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20080701-061-LCD Lithography Process & Equipment
20080701-061-LCD Lithography Process & Equipment
Crystal
& Chips
Computing Consumer
CRT 視訊市場
•TV
Flat-CRT
LED
資訊市場
顯 OLED
•Monitor
•NB
示
器 PDP
可攜式市場
LCD •手機
FPD
•PDA
LED:Light Emission Diode VFD •DSC
OLED:Organic Light Emission Diode •DVC
VFD: Vacuum Fluorescence Display FED
FED: Field Emission Display •Car Display
SED: Surface-conduction Emission Display •Screen Phone
SED •e-Book
Charles Kao, 2005/5/30 5/50
TFT-LCD : A High Growth Industry
從 1998 到 2007 年 , 產值將成長八倍 !
US$ billions 55.8
52.9
55 45.3
50
45 35.5
40
28.5
35
22.4
30 16.8
13.4 14.7
25
20 TFT-LCD
15 6.5 產值
10
5
0
1998 1999
2000 2001
2002 2003
2004 2005 2006
2007
資料來源 : DisplaySearch, Q2/2003
G5 1100x1250
1000.0
G4 680x880 G5 1m x 1m
G3 550x670 G4
G3.5 600x720
G3
G2 370x470
G2
100.0 G1 300x400
1990 1992 1994 1996 1998 2000 2002 2004 2006
Year
Source : AUO
G4 15” x 6 30” x 2
G5 15” x 15 46” x 2
G6 15” x 30 66” x 2
畫素
主動元素
( 電晶體 )
X電 偏光板
Y 電極
極
PCB 基板
控制 IC
印刷電路板 偏光片
顯示電極
擴散板
導光板
線光源 反射板斜方晶
驅動 IC TFT 密封材料
Source 電極
Pixel Electrode
Gate Charge ITO
Operation
1) Check if Gate Line voltage
2) TFT Turn-on
3) Check if signal voltage on pixel
4) Liquid Crystal Operation
5) Change of screen display
Capacity storage
TFT
Pixel Array
GATE Pixel
SOURCE
DRAIN
a-si
Insulator
Glass
ITO Film
R G B R G B
Glass Substrate
Cr BM Film
Color Array
Red Green Blue
ITO
Glass
Black Matrix
LCD Panel 製作
COG Structure
SMT Structure
IC(Bump) FPC/Heat Seal
FPC/Heat Seal LCD Module 製作
IC: SOP;QFP
LCD LCD
Frame
PCB/PWB ACF
Charles Kao, 2005/5/30 21/50
TFT LCD Process - expand
C BM Deposit
T Thin Film Deposit Process F
Color Filter Photo Process
F 5~7
Photo-lithography Process
T Mask 製 Etch Process
製 程
程 Etch Process
RGB Coating
TFT Device Test R
Array Process G RGB Patterning
B
Alignment Layer Coat RGB Developing
L LC Alignment Process
C Inspection
Cell Process D TFT/CF Alignment
製 LC Filling Process
程
LCD Panel Test
Module Process (LCM)
Charles Kao, 2005/5/30 22/50
TFT Process
Glass GATE Electrode Insulator & a-SiDATA Electrode Passivation Pixel Electrode
H H
HSiH H
N H H
H H
H
SiN Si NSiN
B/M
SiF4
C/F
TFT 3
Fi gai
lm n
a
CLEANING
pr
oc
lm
Fi p.
e
ss
de
P.R PROCESS P.R
Stripping
CYCLE coating
g
in
t ch M
E a
l m Ex sk
Fi p.
Developer
Exposure 132x132~105x153mm
Field (φ186mm)
Reticle 6 inch
Plate 600x700 mm
alignment ≤ 0.5 µm
Charles Kao, 2005/5/30 31/50
Nikon Fx701M Stepper
Reticle Loader
System
Optical
System
Control
Rack
Stage
Plate loader
System
Charles Kao, 2005/5/30 32/50
Projection Exposure in LCD Stepper
A
B
Projection
C
D
Lens
Plate
D
C
B
A
D
B
B
C
C
A
A
D
D
B
B
C
C
A
Potting ILB
Pick & Place
Marking
• Resist Coating
Ultra fine
• Resist Striping