ACCELEROMETERS

Shaswata Bose
17ME167
Dept. of Mechanical Engineering
NITK Surathkal
 WHAT IS AN ACCELEROMETER?

• An accelerometer is a device used to sense the absolute or

relative acceleration of a device.
• The fundamental concept behind the working of any MEMS
accelerometer is based on the deflection of a certain body
known as proof mass attached to a rigid body via springs under
acceleration
 TYPES OF ACCELEROMETERS

• All accelerometers work on the same principle, but the process by

which deflection of the proof mass is converted into electric signal
varies.
• The different types of accelerometers I have found so far:-
1. Piezoresistive
2. Capacitive
3. Tunneling
4. Resonance
BRIEF DESCRIPTION OF THE WORKING OF
SOME TYPICAL MEMS ACCELEROMETERS
 PIEZORESISTIVE MEMS ACCELEROMETERS

• In Piezoresistive accelerometers, a piezoresistive piece is embedded

in the proof mass.
• The motion of the proof mass under acceleration results in the motion
of the embedded piezoresistor which causes a change in its
resistance.
• This change in resistance can be used to determine the acceleration
acting on the setup
A schematic representation of a piezoresistive MEMS accelerometer
 CAPACITIVE MEMS ACCELEROMETERS
• In a capacitive MEMS accelerometer, the proof mass has tiny fingerlike
potrusions that constitute the metal plates of capacitors attached to a fixed
base
• As the proof mass moves under acceleration, the gap between the
capacitor plates changes, which results in a change of capacitance of the
setup.
• Using suitable electrical connections, the variation in gap between the
plates will represent the acceleration acting on the setup
• Plates like this can be arranged so that the accelerometer can read
accelerations in all the 3 directions
Schematic representation of a 3-Axis
capacitive MEMS accelerometer Perspective view of the Z proof mass to
show the Z acceleration sensing capacitors
 TUNNELING MEMS ACCELEROMETERS

• These accelerometers are used to detect minor acceleration acting

on a body
• The setup consists of a proof mass and a tunneling tip close to the
proof mass so as to allow electrons to tunnel through the air gap
between the tip and the proof mass
• When some acceleration acts on the proof mass, the tunneling gap
increases. In order to maintain the tunneling current, some actuation
mechanism can be used
• The actuation can then be converted into acceleration readings
Schematic representation of a tunneling accelerometer SEM picture of the tunneling tip
used for micro and sub-micro g measurements
 RESONANCE MEMS ACCELEROMETERS

• In these type of accelerometers, the proof mass is anchored to a rigid

base via tuning fork-like resonators. The resonators are electrically
actuated to vibrate at their resonant frequencies.
• The acceleration acts axially on the setup. This results in a shift of the
resonant frequency of the setup under axial accelerations
• This frequency variation can be used to detect the acceleration
acting on the body
Schematic representation of a resonance MEMS accelerometer
 MANUFACTURING PROCESSES FOR MEMS

• Various micromachining methods are available which can be used to

fabricate these devices, namely:-
1. Bulk micromachining
2. Surface micromachining
3. Wafer bonding
4. Deep Reactive Ion Etching(DRIE)
5. LIGA
6. Hot Embossing
 BULK MICROMACHINING

• In this process, material is removed by chemical etchants.

• The region where the material is not to be removed is covered by a
masking agent like silicon nitride
• It is of two types:- isotropic and anisotropic etching
• Difficult to control etch depth
• Etch stops are thus used to control the depth of those etches
• In the substrate
 SURFACE MICROMACHINING

• In this process, a sacrificial layer is applied on the substrate and the

pattern is etched on the layer using photolithography
• The gaps are filled then filled using Si to form the structural layer
• The rest of the sacrificial layer is removed to get the complete
product
 DEEP REACTIVE ION ETCHING (DRIE)

• In this process, the unmasked region is alternately exposed to SF6 and

C4F8 which alternately etches and covers the etch with a protective
layer.
• The anisotropy of the etch removes the base faster than the sidewall.
• Alternate etching and protective coating results in deep vertical cuts.
• The sidewalls are not smoothed and are scalloped
 LIGA
• Used to form deep, smooth and nearly vertical etches in PMMA molds, which
can then be used to form the part
• A special X-ray mask is needed for protecting the areas not to be etched
• The process is very expensive as it requires a special X-ray mask and an X-ray
synchrotron
• Sometimes, the final product is used as as a tool insert to imprint the shape of
the tool into a polymer layer.
• Electroplating of metal in the mold is then done and the polymer mold is
removed to obtain the final product
 HOT EMBOSSING

• In this method, a tool insert is fabricated using LIGA, which is then

heated along with the polymer substrate at a temperature higher
than its glass transition temperature and the tool insert is embossed in
the polymer substrate
• The system is then allowed to cool down and the polymer substrate is
then removed from the insert, which can then be used as the product
• The process needs to be performed in complete vacuum in the
absence of any impurities in order to ensure high dimensional
accuracy
THANK YOU!