Company Profile STM Inc.

Semiconductor Tapes and Materials Inc.

UV dicing tape and BG tape Supplier
Corporate Data:
STM Semiconductor Tapes and Materials Inc.
Type of Corporation
S-Corporation Products Sold:
Established
2000
Number of Employees
4 (sales office) 20 (Japan parent office) UV protective
Revenue Rank:
< $6m wafer tapes for
Key Management:
Laila Haq-Collins dicing and
Plant:
Main Facility: thinning
925 Berryessa Rd
San Jose, CA 95133
Phone 408 451 2000
Fax 408 451 2001
Supplier
Denka
Nihonbashi Mitsui Tower, 1-1
Nihonbachi-Muromachi 2-chome, Chuo-ku
Tokyo Japan
Industry Classification:
Electronic Materials MFG.
 Relationship
Tape Manufacturer

Service Model

Materials
Distributor
 Our Japanese tape manufacturer
Denki Kagaku Kougyou
Kabushiki Kaisha

Name Denki Kagaku Kougyou

Head quarter Tokyo Chuo-ku Nihonbashi
Established 1915 /1st/May
Capital USD ３７０ million （’ 0 ８ .3.31. ）

Employee ４ , ６５３ （’ 0 ８ .3.31. ）

Sales USD ３ , ６４０ million （’ 0 ８ .3.31. ）
 Products
“Denka”, Denki Kagaku Kogyo K.K. established in 1915, as a pioneer of the
Carbide chemistry, ever since, expanded the business territory from
Carbide, Calcium cyanamide, to specialty field of advanced electronic
materials and so on. Denka will keep continuous growth to the world
unknown with the proper corporate image of “the specialties and the
impression of existence” as a chemical manufacturer.

Electronic Materials
We are making contributions
to the technological innovation
of electronic products
●Tape for semiconductor
　（ Dicing tape and BG tape)
●Spherical silica
●Electronic packaging materials
Plastic processing products
We are working hard to improve
our lives through.
●Processed resin products
●Packaging materials
●Housing/Piping materials
Organic 　 Materials
We are producing products which
only DENKA can manufacture
with an integrated production
system.
●Functional resins
●Styrene-based resins
●Organic chemicals
Inorganic Materials Others
Meeting a wide range of industrial Develop new business,
needs based on our rich pursuing the possibility
limestone resources. ●Pharmaceuticals
●Special cement additives ●Vaccine
●Cement ●diagnostic reagents
●Inorganic chemicals ●Plant Engineering
●Fertilizer ●Electric supply
Back grinding tape 　　 Dicing tape
 Dicing tape
R

We sell tape for

these dicing
半導体パッケージ Applications
UV 硬化タイプ
シリコンウェハ
Package Silicon wafer
UV type
バリ低減 難接着基板 低パーティクル ダイアタッチ安定
Less burr Hard-to-mount substrates Less particle Stable die attachment

エキスパンド
凹凸基板 カット精度 Expandability
High bumped substrates Dicing accuracy

ガラス光学部品 化合物ウェハ
Optical articles Compound wafer

耐汚染性 低チッピング 一般感圧タイプ 帯電防止対応 環境対応 脱 PVC

Anti-contamination Less Chipping Non UV type Antistatic Non PVC for ecology
Dicing tape Back grind tape
customers customers
　 Customers
END
Contact
STM Inc.
sales@semiconductortapes.com
925 Berryessa Road
San Jose, CA USA 95133
Fax 408 451 2001
Phone 408 451 2000