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3

Static
Awareness
Seminar
Types of ESD Failures to
Electronic Devices
Catastrophic Failure
+ Device no longer operates
+ Represents 10% of ESD failures

Intermittent / Walking Wounded
+ Device is operational, but erratic and
will cause additional service calls
+ Represents 90% of ESD failures
Static Damaged Mos Transistor
DRAIN SOURCE
GATE
OXIDE LAYER
Cost of ESD damage
increases by ten (10) fold at
every process level
Component Level
Board Level
System Level
Field Service Level
$5
$500
$50
$5000
Where do you need static protection ?
Incoming inspection and test
Stores and storage
Transfer carts
Kitting
Manual and automated
insertion
Wave soldering
Equipment assembly and
test
Packaging and shipping
Repair stations
Field service
DEFINITION OF STATIC
ELECTRICITY
+ The electrification of materials through
physical contact and separation, and the
various effects that result from the
positive and negative charges so
formed.



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+
+
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+
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+
MAJOR PROBLEMS
CAUSED BY STATIC
+ Dust and Lint Attraction
+ Material Handling Problems
+ Damage to Products
+ Product Malfunction
+ Fire and Explosion Hazards
+ Shock to Personnel
Ranking of Semiconductor
Failure Causes
EOS/ESD is the #1 Cause of
Semiconductor Failure
Source : Semiconductor Reliability News, March 1993
EOS/ESD 59%
Electrical testing 3%
Oxide/passivation
failure 3%
Conductor failure 3%
Die fracture 4%
Lead short/open 7%
Wire bonds 15%
Others 6%
SEMICONDUCTOR
DEVICE SENSITIVITIES
Device Type

+ MOSFET
+ VMOS
+ NMOS
+ GaAsFET
+ EPROM
+ CMOS
+ GaAsFET
+ JFET
+ SAW
+ Op-AMP
+ Schottky Diodes
+ Film Resistors
+ Bipolar Resistors
+ ECL
+ SCR
+ SChottky TTL
Threshold Susceptivity (Volts)

10 - 100
30 - 1800
60 - 100
60 - 2000
100+
200 - 3000
25 - 50
140-7000
150-500
190-2500
300-2500
300-3000
300-7000
500+
500-1000
500-2500
HUMAN PERCEPTIONS
OF ESD
+ At 3000 volts, you can ESD


+ At 5000 volts, you can ESD


+ At 10000 volts, you can ESD
Typical Electrostatic Voltages


ELECTROSTATIC VOLTAGES
10 TO 20 PERCENT
RELATIVE HUMIDITY
65 TO 90 PERCENT
RELATIVE HUMIDITY
MEANS OF
STATIC GENERATION
WALKING ACROSS CARPET

WALKING OVER VINYL FLOOR

WORKER AT BENCH

VINYL ENVELOPES FOR WORK
INSTRUCTIONS

COMMON POLY BAG PICKED UP
FROM BENCH

WORK CHAIR PADDED WITH
POLYURETHANE FOAM
35,000

12,000

6,000

7,000


20,000


18,000
1,500

250

100

600


1,200


1,500
OWEN J. McATEER
MILITARY ELECTRONICS/COUNTERMEASURES
ELECTROSTATIC
DISCHARGE (ESD)
+ Billions of Dollars $$$ are wasted each
year because of ESD damage.
+ Millions of dollars in PC Board float is
the result of ESD damage.
DAMAGE MODES
Catastrophic Failure
+ Device no longer operates
+ Are mostly caught in-house
+ Represents 10% of ESD failures

Intermittent / Walking Wounded
+ Device is operational, but erratic and will
cause additional service calls
+ Most expensive static problem
+ Represents 90% of ESD failures
DAMAGES CAUSED BY
ESD
PROPERTIES OF STATIC
ELECTRICITY
+ A charged surface has electrical
potential energy (voltage)

+ A charged surface emanates an electric
field

+ A charged surface can produce kinetic
energy (current)
STATIC CHARGE
GENERATORS
+ Work surfaces
+ Floors
+ Chairs
+ Clothing
+ Papers and work order holders
+ Packaging materials
+PERSONNEL
DEVICE FAILURE CAN
HAPPEN AT ANY LEVEL
+ Single device
+ Circuit board
+ Product assembly
+ Field service
STATIC GENERATION
+ Triboelectric charging
+ Induction
+ Changes in capacitance
TRIBOELECTRIFICATION
+ Static Charge can be generated by
contact and separation of dissimilar
surfaces.
+ Static Charge on contacting surfaces can
be increased with addition of friction or
rubbing.
INDUCTION
+ Process of separating charges on a
material through space at a distance by
the influence of an electric field.
+ A conductor in the presence of an
electric field can acquire a charge and
hold it.
+ Non-conductors are polarized and able
to be attracted to charged surfaces (like
dust to a TV screen).
CHANGES IN
CAPACITANCE
+ Voltage on an object is greatly affected
by the capacitance of the object.
+ Capacitance can change in the
environment due to position of the
object relative to other objects in the
area.
Increase capacitance, reduces voltage.
Decrease capacitance, increases voltage.
MATERIALS
CHARACTERISTICS
+ Conductors
Allow the flow of electrons

+ Non-conductors or Insulators
Resist the flow of electrons
FACTORS AFFECTING
STATIC CHARGE
GENERATION
+ Intimacy of contact
+ Speed of separation
+ Conductivity of materials
+ Position on Triboelectric
series
MATERIALS
Air
Asbestos
Glass
Mica
Human Hair
Nylon
Wool
Fur
Lead
Silk
Aluminum
Paper
Cotton
Steel
Wood
Amber
Hard Rubber
Brass Silver
Sulfur
Polyester
Polyurethane
Polyethylene
Polypropylene
PVC
Teflon

