Overview of Photonic Layer Functional Elements V4go

Overview of Photonic Layer
Functions
May 17th, 2012
This communication contains forward looking product development plans based on our current expectations. The actual products and/or product functionality
and timing of the product and/or product functionality releases could change materially. Production released products will be priced separately.
Objective
 Provide an overview of key photonic-layer functional elements

(switching, monitoring, amplification, filtering, multiplexing and
demultiplexing of DWDM signals). For each functional
element, the overview will address the following aspects:
– What it is, and role in the network
– Basic principle of operation
– Key Design Criteria and Figures of Merit
– Current JDSU product(s) for Cisco
– JDSU roadmap for the future
© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 2

Outline
 Introduce and Define the Photonic Layer

– Generic Photonic Terms & Concepts
 Functional Elements
– Optical Amplification (EDFAs & Raman)
– Optical Channel Monitoring (OCM) & Tunable Filtering
– ROADMs and Wavelength Selective Switching
– Super Transport Blade (functional integration of several of the
above)
– Next-generation TrueFlexTM Colorless Directionless Contentionless
Architectures

Defining the Photonic Layer
Router / P-OTP Switch

Transmission
(Routing & Signaling, Transmission, NE OAMP

Layer
Multirate DWDM Interfaces
OSC
OSC OSC OSC
OCM
O CM
WSS
1x20
WSS
1x20
WSS
1x20
WSS
1x20
Photonic
Layer
Line Amplification
WSS
1x20
WSS
1x20 Node
(Line Conditioning, OAMP)
O CM
OSC
Telemetry (OSC)
ROADM Node Signaling & OAMP
(Wavelength Switching, Line Conditioning, OAMP)
Four Basic Types of ROADMs
Tunable
Tunable
Channel
Channel
Filter
Filter
Wave
Wave
Blocker
Blocker
Tunable
Tunable (WB)
(WB)
Band
Band
Filter 2000-2004
Filter Limited Use as ROADM
Limited Use as ROADM
PLC
PLC
ROADM Wavelength
Wavelength
ROADM Selectable
2003-Present Selectable
Switch
Switch
Limited to
2005-Present (WSS)
(WSS)
2-degree nodes
Supports multi-degree
(8->20) mesh; most
versatile and
widespread ROADM in
deployment
ROADM Node – Current Generation Broadcast & Select Architecture
Tx
Tx
Tx
Tx
Rx
Tx
Rx
Rx
Rx
Tx
Tx
Tx
Tx
Tx
Tx
Tx
Tx
Tx
Power
WSS
Demux
Mux
Splitter
OCM
NORTH OCM
OCM
Mux Mux
WSS
WSS
Booster Booster
EDFA EDFA
WEST
EAST
Splitter
Splitter
Power
Power
Preamp Preamp
EDFA EDFA
Demux Demux
Raman OCM Raman
SOUTH
Demux
Mux
Power
Splitter WSS
Rx
Rx
Rx
Rx
Rx
Rx
Rx
Rx
Rx
Rx
Rx
Rx
Rx
Rx
Tx
Tx
Tx
Tx

Next-Generation TrueFlexTM
Colorless Directionless
Contentionless Architectures
Market Overview and Trends
 Higher Data Rates (100G+)

– Improved spectral efficiency = Flexible spectrum
– Improved optical performance = Isolation, Switching and IL
 Colorless, Directionless & Contentionless (CDC) capability

– Architecture change to Route and Select
– Requiring higher port count WSS’s (1x20’s)
 Coherent adoption >40G
 Broad range of other sub-systems that support the above

– Flexible Optical Channel Monitors
– Multi-Cast switching capability
– New and more complex amplifiers
With optimized size, power consumption and cost to meet the network needs
Colorless, Directionless, Contentionless and TrueFlex are
Key to Network Flexibility
 Colorless: an add/drop port’s wavelength is freely provisionable
 Directionless: an added/dropped wavelength is freely provisionable

to/from any network direction
 Contentionless: Allows multiple channels of the same wavelength

within a single add/drop module without conflict
 TrueFlex: Allows adjustable channel passband to support broader
NORTH>100Gbps
spectra of future wavelengths carrying
Mesh Node
WEST EAST
Contentionless
CDC Mux/Demux CDC Mux/Demux

T R
T R
T R
T R

TrueFlex Spectrum
 Bandwidth currency denomination size is increasing.

– 10/40 Gbps/ch yesterday, 100 Gbps/ch today, >400Gbps/ch in the future.
– Spectral width per channel required for transmission is also increasing.
 Today’s ROADMs feature pre-defined spectral transmission “windows”
that are 50Ghz apart, adequate to support up to ~10THz of bandwidth
(96 channels @ 100Gbps/channel) per fiber.
 Future ROADMs are required to offer flexible spectral transmission
windows (TrueFlex) to support spectral content of uncertain and
evolving widths at 400Gbps+…..>20THz of bandwidth per fiber.
10Gbps
400Gbps 100Gbps
400Gbps40/100Gbps 400Gbps 400Gbps
400Gbps
?? ??? ??? ???

???
CH1 CH2 CH4

CH1 CH2 CH3 CH N-1
CH93 CHCH96
CH94 CH95 N
Colorless Add/Drop Ports
 Replace mux/demux AWGs with WSS’s

– Wavelength assigned to each port is provisionable
– Operating wavelength can be remotely modified
 BUT: each Rx and Tx is fixed to a certain direction
– Limits ability to reconfigure around failures
Tx
Tx
Tx
Tx
Tx
Tx
Tx
Tx
Tx
Tx
WSS WSS
WSS
WSS
WEST EAST
Splitter
Splitter
Power
Power
WSS WSS
Rx
Rx
Rx
Rx
Rx
Rx
Rx
Rx
Rx
Rx

Colorless Add/Drop Ports
 Replace mux/demux AWGs with WSS’s

– Wavelength assigned to each port is provisionable
– Operating wavelength can be remotely modified
 BUT: each Rx and Tx is fixed to a certain direction
– Limits ability to reconfigure around failures
(new
Tx
Tx
Tx
Tx
Tx
Tx
Tx
Tx
Tx
Tx
wavelength,
same WSS WSS
transponder)
WSS
WSS
WEST EAST
Splitter
Splitter
Power
Power
WSS WSS
Rx
Rx
Rx
Rx
Rx
Rx
Rx
Rx
Rx
Rx

Directionless Add/Drop Ports
WSS
WSS
NORTH
WEST
PS
PS
WSS
WSS
SOUTH
EAST
PS
PS
Wavelength
contention – cannot WSS
PS WSS WSS
PS WSS 1xM (M=max. degree)
pass multiple
copies of the same WSS WSS
PS 1xN (N as large as
PS WSS WSS
wavelength possible)
Add/Drop Add/Drop
Tx
Tx
Tx
Tx
Tx
Tx
Rx
Rx
Rx
Rx
Rx
Rx
Bank 1 Bank 2

Directionless Add/Drop Ports
WSS
WSS
NORTH
WEST
Failure
West PS
PS
WSS
WSS
Re-
SOUTH
EAST
route
East
PS
PS
Wavelength
contention – cannot WSS
PS WSS WSS
PS WSS 1xM (M=max. degree)
pass multiple
copies of the same WSS WSS
PS 1xN (N as large as
PS WSS WSS
wavelength possible)
Add/Drop Add/Drop
Tx
Tx
Tx
Tx
Tx
Tx
Rx
Rx
Rx
Rx
Rx
Rx
Bank 1 Bank 2

Colorless, Directionless, and Contentionless
WSS
WSS
NORTH
WEST
PS
PS
WSS
WSS
SOUTH
EAST
PS
PS
Contentionless – MxN WSS or
can pass multiple equivalent
copies of same WSS WSS WSS WSS function
wavelength
Add/Drop Add/Drop
Tx
Tx
Tx
Tx
Tx
Tx
Rx
Rx
Rx
Rx
Rx
Rx
Bank 1 Bank 2

Applications of CDC Networks
 Enabled Features
– Photonic layer restoration
– Network load balancing
– Remote and proactive maintenance switching
– Transponder advance deployment and sparing
 Realized Benefits
– Higher availability of the photonic network
– Less redundancy needed at higher network layers
– Dynamically maintain most efficient use of infrastructure
– Reduce amount of manual activities, costs and associated errors
– Decrease time interval for deploying new bandwidth and services
– Lower operating costs

High Port Count WSS for Line Side Requirements
WSS
WSS
WEST EAST
WSS
WSS
To colorless & directionless add/drop To colorless & directionless add/drop
 Large number of WSS ports (≥16) to efficiently support:

– 8 or more node degrees
– Direct and loss efficient connections to CDC add/drop modules
 Inbound and outbound WSS’s reduces node express loss
– Higher system OSNR compared to a passive splitter
– Need wide flat passbands for cascadability
 Support flexible spectrum

General Building Blocks for CDC Add/Drop
Power Splitting Architecture-Demux Shown Only
WSS
WSS
WEST EAST
WSS
WSS
Amplification
Power Power Power Power Power Power Power Power

1:8 Power Splitter Splitter Splitter Splitter Splitter Splitter Splitter Splitter
Splitting
8:1 Space = 8x8

Switching WSS
Channel
Filtering
Rx Rx Rx Rx Rx Rx Rx Rx
Multicast switch
 Arrays of splitters and switches

 Suited for PLC integration
 High splitter loss requires amplification in an array format
 Difficult to scale
 Requires BW-tunable filter for flexible spectrum

Splitting
8:1 Space
Switching
Channel
Filtering

Wavelength Routing CDC
Wavelength Routing Architecture-Demux Shown Only
WSS
WSS
WEST EAST
WSS
WSS
1:8
Wavelength WSS WSS WSS WSS WSS WSS WSS WSS
Routing
= 8x8
WSS
8:1 Space
Switching
Rx Rx Rx Rx Rx Rx Rx Rx
Wavelength Routing
 Loss is low and does not scale with port count

 Wavelength filtering integrated into WSS function
 Arrays of WSS’s and switches
1:8
Wavelength WSS WSS WSS WSS WSS WSS WSS WSS
Routing
8:1 Space
Switching

Multicast switch with coherent Rx

Splitting
8:1 Space
Switching
Coherent
Rx
• Coherent Rx allows elimination of the tunable channel filtering.

