X-ray LIGA Process

Speakers: Zhao Wang and Ross Anthony

Outline
Lithography Technique Overview
LIGA Process
History and origin
X-ray Generation
X-ray Resist Material
Printing Method
Electrochemical Deposition (Electrodepostion)
Hot Embossing
Mask Preparation
Applications

Conclusion

Toward the End of Moores

Law
Ultimate limit: single-atom
transistor
Quantum mechanics
dominates when the size
keeps scaling down: Quantum
tunneling, Heisenberg
uncertainty principle
(5nm gate size)
Manufacture technique (e.g
lithography system)

Next-generation
Lithography
Current throne holder:
Visible-UV lithography, using double patterning. (10 nm)

The competitors:
1.
2.
3.
4.
5.

EUV lithography (30-40 nm)

X-ray LIGA
X-ray lithography (30nm)
Focused Ion beam lithography (30 nm)
Electron beam lithography (30 nm)
Nano-imprint lithography (N/A)
(First 22nm fabrication demonstrated by Toshiba in 2007 )

What is LIGA?
LIGA is a German acronym:
Lithopraphie(lithography),
Galvanik(electroplating),Abformung(molding)

First invented in 80s,at IMT, KIT

Highlights
High freedom to design, high aspect ratios (height vs. width),
Nearly vertical side walls, high resolution

Drawback
High cost (abandoned by the industry at beginning of 90s)

Origin of LIGA

To make super precision microstructure for nuclear reactor

Example: uranium separation nozzle(shown in the above
Figure)

LIGA Process
A. Mask Preparation (Intermediate & working
masks)

B. X-ray exposure with the working mask

C. Electrodeposition
(Female mould, a metallic structure)

D. Mass production by hot embossing

Mask Preparation
Mask fabricated by
E-beam lithography &
X-ray lithography

Au as absorber is
electrodeposited on
the Ti membrane

X-ray Generation
X-rays wavelength:0.01-10 nm.
Electromagnetic radiation emitted from an
electron moving at relativistic speed

Means of generation
1. Synchrotron Radiation
2. Undulator or Wiggler Radiation

Irradiation is extremely bright, polarized and

pulsed

Synchrotron radiation

ANKA Synchrotron at IMT

Synchrotron Radiation

Wiggler and Undulator

eBu
K
: Undulator Parameter
2 mec

K 1 : Undulator, narrow energy band, coherent interefence of E

K 1 : Wiggler, broad energy band, incorrent sum up of I

Emmited wavelength
u
1 2
2 2
i
(1

)
2
2i
2
: Observation angle

: Lorentz transform

X-ray Radiation
Radiation comparison

BESSY II Undulator

Compact Superconducting Storage

ring X-ray Source at IBM

X-ray Resist Material

PMMA
C-C bond and CH2-C
bond are broken by
the photoelectrons
and Auger
(secondary) electrons
generated by highpower X-ray,
Effect after exposure,
PMMA with high Mw
turns into PMMA with
low Mw which
dissolves faster in GG
developer

Characteristic Doses
Initial distribution of PMMA with
high Mw
(After exposure of X-ray)
Distribution at the substrate
(Lower dose limit 3.5-4 kJ/cm3)
(Development dose)
distribution at the surface
(higher dose limit 20 kJ/cm3 )
(Damage dose)

Characteristic Doses

Limit of LIGA

Shadow (Proximity)
Printing

Projection Printing ?
Limitation due to X-ray lens system
Optical lens has no contracting power for X-ray. (n1)

Compound refractive lens

Each lens contributes about 10-4 refractive index change. It is
still not practical as the focal length is on the order of meters

Projection Printing
What if we have thousands of strongly curved
lens cascaded in a ultra-short distance?
Possibly reducing focal length into order of cm or mm by
dramatically increasing the refractive index

Future X-ray
lens !!

