HD_VoiceDevice selection

andStructural design
 table of
Contents

1. Electroacoustic device selection

2. Whole machine audio layout

3. Audio structuredesign
4. Echo performance test
1.Electroacoustic device selection
Sound
pressure
level
Frequenc
speaker y
response
THD+N
Sound
pressure
Frequenc
level
Electroacous y
tic device receiver
response
mainindex THD+N

Types of
Sensitive
degree
microphone Frequenc
y
response
THD+N
1.Electroacoustic deviceSelection-speaker

ITEM standard
Pressure 93 +/- 3db at 2.05 Vrms / 10 cm at 2 Khz
level
F0 850 +/- 150 Hz at 1cc
Frequen 500 Hz ~ 10 Khz
cy
respons
e
THD <15% at 800 ~ 1.2 kHz
<10% at 1.2 kHz ~ 5kHz
1.Electroacoustic deviceSelection-receiver

ITEM standard
Sound 115 +/- 3 db @ 0.7 Vrms 1Khz
pressur
e level
Frequen 300 ~ 7 kHz
cy
Frequen
respons
e cy THD
response
THD see Attachment
1.Electroacoustic deviceSelection-microphone

ITEM standard
Types of MEMS, Recommended quantity:
two
Sensitivi -38 db +/- 1 db
ty
SNR 62 db
Frequen 100 Hz ~ 10 Khz
cy
respons
e
THD+N 1 % 100 db SPL @ 1kHz
10% 120 db SPL @ 1kHz
2. Whole machineAudiolayout-speaker

Speaker at the
top

SPKAway from the

LordMIC

the
LordMI
C
7
2. Whole machineAudiolayout-viceMIC

Upper
Top of middle of
middle shell bottom
shell

8
2. Whole machineAudiolayout-the LordMIC

SPK

Distance keep
toonear awaySPK
the the
LordMI LordMI
C C
9
3. AudioStructural design-speaker

Schematic diagram of speaker cavity

Phone speakerCavity design mainly includes front sound cavity, back sound
cavity, and soundhole,dust-proofNet fouraspect
3. AudioStructural design-speaker

Speaker back soundMain influence of cavityRingtone low frequencyPart, the

impact on the high frequency part is small. The low frequency part of the ringtone
has a great influence on the sound quality. The more the low frequency peak is to
the left, the more prominent the bass.subjectiveThe sense of hearing is stronger.
As the volume of the rear cavity continues to increase, the low-frequency peak
of its frequency response curve continues to move to the left, so that the low-
frequency characteristics can be improved.

recom
mend

frequency hz
Volumecc
3. AudioStructural design-speaker

The recommended volume of the sound cavity behind the speaker is as follows:

Speaker size(mm) Minimum volume of Recommended

back cavity(cc) volume(cc)
ɸ 13 0.8 ~ 1 1
ɸ 15 1.2 ~ 1.5 1.5
ɸ 16 1.2 ~ 1.5 1.5
ɸ 18 1.5 ~ 2 2
18 * 13 1.2 ~ 1.5 1.5
15 * 11 0.8 ~ 1.2 1.2
3. AudioStructural design-speaker

speakerbeforeSound cavityDesign specification

beforeThe function of the cavity is to make the sound produce a high-frequency
cut-off frequency and correct high-frequency noise. A reasonable front cavity
design can increase the intermediate frequency and reduce the high
frequency.Noise, the design should follow:
1Anterior cavityShould be completely separated from the back cavity
2, The volume of the front cavity should be as small as possible.
3,beforeCavity wallHigh, the lower the high-frequency cut-off frequency, the
smaller the high-frequency component

The picture above shows the influence of the front cavity

frequency of the larger speaker on the frequency response
3. AudioStructural design-speaker

Sound holedesignnoteandRecommended value

1, Try not to open the sound hole in the middle, so that there will be more high
frequencies, the sound will be sharper, and the sound will not be loud in the
sense of hearing
2, The opening area should be in5%To15%In between, if the opening is too
large, the sound will appear sharp and harsh, and the opening will be too low,
which will cause the sound to be relatively small
3 、 When the sound hole has fine and dense holes, the hole distance should
not be less than1mm. Too small a pitch will cause the sound to be small and
sharp, without a three-dimensional effect
3. AudioStructural design-receiver

(1)12*06 Size rectangular earpiece

1, The front part of the earpiece and the back part need to be isolated, and the
front sound cavity is required to be sealed;
2, Sound hole areaS:4mm2<S<8mm2 ；
3, The height of the sound cavity before the earpieceH:0.7mm<H<1.0mm;

(2)diameter13mm,8mmRound earpiece
1, The front part of the earpiece and the back part need to be isolated, and the
front sound cavity is required to be sealed;
2, Sound hole areaSApproximately2Square millimeter:1.5mm2<S<4mm2;
3, The height of the sound cavity before the earpieceH:0.7mm<H<1.0mm ；
4, The back of the handset and the shell orPCBClearanceL:L>=1mm.
3. Audio structure design-microphone

microphoneSound cavity design requirements:

1, The microphone hole must be unobstructed and not blocked;

2, The microphone is required to be sealed except for the sound receiving hole,
and the isolation from the speaker is reducedEcho ；
3, The sound hole will not be blocked by the hand or face when using the mobile
phone.

For the microphone’s sound channel design, its resonance frequency is required
to be greater than18KHz,Specific requirements are as follows:

A, Microphone sound hole diameterD 0.8mm~1.1mm ；

B, Channel lengthL L ＜ 8mm ；
C, Try to ensureMicCavity volume of rubber sleeveVTry to be as small as
4. Echo performance test

In order to obtain better call sound quality and echo cancellation effect, after satis
fying the audio layout and structure design of the previous article, use the followin
g methods to verify the structure design performance.

Open
Open and
and blockedMICSound
blockedMICSound
SLR
SLR inlet,SLRdifference30
inlet,SLRdifference30 db
db

BlockageMICInto
BlockageMICInto the
the sound
sound hole,
hole, the
the other
other party
party
Upcall
Upcall cannot
cannot hear
hear the
the sound
sound

shut
shut downEC,
downEC, BlockageMICSound
BlockageMICSound inlet,The
inlet,The other
other
Hands-free
Hands-free party
party hears
hears aa small
small echo
echo
echo
echo
THANK YOU!