• Tunable local oscillator used to lock signal to target wavelength.
• Improved cost/power/size, lower loss (reduced amplifier cost)

Optical Channel Monitors
Optical Channel Monitors
ROADM
EDFA
95-98% 95-98%
FFC FFC
2-5% 2-5%
OCM OCM
Ch1 ChN
Ch1 ChN
1530nm 1565nm
1530nm 1565nm
 Optical Channel Monitors (OCM) provide in-situ real-time information primarily

regarding the presence of channels at various locations in the network, and the
optical power levels associated with those channels.
 Fused Fiber Couplers (FFCs) are typically used to tap a small fraction (2-5%) of
the DWDM traffic, which is then directed into the OCM. The individual channel
powers measured by the OCM are referenced back to the primary path by
precise calibration.
 Information provided by the OCM is used by network-layer software for channel
provisioning and system-level adjustments
Optical Channel Monitors - Principles of Operation
Input Filtering element Detection/Analysis
 Filter may be scanning (series) or fixed (parallel)

 Most OCMs work on this principle
– Differences arise in the technology on which the filter is
based
– Electronic design and filter characteristics are critical to
accurate performance

Scanning (Tunable) Filter OCMs
 A tunable filter with Gaussian profile is scanned over the entire band of interest (C or L)
at requested intervals of frequency/wavelength.
 The optical power measured within the filter bandwidth at each interval represents the
raw data collected.
 Algorithms are then used to interpret the raw data to calculate the optical power within
each channel or band of interest
 Scan speed is in the order of hundreds of milliseconds, to cover the entire band.
OCM
Scanning Filter
1530nm
1565nm
Optical Channel Monitors – Key Performance Criteria
 Dynamic Power Range

– Ability of the OCM to detect individual wavelength signals ranging from high power (0dBm) to
low power (-40/-50dBm) that exist simultaneously in the system.
 Spectral Range and Resolution
– Ability to monitor entire spectral range to desired level of granularity
 Power Measurement Accuracy
– Accuracy of powers reported by OCM under worst-case conditions (e.g. “weak, narrow
10Gbps channel” sandwiched between two stronger, broader 100Gbps channels).
– If OCM uses scanning filter technology, loss of spectral information due to filter
characteristics.
 Frequency Accuracy
– Primarily setting accuracy; important to make sure correct frequency range is being detected
 Acquisition Speed Power
– Speed with which OCM reports (dBm) 0
powers for all channels; drives
system response times.
-40
-50
1530nm 1565nm
Optical Power Range
OCM power error versus signal input power
2
with -55 dBm noise floor • Absolute power
1.5
1 As input optical power

Power error (dB)
decreases, effect of noise

0.5
floor becomes more
-60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5
0
0
significant
-0.5
-1
Signal input power
• Dynamic Range
Adjacent channels with high

optical power can cause over-
reporting

Filter Characteristics
 Bandwidth
– Narrow filters provide best discrimination against adjacent channel power
– Sensitivity decreases as filter narrows
– Scanning filters require more time to collect power
 Filter type
– Steep rolloff at channel edges is desirable

Simulation – Power accuracy with adjacent
channels
448 Gb/s single carrier DP 16 QAM / 75 GHz Spacing
Cross-talk level depends on:
Filter width (FWHM)

Filter shape (roll-off)
Width of spectrum
Spacing of channels
From simulated crosstalk,

contribution to power error at
10/15/20 dB relative attenuation
can be calculated (left)
Filter shape is as important a factor as FWHM

20GHz Gaussian is better than 5 GHz Fabry-Perot
Narrowest filters difficult to realize → increased cost and physical size

JDSU OCM Portfolio
100 GHz
AWG OCM • Integrated in WSS products and JDSU circuit packs
• Parallel detection for up to 44 channels
PLC technology • Power detection only
• High volume production
50/100 GHz/Flex
• Cascaded Mach-Zehnder interferometers
• Integrated in WSS or JDSU circuit pack or standalone
Tunable filter OCM • Power and wavelength reporting, channel presence detection,
peak detection
PLC technology • Qualified and in production
Flex Spectrum (in development)

• Four inputs with synchronous measurements
TrueFlex OCM TM • Configurable channel width and spacing
• Integrated in circuit pack or standalone
MEMs technology • Rapid scan time
• GA Nov 2012

AWG OCM
 Arrayed Waveguide Grating demultiplexes DWDM (100Ghz spaced)

payload into 40-48 individual wavelengths which are then monitored with a
photodetector array – parallel filter.
 Simultaneous monitoring of all 40-48 wavelengths
 AWG can only support a fixed grid spacing (i.e. 100Ghz or 50Ghz), which
must be known a priori.
 A filtering penalty (i.e. degraded power accuracy) may be incurred for high
bit rate (spectrally broad) channels due to the filter shape of the AWG
truncating the signal spectrum.

Tunable Filter (TF) OCM
Features
 Continuously settable high resolution Gaussian filter
– 50 or 100 GHz BW filters available
 Integrated in WSS or JDSU circuit pack or standalone

 Stable, precision wavelength tuning
 Power and wavelength reporting, channel presence
detection, peak detection, bandwidth detection
Flat top equivalent
 SPI and RS232 interface filter for rapid
Description power reporting
 Module footprint
– 104 x 52.5 x 16.5 mm
 Selectable scan range over > 120 C band channels
Gaussian filter for
 Power accuracy ±1.0 dB wavelength measurement
 Operating power range 0 to -50 dBm

 Scanning time 500 ms, C band
Tunable Filter OCM Optical Specifications
Current Spec
Parameter Unit
Min Typ Max
Channel Spacing GHz 50
Number of 50 GHz Channels Up to 121
Wavelength range THz 191.0 197.0
Operating power range dBm -50 0
Gaussian Filter equivalent width
GHz 20
(FWHM)
Flat Top Filter equivalent width (FWHM) GHz 44
Dark level dBm -55
Power only 0.5
Scan time Power and s
1.5
wavelength
Wavelength Reporting Accuracy GHz ±3
Adjacent channel power delta
Power Range
0 … -5 -5 … -15
Absolute Power accuracy dB
0 … -30 ± 0.7 ± 1.0
-30 … -40 ± 1.0 ± 1.5
Relative power accuracy dB 0.8
Optical Return Loss (ORL) dB 40

TrueFlexTM OCM
 Features
– Flex spectrum
– Four functionally integrated OCMs
– Continuous high resolution scanning filter
– Up to 16 band and channel configurations can be saved to
memory
– Internal reference
– SPI and RS232 interface
– Also suitable for existing systems
Module dimensions 95 x 45 x 13 mm
 Development Timeline
– Alphas May 2012
– Betas June-July 2012
– Verification complete September 2012
– GA November 2012
 Description
– Selectable scan range over 105 (50 GHz equivalent) C band
channels
– Power accuracy ±0.8 dB
– High adjacent channel isolation
– Operating power range 0 to -50 dBm
– Scanning time 250 ms, all four inputs

Flex Spectrum OCM Performance
Specification
Parameter Note Unit
Min Max
Number of inputs 4
Channel Spacing GHz Configurable
Number of ITU Channels 50 GHz Up to 105
Frequency Range THz 191.0 196.25
Operating Power Range dBm -50 0
Filter Equivalent Width FWHM GHz 20
Dark Level dBm -60 –
Frequency Reporting Accuracy GHz – ± 6.25
0 to 15 dB DR dB – ± 0.8
Absolute Power Accuracy
15.1 to 20 dB DR dB – ± 1.0
Relative Power Accuracy dB – 0.5
Power Repeatability dB – ± 0.2
Optical Return Loss dB – 30
Response Time* ms – 250
* All four ports, SPI interface

TrueFlexTM Quad OCM Design
 Continuous high resolution scanning filter

– Gaussian filter with steep sides
 Based on diffraction grating (dispersion) + MEMs (tilt tuning)
– Leverages existing product optics and design concept
 Internal reference ensures reliable performance over lifetime

 Four functionally integrated OCMs - four signals input in parallel
– Shared optics are sized to accommodate multiple beams
– Single sweep analyses all four simultaneously
– Each signal is detected and analyzed independently
– Eliminates need for input selector switch for n≤4 ports
– Reduced footprint relative to single-port OCM + external switch
 Selectable scan range over 106 (50 GHz equivalent) C band channels
– Spectrum is configurable by selection of beginning and end frequencies
– Overlapping bands may be selected if desired
– Up to 16 band and channel configurations can be saved to memory

Four Port Implementation
Detection
Spherical
Diffraction
mirror
grating
Input FAU
MEMS
mirror
Schematic view of
beams at input & output
 Four input signals are managed by fiber array (FAU)
 All four beams are swept across frequency range using a single MEMS mirror and diffraction
grating
– Conditioning and steering optics are shared
– Optics are sized to accommodate multiple beams
 Beams exit the optical block via fiber array and power is detected independently for each
Advantage of Four Input Ports
 The FS-OCM can process four independent signals in parallel – no switching, even internal to
the module
– No need for a switch on the customer card for up to four monitoring points
– Saves component cost, card space, assembly time
– Allows synchronous signal processing for attenuation control
 Sample setup is shown for 1x9 architecture
– Three high priority ports do not go through switch
• Provides faster response
• Improves accuracy
 Compare “everything muxed with switch” cycle:
1. Set switch to Port “i” and settle optically
2. Scan OCM
JDSU 1x8
3. Set switch to Port “j”
Switch
4. Scan OCM
5. Adjust WSS attenuation and settle optically
6. Repeat from “1”
JDSU
 To “Multi/simultaneous port OCM” cycle OCM
1. Set switch to Port “i” and settle optically
2. Scan OCM
3. Adjust WSS attenuation and settle optically
4. Repeat from “2” (no need to switch until final setting has been achieved)
(Assumes switch time = 10 ms, OCM scan time 250 ms, WSS attenuation time 185 ms)
• Cycle time would drop from ≈ 700 ms to ≈ 450 ms

