FLEXIBLE ELECTRONICS

GOVT. COLLEGE OF TECHNOLOGY,COIMBATORE

PRESENTATION BY
K.DHANUSU
S.LAKSHMI NARAYANAN
N.PRAVEEN SANKAR

Dept. of Electronics And Instrumentation

Engineering
Outline:
Introduction

Focused
 areas:
Flexible circuit boards

Flexible electronic components

Flexible display

Types of flexible circuits

Manufacturing technology

Degree of flexibility

Future for flexible electronics

Applications

Advantages and disadvantages

Conclusion

INTRODUCTION

 A technology of fabricating the

electronic circuits on a plastic substrate
A high-growth technology in the area of
electrical interconnectivity
FLEXIBLE CIRCUIT BOARDS

 FCBs are made up of polyamide , polyester

or thin sheets of glasses.
 Compact and high electrical connection
density
 Cost saving over other PCBs
Flexible electronic components

 Thin film
1. Transistors
2. Resistors…
3. Capacitors.
made by silicon Nano - -
membrane
Flexible displays

 Organic Light
Emitting Diodes
 Normally used
instead of back light
for flexible displays
Single sided flex circuits

Single conductor layer

 Access via one side
 Holes made in base for passage
interconnections
 Fabricated with or without cover
layer
Double access or back bared flex
circuits
single conductor layer
 processed to access the pattern from
both sides.
 These circuits have certain benefits
 The specialised processing
requirements limits its uses.
Manufacturing technology
 Roll to Roll (R to R)
method
 Ink jet printing
method
 Soft lithography
method
Flexible circuit make up:
Components
 Base substrate: Act as insulator -polyester
 Conductor : Electrical and
mechanic performance

 Adhesives : Bond substrate with

conductor
 Cover lay: Act as protective cover.
DEGREE OF FLEXIBILITY
While bending homogeneous sheet
 Outside surface expands
 Inside surface is compressed
 Bending strain έ
έ=d/2r
d- thickness of sheet or film
r- cylindrical radius
 Printed circuit boards must have high degree of
flexibility
Future flexible electronic product
 FPC- Notebook
computers and flip lid
mobile phones
 Electrical connection
in a three dimensional
way.
 Reduce weight up to
75%
Polymer thick film process

 Generates conductors
on FPC base film
 Screen printing on
polymer film
 Circuit traces are
created
 Keyboard, tele phone,
calculators ,etc.
  Two basic use categories of
flexible circuit applications,
Applications 1.Flex to install:
• Flex to install applications
• Represent the circuit to be
formable at the time of
assembly
• Fits into a product at
maximum ease.
2.Dynamic operation:
• Use circuits dynamic
capabilities
• Thousands of operations
Other application
 Automotive industries
 Displays and human-machine
interaction
 Energy management and
mobile devices
 Wireless systems
 Electronics embedded in the
living environment
 Biometric applications
Advantages
Foldable and bendable
Durable
Light weight
Space saving
Smaller dimensions required
High interconnectivity
Conclusion:

In future Flexible electronics will play the

major role in,
1. Entertainment
2. Security
3. Innovative applications
It will be the most demandable and preferable product
by 2020.
 Thank you

Any queries?...