Professional Documents
Culture Documents
Presented By:-Dibyendu Saha Dhiraj Sahu Deepak Ku. Verma
Presented By:-Dibyendu Saha Dhiraj Sahu Deepak Ku. Verma
Presented By:-Dibyendu Saha Dhiraj Sahu Deepak Ku. Verma
DIBYENDU SAHA
DHIRAJ SAHU
DEEPAK KU. VERMA
INDIAN TELEPHONE INDUSTRIES LTD
(A Government of India Undertaking)
India is among the four high growth markets in the world
for Telecom and information Technology along with China,
Brazil and Russia. Telecommunication is the rapidly growing
infrastructure industry in India. New technological developments
and regulatory demands have reshaped the global telecom
industry today,. New technological developments and regulatory
demands have reshaped the global telecom industry today.
LOGO :
LOCATION OF MANUFACTURING UNIT, REGIONAL OFFICE AND CORPORATE OFFICE
REGIONAL OFFICES AND AREA OFFICES
AHMEDABAD
BHOPAL
RO Kolkata
CALCUTTA Siliguri, Dimapur,
RO AHM KOLKATA
AO: Guwahati
Rajkot,
RO AHM Surat MUMBAI
Vadodra
AO: BHUBANESWAR
Rajkot, Surat Vadodra HYDERABAD RO Bhubaneswar
HYDERABAD AO:
RO Bhopal Ranchi, Jamshedpur
RO Bangalore AO:
AO: Indore, Raipur
Mysore, Hubli, BANGALORE
managlore, Goa
CHENNAI
RO Chennai
AO:
KOCHI Vellore, Kalpakkam, salem,
Coimbatore, Tiruchy, Madurai,
Tuticorin,Pondichery
EXPORTS
INTERNATIONAL PRESENCE AND EXPORT
ITI has exported products such as ADPCM, C-Dot MBM / SBM Switches, SMPS Power
Plant, VRLA batteries, CDMA WLL Equipments, FWTs, DG Sets, Shelters, Towers, MW Radios,
Rural Exchanges, Telephones of different types, spare cards for E-10B exchanges Single Channel VHF
Radio, Multi Access Rural Radio (Analog and Digital both) and ASICs to countries in Afghanistan,
Asia, Africa and Europe.Besides various projects in India, ITI has successfully executed turnkey
projects overseas.
•Nokia
•Samsung
•L G
•Ericson
•Siemens
•United Telecom
The following of them are the departments of the company.
used
everywhere in the world G.S.M. is the short form for Global System for
Mobile communication/Global Space for Mobile Communication.
Analog cellular system is known as 1st generation digital system. Digital
system are second generation system. The digital transmission over air
interface has a number of advantages over analog transmission. In
G.S.M. System, TDMA in a combination with FDMA is used. The usage
of each radio channel is portioned into multiple (8) time slots and each
user is assigned a specific frequency\time slot combination.
Some Version of G.S.M:-
1. G.S.M.-900(STANDARD)
2. G.S.M.-1800
3. G.S.M.-1900
● Good speech quality.
● Low terminal and service cost.
● Support for international roaming.
● Ability to support handheld terminals.
● Support for range of new services and facilities.
● Spectral Efficiency.
● ISDN compatibility.
● Tele-Service: - Telephony.
● Data Service: -
-Circuit Switched Data up to 9600 bps (9.6kbps).
- G3 Facsimile-Of third generation.
- S.M.S.
● Supplementary Services:-
-Call forwarding, when subscriber is unavailable.
-Call barring for outgoing or incoming calls.
-Call identification.
-Call waiting.
-Multiparty Conversion.
Let’s take the case of G.S.M. Band frequency.
890 to 915 MHZ - Uplink Frequency
935 to 960 MHZ - Downlink Frequency
Each Uplink band & Download band is of 25 MHZ duration.
Now 25 MHZ is divided in 125 Parts. Each part is called
Channels.
1 Channel=1 ARFCN=25 MHZ 125=200KHZ
So, 1Channel=200 KHZ.
Hence each channel becomes 200 KHZ .Each person is
allocated for 1 Channel. Hence in one band of frequency 125
Persons can talk at a time.
Steps involved for the development of PCB’s are:-
•BASE MATERIAL
•CUTTING
•DRILLING
•ELECTROLESS PLATING
•PUMICING
•LAMINATION
•EXPOSURE
•DEVELOPMENT
• ELECTROPLATING
• STRIPPING
• ETCHING
• Sn - Pb STRIPPING (SOLDER STRIPPING)
• PISM (PHOTO IMAGE SOLDER MASK)
• HAL (HOT AIR LEVELLING)
• SCREEN MASKING/PRINTING
• ROUTING
• TESTING
• QUALITY CONTROL
PCB unit is meant for producing printed circuit boards of
various dimensions. The most common dimension of which
PCBs are generally made of:
240×400 Sq. mm.
280×400 Sq. mm.
300×400 Sq. mm.
300×500 Sq. mm.
300×600 Sq. mm.
The raw material used for the manufacturing of the PCB is
“COPPER CLAD
After cutting the base material to required sizes,
in order to make the surface coating of Cu even, to
remove the volatile impurities, vapours &
moistures & moreover to make the sheet plane,
the raw sheet of glass epoxy with Cu clad laminate
is baked in oven at 3 different temperatures
depending upon thickness of raw material. The
process requirement time and temperatures are
given below:
After drilling holes, burrs left over the sheet &
on the edges are removed by deburring.
Deburrring removes unwanted materials &
makes holes perfect. Also, the board surface
gets smoothened
Gem stones are crushed to powdered form which is
dissolved in a container & sprayed over the Cu sheet
to make it little rough for better lamination & for
removing any hand marks, grease or dust which may
have accumulated during the process.
The sheet prepared so far is now placed
under circuit layer (Diazo; Photo Tool)
& UV rays are passed through it. The
part through which the UV rays pass
becomes hard & the rest remains soft
(tracks).
In this process, the electroplated sheet is
passed through the solution of NaOH which
removes the hard layer or the polymerized
layer.
After stripping the polymerized layer, the Cu
becomes visible. This Cu layer is then
removed by etching. Etching is done using
Ammonical Cu solution.
The board or the sheet till now produced
consists of complete ink & copper are to be
soldered which is done using a solder.
Therefore a layer of solder is developed over
these holes by dipping the PCB in a bath of
molten solder.
In the end, quality inspection of the PCB
plate is done. Plate is visually inspected to
meet the desired specifications like
conduction area must be totally covered by
solder resist, overlapping of solder resist
must be admissible, solder must pass
adhesive test etc.
FINDINGS in Finance Department of the company facing two important problems in
their operation, the problems are improper cash management and manual accounting
system.
A. CASH MANAGEMENT PROBLEM:
The company facing the following cash management problems
1. Delay in cash collection
The company sells their products to their customers namely, BSNL and MTNL. Those
who are purchased from the company but they are failed to pay the money on time. This is
the major problem for the company.
2. Delay in payment of salary:
This is the problem due to delay in collection of money from the customers. So,
ultimately the employees are affected and they are getting their salary two months once.
3. Delay in payment to suppliers;
The company failed to pay the money to their suppliers because inefficient cash
management system.
4. Delay in other payments
Due to the improper cash management the company totally failed to pay the money to
the outsiders are in delayed manner. It affects the company reputation in the outside.