– With OCM scan interval of 150 ms, the response time falls to 350 ms
Wavelength Selective Switches
PLC-based Product History between JDSU and Cisco
2005 2008 2010 2012

Brunello 32 Porto
ch PLC (includes FS-OCM)
ROADM
WSSM-100 (includes
AWG-OCM)
Amarone (includes
TF-OCM)
Sassacaia Fiano (includes

40 ch PLC AWG-OCM)
ROADM Future
2007 2009 2011
2003

The Wavelength Selective Switch (WSS)
 Features
– 1xN or Nx1 port device
– Independently routes each
channel to one of N ports Wavelength
wavelength Selective
– Attenuate and block channels Switch
independently (WSS)
 Supports any wavelength from

any degree to any degree
– Eliminate OEO on ring
interconnects
– Enables mesh network with in- Rx Tx
Rx Tx
service connection upgrades
AWG
AWG
Rx Tx
Rx Tx
 Equalization of Express and Add Power
Splitter WSS
channels Rx Tx
 Wide, flat passband → good

cascadability

WSS Flash Demo

The Wavelength Selective Switch (WSS)
Array of Optical Fibers

Bulk
Diffraction
Grating
Spherical
Mirror
q Example:
MEMS Mirror
Array
l
Construction  Switch Engine
• Bulk diffraction grating to spatially
spread channels
– Angular deflection of beam (q)
• Switch Engine is an array of beam selects output port
steering actuators – Pixelated along l direction for per-
• One actuator per channel channel switching
• Steers channel to desired output
port
WSS Technologies: Switching Basics
qpiano
l
qpiano
qtilt
Stack of LC & Birefringent wedges
• Each LC layer controllably rotates polarization
MEMS: Array of tilting Mirrors • Each wedge refracts the light in one of 2
• Array of tilting mirrors, tilting in 2 directions. directions based on polarization
• Continuous control of reflected beam angle. • For N LC layers, 2N discrete beam angles are
possible.
DLP
• 2-D array of tilting mirrors LCOS: Array of LC Pixels
• 2 reflected beam directions only • Phased array beam steering
• Continuous control of reflected beam angle.

MEMS Mirror Arrays
qpiano
l
qpiano
qtilt
 Array of mirrors, continuously tiltable about 2 axes

– Tilt about 2nd axis for hitless switching
 Polarization insensitive
 Low scattering, minimal number of optical surfaces

MEMS Switching Engine - Principle
 Micromirror array fabricated in silicon, using lithographic processes

leveraged from semiconductor industry
– Silicon hinges are very stable – no creep
 Voltage applied to electrode causes mirror to tilt due to electrostatic
attraction
 Attenuate by moving slightly away from port location.
– Small perturbations can result in attenuation accuracy issues
 No friction or physical contact, for high reliability
V1=0 V2=0 V1=0 V2=V

- - -
+++
GND GND
LCOS (Liquid Crystal on Silicon)
 Liquid Crystal on Silicon (LCOS) refers to a Liquid Crystal (LC) display

technology that incorporates drive circuitry in a silicon substrate
adjacent to the liquid crystal layer.
 The active substrate enables large 2D arrays of pixels to be addressed
independently, usually for display applications:
– Projectors
– Projection TV’s
– Micro-displays (for camcorder eyepieces etc.)
Polarized light
LC fluid Mirrors/electrodes
Cover glass
Epoxy seal
Silicon substrate

LCOS for Telecom
 Properties of LCOS are similar to other LC technologies.

– Slow response at low temperatures (heater required)
– Transition regions at pixel boundaries (limits spatial resolution)
– Operates only on one polarization (polarization splitting required)
 Changes required to convert an LCOS display into an LCOS for WSS:
– Longer wavelength → thicker LC fluid layer, different AR coatings
– Flicker-free response → DC or high frequency drive voltage (but
customization options may be limited), different LC fluid
– Phase modulation instead of intensity modulation → change LC fluid axis,
no polarizer
Custom AR coating
Custom LC fluid Cover glass Custom rubbing
Thicker epoxy seal direction (LC
orientation)
Silicon substrate

Beam Steering with LCOS
blue green  Multiple pixel
phase
channel channel
pixels pixels columns per
channel
 Phase pattern in
column
l determines
deflection angle
 Tilting mirror →  Phase Array →

Steers the beam by Steers the beam by
imparting a linearly imparting a linearly
increasing phase increasing phase
(modulo 2p)
Modulo 2π phase shift acts like a Phased Array

Tilting Mirror tilted mirror for a single wavelength

Liquid Crystal Switching Engine – Principle
 LC cell selectively controls the polarization state of transmitted

light by application of a control voltage
 Randomly polarized input must be separated into two orthogonal
polarizations
LC off
PBS HWP PBS

V LC on

WSS Design Basics
steering
 Spectral Resolution (R) of System actuators
d Spot Diameter = 2w
2w
Rd
Channel 2
passband
l
Larger
LargerRRBetter
BetterBandwidth
Bandwidth
 Focal Length (F) of System
dispersive l
element
(strength=G) d
steering F d
actuators
G
F F
Smaller
SmallerFF
Shorter
ShorterOptical
OpticalTrain
Train
It’s all About the Spot Size!!!
Assume
Assume2w
2wmin is the minimum spot size tolerated by the
min is the minimum spot size tolerated by the
switching
switchingengine
enginetechnology
technology
Desired
WSS Characteristic Relationship Consequence Spot
(50GHz channel spacing)
Size
Maximum Channel
Bandwidth Smaller spot size enables
Rmax µ d / 2wmin better channel bandwidth
(want large Rmax)
Minimum Actuator Larger spot sizes requires

Dimension (dmin) dmin µ R 2wmin wider actuator dimensions Small
er is
Minimum Device Size Wider actuator dimensions Bette
(want short focal length, Fmin)
Fmin µ dmin / G force longer focal lengths
r
Wider actuator dimensions
Minimum Grating Strength require higher strength
(want small Gmin) Gmin µ dmin / F gratings
(complexity increases ~exponentially
above 1200 pitch)

Minimum Spot Size vs Switch Engine Technology
Switch Engine Type Minimum Spot Limitations

Diameter
MEMS  Limited by the surface quality of
Mirror <20 mm the mirror and optical
Array aberrations
LC and  Rayleigh range of the beam

must be > stack thickness
Birefringent >60 mm  1x8 Stack length is ~???mm
Wedges  Increases with port count
 Pixel pitch >8 um

LCoS >33 mm  must cover >2 pixels to avoid
inter-channel ripples
DLP  Pixel pitch >7 um limited by DLP

manufacturing process
Mirror >28 mm  must cover >2 pixels to avoid
Array inter-channel ripples

Resulting Minimum WSS Component Sizes
100GHz
100GHz

Small spot size is the key!
 Minimum actuator tolerable spot size influences:

– Channel bandwidth and passband “squareness”
• See upcoming section on cascaded bandwidth performance
– Component physical size
– Required dispersive grating strength
– Minimum actuator width (per channel)
LC: >60mm LCoS: >33mm DLP: >28mm MEMS: <20mm

Flatness of WSS Channel Passband Is Important
Single WSS-50 / 3-dB BW = 43 GHz

0 Systematic
Systematicloss
loss
Normalized Transmission [dB]
ripple as small
ripple as small
as
as0.1dB
0.1dBwill
will
also accumulate
-2 also accumulate
16 Cascaded WSS-50
3-dB BW = 31 GHz
-4
3-dB bandwidth of 16
-6
cascaded WSS’s is
determined by 0.19-dB
bandwidth of single-
-8 WSS passband
( 0.19dB = 3dB / 16 )
-10
-30 -20 -10 0 10 20 30
Relative Optical Frequency [GHz]
“Squareness” of WSS Channel Passband is Critical
0 Mini 50
(~ 6th-Order
4th-Order
-2 3rd-Order Gaussian)
Gaussian
Transmission [dB]
Gaussian
-4
All three passbands
have the same 2-dB
-6 bandwidth,
but that of the ‘Mini 50’
-8 is slightly more
rectangular …
-10
-40 -30 -20 -10 0 10 20 30 40
Relative Optical Frequency [GHz]
Overall 3-dB Bandwidth of Cascaded WSS’s
45
… which makes a big difference
Overall 3-dB Bandwidth [GHz]
in cascaded bandwidth
40
Mini 50
(~ 6th-Order
Gaussian)
35
32 GHz
4th-Order
30
3rd-Order
Gaussian
25
0 4 8 12 16 20
Number of Cascaded WSS's
Transmission Penalty vs. 3-dB Optical Bandwidth
20
43-Gb/s Transmission Through Cascaded WSS's
Required OSNR for 10 - 3 BER [dB]
19
Steep Increase
18 Below 32 GHz
Optical
17
Duobinary
16
15 RZ-ADPSK
14
13 NRZ-ADPSK
12
60 58 56 54 52 50 48 46 44 42 40 38 36 34 32 30
3-dB Bandwidth of WSS Cascade
Spot Size Determines the Passband Order!
steering
 Spectral Resolution (R) of System
actuators
d Spot Diameter = 2w
2w Rd
Channel 2
passband
l
Larger
LargerRR
Better
BetterBandwidth
Bandwidth
 Smaller spot size (relative to width Larger
LargerRR
Higher
HigherOrder
OrderPassbands
Passbands
of channel actuator) produces more
square passbands (higher order
Gaussian)
 Conclusion: Best cumulative
LC: >60mm LCoS: >33mm DLP: >28mm MEMS: <20mm
bandwidth achieved with
smallest spot size