Increasing Positive
Increasing Negative
HOW STATIC IS GENERATED
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+
+
+
+
+
+
+
Contact and Separation of Materials
5,000 Volts
4
,
0
0
0
V

3
,
0
0
0
V

2
,
0
0
0
V

STATIC FIELD EMANATES FROM CHARGED OBJECT
Fundamentals of Static
VOLTAGES associated
with static charges can
be created by :

1. Triboelectric charging
2. I nduction
3. Changes in capacitance
SCIENTIFIC BASIS :
1. Coulombs Law
* like charges repel
* opposite charges attract
2. V = Q/C
V = voltage in volts
Q = charge in coulomb
C = capacitance in
farads
Typical Voltage Variations
Monitored on a Person with No
Wrist Strap
0
500
1000
1500
Voltage
Pulse
Height
Operator
Walking
Operator
Sat Down
Feet
Raised
Feet
Lowered
Operator
Stands Up
Operator
Sat Down
850 v(max)
3200 v/sec
5000
v/sec
3800 v/sec
1400 v(max)
1550
v(max)
Time
SOLUTIONS TO STATIC
PROBLEMS
Prevention of Charge Generation
Neutralization of Charge
Dissipation of Charge
Shielding
PREVENTION
+ Static cannot be totally prevented ..........

Only Limited !!!!!
PREVENTION
+ The property of Antistaticity is related
to Prevention of static charge
generation -
=Providing surface lubricity and slightly
conducting properties usually results in
low charging properties.
DISSIPATION
+ Removal of Charge from Conductors

=Rate of dissipation controlled by
resistance to ground
=Slow rate of dissipation preferred by
most
DISSIPATION
+ Device damage models have helped
determine the need for dissipative
worksurfaces.
=Human Body Model
=Charged Device Model
=Machine Model
Human Body Model
oxide layer
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static discharge
Charged Device Model
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_
discharge
tweezers
DISSIPATION
+ Dissipation is the most important
control property in electrostatics.
+ Dissipation includes grounding of
people, worksurfaces and flooring.
+ Electrical system ground preferred over
a separate system or building ground.
IONIZATION
+ Creation of free charge in gases (usually
air).
+ Coulombs Law dictates that opposite
charges attract.
+ Ionization cancels out static charges,
one for one on surfaces.
+ Ionization must be balanced, otherwise
a charge can be added to a surface.
SHIELDING
+ Shielding is used to protect electrostatic
susceptible items when they are being
transported between Static Protected
Areas.
+ Shielding is a requirement for most
classes of components in Military and
commercial specifications.
4 RULES OF STATIC
CONTROL
+ Handle all static sensitive items at a
static safeguarded work station.
+ Transport all static sensitive items in
static protective containers.
+ Test and monitor the static control
process.
+ Make sure every party in the supply
chain follows then above 3 rules.
RULE 1 - STATIC
SAFEGUARDED WORK
AREA
+ Provides bonding and grounding for all
conductors used in the area, including
people.
+ Provides neutralization of charge on the
necessary non-conductors used in the
area.
RULE 1 - SOLUTIONS
+ Worksurface Materials
+ Flooring Materials
+ Wrist Straps
+ Shoe Grounding
+ Ionization
OHMS LAW
VOLTS
OHMS
=
AMPS
EXAMPLE:
120 VOLTS
1,000,000 OHMS
=
120 MICROAMPS
RULE 2 -
TRANSPORTATION
+ Products must be protected when they
are moved from the static safeguarded
work station.
RULE 2 - SOLUTIONS
+ Flexible packaging - shielding bags
+ Rigid containers - tote boxes, trays, card
carriers
RULE 3 - TEST
EQUIPMENT
+ Tester for Wrist/Shoe Strap.

+ Megger (high voltage meter) for
worksurfaces and flooring.

+ Charge Plate for Ionization.

RULE 4
+ Make sure everyone that is in the
supply and distribution system follows
the first 3 Rules.
+ Conduct audits on suppliers for
conformance to Operating Procedures if
necessary.
STANDARDIZATION IN
STATIC CONTROL
+ Standards setting organization exist in
the US, Europe, and Internationally.
+ The most active organizations are : ESD
Association, EIA, JEDEC.
+ The US Military also has many
standards related to Static Electricity.
ESD ASSOCIATION TEST
METHODS
+ Individual Products
Wrist straps, flooring, table mats etc.
+ Measurement Techniques
Resistance, Shielding, Charge Generation
+ Advisories
Guidelines, Practices, Procedures,
Definitions
EIA - Electronic Industry
Association
+ Packaging of Electronic Products for
Shipment - EIA 541
Specifications for materials used in
packaging materials
+ ESD Standard 625
PREREQUISITES FOR A
SUCCESSFUL STATIC
CONTROL PROGRAM
+ A full commitment on the part of top
management
+ ESD control compliance on all suppliers
+ A comprehensive in-house ESD control
program
+ Advise your customers on proper handling
+ Select a professional and knowledgeable
static control vendor
Benefits of a total static
control program
+ Reduced IC and PC board rejects
+ Reduced field service calls
+ More competitive service contract due to lower warranty costs
+ Reduced circuit board float resulting from increased IC and PC board
reliability
+ $$ Savings proportion example:
+ 5 PC boards in inventory per 1 PC board in the field can be reduced
to:
+ 3 PC boards in inventory per 1 PC board in the field
+ Reduced physical space requirements for PC
+ Savings = return on investment capital invested
+ Improved customer satisfaction (goodwill) and assure customer re-
orders.
+ Increase share of marketplace with high quality and reliable products
+ Improve profits

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