Printed Circuit Board Manufacturing in At&S

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AT&S PRESENTATION 1 --
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AT&S India Private Ltd. --
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PRINTED CIRCUIT BOARD
WELCOME
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MANUFACTURING IN AT&S
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TO --
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Rashmi P.N --
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D.N. SAS-06E.03 -
www.ats.net --
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AT&S PRESENTATION 2
Contents --
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• Company overview --
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• Abstract --
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• Introduction
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• Steps involved in PCB manufacture --
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D.N. SAS-06E.03 -
www.ats.net --
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AT&S PRESENTATION 3
Company overview --
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• AT&S is India’s largest producer of PCB’s. --
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• It has its plants in Austria, India, China and Korea. --
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• AT&S has the distinction of having the following --
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certifications: --
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ISO9001 --
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ISO14001 --
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ISO18001 --
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D.N. SAS-06E.03 -
www.ats.net --
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AT&S PRESENTATION 4
Abstract --
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• A PCB contains a fiber glass epoxy board with thin copper --
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layers attached to it. --
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• A photographic process is used to etch off the copper where it --
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is not needed to connect ICs. --
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• Prior to etching, all holes are drilled in the PCB and it is --
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electroplated so that the feed through holes connect to the --
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different copper layers. --
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• Electronic parts are soldered to copper mounting pads left --
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after etching, and thin copper traces are used to connect the --
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parts. --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 5
Introduction --
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• PCB is the short form for Printed Circuit boards (It is also called --
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Printed Wiring Board). --
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• These are basically devices that provide electrical interconnections --
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and a surface for mounting electronic components. --
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• A PCB consists of tracks, holes, and pads. --
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– Tracks are basically the wiring paths. --
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– There are different kinds of holes with different diameters on the --
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PCB. --
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– The holes can be plated or non-plated. They might be via holes --
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or component holes. --
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– Pads – Depending upon the application different types of pads --
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will be which are designed by customer. --
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– Component legs are inserted through the holes in the PCB --
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& Components are soldered directly to pad areas on the --
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surface of the board. --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 6 PCB’s are classified as: --
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Single sided boards: --
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• The single sided board (SSB) has circuits on only one side of the --
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board. --
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Double sided boards: --
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• Double-sided boards have circuits formed on both sides of the --
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boards. Interconnections between different layers are made --
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through PTH (Plating Through Hole). --
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Multi layer boards: --
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• PCB with more than 2 layers are called Multi layer boards. Multi --
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layer will go upto 24 layer. Interconnections between these --
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layers are achieved through PTH. --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 7
Process Flow --
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Customer Requirement CAD/CAM Product --
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Engineering PPC Inspection (stores) Surface Prep --
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Inner Layer Process  DES Post Etch Punch AOI --
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Circubond Multi layering Pressing X-ray inspection --
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Drilling Deburring PTH &Cu Plating Outer Layer --
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Process & Photo Printing Solder Mask Surface Finish --
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Routing Final Inspection & AQL Labeling & --
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Packaging Shipping --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 8
Customer Requirement --
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• Customer Places a Requisition for production. --
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• Requisition will be in the form of Gerber Data. --
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• Gerber data includes all Product specifications like No.of --
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Layers, Surface finish, Circuit design, Material. --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 9
CAD/CAM --
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Creates Production Specifications using Gerber data. --
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Does IDS( Initial data screening) --
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Creates all the necessary Programs for: --
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-Drilling --
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-Routing & V groove --
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-AOI --
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-Photo Printing --
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-BBT --
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-FI --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 10
Product Engineering --
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• Quotation-Manual and Complete data package. --
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• Process Feasibility- Checked through MFS. --
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• First article inspection( FAI) --
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• Product Launch --
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• Generation of BOM( Bill of Material) --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 11 PPC --
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• Plans all Production Activities --