Smaller Spot Size Means Wider and Squarer Band
Width of Transition l
Determined by Spot
Size
Insertion Loss
Output port A
Output port A
Larger
spot size Output port B
Output port B
l
Typical WSS-based Node and Port Isolation
…what happens to li in WSS?

from deg 1 port isolation (PIso)
li,port_1
splitter
from deg 2
port selected to pass
Degree 1 li,port_2
AWG
from deg 3
li,port_3
from deg 4
li,port_4
splitter
Degree 2 Output (at li) is

AWG
coherent combination
from deg m-1 of li,port_2 along with m-
li,port_m-1
1 li signals, each
from add suppressed by PIso
li,add
WSS
splitter
Degree m-1
AWG
AWG

Port Isolation: System Level Perspective
lo 1xm WSS lo lo lo lo lo lo lo
1xm WSS
1xn WSS
1xn WSS
1xn WSS
1xn WSS
1xn WSS
1xn WSS
lo lo lo lo lo lo lo lo
AWG
AWG
Rx
lo
 For a given link…

 Interference is in-band and therefore accumulates
 How large is the total interference at Rx?
– How many nodes passed?
– How many degrees populated at each WSS?
– For each populated degree, is the wavelength active?
 Level and shape of interference determined by spectral shape and
magnitude of port isolation?
– 40G spectra fills 50GHz channel bands
 The Question: how does the spectral shape and magnitude of the port
isolation affect the system penalty?

Port Isolation Profiles and 40Gb/s
 Many 43Gb/s formats fill the (50GHz) channel band
 Different WSS technologies have different port isolation profiles
 How does the system penalty depend upon:
– the lesser isolation at the edges of the passband?
– the isolation at the channel center?
 Which is more critical?
[dB]
00
Intensity[dB]
43Gb/s NRZ-
-10
Loss,Intensity
-10 ADPSK
-20
-20 “Flat-Isolation”
Profile, Y=38dB
-30
Isolation,Loss,
-30
-40
-40
Isolation,
-50 50GHz channel

-50 FSO MEMs passband
-60 WSS
-60
-50
-50 -25
-25 00 25
25 50
50
Normalized Optical Frequency [GHz]
Normalized Optical Frequency [GHz]
Port Isolation at Channel Edges: Spectrometer Resolution
Transmission Profiles
(Insertion Loss)
 Better isolation with higher resolution Port A Port B Port A
– Smaller beam size  high resolution
g
gratin
A
rt
po
m
irr
or
B
rt
ar
po
ra
y
on
my
Co
m
rra
era lens
Fib
w
av
el
en
gt
h
Port Isolation Limitation: Background Scatter
Transmission Profiles
(Insertion Loss)
 Baseline isolation determined by Port A Port B Port A
background scatter
g
gratin
A
rt
po
m
irr
or
B
rt
ar
po
ra
y
on
my
Co
m
rra
era lens
Fib
w
av
el
en
gt
h
Spectrally Dependent Interference
isolation  JDSU MWS50

– Interfering power is concentrated at edges
of channel band
interference signal
 Constant Isolation at channel center,

isolation
rising towards edges
interference
– Interfering power is has components at
signal center and at edges of channel
signal
 Spectrally Constant (Coherent)
isolation
– Interfering power is concentrated at center
interference of channel
interference
 Out-of-Band Interference
– Interfering power has no spectral overlap
signal with signal

Spectrometer Resolution Limited Isolation
WSS Passband
WSSIsolation
WSS PassbandFunction
WSS Isolation
NRZ-ADPSK Function
Spectrum
NRZ-ADPSK Spectrum
0
0  Power accumulates at edges
Insertion Loss, Intensity [dB]
-10
-10 of channel passband
-20
-20
-30
-30
-20
-40 -20
-40
-50 40dB 1 ROADM
-50 1 ROADM
-25 2 ROADMs
-25 2 ROADMs
-60
-60 3 ROADMs
3 ROADMs
4 ROADMs
-70 4 ROADMs
-70 -30 5 ROADMs
-50 -30 -10 10 30 -30 50 5 ROADMs
-50 -30 -10 10 30 50 6 ROADMs
6 ROADMs
Optical Frequency [GHz]
Intensity [dB]
7 ROADMs
Intensity [dB]
7 ROADMs
8 ROADMs
-35 8 ROADMs
-35 9 ROADMs
9 ROADMs
10 ROADMs
10 ROADMs
11 ROADMs
-40 11 ROADMs
-40 12 ROADMs
12 ROADMs
13 ROADMs
13 ROADMs
14 ROADMs
14 ROADMs
-45 15 ROADMs
-45 15 ROADMs
16 ROADMs
16 ROADMs
Single Passband (Norm)
-50
-50
-30 -20 -10 0 10 20 30
-30 -20 -10 0 10 20 30
Norm alized Optical Frequency [GHz]

Background Scatter Limited Isolation
WSS Passband
WSSIsolation
WSS Isolation
NRZ-ADPSK Function
Spectrum
NRZ-ADPSK Spectrum
0
0  Power accumulates at edges
-10
-10 and center of channel
-20
-20 passband
-30
-30
Single Passband (norm)
-40 Single Passband (norm)
-40 Interference Pow er
Interference Pow er
-50 00
-50
-60
-60
-70 -10
-10
-70 [dB]
Intensity[dB]
-50 -30 -10 10 30 50
-50 -30 -10 10 30 50
Optical Frequency [GHz] -20
-20
Intensity
-30
-30
-40
-40
-50
-50
-40
-40 -20
-20 00 20
20 40
40
Normalized
NormalizedOptical
OpticalFrequency
Frequency[GHz]
[GHz]
Constant Isolation
WSS Passband
WSSIsolation
WSS Isolation
NRZ-ADPSK Function
Spectrum
NRZ-ADPSK Spectrum
0
0  Power accumulates about
-10
-10 center of channel passband
-20
-20
-30
-30
-40 -20
-40 -20
-50
-50 1 ROADM
1 ROADM
-25 2 ROADMs
-60 -25 2 ROADMs
-60 3 ROADMs
3 ROADMs
-70 4 ROADMs
-70 -30
4 ROADMs
5 ROADMs
-50 -30 -10 10 30 -30 50 5 ROADMs
-50 -30 -10 10 30 50 6 ROADMs
6 ROADMs
Intensity [dB]
Optical Frequency [GHz] 7 ROADMs

Intensity [dB]
7 ROADMs
-35 8 ROADMs
-35 8 ROADMs
9 ROADMs
9 ROADMs
10 ROADMs
10 ROADMs
-40 11 ROADMs
-40 11 ROADMs
12 ROADMs
12 ROADMs
13 ROADMs
13 ROADMs
14 ROADMs
-45 14 ROADMs
-45 15 ROADMs
15 ROADMs
16 ROADMs
16 ROADMs
-50 Single Passband (Norm)
-50
-30 -20 -10 0 10 20 30
-30 -20 -10 0 10 20 30

Penalty vs Type of Interference
tion
11 FSO
FSOMEMS
MEMSWSSWSS
sola
Flat
FlatIsolation
IsolationProfile
ProfileWSS
nd
WSS
-3 ) [dB]
) [dB]
In-Band
In-BandInterference
-Ba
0.8
I
0.8 Interference
Flat
Out-of-Band
Out-of-BandInterference
-3
-of
Interference
10
(BER10
0.6
Out
0.6
Penalty(BER
0.4
0.4 and M S
B ME
OSNRPenalty
In- FSO
0.2
0.2
OSNR
00
-0.2
-0.2
-35
-35 -30
-30 -25
-25 -20
-20 -15
-15 -10
-10 -5-5
Total
TotalInterference
InterferencePower/Total
Power/TotalSignal
SignalPower
Powerat
atRx
Rx[dB]
[dB]

Interference at Channel Center is ~10dB More Damaging
11 FSO
FSOMEMS
MEMSWSS WSS
ion
Flat
Flat IsolationProfile
Isolation ProfileWSS
WSS
-3 ) [dB]
) [dB]
at
0.8
0.8 In-Band Interference
In-Band Interference
Isol
d
Ban
Out-of-Band
Out-of-BandInterference
-3
Interference
10
Flat
(BER10
0.6
-of-
Penalty(BER 0.6
Out
0.4
0.4
OSNRPenalty
an
d ~10dB MS
B E
0.2
0.2 In -
FS OM
OSNR
00
-0.2
-0.2
-35
-35 -30
-30 -25
-25 -20
-20 -15
-15 -10
-10 -5-5
Total
TotalInterference
InterferencePower/Total
Power/TotalSignal
SignalPower
PoweratatRx
Rx[dB]
[dB]
0 Interference
0 Flat 0
0 Interference
-10
-10 at Rx Isolation -10
-10 at Rx
Intensity [dB]
Intensity [dB]
Intensity [dB]
Intensity [dB]
-20 -20
-20 -20
-30 -30
FSO MEMS
-30 -30
-40 -40
-40 -40
-50 -50
-50 -50
-60 -60
-60 -60
-40 -20 0 20 40 -40 -20 0 20 40
-40 -20
Normalized Optical0Frequency [GHz]
20 40 -40 -20
Normalized Optical0Frequency [GHz]
20 40
Normalized Optical Frequency [GHz] Normalized Optical Frequency [GHz]

System Penalty vs Channel Center Port Isolation
 How much port isolation is needed at the channel center?

