DIAMOND CHIP

SWETA SAWKAR
1CR07EC110
EC ‘B’
 INTRODUCTION
 Electronics without silicon is unbelievable.

 Today, we are using silicon for the manufacturing of

Electronic Chip's.

 But, it has many disadvantages , when it is used in power

electronic applications, such as bulk in size, slow operating
speed etc.

 Silicon chip, which has supplied several decades’ worth of

remarkable increases in computing power and speed, looks
unlikely to be capable of sustaining this pace for more than
another decade .
Continued…
 Carbon, Silicon and Germanium belong to the same
group in the periodic table.

 They have four valance electrons in their outer shell.

 Pure Silicon and Germanium are semiconductors in

normal temperature.

 So in earlier days they were used widely for the

manufacturing of electronic components.
Continued…
 But later it was found that Germanium has many
disadvantages compared to silicon, such as large reverse
current, less stability towards temperature etc.

 So the industry focused in developing electronic

components using silicon wafers.

 Now research people found that Carbon has more

advantages than Silicon.

 By using carbon as the manufacturing material, we can

achieve smaller, faster and stronger chips.
WHAT IS A DIAMOND CHIP?
 In single definition, Diamond Chip or carbon Chip is an
Electronic Chip manufactured on a Diamond structural
Carbon wafer.
OR
 It can also be defined as the Electronic
Chip manufactured using carbon as the wafer. 
 The main Carbon using
Component is ‘Carbon Nanotube’.

 They are nano size cylinder of Carbon

atoms.

 They are made of one or several

concentric walls of carbon atoms
arranged in hexagonal pattern,
measuring several tons of microns in
length and less than a few nano
metres in diameter.
Depending on how we roll it, the carbon nanotubes
properties differ….
This is how carbon chip look like…
HOW IS IT POSSIBLE?
 Firstly, diamond structural carbon is non-conducting in
nature.

 To make it conducting - doping process is performed.

 Boron--as the p-type doping Agent
 Nitrogen--as the n-type doping agent.

 This process is similar to Silicon chip manufacturing.

 But this process will take more time compared with that of
silicon because it is very difficult to diffuse through
strongly bonded diamond structure. 
 ADVANTAGES
OF DIAMOND CHIP OVER SILICON CHIP…

 Smaller Components Are Possible

 It Works At Higher Temperature

 Faster Than Silicon Chip

 Larger Power Handling Capacity

 ADVANTAGES
OF DIAMOND CHIP OVER SILICON CHIP…
 It Works At Higher Temperature

 At very high temperature, crystal structure of the

silicon will collapse.

 But diamond chip can function well in these elevated

temperatures.

 Diamond has an extremely high thermal conductivity,

can withstand high electric fields, and can be made
into a semiconductor -- ideal for power devices.
 ADVANTAGES
OF DIAMOND CHIP OVER SILICON CHIP…
 It Works At Higher Temperature (contd..)

 They can work at a temperature of up to 1000 degrees

Celsius, while silicon chips stop working above 150
degrees Celsius

 Diamond can also resist voltages up to around 200

volts, compared to around 20 volts for a silicon chip.

 Due to this power electronics, such as an inverter, can

become made much smaller in size.
 ADVANTAGES
OF DIAMOND CHIP OVER SILICON CHIP…
 Faster Than Silicon Chip

 Mobility of the electrons inside the doped diamond

structural carbon is higher than that of in the silicon
structure.

 As the size of the silicon is higher than that of carbon,

the chance of collision of electrons, with larger silicon
atoms increases as compared to carbon chip.
 ADVANTAGES
OF DIAMOND CHIP OVER SILICON CHIP…
 Larger Power Handling Capacity

 Diamond has a strongly bonded crystal structure. So

carbon chip can work under high power environment.

 It is assumed that a carbon transistor will deliver one

watt of power at rate of 100 GHZ.

 The inter phase between low power control circuit with

a high power circuit will not be needed as we can
directly connect high power circuits with a diamond
chip.
 LIMITATIONS
 Much more expensive than silicon

 A four-millimeter-square diamond substrate costs

several tens of thousands of yen compared to virtually
nothing for silicon.

 Electricity cannot travel smoothly through diamond

 Researches are seeking impurities that can be added

to aid electricity flow.
 CONCLUSION
 The chip would be most useful in devices located near
hot-burning engines.

 Thus Diamond Chip replaces the need of silicon chip in

every aspect in future generations
THANKYOU