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• Prioritizes all orders based on customer requirement. --
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• Check for the availability of materials. --
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• MRP( Material Requirement Planning) using BOM --
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• Scheduling and Work centre allotment --
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• Travel Chart generation --
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• Line control-Smooth flow of product in process till dispatch. --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 12 Surface Preparation --
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• Prepares surface for Inner layer processes. --
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• Baking: The Panels are baked after getting them from stores to --
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Relieve stresses, Get the Mechanical Stability, Take away the --
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Moisture content. --
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• IL Pre-Clean --
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• Blowing & Drying --
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D.N. SAS-06E.03 -
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Surface Preparation
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• IL Pre-Clean: Includes the following. --
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Acid Clean- Sulphuric acid based clean. --
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Water rinse --
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Micro Etch- H2O2+ H2SO4used,about 1micron Cu removed. --
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Water Rinse --
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Acid Spray-H2SO4 based soln Removes Cu smut and Expose --
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active surface of Cu. --
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Blower & Drier- 40 to 70 degres. --
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D.N. SAS-06E.03 -
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Inner layer Photo Printing --
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• Tacky Cleaning: Takes place @ 42 deg celcius. --
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• Hot Rolling: Panel is Hot rolled between 98-102degrees for --
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proper bonding and cavity filling. --
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• Lamination: The ploythene cover is removed, then DFPR and --
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Mylar will be laminated on both the sides of the panel. --
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• Exposing:. UV light is passed through the photo tool. Negative --
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photo tool is used, made of Silver Halide. Exposed area will be --
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polymerized (hardened), unexposed area remains soft. Mylar is --
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removed before entering into the next process. --
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**Polythene film b/w DFPR &Photo tool helps to check any abrasion or excess O2 --
spreading, Panel thickness Max=1.6mm and Min=.15mm, Over Exposure-Shorts --
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and Under Exposure- random opens in ckt region. --
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D.N. SAS-06E.03 -
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DES --
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• Develop: Selective removal of Un polymerized DFPR. Sodium --
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Carbonate is used. --
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• Etching: Unwanted Cu etched off using H2o2+Hcl based --
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annalyte soln. --
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• Stripping: Polymerized DFPR is stripped using a NaoH --
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solution. --
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• Water Rinse & Drying. --
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Post Etch Punch: 4pin Registration done with fiducials as ref. --
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Its directly responsible for Multilayer in pressing. Accuracy is --
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very important. --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 16 AOI --
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• AOI –Automatic Optical Inspection. --
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• It’s a comparison process, using camera and magnifying lens. --
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Defects are compared with Cam data for validation. --
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• The circuit in the board is checked for Open and Shorts. --
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• Net and Image inspection. --
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• Acceptable re-works are done. --
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D.N. SAS-06E.03 -
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Circubond --
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• Oxidation process of making the Cu process porous. --
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• Cleaner (Basic clean M Cascade rinse Activator Bond --
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Film Cascade rinse Drier. --
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• Applying an oxide film onto the surface improves bonding --
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strength, both mechanically and chemically, prevents --
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atmospheric oxidation and migration of molecules. --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 18 Lay-up and Pressing --
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• This is a process where multilayer PCB’s are made. --
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• Inner cores are attached together with epoxy in the middle --
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called Layup. --
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• Pressing of Multilayer arrangement is done by applying high --
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pressure and temperature using Al sheet, Kraft papers and --
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caul plate. --
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• Pressing in done in two ways: --
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• Hot pressing- 190deg --
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• Cold pressing-50deg(Water cooled) --
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D.N. SAS-06E.03 -
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Drilling --
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• Flash Trimming- Removal of extra Cu outside the panel. --
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• Resin de burring: Surface finish operation. Grinding tool is used. --
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Removes extra resin that occur over hole during pressing --
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• X-ray inspection: Inspects the fiducials for reference and drill the --
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stack holes for proper alignment and anti- rotation. --
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• Stacking interference: Pins are attached on the panels with base --
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plate. --
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• Coupon holes: Verification for zero correction and --
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Concentricity. --
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• Drilling: Done by calling a program from CAM using VCS. --
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• Al plate of 0.2mm thickness is placed on the panels to be drilled --
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for dissipation of heat and to minimize the burr. --
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D.N. SAS-06E.03 -
