Chinhoyi University of Technology

Power electronics protection systems

 Lecture outline
• Thermal protection
• Designs
• Cooling methods
• Snubber circuits
 CONTIE..
Power electronics is a focus on
(1) linear power amplifiers: – for signal drive of a large
output transducer
(2) power converters: – to achieve levels of I,V required
from available I,V .
In these and other cases where large levels of power
must be handled by electronic devices, several
concepts become of considerable importance. They are:
(1) Efficiency
(2) Thermal derating
(3) Distortion
The efficiency is the fraction of the supplied power
that is actually delivered to the load. An efficiency
close to 100% is desired but not very likely. Chances
are that some power will be wasted along its route
to the load and be dissipated within the circuit.
Power dissipated within the circuit manifests itself
in the form of heat that degrades the circuit
capabilities and operational lifetime. In order to
keep the transistors out of trouble, their power–
handling capability must always be derated by the
ability of the cooling system to cool the fevered
brow of the junctions, and these constraints must
be factored into the design.
 Elementary heat transfer principles and common sense tell
us that temperature difference is
proportional to the heat, – as is generated by dissipated
power. Most of the dissipated power is released at the
vicinity of the junction of a transistor or diode, or within the
channel if the component is a FET. Assuming that the
junction temperature is of magnitude TJ and the ambient
temperature is TA, then we can make the identification

where 𝑃𝐷 is the power dissipated in the device. The constant of

proportionality𝜃𝐽𝐴 defined as the thermal resistance between junction
and the ambient medium. Thermal resistance is given in terms of
℃/𝑊. The lower the thermal resistance, the more heat can be
conducted away from the junction. Cooler junctions are happier
junctions, and live longer.
 Transistor
Transistors have a maximum rated junction temperature, 𝑇𝐽 (max), on
the order of 150 to 300℃.
𝑇𝐽 (max)should not be exceeded, or device meltdown, distortion of the
space–time continuum, or something else equally undesirable will
take place. One of the design concerns of power electronics circuits is
that 𝑇𝐽 be kept less than 𝑇𝐽 (max).

Thermal resistances.
Temperatures can be kept within reasonable limits if the
transistor has a good thermal conduction path from the
junction to the ambient medium. Since the ambient
environment is usually air, the exterior part of the thermal
path will usually be in the form of a ’heatsink’ radiator,
usually little more than a metal plate with fins.

where 𝜃𝐽𝐶 , 𝜃𝐶𝑆 , and 𝜃𝑆𝐴 are the thermal resistances of the various layers between the
junction and the ambient, consisting of junction–to–case, the case–to–sink, and the sink–to–
ambient, layers (or elements) respectively.
Schematic representation of a heat pipe
DISCUSS