– Calculated from penalty vs “In-band” interference power
11
WSS with 38dB
16 n
24 n
8 no
10-3))
-3
background Isolation
(BER10
ode
odes
0.8
des
0.8 8 nodes
Penalty(BER
s
0.6
0.6
[dB]
[dB]
OSNRPenalty
0.4
0.4 FSO MEMs-based WSS
8 nodes
OSNR
0.2
0.2 Constant Isolation
8 nodes
00
30
30 35
35 40
40 45
45 50
50 55
55
Isolation at Channel Center (equalization attn = 4dB) [dB]

What this Means…
 >45dB needed to avoid penalty11
16 n
24 n
8 no
10-3))
-3
(BER10
odes
0.8
des
0.8
des
Penalty(BER
0.6
0.6
[dB]
[dB]
OSNRPenalty
8 nodes, 0.5dB Penalty 0.4
0.4
OSNR
0.2
0.2
WSS 36dB
isolation 00
30
30 35
35 40
40 45
45 50
50 55
55
16 nodes, 0.5dB Penalty 16 nodes, <0.1dB Penalty
WSS WSS
isolation
39dB isolation
45dB

WSS Technologies: Cause of Isolation Limitations
MEMS LC LCoS DLP

Switch
Engine Type
Light is thrown Light is

Light is thrown directly into
Consequence of between ports scattered to None
Imperfect Control another port multiple ports (hard MEMS stops)
(drift of angle) (incomplete
(phase mask drift)
polarization rotation)
Total Length of 16 mm
2 mm
Edges per 1 mm 32 mm (per pass)
(for 8 port device)
Channel
1 24 3
# of Surfaces 3 (dual pass for
(MEMs mirror) (for 8 port device) attenuation)
Port Isolation Excellent ER Acceptable Poor ER, Acceptable to

for all port ER, degrading degrading with
Performance Poor ER
counts with port count port count

WSS Switch Engine Feature Comparison
LC +
Feature MEMS LCOS LC DLP
MEMS
50 GHz or 100 GHz channel spacing     
High port count (≥16)  O   -
Flexible spectrum -  O - 
Wide, flat BW     
Low loss  O O  O
Small size  O O O 
Switching speed O O O O 
Good port isolation  O O  O
Attenuation accuracy O    
ü Technology strength
O Acceptable, achieved with technical challenge
- Not compatible with the technology

WSS Product History between JDSU and Cisco
2005 2008 2010 2012 Porto

(up to 16-degree,
TrueFlexTM)
WSSM-100 (8- Amarone (8-

degree, 100Ghz) degree, 50Ghz)
Fiano (2-4
degree, 100Ghz)
Future
2007 2009 2011
2003

WSS ROADM Status
#1 Market Leaders 2000+
ROADMS > 50% share* Super Transport Blades (featuring

WSS ROADMs) Shipped >80% share
Solutions for all Applications Vertical and Functional Integration
Vertical (Blades)
Super Transport
Blade
Amp Array
MCS
Twin WSS
Dual MCS
Quad OCM
Broadcast and Select OPM
Route and Select

Functional (ROADM)
2002 2005 2008-2010 2011 2012 TrueFlexTM Portfolio

Industry’s first ROADM 2nd Gen ROADMs 3rd Gen ROADM Platform Introduced “route and select 4th Gen ROADM Platform
(Wave-blocker) (PLC and WSS) (Mini/Nano) (R&S) architecture” Twin 1x20 WSS, Dual MCS
Small form factor soln.s and Quad OCM
Innovation Leaders
JDSU Solutions - TrueFlexTM Portfolio
i de
p sl
ma
oa d
R

Requirements For Next Generation Networks
Capability JDSU
Full TrueFlex ROADM, MCS & Channel Monitor suite
Compact, low power, integrated packaging
Broad suite of amplifiers and blade capability to

provide a total solution to the customer
40/100Gbit/s client & line side pluggable portfolio
Full line of low cost 10Gb/sec tunable transceiver

portfolio
Offerings for long haul, metro and edge
Test solutions for network enablement and service

assurance

CDM with Cisco CORBU:
Case Study

Fiano (Single Module ROADM)
Booster
Add / Express
4x1
OSC
Add
WSS
2O
Preamp (P ptic
re
OSC Drop OCM am al A
p & mp
Bo lifie
1:2 os rs
ter
)
OSC DCM Drop
4x1 Nano-WSS
OCM

Super Transport Blade Flash Demo

Fiano : Vital Statistics
 > 3,000,000
– Total investment by JDSU to productize Fiano and successfully ramp production (currently at 130 pcs/week)
 200,000
– Total NRE paid by Cisco for Fiano program
 > 8000
– Number of Fiano blades shipped by JDSU to Cisco to date
 > 3000
– Number of parameters that every Fiano blade in production is tested to, across two CM sites.
 > 700
– Number of electrical components on the PCBA BOM of a Fiano blade
 > 140
– Number of direct labor hours required across two CM sites to assemble and test a single Fiano blade in production
 > 100
– Number of unique suppliers involved in the sourcing of material required for a Fiano blade
 > 40
– Number of optical components / modules on a Fiano blade
 < 20
– Number of field-returns of Fiano blades to date
 16
– Number of months to complete development & qualification of the Fiano blade (June 15th, 2008 – Oct 20 th, 2009)
 0
– Number of Cisco’s competitors with an equivalent solution
– Number of JDSU’s competitors with an equivalent solution

Before
AfterFiano
FianoSingle
SingleModule
ModuleROADM
ROADM
20 Slots for
1 slot for for
4 slots 14 Slots Cards
for 1 slot
4 slots for for
Transponder
ROADM
ROADM(West)
(East) Transponder Cards ROADM
ROADM (East)
(West)
Blade Function # of Slots # of Total # of
per blade blades Slots in
Shelf
Super Transport Blade (East)
Super Transport Blade (West)

Shelf Controller (redundant)
Shelf Controller (primary)

WSS
Fiano+SMR2
OCM 2
1 2
1 42
Preamp
WSS+OCM
WSS+OCM
Preamp
Transponder20
Transponder19
Transponder18
Transponder17
Transponder16
Transponder15
Transponder14
Transponder13
Transponder12
Transponder10
Transponder11
Booster
Transponder12
Transponder10
Transponder11
Booster (East)
Transponder9
Transponder8
Transponder6
Transponder3
Transponder2
Transponder4
Transponder7
Transponder5
Transponder1
Transponder9
Transponder8
Transponder6
Transponder3
Transponder2
Transponder4
Transponder7
Transponder5
Transponder1
Barolo Preamp 1 2 2
Option (East)
(West)
(West)
Barolo Booster 1 2 2
(West)
(East)
Controller 1 2 2
Transponder 1 14
20 14
20
Fans
Mux/Demux 2U 2 4U
(A-AWG)
d
Shelf Controller (redundant)
Shelf Controller (primary)
ate Blade Function # of Slots

per blade
# of
blades
Total # of
Slots in
in
Transponder20
Transponder19
Transponder18
Transponder17
Transponder16
Transponder15
Transponder14
Transponder13
m Shelf
Eli
el f Controller 1 2 2
S h
Transponder 1 6 6
10U
1 * Empty Slot 16
Fans
Only
24U 14U (1 * 10U
(2 * 10U Shelf&&Passive
Shelves PassiveMux/Demux
Mux/DemuxBoxBox) required
) requiredfor
for2-Degree
2-DegreeROADM
ROADMNode
Nodetoto
support 10-l
© 2012 JDS Uniphase Corporation 10-l colored
colored add/drop
add/drop per
| per direction.
direction.
JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION
86
Collaborative Innovation Success
40-WSS-CE 40 40 4 0-WSS-CE 10GE 10GE 10GE 10GE 10GE 10GE 10GE 10GE 10GE 10GE
D MX - CE DM X - C E XP XP XP XP XP XP XP XP XP XP
10E MR 10E MR 1 0E M R 10E MR 10E MR 10E MR 10E M R 10E MR 10E MR 1 0E MR 10 E MR 1 0E M R 10E MR 10E MR
OPT OP T TXP TCC 2 OSCM OS CM TC C 2 TX P OPT OPT TXP TXP TX P TXP TXP TXP TCC 2 TCC 2 TXP TXP TXP TXP TXP TX P AD -4C TCC 2 OSC M OSCM TCC 2 AD-4C
BST PRE P RE BST
1530.33 15 30.33 1 530. 33 1530.3 3 15 30.33 1530.33 1530 .33 153 0.33 153 0.33 1 530.33 15 30.3 3 1 530.3 3 1530.33 15 30.33
1532.68 15 32.68 1 532. 68 1532.6 8 15 32.68 1532.68 1532 .68 153 2.68 153 2.68 1 532.68 15 32.6 8 1 532.6 8 1532.68 15 32.68
FAIL FAIL FAIL FAIL FAIL FAIL FAIL FAIL FAIL FAIL FAIL FAIL
FAIL FAIL FAIL FAIL F AIL FAIL FAIL FAIL FAI L FAIL FA IL FAIL FAIL F AIL FAIL FAIL
AC T/ A CT/ ACT/STBY ACT/STBY ACT/STBY ACT/STBY ACT/ STBY ACT/ STBY ACT/ STBY ACT/STBY ACT/STBY ACT/STBY
FAIL FAIL FAIL FAI L F AIL FAIL FAI L FAIL FA IL FAI L
ACT/STBY AC T/STB Y AC T/STBY ACT/ STBY AC T/STB Y AC T/STBY ACT/STBY AC T/STB Y AC T/STBY ACT/STBY AC T/STBY ACT /STBY ACT /S TBY AC T/STB Y AC T/STBY ACT/STBY
SF FAIL FA IL SF FAIL FAIL SF SF SF SF SF FA IL FAIL SF SF SF SF SF
ACT AC T AC T ACT ACT AC T AC T A CT A CT ACT
SF SF PWR PWR SF SF SF SF SF SF SF SF PWR PWR SF SF SF SF SF SF PWR PW R
SF SF SF SF SF SF SF SF SF SF
A B A B A B A B A B A B
AC T/STBY ACT/S TBY A CT/S TBY ACT/ STBY A CT/S TBY ACT/ STBY
HAZ ARD HAZARD

