SEMI S2 Guidelines

For Semiconductor
Manufacturing Equipment

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SEMI
 The Semiconductor Equipment and Materials
International (SEMI) initiated the SEMI International
Standard Program some 20 years ago in North
America

 1985, programs was included in Europe and Japan

 SEMI S2 is a minimum set of

performance based
environmental, health and safety
considerations for equipment
used in the semiconductor
manufacturing
DAS-CI / Mark Op / Services / JY Le Stum / June 1999
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SEMI
 SEMI S2 is not directly compatible with the European
Directives such as the Machine Directive for Low
Voltage Directive.

 However, there are some similarities with the

European standard e.g. EN 61010

 It is recommended to have a combination of both

requirements

DAS-CI / Mark Op / Services / JY Le Stum / June 1999

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SEMI
 SEMI S1-90 Symbols & Warnings
 SEMI S2-93A Safety Guidelines for all manufacturing
equipment
 SEMI S3-91 Heated Chemical Baths
 SEMI S4-92 Segregation of Gas Cylinders in
Cabinets
 SEMI S5-93 Flow Limiting Devices
 SEMI S6-93 Ventilation
 SEMI S8-95 Ergonomics
 SEMI S9-95 Test Methods

DAS-CI / Mark Op / Services / JY Le Stum / June 1999

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Scope SEMI S2
1. Safety Philosophy 10. Emergency Shutdown
2. General Guidelines 11. Heated Chemical Baths
3. Safety-Related Interlocks 12. Ergonomics/Human Factors
4. Chemicals 13. Robotics and Automation
5. Ionizing Radiation 14. Hazard Warning
6. Non-Ionizing Radiation 15. Earthquake Protection
7. Audio Noise 16. Documentation
8. Ventilation and Exhaust 17. Fire Protection
9. Electrical 18. Environmental

DAS-CI / Mark Op / Services / JY Le Stum / June 1999

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SEMI S2 Safety Philosophy

 Few safety standard for design and construction of
process equipment used in manufacturing of
semiconductors
 Too costly and disruptive to safely retro-fit equipment
after commissioning therefore guideline should be
used during R&D stage

 Potential hazards in the operation and maintenance of

equipment be identified and engineered out of
equipment during the design and construction phases

DAS-CI / Mark Op / Services / JY Le Stum / June 1999

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SEMI S2 Safety Philosophy

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 where identified hazards cannot be eliminated, no

single point failure or operational error should allow
immediate exposure of personnel, facilities, or
community to hazards or directly result in injury,
death, or equipment loss
 All equipment should be fail-safe or
of a fault-tolerant design
 does not provide specific design
criteria for OEMs
It is the responsibility of the user of these
guidelines to established appropriate
safety and health practices and determine
the availability of regulatory
DAS-CI / Mark Op / Services / JY Le Stum / June 1999
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General Guidelines
Meant for all semiconductor manufacturing process and test
equipment
 equipment manufacturer’s responsibility to comply
with all applicable codes and requirements
 design of the completed equipment
should be examined and a risk analysis
performed and documented by a
qualified product-safety professional
or other qualified engineering/
technical professional
(<30 days prior to shipment)

DAS-CI / Mark Op / Services / JY Le Stum / June 1999

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General Guidelines
 equipment manufacturer should ensure that its
equipment complies with laws & codes which are in
effect at the time of purchase

 equipment manufacturers who do not have an

established and active product safety program and
comprehensive understanding of safety standards
should seek professional help

DAS-CI / Mark Op / Services / JY Le Stum / June 1999

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Safety Related interlocks

 all equipment should use fail-safe hardware safety
interlocks to protect against hazards inherent in the
operation of the equipment

 when triggered, safety interlocks should

place the point of hazard area in a safe
state, and all affected safety interlock
should require individual manual
reset/restart to restore operation

DAS-CI / Mark Op / Services / JY Le Stum / June 1999

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Safety Related interlocks

 hardware safety interlocks should back up the equipment’s
operating system to ensure that, upon activation, the
equipment is brought to a safety standby condition
automatically and operator alerted immediately

 Computer hardware failure should automatically place the

equipment in safe standby mode.

 Software safety interlocks should be

backed up by hardware safety interlocks
in all cases

DAS-CI / Mark Op / Services / JY Le Stum / June 1999

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Safety Related interlocks

 the safety interlock scheme should be designed to minimize
the need to override automatic fail-safe safety interlock
systems during maintenance

 upon exiting the maintenance mode, all safety interlocks

should be automatically restored

 all equipment using >30V RMS or

42.2 volts peak, rf power, hazardous
chemical, lasers, & UV lights, as well
as radiation-generating equipment,
should be fitted with physical light
barriers
DAS-CI / Mark Op / Services / JY Le Stum / June 1999
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Electrical
Supplier should design the equipment to

 minimize the need to conduct

calibration, testing, or maintenance on
equipments that may be energized
 minimize work that must be performed on
components near exposed energized circuit
 Supplier should move as many tasks from the
“Hot Work” categories type 3, 4, and 5 to type 1
or 2 (thru’ hardware changes such as remote safe testing
points for high-voltage measurements)

DAS-CI / Mark Op / Services / JY Le Stum / June 1999

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Electrical
Types of Energized Electrical Work (“Hot Work”)

1. Equipment is fully de-energized (“electrically cold”)

2. Equipment is energized. Live circuits are covered or

insulated. Work is performed at a remote location to
preclude accidental shock

3. Equipment is energized. Live circuits are exposed and

accidental contact is possible. <30volts RMS, 42.2 volts
peak, 240 volt-amps, and 20 joules.

