Presentation Group:

Abdul Rahman (16-ME-109)

Amjad Perveez (16-ME-
Hira Nawaz (16-ME-
 Group of processes that removes excess material without cutting
forces.
 Means no Cutting Tool are used.
 In NTM there may not be a physical tool present.
 In NTM the tool need not to be harder than workpiece.
 Complex geometries beyond simple planar or cylindrical
features can be machined.
 Parts with extreme surface-finish and tight tolerance
requirements can be obtained.
 Delicate components that cannot withstand large cutting
forces can be machined.
 Parts can be machined without producing burrs or
inducing residual stresses. Brittle materials or materials
with very high hardness can be easily machined.
 Microelectronic or integrated circuits are possible to
mass-produce.
I. CHEMICAL MACHINING PROCESSES
II. ELECTROCHEMICAL MACHINING
PROCESSES
III. EELECTRICAL DISCHARGE MACHINING
 Chemical reaction between a liquid reagent and
the workpiece results in etching.
The general material removal steps for CHM are:
1. Cleaning
2. Masking
3. Etching
4. Stripping
o Photo-Chemical Machining
o CHEMICAL-MECHANICAL POLISHING
o IC MANUFACTURING
o ELECTRONIC ASSEMBLY
 Chemical-mechanical polishing (CMP),or chemo-
mechanical polishing,uses the synergy of chemistry
and mechanical grinding to obtain flatness on the order
of 50 nm.
Steps for IC fabrication
 Wafer production. The first step is wafer
production. ...
 Masking. To protect some area of wafer when
working on another area, a process called
photolithography is used. ...
 Etching. It removes material selectively from
the surface of wafer to create patterns. ...
 Doping. ...

 Metallization.
 The term electronic assemblyis generally reserved for
the third level of electronics manufacturing involving
the soldering of packaged ICs and other discrete
components onto PCBs using either through-hole
and/or surface mount.