L EVEL 1M LEVEL 1 M
HAZ ARD HAZARD
L EVEL 1M H AZARD H AZARD LEVEL 1M HAZARD HAZARD HAZARD H AZARD H AZARD HAZAR D HAZARD HAZAR D HAZARD HAZARD H AZARD H AZARD
LEVEL 1 LEVEL 1 L EVEL 1 LEVEL 1 LEVEL 1 LEVEL 1 LEVEL 1 L EVEL 1 L EVEL 1 L EVEL 1 LEVEL 1 LEVEL 1 LEVEL 1 LEVEL 1
TX
TX
MX MX
3 0.7 – 3 6.2
30 .7 – 36 .2
TX
TX
TX
TX
TX
TX
TX
TX
HAZ ARD H AZARD C RIT C RIT HAZA RD HAZ ARD CR IT CRIT HAZA RD CR IT CRIT H AZ ARD
LE VEL 1M LEVEL1 M
TX 30.7 – 36. 2
TX 30.7 – 36. 2
LEVEL 1 M LE VEL 1M LE VEL 1 M LE VEL 1M
1
M AJ MAJ MAJ MAJ MAJ MAJ
UC
UC
UC
UC
MON
RX
RX
RX
RX
RX
RX
RX
RX
MON
RX
RX
M IN MIN MIN MI N MIN MIN
RX
RX
RX
TX
RX
TX
TX
TX
CLIE NT
CLIE N T
CLI EN T
CLI EN T
CLIEN T
CLIE NT
CLIE NT
CLIE NT
CLI EN T
CLI EN T
RE M R EM REM REM RE M REM
MON
MON
S YNC H AZA RD HA ZARD SYNC SY NC SYNC SYN C HAZAR D HA ZARD SYN C
37 .0 – 42.5
3 7.0 – 4 2.5
MX MX
LEVEL 1M LEVEL 1M LEV EL 1M LEVEL 1M
TX
TX
TX
TX
TX
TX
TX
TX
TX
TX
TX 37.0 – 42.5
TX 37.0 – 42.5
ACO ACO AC O A CO AC O A CO
RX
RX
2
2
TX
TX
RX
RX
TX
RX
TX
TX
RX
TX
ADD RX
ADD RX
RX
RX
RX
RX
RX
RX
RX
RX
RX
RX
ACO AC O ACO ACO ACO AC O
COM
COM
COM
COM
43 .3 – 48 .9
4 3.3 – 4 8.9
MX MX
LAMP LAM P L AMP L AMP LAMP LAMP

TX 43.3 – 48. 9
TX 43.3 – 48. 9
RX
RX
RX
TX
TX
RX
TX
RX
TX
HAZARD HAZARD HAZ ARD HAZARD HAZ ARD HAZ ARD HAZ ARD HAZ ARD HAZARD HAZARD
TX
RX
TX
LEVEL 1M LEVEL 1M LEVEL 1M LEVEL 1M L EVEL 1M L EVEL 1M L EVEL 1M LEVEL 1M L EVEL 1 M LEVEL 1M
COMPLIE S WI TH COMP LI ES WI TH COMP LI ES WITH COM PLIES WITH COM PLIES WITH COM PLIES WITH COMPLIE S WIT H COMPLIE S WI TH COMP LI ES WI TH COMP LI ES WITH
SD
SD
21 CFR 1040.10 21 CFR 1040.10 21 CFR 1040.10 21 CFR 1040. 10 21 CFR 1040. 10 21 CFR 1040. 10 21 CFR 1040. 10 21 CFR 1040.10 21 CFR 1040.10 21 CFR 1040.10
DC
DC
TX
TX
AND 1040.11 AND 1040.11 AND 1040.11 AND 1040.11 A ND 1040.11 AND 1040.11 A ND 1040.11 A ND 1040. 11 A ND 1040. 11 AND 1040.11
E XCEPT FOR EXCEP T FOR EXCEP T FOR EXCE PT FOR EX CE PT FOR EX CE PT FOR E XCE PT F OR E XCEPT FOR EXCEP T FOR EXCEP T FOR
49.7 – 55 .3
4 9.7 – 5 5.3
MX MX DEVI ATI ONS DEV IATI ONS DEV IA TI ONS DE VIA TIONS DEVI ATIONS DEVI ATIONS DEVI ATIONS DEVI ATI ONS DEV IATI ONS DEV IA TI ONS
MX MX
TX 49.7 – 55.3
TX 49.7 – 55.3
P URSUANT TO PURS UA NT TO PURS UANT T O PURS UA NT TO PURSUA NT TO PURSUA NT TO P URSUANT TO P URSUANT TO PURSUANT TO PURS UANT TO
RX
RX
TX
TX
RX
RX
TX
TX
LASE R NOTI CE LAS ER NOTICE LAS ER NOTICE LA SER NOTICE LASE R NOTICE LASE R NOTICE LASE R NOTICE LASE R NOTI CE LASE R NOTICE LAS ER NOTICE
DROP
DROP
NO. 50. DATED NO. 50. DATED NO. 50. DATE D NO. 50. DATE D NO. 50. DAT ED NO. 50. DATE D NO. 50. DA TED NO. 50. DAT ED NO. 50. DATED NO. 50. DATED
JULY 26. 2001 JULY 26. 2001 JULY 26. 2001 JULY 26. 2001 JULY 26. 2001 JULY 26. 2001 JULY 26. 2001 JULY 26. 2001 JULY 26. 2001 JULY 26. 2001
LINE
LINE
! ! ! ! ! ! ! ! ! ! ! ! ! !
TX
TX
TX
RX
RX
RX
RX
RX
TX
RX
TX
TX
RX
R S-2 32 RS -232
RX
MX RS-23 2 RS -232 MX RS-2 32 RS -232
TX
TX
MX MX
TX
TX
TX
TX
TX
TX
TX
TX
TX
TX
56 .1 – 61 .8
5 6.1 – 6 1.8
MAX INPUT MAX INPUT MAX IN PUT MAX IN PUT MAX INPUT MAX INPUT MAX INPUT MAX INPUT MAX INPUT MAX INPU T MAX IN PU T MAX IN PUT MAX INPUT MAX INPUT
TX 56. 1 -61. 8
TX 56. 1 -61. 8
EX P
EX P
POWER LEVEL POWER LEVEL POWER LEVEL POWER LEVEL POWER L EVEL POWER L EVEL POWER L EVEL POWER LEVEL POWER L EVEL POWER LEVEL POWER LEVEL POWER LEVEL POWER LEVEL POWER L EVEL
1
CL IENT : +1 d Bm CLIENT : +1 d Bm C LIEN T: +1 dBm CLIENT : +1 d Bm CLIENT: + 1 d Bm CL IENT: + 1 dBm CL IENT: +1 dBm C LIEN T: +1 dBm CL IEN T: +1 dBm C LIEN T: +1 dBm CLIENT: +1 dBm CLIENT: +1 dBm CL IENT: +1 d Bm CLIENT: + 1 d Bm
EXP
EXP
DWDM : 0 dBm D WDM : 0 dBm DWDM : 0 d Bm D WDM : 0 dBm D WD M : 0 dBm DWDM : 0 dBm DWDM : 0 d Bm DWDM : 0 d Bm DWDM : 0 d Bm DWDM : 0 d Bm D WDM : 0 dBm DWDM : 0 dBm DWDM : 0 dBm DWD M : 0 d Bm
RX
RX
RX
RX
RX
RX
RX
RX
RX
RX
TX
TX
RX
TX
TX
TX
TX
RX
RX
TX
TX
TX
TX
RX
RX
RX
RX
RX
TX
RX
RX
RX
RX
TX
RX
TX
TX
RX
RX
RX
RX
TX
RX
TX
TRUNK
T RUNK
TRU NK
TRUNK
TRUNK
TRUNK
TRUNK
TRUNK
TRU NK
TRUNK
RX
RX
TX
TX
MX MX MX MX MX MX MX MX MX MX MX MX MX MX
MX MX
COM
COM
COM
COM
COM
COM
TX
TX
TX
TX
TX
TX
TX
TX
TX
TX
TCP /IP TCP/IP TCP/IP TCP /IP TC P/IP TCP/IP
MAX I NPUT M AX INPU T MAX INP UT MA X INPUT
P OWER L EVEL POWER LEVEL POWER L EVEL POW ER L EV EL
2
-8 d Bm -8 dBm -8 dB m - 8 dBm
RX
RX
RX
RX
RX
RX
RX
RX
RX
RX
CO NSO LE C ONSO LE CONSOLE CONSO LE CONSOL E CONSOLE CONSOL E CONSOL E CON SOL E CO NSO LE
INPUT I NPUT INPUT I NPUT INPUT INPUT INPUT INPUT INPUT INPUT
O WER L EVEL OWER LEVEL OWER LEVEL OWER LEVEL OWER LEVEL OWER LEVEL OWER LEVEL O WER L EVEL OWER L EVEL OWER LEVEL
CL IENT: + 3dBm CL IENT: + 3dBm C LIENT: + 3d Bm CLIENT: +3d Bm CLIENT: +3 dBm CLIENT: +3 dBm CLIENT: + 3dBm CL IENT: +3dBm CL IENT: + 3dBm C LIENT: + 3d Bm
TRUNK: +1dBm TRUNK: + 1dBm TRUNK: + 1dBm TR UN K: +1dBm TRUNK: +1d Bm TRUNK: +1d Bm TRUNK: +1d Bm TRUNK: +1dBm TRUNK: +1 dBm TRUNK: + 1dBm
! ! ! ! ! ! ! ! ! !
SLOT
FAN FAIL CRIT

