Electronic Ceramics

By: Marvel Mathias

Reg No. 100926019
INTRODUCTION
 Electronic ceramics describes a class of inorganic, non
metallic materials utilized in the electronic industry.
 The polycrystalline inorganic solids comprised of randomly
oriented grains are intimately bonded together.
 Electronic ceramics are often combined with metals and
polymers to meet requirements of high technology
applications, computers, telecommunications, sensors and
actuators.
PROPERTIES
 Insulating property
 Electrical conductivity
 Dielectric strength

 Superconducting properties
 Piezoelectric properties
 Magnetic properties
MANUFACTURING METHOD
The following steps are followed:
 Powder preparation

 Powder processing
 Green forming

 Densification
Powder Preparation
 Mixing/ Calcination

 Co-precipitation
 Hydro-thermal processing

 Metal organic decomposition

Powder Processing
 As little as possible processing is to be done to achieve the
targeted standard performance.
 Powder processing is done to remove undesirable
contaminants and other defects arising during powder
preparation.
Green forming
 Uni-axial pressing- Disk capacitors, transducers.
• It is a powder compaction method in which uni-axial pressure
applied to the powder placed in a die between two rigid punches.
 Cold isostatic pressing- Simple and complex shapes :spark plugs
• Cold isostatic pressing (CIP) is conducted at room temperature.
• A flexible (commonly polyurethane) mold immersed in a
pressurized liquid medium (commonly water) is used in the cold
isostatic pressing method.
 Colloidal casting- Complex shapes: porcelain insulators
• A polymerizable solvent was employed to disperse ceramic particles
to form a colloidal ceramic suspension with good fluidity.
• After casting, the solvent was polymerized into a polymer, resulting
in solidification of the colloidal suspension.
 Extrusion- Thin sheets, rods, tubes : thermocouple insulator,
catalytic convertor etc.
• Extrusion ram forces the ceramic paste through a die, resulting in a
long product (rods, bars, long plates, pipes) of regular cross-section,
which may be cut into pieces of required length.
Injection moulding- Small complex shapes: ZrO2-O2 sensors
• It is the method of compaction of ceramic powder fed and injected
into a mold cavity by means of a screw rotating in cylinder.
New developments in thin film electronic ceramics

MATERIAL METHODS

PT, PZT, PLZT Sol–gel, Sputtering

Diamond Chemical Vapor Deposition(CVD)

SiO2, BaTiO3 Sol-gel, Sputtering, CVD

Densification
 It is usually carried out to eliminate porosity.

Methods used are:

 Pressure less sintering

 Hot pressing

 Hot isostatic pressing

ADVANTAGES
 Chemically inert
 Able to withstand high temperature
 Less prone to corrosion

 Provide safety and stability

 Prevent component failure and electric shutdowns
 Allow flow of electricity
LIMITATIONS
 Fragile and brittle
 Weakness in tension

 Relatively poor shock resistance

 Difficult to obtain complex shapes with close tolerances which
drive up the cost.
APPLICATIONS
 Cellphones, computers, television and other consumer
electronic products.
 Ceramic spark plugs

 Ceramics help improve antennae performance. So widely

used in GPS applications.
 Used in transistors which process ones and zeros of digital
world.
 Optical fibres, disks and Resistor and sensors
displays

Substrates and insulators Piezoelectric transducers

Multilayer capacitors Hard and soft ferrites

Electronic ceramics market

 Function Material Products
Insulators Porcelain, glass, steatite High voltage insulation
Packaging Al2O3, BeO IC substrates,
Packaging(MMC’s)
Dielectric strength BaTiO3, SrTiO3, Ti02 Capacitors
Piezoelectric SiO2 Oscillators, filters,
motors, actuators, etc
Magnetic Inductors, transformers,
memory devices
Semi conductors (Ba,La)TiO3, V2O3, Solar cells, Electric
Fe2-xTixO3, heaters, pH sensor, PTC,
Mn1-x ZnOxFe
ZnO–Bi , 2O4, O -
MgCr NTC-resistors, humidity
2 3 2 4
Ni
TiO1-x Zn Fe O sensor
2, CdS,
x SiC
2 4

Conductors RuO2, NaAl11O17, Zr1- Resistors, solid

2xY2xO2-x,
electrolytes, oxygen
Yba2Cu3O7-δ; sensors,
superconductors
Electronic ceramic insulator

Ceramics used in lamps, temp.

controller
CERMETS
INTRODUCTION
The name CERMET is derived from CERamic-METallic.

CERMET is defined as “a heterogeneous combination of

metal(s) or alloy(s) with one or more ceramic phases in which

the latter constitutes approximately 15 to 85% by volume and

in which there is relatively little solubility between metallic and

ceramic phases at the preparation temperature.”

 Cermets have been around since 1929 but gained importance

in the mid 70’s due to attempts at improving performance.

COMPOSITION AND PROPERTIES
1) Refractory Oxide-Base Cermets- are cermets of metal-
bonded refractory oxides.
 Have good thermal stability and load bearing strength at high
temperatures.
 Oxide-base cermets of greatest commercial interest are chromium bonded,
alumina base materials.
 Good erosion and wear resistance.
 Excellent resistance to molten metals and oxidation.
 Refractory oxide contributes to hardness, refractoriness and resistance to
oxidation.
2) Carbide-Base Cermets
 Easier to bond, but have poor load bearing characteristics.
 Carbide base cermets include:

• Titanium carbides bonded with metals such as nickel, cobalt,

chromium and molybdenum.
• Tungsten carbide bonded with cobalt.
• Chromium carbides bonded with nickel and copper
3) Aluminide-Base Cermets- include:
 Molybdenum-bonded aluminides have good high
temperature stability and resistance to oxidation but poor
stength and thermal shock resistance.
 Nickel bonded aluminides have good thermal shock
resistance, high temperature oxidation resistance and good
ductility at room temperature but poor strength.
4) Boride-Base Cermets- are brittle and do not posses
high load bearing ability.
 Boride-base cermets include:
• Chromium-bonded molybdenum boride

• Iron-bonded Iron boride

• Iron-bonded manganese boride
• Chromium boride bonded with nickel, iron or cobalt
5) Nitride-base cermets- consist of titanium carbide and
titanium nitride bonded with chromium or a nickel-cobalt
alloy.

6) Silicide-Base Cermets- possess better strength at high

temperatures than any other types except for oxide base
cermets.
MANUFACTURING METHOD
 Cermets are fabricated by normal ceramic forming operations and
subsequent sintering.
 These operations include:

• Both cold and hot pressing,

• Extruding and

• Casting.
 Thermite process is used for bonding the ceramic and metal phases.

 The distribution of the phase determines the properties.

 Cermet protective coatings may be applied by flame spraying.
ADVANTAGES
 Good thermal shock resistance
 High strength and hardness

 Wear resistance
 Corrosion resistance
 Good electrical conductivity

 Good thermal conductivity

DISADVANTAGES
 Poor impact resistance

 Poor conformability
 Expensive
 Are difficult to machine.
APPLICATIONS
 Brake and clutch linings due to greater weights and speed of
equipment.
 Used as non lubricating bearings in the temperature range from
700-1500°F.
 Used in machining on cutting tools.
 For reducing friction in machine parts.
 Used in resistors, capacitors and vacuum tubes.
 Military applications include light weight protective coating on
clothings and friction reducing surface layer on nuclear submarines.
In bio medical industry Cutting tools

End mill with cermet

inserts
A cermet tool in a turning application
THANK YOU