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Micro Electrical Mechanical Systems
Micro Electrical Mechanical Systems
Sharifuddin Mondal
M.Tech in Manufacturing Tech. En.Roll:- 112604 Jaypee University Of Engineeing & Technology, Guna
CONTANTS OF PRESENTATION
Introduction MEMS fabrication techniques
Bulk micromachining Surface micromachining LIGA
Applications
INTRODUCTION
Microelectromechanical systems (MEMS) is the technology of
until it reaches its final shape. The most common method for performing bulk micromachining is via selective masking and wet chemical solvents.
Photolithography is used to transfer a pattern from a mask to the
surface.
Method of BMM Dry etching (Plasma or ion bombardment) Wet etching Chemical solvents used in BMM Potassium Hydroxide(KOH) Tetramethylammonium hydroxide(TMAH) Ethylene diamine pyrocatechol (EDP) Material used in BMM Silicon wafers Plastic Ceramic Glass
BULK MICROMACHINING
depositing thin films on a wafer, photo patterning the films, and then etching the patterns into the films.
In order to create moving, functioning machines, these layers are
alternating thin films of a structural material (typically silicon) and a sacrificial material (typically silicon dioxide). The structural material will form the mechanical elements, and the sacrificial material creates the gaps and spaces between the mechanical elements.
At the end of the process, the sacrificial material is removed, and
Materials used for deposition Silicon wafers Glass Plastic Method of SM Dry etching (Plasma etching) Wet etching(Chemical solvents) Chemical solvents used in BMM Potassium Hydroxide(KOH) Tetramethylammonium hydroxide(TMAH) Ethylene diamine pyrocatechol (EDP)
SURFACE MICROMACHINING
Final Product
(width/height)microstructures.
In the process, sensitive polymer photo resist, typically Para-
Methoxymethamphetamine (PMMA), bonded to an electrically conductive substrate, is exposed to parallel beams of high-energy rays from a synchrotron radiation source through a mask partly covered with a strong ray absorbing material. Chemical removal of exposed (or unexposed) photo resist results in a three-dimensional structure, which can be filled by the electrode position of metal. The resist is chemically stripped away to produce a metallic mold insert. The mold insert can be used to produce parts in polymers or ceramics through injection molding.
Steps of LIGA Exposure Development Electroforming Stripping Replication Method of LIGA X-Ray LIGA (High aspect ratio) U-V LIGA (Low aspect ratio) Material used in LIGA Silicon wafers Ti Cu and many other material
LIGA
APPLICATIONS
Techniques
Bulk micromachining
Applications
Pressure sensors Accelerometer IC fabrication Medical instruments TFT Thin film solar cells Modern IC (100 layers)
Surface Micromachining
OTHER TECHNIQUES
High Aspect Ratio Microstructure Technology (HARMT)
Advanced Silicon Etch(ASE)
REFERENCES
P. Rai Choudhury, MEMS and MOEMS Technology and Applications
0-8493-0826-0.
Saile, V. (2009). LIGA and its Applications. Wiley-VCH. ISBN 978-3-
527-31698-4.