4. (same as type 3 with exception of >30volts RMS and/or

addition of radio frequency present)
DAS-CI / Mark Op / Services / JY Le Stum / June 1999
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Electrical
Types of Energized Electrical Work (“Hot Work”)

5. Equipment energized and measurements and adjustment

require physical entry into the equipment, or equipment
configuration will not allow clamp-on probes

Type 3 or higher electrical hazard task must be listed by their

type in equipment operation and maintenance manuals
DAS-CI / Mark Op / Services / JY Le Stum / June 1999
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Electrical
Electrical Design – NFPA 79 (detail of electrical design)
 Non conductive and/or grounded conductive physical
barriers on all area where exposed circuits are >30V RMS
or 42.2 volts peak

 Visual hazard alerts should be in accordance to SEMI S1,

ANSI Z535 or an equivalent

 Electrical wiring should be colour coded (NFPA79 &/or

EN60204)

 Circuit breaker are preferred over fuses as overcurrent

devices (reset without exposure to energized terminals, can be
safely reset by non-technical personnel)
DAS-CI / Mark Op / Services / JY Le Stum / June 1999
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Electrical
Electrical Design – NFPA 79 (detail of electrical design)
 Equipments should be provided with lockout/tagout that
comply with OSHA 29 CFR 1910.147 (Control of Hazard
Energies, Lockout/Tagout) and 29 CFR 1910.331-335
(Electrical Safety Related Work Practices)

 Lockout/tagout procedure and installation instruction

should be supplied for users as part of the
maintenance/installation instruction

 Incoming supply should terminate at the main disconnect

with lockout capabilities specified by OSHA 29 CFR
1019.147
DAS-CI / Mark Op / Services / JY Le Stum / June 1999
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Electrical
All electrical components and wiring should be designed to
conform with the most recent electrical code of the country of
use at the time of the equipment’s assembly.

 United States : NEC/NFPA 70, NFPA 79

 Japan : JIS

 Europe : IEC 950, IEC 204

DAS-CI / Mark Op / Services / JY Le Stum / June 1999

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Emergency Shutdown
All equipment should have an ‘Emergency Off’ (EMO)
circuit that places the equipment into a safe shutdown
condition when activated (except for non stand-alone system
receiving power from end-user system)

Emergency Off circuit should :

 be of a fail safe circuit that shuts off all electrical

power to the equipment and will restrict all
hazardous potentials to the main power enclosure
upon activation

 be hardwired to the equipment’s operating system

DAS-CI / Mark Op / Services / JY Le Stum / June 1999

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Emergency Shutdown
Emergency Off, when activated, should :

 remove all hazardous voltage from the equipment

when activated

 ensure any radiation sources de-energized or totally

contained

 require manual resetting, power cannot be restored

automatically

 ensure that resetting of the EMO switch should not

re-energize the equipment

 Take precedence over all other controls

DAS-CI / Mark Op / Services / JY Le Stum / June 1999
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Emergency Shutdown
All “Emergency Off” should :

 be red, palm or mushroom shaped

 be of self-latching type

 be accompanied by a yellow background label

marked “Emergency Off”

 NOT used in place of “Stop” or “Off” switches

 be clearly labeled and easily accessible from

operating and maintenance locations

DAS-CI / Mark Op / Services / JY Le Stum / June 1999

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Emergency Shutdown
All “Emergency Off” should :

 be made available when any operation or

maintenance location is > 3meter from a button or
there is a physical barrier between work location
and a button (additional EMO buttons)

 be located in an area not subjected to accidental

activation

 require a guard, its diameter should be no < 75mm

with the button recessed no > than 3mm from the
front of the guard, or of equivalent configuration to
allow for palm activation
DAS-CI / Mark Op / Services / JY Le Stum / June 1999
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Emergency Shutdown
“Emergency Stop”

Automated equipment and systems having hazardous

mechanical interfaces may require E-stop control that
removes physical hazard at the interface but do not shut off
the associated equipment

“Emergency Off”

Should be installed where equipment is likely to be

integrated and share hazardous with other assemblies in the
end-user’s facility

DAS-CI / Mark Op / Services / JY Le Stum / June 1999

 A universal product for I
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protection

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personnel
We, at Schneider Electric,
has a complete solution
for your safety needs

It is our responsibility to
assist you in establishing an
appropriate safety and health
practices during the design
and fabrication of
semiconductor equipments

The ISO 9001

certification
guarantees a high
level of quality and
reliability.

DAS-CI / Mark Op / Services / JY Le Stum / June 1999