Prepared by

Eng: Qais Obaid

Eng:Shama’a Alsarori
Eng:Taher Alshehari
Eng: Ahmed ALruziqi
 INTRODUCTION
An integrated circuit (IC), also called a chip or microchip, is a
semiconductor wafer on which thousands or millions of tiny
resistors, capacitors, and transistors are fabricated.

An IC can function as an amplifier, oscillator, timer, counter,

computer memory, etc.

A particular IC is categorized as linear (analog) or digital,

depending on its intended application.
Transistor Fabrication Process
 INTRODUCTION(2)
Linear ICs have continuously varying output that depends on the
input signal level. The output signal level is a linear function of the
input signal level.

Linear ICs are used as audio-frequency (AF) and radio-frequency

(RF) amplifiers. The operational amplifier (op amp) is a common
device in these applications.
 IC FABRICATION
The classifications of ICs based on fabrication are monolithic ICs
and hybrid ICs.

MONOLITHIC IC: A monolithic IC contains active and passive

devices (transistors, diodes, resistors, capacitors) that are made
in and on the surface of a single piece of a single crystal
semiconductor, such as a Silicon (Si) wafer.
 IC FABRICATION(2)
HYBRID IC: This IC is manufactured on an insulating substrate
Use some combination of thick/thin film components, monolithic
semiconductors, and other discrete parts.

The substrate is ceramic wafer on which a single or multiple

layers of conductors, resistors, and capacitors are deposited or
screened.
Repeat the process…

Oxidation

Photo-
lithography

Etching

Diffusion (Ion
Implantation)
 STEPS INVOLVED IN IC FABRICATION
1. Silicon wafer (substrate) preparation
2. Epitaxial growth
3. Oxidation
4. Photolithography
5. Diffusion
6. Ion implantation
7. Isolation technique
8. Metallization
9. Assembly processing & packaging
 WAFER MANUFACTUR

• The Silicon Crystal is Sliced by Using a Diamond-Tipped Saw

into Thin Wafers
• Sorted by Thickness
• Damaged Wafers Removed During Lapping
• Etch Wafers in Chemical to Remove any Remaining Crystal
Damage
• Polishing Smoothes Uneven Surface Left by Sawing Process
 Epitaxial growth
1. Epitaxy means growing a single crystal silicon
structure upon a original silicon substrate, so that
the resulting layer is an extension of the substrate
crystal structure.
2. The basic chemical reaction in the epitaxial
growth process of pure silicon is the hydrogen
reduction of silicon tetrachloride.

1200oC
SiCl+ 2H <-----------> Si + 4 HCl
 Oxidation
SiO2 is an extremely hard protective coating & is
unaffected by almost all reagents except by
hydrochloric acid.

Si + 2HO-----------> Si O2+ 2H2

 Field Oxide Growth

• A layer of silicon dioxide (field oxide) serves as

isolation between material between devices
manufactured on the same substrate.

field oxide

oxide

silicon substrate
 Photolithography

Two processes involved in photolithography

a) Making a photographic mask

b) Photo etching
 Photolithography

Photolithography
is a technique that
is used to define
the shape of
micro-machined
structures on a
wafer. The same
Mapping
 Ion implantation technique

1. It is performed at low temperature. Therefore, previously diffused

regions have a lesser tendency for lateral spreading.
2. In diffusion process, temperature has to be controlled over a large
area inside the oven.
Ion Implantation
 Metallization
After all diffusion and oxidation steps are
completed, metal is deposited onto
the surface of the wafer. This metal is
used to ‘wire’ the devices fabricated in
the silicon together.
 Metallization
After metallization, the wafer is completely covered by the aluminum.

It must be patterned and etched to form the actual ‘wires’ connecting

individual devices into a circuit.

Wafer after aluminum evaporation

Aluminium Metallization
Aluminium Metallization
 IC packages available

1. Metal can package.

2. Dual-in-line package.
3. Ceramic flat package.
Metal can package
 Dual-in-line package.
Dual in-line package (DIP ) is an electronic device package with a
rectangular housing and two parallel rows of electrical connecting pins.
Ceramic flat package
 Application for ICs Fabrication
• Making the pulses timer
• Making the pulses generator (oscillator)
• Making the counter
• Making the memories for storing
• Making the operational amplifier
• General using with the digital circuit