www.ats.net --
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Deburring --
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Deburring is to remove the burr and dust from the drilled hole. --
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The three stages of Deburring are: --
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• Brushing --
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• High Pressure Rinse/Ultrasonic cleaning --
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• Drier --
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D.N. SAS-06E.03 -
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PTH --
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Creates connectivity between the layers by applying Cu through --
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the holes.( 3 to5 Microns of Cu is added) --
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Processes involved in this --
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• P-Desmear --
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• CP-Conductive Polymerization --
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• CU-Copper Plating --
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D.N. SAS-06E.03 -
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Seleo Cp Process
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De Smearing: --
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• Etching: NaPS + H2So4 --
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• Triple rinse --
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• Sweller: Resin preparation for easy removal of resin. --
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• Permanganate: The permanganate etch solution removes resin --
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smear from the inner layers and cleans the hole wall surface --
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and roughness the epoxy resin surfaces. --
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• Reducer: The glass fibers can be cleaned/etched simultaneously by
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glass etching additive . --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 23 Cp-Conductive Polymerization --
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• Etching: NaPS and H2SO4 used. Roughness the hole wall and panel --
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surface. --
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• Cleaner: The chemical solution used here ensures proper wetting of the --
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hole wall surface. The temperature of about 70C is maintained here. --
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Chemicals used here are cleaner cp, sodium carbonate. --
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• Conditioner: Hole wall gets conditioned making it ready for promoter --
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attack. --
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• Adhesion Promoter: A thin layer of MnO2 is coated on the panel for --
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better bonding of Cu. Seleo Cp buffer, additives and NaoH are used. --
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• Poly Conduct: Which is non-conductive in the monomer state, becomes --
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conductive when it is polymerized, this is the basic principle employed in the --
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Seleo line. The temperature is maintained at 18oC --
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D.N. SAS-06E.03 -
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Cu Plating.
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• CGA( centre gap adjustment): Panels are adjusted between 10-12mm to --
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avoid negative effects of current density. --
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• Acid Dip: This avoids the water drag out into the plating stage. The --
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fingerprints are removed by the action of Sulphuric acid. --
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• Cu Plating: Done using Reverse Pulse plating. Electrolytic process. Around --
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3to5microns in hole, 6to7microns on surface. --
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• Reverse Pulse Plating: Avoids over plating and evolution of O2 leading to air --
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bubble development. --
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• Rinsed and dried at 50-60 deg. --
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D.N. SAS-06E.03 -
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Types of Cu Plating
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• Plate Etch route (also called as Pattern plating route). --
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• Print Etch route (also called as Panel plating route). --
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• Semi panel plate. --
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• Tin plating route --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 26 Print Etch Process --
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 Panel plating route --
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• Cu is plated on the whole panel based on the customer --
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requirement.( No flash cu plating) --
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• Electro Plating.( SAP and VCP) --
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• Scrubbing for surface preparation. --
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• Photo Printing: Panel is exposed to UV light using Negative --
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photo film. --
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• Acid Etching: Na2Co3 etches unexposed DFPR, Cupric Chloride --
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removes unexposed Cu. --
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D.N. SAS-06E.03 -
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Plate Etch --
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• Pattern plating route( P2, P3) --
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• Photo printing: Panel is exposed to UV light using Positive --
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photo film. --
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• Electro-less Cu plating( based on Customer Req) --
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• Tin Coating: Stannous sulphate is used.( 1-2 microns) etch --
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resistant to protect required Cu. --
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• Alkaline Etching: Exposed DFPR is stripped using NaoH, Cu --
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is stripped using Cupric Ammonium Sulpahte. --
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• Tin Stripper: Nitric acid is used. --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 28 Semi panel plating --
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• Pattern plating route( P2, P3) --
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• Scrubbing: Panels are scrubbed. --
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• Cu plating- 10 um cu plated (SAP/VCP)
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• Pattern Plating- Remaining Cu is plated to fulfill Cust req. --
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• Photo printing: Panel is exposed to UV light using Positive photo --
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film. --
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• Alkaline Etching: Exposed DFPR is stripped using NaoH, Cu is --
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stripped using Cupric Ammonium Sulpahte. --
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• Tin Stripper: Nitric acid is used. --
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D.N. SAS-06E.03 -
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Criteria for Panel or Pattern --
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Sln Parameter Pattern Plating Panel Plating --