STATUS
MAJ
PORT
MIN
66% Space and Power SLOT STATUS
FAN FAIL CRIT MAJ

PORT
MIN
SLOT
FAN FAIL CRIT

STATUS
MAJ
PORT
MIN
Reduction
15454-PP-MESH-4=
15454-PP-MESH-4= PATCH PANEL
PATCH PANEL
CISCO PID/VID
C ISCO PID/VID
PN
PN
1 0E M R 10E MR 10E MR 1 0E M R 10E MR 10E MR SN
TXP TXP TX P TCC 2 TCC 2 TXP TXP TX P
SN 1 530. 33 1530.3 3 15 30.33 1 530.3 3 1530.33 15 30.33
1 532. 68 1532.6 8 15 32.68 1 532.6 8 1532.68 15 32.68 CLEI CODE
CLEI CODE
F AIL FAIL FAIL F AIL FAIL FAIL
AC T/STB Y AC T/STBY ACT/STBY AC T/STB Y AC T/STBY ACT/STBY

FAIL FAIL
SF SF SF PWR PWR SF SF SF
A B A B
A CT/S TBY ACT/ STBY
15454-PP-MESH-4=
HAZARD
L EVEL 1
HAZARD
LEVEL 1
HAZARD
LEVEL 1
HAZARD
LEVEL 1
H AZARD
LEVEL 1
H AZARD
LEVEL 1 PATCH PANEL
15454-PP-MESH-4=
CISCO
CR IT CRIT
PATCH PANEL PID/VID
MAJ MAJ
MIN MI N
C ISCO PID/VID
REM REM
PN
SY NC SYNC
PN SN
AC O A CO
SN CLEI CODE
ACO ACO
CLEI CODE L AMP L AMP
! ! ! ! ! !
RS-2 32 RS -232
MAX IN PUT MAX IN PUT MAX INPUT MAX IN PUT MAX INPUT MAX INPUT
POWER LEVEL POWER LEVEL POWER L EVEL POWER LEVEL POWER LEVEL POWER L EVEL
20x 10G TXPs +

C LIEN T: +1 dBm CLIENT : +1 d Bm CLIENT: + 1 d Bm CLIENT: +1 dBm CL IENT: +1 d Bm CLIENT: + 1 d Bm
DWDM : 0 d Bm D WDM : 0 dBm D WD M : 0 dBm DWDM : 0 dBm DWDM : 0 dBm DWD M : 0 d Bm
20x 10G TXPs +

RX
TX
TX
TX
TX
TX
RX
TX
RX
RX
RX
RX
MX MX MX MX MX MX
TCP/IP TCP /IP
40Chs Degree-2 40Chs Degree-2

ROADM SLOT STATUS
FAN FAIL CRIT MAJ

PORT
MIN
ROADM
YESTERDAY TODAY
“JDSU’s Super Transport Blade solution helped deliver 66% savings in

density and power consumption for 2-Degree ROADM Nodes supporting
40ch, 10Gbps, and 50% add-drop”…CISCO testimonial in joint Lightreading
Webinar
JDSU’s Market Leadership in Transport Blades
 JDSU has been designing and manufacturing custom products (blades, linecards,
circuit-packs, pizzabox) for leading Network Equipment Manufacturers since 2003
 JDSU’s portfolio consists of more than 45 distinct blades across 6 optical platforms
 >12 blade programs currently in development
 JDSU has shipped more than 190,000 blades to date to Tier 1 Customers across NA
and Europe.
 In FY11, JDSU delivered more than 15,000 blades:
– >5,500 Optical Amplifier blades
– >3,000 WSS blades
– >6,000 Super Transport Blades
 EDFA Circuit-Pack  50Ghz 4x1 Super

 VMUX Circuit-Pack  100Ghz Metro ROADM Transport Blade –
 WSSM 100GHz Circuit-Pack Super Transport Blade single slot
 WSS 50GHz Circuit-Pack with OSC – Single Slot  Multicast Switch &
  Amp Array blade for
Raman Circuit-Pack CDC FlexSpectrum Twin CDC Add/Drop
 100Ghz Metro ROADM Super Transport 1x20 WXC Blade  High-Density
Blade – Single Slot  Hybrid EDFA / Raman Transmission Blade
 50Ghz Super Transport Blade – dual slot Blade
Past Present Future

Linecard/Blade Product History between JDSU and Cisco
2005 2008 2010 2012

Porto
(TrueFlexTM,
Twin 1x16+16x1 WSS,
FS-OCM)
Amarone (50Ghz,
Barolo (Preamp 9x1 WSS,
or Booster EDFA, TF-OCM)
40ch)
Cannonau
Fiano (100Ghz, (Preamp EDFA,
4x1 WSS, Booster EDFA,
AWG-OCM Raman)
Preamp EDFA
Booster EDFA)
Future
2003 2007 2009 2011

Cannonau : Hybrid EDFA/Raman Blade under Collaborative
Development with CORBU
Double-Slot Linecard integrating:

 8 High-Power Lasers
 >70 Passive Optical Components
Erbium Heater
PreAmp and Booster 4x 980 nm Lasers

4x 14xx nm
EDFA Passive Trays
1x2 Switch Lasers
Porto : TrueFlexTM Route & Select Wavelength Cross Connect
Blade under Collaborative Development with CORBU
12x1 Switches
FFC
Flex Spectrum
4-port OCM
Twin 1x17
WXC
Module
Double-Slot Linecard integrating:

 Twin 1x17 WXC Module
 Flex Spectrum 4-port OCM
 3 * 12x1 High-Durability Switches
 38 Fused Fiber Couplers
 2 Photodiodes

Generic Photonic Terms & Concepts
Propagation in Fiber & Waveguides
 Light propagates by total internal reflections at the core-cladding interfaces

– Refractive index of Core (n1) > Refractive index of Cladding (n2)
– Ideal Total Internal Reflections suffer no loss at the interface boundaries
 Each ray represents a specific angle of incidence, for which total internal
reflection occurs at the core/cladding interface and keeps the ray confined within
the core
 Multimode fibers & waveguides n2 Cladding

– Multiple angles of incidence
of rays (modes) supported
– Core diameter varies n1 Core
• 50 mm for step index
• 62.5 mm for graded index Cladding
 Single-mode fibers & waveguides

n2 Cladding
– Only a single angle of incidence
of ray (mode) supported n1 Core
– Core diameter is about 9 mm Cladding
Signal Impairments Due to Fiber Propagation
Attenuation
Dispersion
Nonlinearity
Distortion
Attenuation:
Reduces signal power level with distance….
Requires optical amplification (EDFAs/Raman) to compensate
Dispersion and Nonlinearities:

Erodes signal clarity with distance and speed
Nonlinearities are countered through optical system design
Dispersion is increasingly compensated for in the electrical domain

Attenuation due to Fiber Propagation
1500-1600nm window represents lowest

loss (0.2-0.3dB/km) for fiber propagation
Even within this window, a 200km length

of fiber inflicts a 50dB loss (factor of
100,000 reduction) to the intensity of the
optical signal propagating across it,
requiring amplification (EDFA / Raman)
to compensate.
n2 Cladding
Pi Po
n1 Core
Cladding
Pi (mW) Fiber Length (km) Fiber Loss (dB) Po (mW)
10 50 12.5 0.56
10 100 25 0.03
10 150 37.5 0.0018
10 200 50 0.0001
Light Amplification through Stimulated Emission of Radiation
 Atoms at rest (ground state) absorb energy from a photon (“Pump”) at a particular
frequency (n1), and
 Transition to a higher energy-level state, from which they then
 Rapidly transition back down to a lower “metastable” energy-level state, from which they
then
– return to the ground state, giving back the residual energy in the form of a
spontaneously-emitted photon at a new frequency (n2),
OR
– return to the ground state, giving back the residual energy in the form of a stimulated
photon (stimulated by the presence of a clone photon) at a different wavelength.
 Stimulated emission of photons are the basis for optical amplification and lasing.
Higher State Higher State
Meta-stable State Meta-stable State

n1 n1
hn1 hn1
n2 n2
n2
hn2 hn2
n2
Ground State Ground State
Spontaneous Emission of Photon Stimulated Emission of Photon ->

Replica of Incoming Photon
Optical Signal to Noise Ratio (OSNR)
 Spontaneous emission of photons, and their subsequent

amplification (Amplified Spontaneous Emission or ASE) represents
noise.
 ASE can be forward and backward propagating, and its buildup can
compete with stimulated emission (i.e. reduce the amount of optical
amplification of the signal)
 Optical Signal to Noise Ratio (OSNR) is a key system parameter
that determines the receiver’s ability to detect the signal from
above the noise within a finite spectral window.
Higher State
Meta-stable State
n1
hn1 n2
n2
hn2
n2
Ground State
Amplified Spontaneous Emission ( “ASE”) Noise
Arrayed Waveguide Gratings
 The incoming light (DWDM) from an input fiber (1) traverses a free space slab

waveguide (2) and enters a bundle of waveguides (3). The waveguides have
different length and thus apply a relative phase shift. At the exit of the
waveguides (3) the light traverses another free space slab waveguide
region (4) and interferes at the entries of the output fibers (5) in such a way that
each output channel receives only light of a certain wavelength. AWGs are bi-
directional devices. The light path from (1) to (5) represents a demultiplexer, and
from (5) to (1) represents a multiplexer.
 The DWDM grid to be supported - 50Ghz or 100Ghz spacing between wavelengths
– determines the design of the arrayed waveguide grating structure (i.e. Regions
2,3, and 4).