Electrodeposition
Electrochemical deposition:
coating a metallic layer on to
another metal
1. Cu-2e Cu 2+

Cu oxided at anode

2. Cu 2+ (cation) SO-24(anion) CuSO 4 (copper sulfate)

3. Cu 2+ 2e Cu Cu 2+ deposited at cathode

Hot Embossing
(Mirothermoforming)
Hot embossing : essential for Nanoimprint Litho.
1. Pressure given to the
polymer by 2 metal
plates.
2. Inject into female mould
by heating the polymer
above the glass transition
Temp. temperature
(molding)
3. Demolding by cooling
down the polymer

Glass transition: an intermediate state between solid and liquid, commonly

oberved in the polymer or plastic materials

Hot Embossing
Wide applications of MEMS fabication

Optical
waveguide

Optical bench for a micro

spectrometer

Mask Material
Absorber needs to be able to dissipate heat
Absorbers optical and mechanical properties
must not change greatly even after long
exposure.

Material is chosen depending upon:

absorption characterstics
ease of formation
processing conditions

Absorber
Several materials can be used for the absorber:
Ni, Sn, Ta, Au, Pt

Gold and platinum offer the best absorption

Substrate
Substrates main purpose is to provide structural
support

Also needs to be able to dissipate heat

generated during exposure

Common materials are: Ti, Si3N4, Graphite, Be,

Glass

Mask Preparation
A mask consists of microstructures made of an
x-ray absorbing material placed on top of a
substrate which is transparent to x-ray radiation.

Intermediate Mask
Depending upon which substrate material is used
the process of intermediate mask deposition
differs.

Titanium is the most common process and has

been in use for the last two decades

Process begins with Si

substrate

Intermediate Mask
Carbon film is added to
substrate

2.5 um Titanium is
sputtered

Titanium undergoes wet

oxidation using alkaline
peroxide

Intermediate Mask
~2.5 um resist is added
After baking resist is
patterned using e-beam
lithography

Intermediate Mask
Resist is developed
2 um gold is
electrodeposited onto
material

Intermediate Mask
Pattern is glued to an Steel
Invar frame

Lifted off the silicon substrate

Working Mask
Begins with steel frame
Frame is thinned
Coated with 2.8 um Titanium

Working Mask
Mask is coated with ~30um
resist

Intermediate Mask is
patterned on using soft x-ray
lithography

Working Mask
Resist is developed
Followed by electrodeposition
of gold

Gold layer is ~20 um thick

Final Mask
After resist is removed mask
is ready for deep x-ray
lithography

Deep X-ray Lithography

Example of final treatment

Electroforming
When metal microstructures are
needed extra step of
electroforming is added

Microstructure is fabricated on an
electrically conducting substrate
or the microstructures are
covered with a thin layer of gold

Electro forming
Nickel is deposited onto the resist
structures until it is several
millimetres thick

Nickel mould is then stripped

from the substrate

Electroforming
Flood exposure of the resist
Resist is removed
Final mould is now ready for mass
production

Applications
Originally developed for production of Uranium
Nozzles in 1980s

Applications have since expanded

LIGA has been used to construct: Microprism,
Microlenses, resonant filters, optical lab benches
etc

Radiofrequency
Applications
Variable Capacitor

Conclusion
X-ray LIGA: a powerful lithography to achieve
extremely high resolution, high aspect ratio and
complex 3-D structure

Versatile applications: precision mechanics, microfluidic structure, photonic device, Biophotonics.

Hot Embossing allowing mass production

Relatively high cost for X-ray generation and mask
preparation

Conventional optical system needed

Reference
General LIGA process description:
http://www.imt.kit.edu/english/liga.php

2010 summer course Optical Lithography at

IMT, KIT

Korvink, G., Saille, V., Tabata, O., Wallrabe, U.

(2009) LIGA and its Applications, 7th edn, WILEYVCH Verlag GmbH, Weinheim.

Thanks for your

attention!
Question??