IPC-610G (Acceptability for Electronic Assemblies)

IPC-ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES

Prepared By:- Sanjay Sharma(CIS :- A610E & A610F, 7711B/21B, 7711C/21C)
IPC-610G (Acceptability for Electronic Assemblies)
Through Hole Technology
Through Hole technology is a method for constructing electronic circuits in which the pin-
through hole (PTH) components are inserted through holes drilled into printed circuit boards
(PCBs). The ends, or leads, are then affixed to pads on the opposite side with molten metal
solder using wave soldering or reflow soldering equipment.

Advantages of Through-hole Assembly

Through-hole mounting indicates stronger mechanical bonding and applicable for products
that are ready to suffer from mechanical stress.
Through-hole assembly is easy for manual adjustment and replacement and widely accepted
by testing and prototyping.
Disadvantages of Through-hole Assembly
Through-hole component leads go through holes on board that are time-consuming and lead
to higher cost.
Through-hole mounting also limits routing space of multilayer PCBs since drilled holes
have to cover all layers of the board.
IPC-610G (Acceptability for Electronic Assemblies)
7.1 Component Mounting
7.1.1 Component Mounting – Orientation
7.1.1.1 Component Mounting – Orientation – Horizontal
Additional criteria for horizontal mounting of axial leaded components are provided in
clauses 7.4.1 (unsupported holes) and 7.5.1 (supported holes).

Target - Class 1,2,3

• Components are centered between their lands.
• Component markings are discernible.
• Nonpolarized components are oriented so that markings all
read the same way (left-to-right or top-to-bottom).
Figure 7-1
Acceptable - Class 1,2,3
• Polarized and multilead components are oriented correctly.
• When hand formed and hand-inserted, polarization symbols
are discernible.
• All components are as specified and terminate to correct
lands.
• Nonpolarized components are not oriented so that markings all
read the same way (left-to-right or top-to-bottom).
Figure 7-2
IPC-610G (Acceptability for Electronic Assemblies)
7.1.1.1 Component Mounting – Orientation – Horizontal

Defect - Class 1,2,3

• Component is not as specified (wrong part) (A).
• Component not mounted in correct holes (B).
• Polarized component mounted backwards (C).
• Multileaded component not oriented correctly (D).

Figure 7-3
IPC-610G (Acceptability for Electronic Assemblies)
7.1.1.2 Component Mounting – Orientation – Vertical

Target - Class 1,2,3

• Nonpolarized component markings read from the top down.
• Polarized markings are located on top.

Figure 7-4

Acceptable - Class 1,2,3

• Polarized part is mounted with a long ground lead.
• Polarized marking hidden.
• Nonpolarized component markings read from bottom to top.

Figure 7-5

Defect - 1,2,3
• Polarized component is mounted backwards.
Figure 7-6
IPC-610G (Acceptability for Electronic Assemblies)
7.1.2 Component Mounting – Lead Forming
7.1.2.1 Component Mounting – Lead Forming – Bends

Figure 7-4

Acceptable - Class 1,2,3

• Polarized part is mounted with a long ground lead.
• Polarized marking hidden.
Figure 7-5 • Nonpolarized component markings read from bottom to top.

Defect - 1,2,3
• Polarized component is mounted backwards.
Figure 7-6
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