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1 Board thickness 0.8 to 3.2 mm 0.8 to 1.6mm --
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2 Aspect ratio 5.33 5.33 --
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3 Base Copper Upto 5 ounce Upto 2ounce --
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4 Cap on Surface cu Not possible Possible --
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5 PFC holes NO( with zero Neg tol) YES ( with zero Neg tol) --
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6 Line width/spacing 6/6 mil-isolated tracks 5.5mil restricted by base --
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Upto 20 mil PTH cu thickness --
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7 PTh holes No limit Upto 5mm max --
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D.N. SAS-06E.03 -
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Solder Mask
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• Acid Clean- to remove surface contamination, Oxidation --
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• Water wash --
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• Pummice scrubbing: Pummice powder is used for making the --
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surface rough and better bonding of the ink. --
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• Water blast @ high pressure. --
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• Drier: 80 to 90 degrees. --
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• Coating of solder ink on the panel. Includes two processes. --
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• Screen printing & Curtain Coating. --
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D.N. SAS-06E.03 -
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Solder Mask
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Screen Printing: --
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• Resin + Hardener + BC solvent is used(0.7kg+0.35kg+30%) --
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• Screen used is 43T/cm.(Manual Operation) --
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• Ink coated & dried for 40mins. --
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• After drying ink applied on the other side n dried in Oven@ --
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80degrees. --
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• About 30microns of ink coated. (track edge=4um;top=8um) --
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• For greater than 0.35mm dia, Squeezing pressure 20 PSI --
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• Semi Matt Finish --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 32 Solder Mask --
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Curtain coating: --
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• Resin+ Hardener+ PM solvent(1.72kg+8.32kg+1.2 liters ) --
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• Preheated @ 30deg. --
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• Machine coating based on the wet wt. (Flow rate of ink is --
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adjusted) --
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• Matt finish: Even distribution of ink on the panel surface. --
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• Dried between 90-110deg. --
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Solder Mask --
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• Exposing: panel is exposed to UV light using positive film. --
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• Developing: Unexposed solder mask ink is etched using --
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Na2Co3 soln. --
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Curing: Tunnel oven-80 to 150deg, tenting jobs not done here. --
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Box Oven: 80-150 deg, tenting jobs are done here. --
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UV Bumping: Solder ink hardened by passing through UV light. --
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D.N. SAS-06E.03 -
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AT&S PRESENTATION 34 Surface Finish --
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1.HASL: --
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Micro etch: mild solder mask scum is removed in this process --
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Fluxing: It forms a film on copper surface and keep it active --
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even in a very high temperature. (Improper Fluxing results in --
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bath) --
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Solder leveling: contains molten solder (tin 63% and lead 37%) --
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Panels dipped and hot air is blown. Care taken for uniform --
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coating. Hot air is blown @ 389deg using air knives. --
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Post Cleaning: Hot water spray with Nylon brush- scrubbbed for --
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removal of excess flux, contaminants like carbon etc.. --
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Dried and inspected. (insufficient drying leads to legend peel off) --
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D.N. SAS-06E.03 -
www.ats.net --
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AT&S PRESENTATION 35 Surface finish --
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2. ENIG: --
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Acid cleaner: Deactivates Palladium residue in NPTH where ENiG not --
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required. --
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Micro etch: removes 1.5-2 microns of copper, good adhesion. --
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Hot sulphuric dip: ensures removal of entrapped micro-etch solution --
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from the partially tented holes --
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Pre dip: It acidifies surface of the panel to prevent the formation of --
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palladium hydroxide. --
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Activator: it contains palladium ion and dilute sulphuric acid --
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Electroless nickel: ENiG is deposited, Hypo Phosphite used is --
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responsible for redn of Ni from ionic to metallic stage. --
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Immersion gold: in this stage gold deposited on nickel surface by --
displacement reaction.(.06 t 0.12um) --
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Drying and Rinse. --
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D.N. SAS-06E.03 -
www.ats.net --
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Surface Finish
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3.Immersion tin: --
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• Cleaner: cleaning the surface, remove oxide layers and dust --
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• Triple rinse: cleans up the chemical residues --
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• Micro etch: Small solder scum is removed.( less poor bonding --
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between Copper and Tin) --
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• Triple rinse: Cleans up the chemical residues. --
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• Stannadip: Tin gets deposited on copper .(0.8to1.4um) by --
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displacement reaction. Thio-Urea is used to avoid Cu precipitation. --
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D.N. SAS-06E.03 -
www.ats.net --
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Surface Finish
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• Stannatech: 0.8 to 1.4 microns of tin gets coated at this stage, --
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with a dense satin finish. --
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• Crystallizer: Here temperature is reduced from 700C to 2 C.
