicon Bulk Micromachining
Mask Lithography
Use
of photo resist
Dissolves under light Hardens under light
Positive
Negative
Both
get covered with desired material, then photo resist is dissolved by a solvent
Multiple
Mask Lithography
Injection Molding
Starts
with mask lithography Metal poured over resist Resist gets dissolved Metal form is left for plastic injection molding
Injection Molding
Microstereolithography
Similar principal to mask lithography, but for 3D pieces Uses an active mask
Utilizes a photo-reactive acrylic resin Each layer image projected through a DMD(digital mirror device) Projected into the resin
Uses lenses
Resin that is illuminated, Cross-links and hardens Piece is then covered in a hardened layer
Microstereolithography
Dimensional
capabilities Lateral and Vertical resolution: 10m Maximum field size: 10.24mm x 7.68mm Structural height: up to 5mm
Microstereolithography
Microstereolithography
Uses the same process as IC fabrication Needs multiple layers to create structures Cheapest form of Micromachining Similar to lithography
Done with Crystalline silicon Constructed using etch stop planes Chemical process Anisotropic Etching
Speed dependent Directional etch in different crystallographic directions at different rates Slower directions create and etch stop plane
Sapphire Etching
Metal Mask 100m etch depth .28m/min etch rate Chlorine etching
High-Speed Etching
Questions
References
http://home.earthlink.net/~trimmerw/mems/tour.html http://home.earthlink.net/~trimmerw/mems/BM_bulk.h tml http://www.samcointl.com/apps/mems.html http://www.cmf.rl.ac.uk/latest/msl.html http://www.chemguide.co.uk/atoms/bonding/vdw.html Micromachining for Optical and Optoelectronic Systems. MING C. WU