INTERNSHIP REPORT

INTERNSHIP AT
AKON ELECTRONICS , BAHADURHARH

INTERNSHIP BY
kunal
THE NORTHCAP UNIVERSITY
17ECU011
 ABOUT AKON
• Since 1980, AKON has been a leading supplier of microwave
products for airborne, ground, shipboard and space
applications.
• AKON-designed hardware can be found in almost every major
EW program in the free world. Leading defense contractors
such as Lockheed Martin, Northrop Grumman, BAE Systems,
Raytheon, DRS Systems, Naval Research Laboratory, Jet
Propulsion Lab, Indian Air Force, Turkish Navy, to name just a
few have chosen AKON as their supplier of choice for tuners,
log components, frequency measurement modules, miniature
switches and filters, frequency synthesizers etc .
 AIM
• The aim of this internship was to design microwave
amplifiers .
• Microwave amplifiers undergoes three stages:-
1. Assembly Stage
2. Bonding Stage
3. Testing and Tuning Stage
 Assembly Stage
• This stage starts with a housing on which various
substrates are attached .
• Housing is made of aluminum and nickel .
• It has two sides:-
RF side
Video side
• Before starting it is cleaned with alcohol.
• It is placed on hot plate ,set at temp. 240 C and feed
thru is soldered using SN-96
• After this feed thru connections are done using 5 mil
wire and solder wire used here is SN-63 .
 Assembly Stage
• Housing is then placed in Baron Blakeslee(Cleaning
Machine) which contains boiling alcohol that removes
unwanted flux .
• It is then dried up in oven.
• It is then ready for next stage .
• Housing is then placed in Baron Blakeslee(Cleaning
Machine) which contains boiling alcohol that removes
unwanted flux .
• It is then dried up in oven.
• It is then ready for next stage .
 Epoxy
used for substrate attachment on RF and Video side

Conductive Epoxy Non-Conductive Epoxy

• Also known as Silver • Also known as Gray

Epoxy . Epoxy.
• Curing temp. is 2hr . • Curing temp. is 30
minutes.
• Used for attaching
• Used for attaching
components like
components like
capacitors , IC’s .
resistors , stand-ups ,
electrolytic capacitors.
• It is further of two types:
resin and hardener
 Video Side
• A small PCB is first attached using epoxy.
• Then all the required components such as Dyes ,
resistors , capacitors , standups as specified in the
circuit diagram are attached using their particular
epoxy on PCB.
• Positions of all the components are specified in the
circuit diagram .
 RF Side
• The design of this side is based upon the
required frequency .
• Some of the main components used on the RF
side are MM IC , standups , power divider ,
capacitors , resistors , equalizer etc which are
attached using their particular epoxy .
 Bonding Stage
• In Bonding stage interconnection between the
components is made using bonding machine .
• Bonding machine is mainly of two types:-
Veg Bonding:-It is done on RF side .
Ball Bonding:-It is done on Video side .
• After this Gap welding machine is used to weld the gaps
of capacitor .
• In bonding specified size of wire is used like 5 mil wire , 1
mil gold wire .
• After bonding , product is sent for testing and tuning.
 Testing and Tuning Stage
• Components used for testing are:
 Sweep Oscillator:-produces RF source .
 Attenuator:-to reduce RF level according to need .
 Network Analyzer:-to observe gain and other
properties .
 Detector:-product to be tested is placed between
attenuator and detector .
 DC power supply
 Multimeter
 Control Switch:-to give digital inputs .
 Testing and Tuning Stage
• It is done in two parts:-
1. Debugging - DC voltages in the components at the
video side are checked .
2. RF tuning – Various specifications like gain level ,
flatness of the signal are checked after debugging .
 Calibration
• All the testing components are calibrated according
to the specifications of each product before testing
that product .
• It is done to prevent the systematic errors like losses
due to cables .
• So to nullify all the losses, calibration is done .