0 --
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At this low temperature the Cu thiourea complex turns into --
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crystalline form, Cu complex is separated from the mixture using --
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filter,Thiourea is pumped back to stannatec which helps to --
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achieve required thickness of tin --
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• Constannic: Here Sn4 is converted back into Sn2 and again --
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pumped back to stannatec module --
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• Thiourea rinse: To avoid Copper precipitation on the PCB. --
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• Water rinse and dryer --
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D.N. SAS-06E.03 -
www.ats.net --
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Surface Finish
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• Legend Printing: --
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• Stencil preparation – screen used is 120 T/cm, image exposed --
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to screen using Uv light, Positive photo film used. --
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• Plugging: Plugging ink mixed and poured on the printing --
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screen, Screen printed and ink is deposited inside via holes. --
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Cured for 60 mins at 150C --
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• Legend: Done to identify the locations of the surface mounted --
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devices which will be later mounted onto the board. --
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• Peelable: Done to mask certain portion of the active region on --
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the board. Depends upon Customer requirement. --
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• Carbon Printing: A thin layer of Tamura ink is used. --
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D.N. SAS-06E.03 -
www.ats.net --
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Routing and V-Groove

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• Panels are converted into pallets --
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• V-scoring: Only straight line cuts are made,Depth upto o.4 to --
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0.6 mm is made depending on the thickness of board --
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• Routing: Both straight and contour shapes can be easily --
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achieved. Router bit tungsten carbide from 0.8 to 2.5mm --
--
bits are available. --
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4 boards are machined at a time --
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• Beveling: 30 to 40o chamfering is given to connectors --
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• Water wash --
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D.N. SAS-06E.03 -
www.ats.net --
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Bare Board Testing

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Tests for open and shorts in all circuits:- --
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For each type of panel a test jig is prepared on bed of nail --
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system. --
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Electrical grid in the machine, tests the connectivity in the --
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circuit. --
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Acceptable rework of open circuit and short circuit is done and --
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sent to final inspection. --
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D.N. SAS-06E.03 -
www.ats.net --
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Final Inspection and AQL --
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FINAL INSPECTION --
--
- Circuits are optically tested for blocked holes, routing --
--
defects. --
--
- For acceptable rework, boards are cured. --
--
-All circuits are manually inspected for defects and --
--
compared with the master circuit. --
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--
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Some of the defects found are : MOP, Alignment shift, routing --
--
defect, shorts, opens. --
--
Then Sent to AQL --
--
--
3 circuits in a lot are inspected thoroughly for the track width, --
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hole- hole distance, hole – track distance, track- track --
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distance. --
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D.N. SAS-06E.03 -
www.ats.net --
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AT&S PRESENTATION 42 Labelling, Packing andShipping --
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-
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• Lots passed in the AQL are sent to the packaging section. --
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• Circuits are hot sealed, bar coded and labeled according to --
--
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customer specifications. --
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• Then final shipment takes place. --
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D.N. SAS-06E.03 -
www.ats.net --
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Thank You
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D.N. SAS-06E.03 -
www.ats.net --

Printed Circuit Board Manufacturing in At&S

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Printed Circuit Board Manufacturing in At&S

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Routing and V-Groove

Bare Board Testing

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