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SCTT-3 (IV) - 5.metallization
SCTT-3 (IV) - 5.metallization
Metallization
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Contents
Sr No Topic
1 Solar Cell Process Flow 3-4
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Solar cell Process Flow
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Screen Printing –Purpose
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Screen Printing –Purpose
Electrodes formation at both Emitter and Base sides of the Solar Cell.
Soldering area for the module interconnects
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Overview
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Printing Line – Line View
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Printing Overview
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Printing Line- Print Machine View
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Working Principle
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Components Of Printing - Screen
3 types of Screens are used for contacts printing :
1. Back Side Bus Bars Printing with Ag (Silver) paste
2. Back Side Full coverage Printing with Al (Aluminium) paste
3. Front Side Contact Printing with Ag (Silver) Paste
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Components Of Printing - Screen
Poor Good
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Components Of Printing - Screen
Screen tension-The tension of mesh is how tightly it is stretched across your frame. It is
measure in N/cm.
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Components Of Printing - Screen
Emulsion Over Mesh- The EOM’s role is to define the shape of the pattern to be printed
onto the substrate..
The roll of the EOM is to maintain the height and weight deposition on the wafer.
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Components Of Printing - Paste
Paste- Paste is a conducting martial use to make solar cell electrical contacts. These contact
grids are made of using conductive materials (Silver and Aluminium paste)
Back Ag Paste:
• Good solderability
• For 156*156 3BB wafer weight 28mg to 32mg
• Solid content 53.5 to 55.5%
• Viscosity 45 to 70Pa.s
Al Paste:
•Low bow
•Excellent BSF formation
•For 156*156 3BB wafer weight 1.45gm to 1.70gm
•Solid content 75.5 to 79.5%
• Viscosity 30 to 60Pa.s
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Components Of Printing - Paste
Back Ag paste
• To provide electrical connection at Cell Rear Side.
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Components Of Printing - Paste
Back Al printing
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Components Of Printing - Paste
Front Ag Paste
• To create collector grid lines and silver Bus bars on Front Side of Cell.
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Components Of Printing – Consumables
Wipes – Use for cleaning. These are lint free clothes.
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Drying Furnace (Dryer)
Dryer is a furnace used for drying the paste deposited on cells.
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Parameters of dryer
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Solar Screen Printing Process
Back Ag Rear Side Back Side BSF (Al) Front Side FC (Ag)
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Screen Printing –Critical Parameters
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Process Parameters
• Snap-off Paste deposition Increase with Snap Off
• Pressure Paste deposition decrease with pressure
• Squeegee Speed Paste deposition Increase with Squeeze speed
Pressure
Snap off - 1 to 2mm
motion Pressure-55 to 75N/cm
Speed- 110 to 150mm/s
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CTQ Parameters
Critical to quality parameters to be checked/maintained during process are:
1. Weight deposition of paste
2. Finger width of front contact
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CTQ Parameters
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Screen Printing –Defects
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Defects- Incoming defects from front end
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Printing defects
Defects Causes Remedies Preventive action
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Printing defects
Defects Causes Remedies Preventive action
Over paste deposition Proper screen cleaning and Proper mix the paste.
squeegee alignment
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Printing Defects
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Printing Defects
Defects Causes Remedies Preventive action
• Screen damage due to Screen change. Check the cell properly before
breakage or dust particle & after printing.
Paste mark
• Handling the wafer with Use new gloves Remove the used dirty gloves
used gloves immediately
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Printing defects
Defects Causes Remedies Preventive action
Al-over weight Paste deposition on control Take the laydown after each
deposition. limit. printing section.
Bow Squeegee alignment Squeegee align or change Always make the squeegee on
problem squeegee. plane surface.
Cell thickness variation Control before texturisation. Check the TTV before texturing
Print Offset
Wafer size problem Check the wafer size at first
process.
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Precautions
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Fast Firing
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Purpose of Fast Firing
Fast firing furnace is used to dry the paste and to form the metallic contacts on Front
and Rear side of Solar Cell.
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Motivation
The silver contact formation to the emitter.
The passivation quality of the SiNx layer improves ⇒ higher
efficiency
Bulk Passivation by SiNx layer Hydrogen, which enter bulk at
Higher temperature
The base is doped with aluminium leading to a back surface field
that passivates the rear side ⇒ higher efficiency
The line resistance is reduced due to sintering of the silver
particles ⇒ higher efficiency
The sheet resistance of the aluminium paste is reduced ⇒ higher
efficiency
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Process Overview Drying temperature
Firing temperature
Belt Speed
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Effect of Temperature in paste and wafer contact
1) Organics in Ag paste burn 2) Glass melts, etching SiNx & dissolving Ag
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Cell Tester
MOTIVATION – Cell Testing and Sorting
Testing and Sorting is the final step in Solar cell manufacturing. It Includes
following steps:
Screen View
Electrical Parameters
Maximum Power(Pmax)
Max power peak point Point on IV curve where we get the maximum power.
Current and voltage values at this point are designated as Vmp and Imp
respectively
Pm=Imp*Vmp
Or
Pmax=Isc*Voc*FF
Power = 0 at
Isc and Voc
Electrical Parameters
Fill Factor(FF)
The Fill Factor (FF) is essentially a measure of quality of the solar cell.
If the solar cell could simultaneously deliver the maximum voltage and the maximum
current, the maximum power would be Pm = Voc ×Isc
The actual power is given by Pm= Vm×Im
The solar cell fill factor is thus defined as
Pm
FF
Voc I sc
Efficiency(η)
solar cell's energy conversion efficiency(η, "eta"), is the percentage of power
converted from absorbed light to electrical energy
Efficiency (η)= Pout from solar cell/Pin to solar cell
Pout=Isc*Voc*FF
Pin=Area of solar cell*Solar power(w/m2)
Pm Voc I sc FF
Pin incident solar power
Electrical Parameters
Series resistance ,
Rs is combination of following resistance :
Resistance to flow of electrons through the
emitter and base of solar cell.
Contact resistance between metal contact
and the silicon
Resistance of top and rear metals contacts
For Ideal solar cell Rs is considered zero
Electrical Parameters
Shunt Resistance (Rsh)
Rsh in solar cell is resistance of shortest path between emitter and base that
allows charge carriers(electrons) to recombine before they are collected at metallic
contacts.
The shunt resistance represents the loss due to surface leakage along the edge of
the cell or due to crystal defects.
For an ideal cell, Rsh would be infinite and would not provide an alternate path
for current to flow.
Camera Inspection System
Camera Inspection System is used for :
Front Print quality
Camera Image
Back Print Quality
Colour Classify
Visual Surface Defect
Camera System
Cell Sorter- Overview
Sort cells in different bins as per Electrical and Visual Quality Classification
Robotic
Arm
Bin
Colour Classification and Defects
AA grade
AD AML AL AUL
Dark-Blue Medium-Blue Light-Blue Ultralight-Blue
A Grade Cells
B Grade Cells