Mach-Zehnder Waveguide Interferometers
L1
Input
Phase-Shifting Arm
3dB 3dB
coupler Reference Arm coupler
L2 Output
0.9
0.7
Transimission (%)
0.5
0.3
0.1
-1000 -800 -600 -400 -200 -0.1 0 200 400 600 800 1000
delta frequency (GHz)
 Light at input of waveguide is split into two arms. Thermo-optic (heater) changes to
refractive index of Phase-shifting Arm creates phase shift relative to Reference Arm,
resulting in constructive or destructive interference at Output.
 L1 and L2 determines the interference pattern at Output
 Mach-Zehnder waveguide interferometers are used for modulation of light, spatial
switching of light, attenuation of light, and as scanning filters for monitoring of light.
Dielectric Optical Filters
Dielectric Filter
l1,l2,l3,...ln
l2 l1, ,l3,...ln
 Stack-up of numerous (200) layers of dielectric material of different

refractive indices
 Tailoring refractive index profile of dielectric stack-up permits
selected wavelength(s) to be reflected while others are transmitted,
allowing for separation (“Demultiplexing”) and combining
(“Multiplexing”) of wavelengths.
Miscellaneous Optical Toolkit
 Fused Fiber Couplers
 Isolators
 Photodiodes
Erbium-Doped Fiber Amplifiers and
Raman Amplifiers
Two Basic Types of Amplification
Transmission
Fiber
(0-150km) Transmission
Fiber
(1530-1610nm)
(0-150km)
Signals
DWDM
EDFA
EDFAs (1995 – Present)
Most ubiquitous and widely deployed optical amplifiers
Transmission
Fiber
(0-150km)
(1530-1610nm)
Signals
DWDM
Raman
Raman Pump Propagation
Raman (2000 – Present)

Niche (long spans) evolving to mainstream (enhanced OSNR for 100Gbps and beyond) optical amplifier
Erbium-Doped Fiber Amplifiers
Erbium-Doped Gain Flattening

Isolator Fiber (10–50m) Filter Isolator
(1530-1610nm)
Coupler
Signals
DWDM
Coupler
Pump Emission/Absorption
Cross-section in
Pump
Laser Erbium-doped glass Laser
(980nm) (1480nm)
 Erbium atoms at rest (ground state) absorb energy from pump laser photons at 980nm or
1480nm, and provide amplification through stimulated emission in the presence of DWDM
signals (1530-1610nm).
 The amount of amplification provided is not uniform across the 1530-1610nm window, due to
the fact that “meta-stable state” is in reality a continuum of energy levels with varying
properties.
 Hence DWDM window is segmented into a C-Band (1530-1565nm) and an L-Band (1565-1610nm).
 Within each of C-Band and L-Band, Gain Flattening Filters are used to compensate for this non-
uniform amplification.
Basic EDFA
Erbium-doped fiber
WDM
isolator isolator
pump
30 6
Pump levels
25 5
Noise Figure (dB)

980nm pump 20 4
Meta-stable levels
Gain (dB)
15 3
1480nm 10 Gain 2
pump Noise Figure
1525-1565nm 5 1
0 0
-30 -25 -20 -15 -10 -5 0
Input power (dBm)
Ground levels
3-level laser system
EDFA Design – Key Performance Criteria
Ch1 ChN
Transmission MSL
Ch1 ChN Transmission
Fiber Fiber
(0-150km) (0-150km)
EDFA
1530nm 1565nm
1530nm 1565nm
Pin, ch POut, ch
Pin, total POut, total
 Band of operation (i.e. C-Band vs. L-Band)

 Channel Plan
– Number of incoming DWDM wavelengths that EDFA needs to amplify
• 40-44l for a 100Ghz system
• 80-96l for a 50Ghz system
– Start and stop wavelengths for each of the C and L-Band
 Gain
– Amount of amplification provided by the EDFA (Pout/Pin), as a function of input signal strength
 Gain Flatness
– Extent of gain uniformity across the chosen Channel Plan (i.e. incremental variation in P out,ch
introduced by the EDFA, relative to P in,ch)
 Dynamic Range
– EDFA’s ability to maintain gain and gain flatness for a range of transmission fiber span losses in
the network (i.e. range of Pin into EDFA)
EDFA Design – Key Performance Criteria
Ch1 ChN
Transmission MSL
Fiber Fiber
(0-150km) (0-150km)
EDFA
1530nm 1565nm
1530nm 1565nm
Pin, ch POut, ch
 Noise Figure (NF)

– Degradation of OSNR by noise added by the EDFA
• NF = OSNRin / OSNRout
• High NF = Greater degradation in OSNR
• Low NF requires High Gain and Low ASE
– Each EDFA contributes to net OSNR limit for the system
 Output Power Pout
– DWDM Signal power exiting the EDFA, into the next lossy span of transmission fiber
 Mid-Stage Loss (MSL)
– Amount of loss that EDFA can tolerate to support functions unrelated to amplification (e.g.
dispersion compensation)
 Gain Control
– Ability of EDFA to maintain set Gain condition, despite perturbations in the system (e.g. reacting
to fast transient events such as loss of 95 / 96 wavelengths to minimize the impact to the 1
surviving wavelength).
Typical EDFA Performance Attributes
 # channels : up to 96 per band

 Dynamic Gain Range: 15-30 dB
 Gain Flatness: <1dB
 NF: 4.5-7 dB
 Pout : up to 23 dBm (200mW) total; 3dBm (2.1mW) / channel
 MSL : up to 12dB
 Gain Control : < 1dB excursion in output signal power
for 20dB add/drop transient events (<ms timescales)
30 6
Gain is not linear;
25 5 Gain saturates at high
input powers.
Noise Figure (dB)

20 4
Gain (dB)
15 3
10 Gain 2
Noise Figure
5 1
0 0
-30 -25 -20 -15 -10 -5 0
© 2012 JDS Uniphase Corporation | Input power (dBm)
JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 109
EDFA Performance – Noise Figure
NF performance changes with operating regime (i.e. as a function of gain)

18 dBm unit - with 10 dB mid-stage loss : Varying input powers
12 -20 dBm -15 dBm

-10 dBm -5 dBm
10
0 dBm 5 dBm
8
High input signal powers deplete
Noise Figure (dB)
the number of erbium ions in the

6
metastable state (i.e. counteracts
4 the effect of pump), thereby
reducing gain and increasing NF.
2
0
1525 1530 1535 1540 1545 1550 1555 1560 1565
Wavelength (nm)
EDFA Performance – Gain Flatness
24
With GFF
22 Without GFF
Gain (dB) 20
18
16
14
12
1525 1530 1535 1540 1545 1550 1555 1560 1565 1570
Wavelength (nm)
Even with GFF, EDFA Gain can be flattened only for one specific Gain Condition (e.g.
Average Gain = 18dB in the case above). Operating at Average Gains above or below
18dB would result in a tilted gain spectrum.
GFF normally located mid amplifier for power efficiency.
EDFA Performance – Tilt Control
Variable Optical Attenuator (VOA) is used to keep Erbium-fiber gain almost constant under
different input signal power conditions, by effectively introducing loss to maintain Gain Flatness.
G Avg Ga G
in = 30dB Avg Gain = 30dB
Avg Gain = 18dB Avg Gain = 18dB
= 1 0 dB Avg Gain = 10dB

Avg Gain
 
EDFA with Tilted Gain Spectrum for EDFA without Tilt (using VOA) for
different Average Gain Conditions different Average Gain Conditions
Transmission Transmission EDFA

Fiber EDFA
Fiber Gain = +30dB
Loss = -30dB Gain = +30dB
Loss = -20dB VOA Loss = -10dB
Allows a single EDFA to be used for a variety of transmission fiber lengths.
Balancing EDFA Design Considerations
• High loss at input causes increase in NF

• High loss at output reduces efficiency and output power
• Location of loss elements needs to be optimized within an amplifier
Erbium-Doped Erbium-Doped
Isolator Fiber Fiber Isolator
Coupler Coupler
Pump Pump
Laser Laser
(980nm) Bury loss elements
in the middle
Optimize for low NF – high gain Optimize for power

extraction – saturated gain
EDFA Performance – Gain Control
Ch1 ChN
Transmission MSL
Fiber Fiber
(0-150km) (0-150km)
EDFA
1530nm 1565nm
Pin, ch POut, ch
Ch1
1530nm
 EDFA must maintain gain set point even in the event of extreme perturbations in
the network. Example:
Prior to After After Perturbation, With After Perturbation, With
Perturbation Perturbation Inadequate EDFA Gain Perfect EDFA Gain Control
(Desired) Control
Number of Channels 96 1 1 1
EDFA Gain Set Point 18dB 18dB 38dB 18dB
EDFA Pin -15dBm/ch -15dBm/ch -15dBm/ch -15dBm/ch
+5dBm (total) -15dBm (total) -15dBm (total) -15dBm (total)
EDFA Pout +3dBm/ch +3dBm/ch +23dBm/ch +3dBm/ch
+23dBm (total) +3dBm (total) +23dBm (total) +3dBm (total)
Surviving channel suffers from non-linear penalties and receiver overload due to excessive optical power
Amplifier Control
 EDFA typically operated in Automatic Gain Control (AGC) or

Automatic Power Control (APC).
 Closed loop control feedback using photodiode monitors on
the input and/or output.
 With input power changes the control loop can take time to
respond, giving large gain transients.
 Additional circuitry used to suppress gain transients with fast
feed-forward directly from the input signal.
JDSU’s State-of-the-Art EDFA Control Platform
PD PD PD
TIA TIA TIA Low Speed

DAC
Low Speed ADC VOA Driver VOA Driver VOA Driver

Heater Driver
TEC Driver
EDF EDF
MSL EDF EDF
PD Laser Driver PD PD PD PD PD Laser Driver PD PD Laser Driver PD
TIA TIA TIA TIA TIA TIA TIA TIA TIA
High Speed Low Speed Low Speed High Speed Low Speed Low Speed High Speed Low Speed Low Speed High Speed
DAC ADC ADC ADC x1 ADC ADC DAC ADC ADC ADC x1
High Speed High Speed High Speed
ADC x2 ADC x2 DAC
First Stage Control (FB control) Second Stage Control (FB control)
Link and other slow tasks
FF path, about 0.5µs reaction time

FF function: Fast control of the pumps, reaction to the stage input signal change
FB control, 4 to 8µs loop time, up to 20µs reaction time due to gain switch*, about 6µs without GS for 4µs loop
FB function: Setting gain of the stage through adjustment of FF control ASE compensation, relatively fast
Link Task >1ms loop (usually 2ms).
Link task function: determines gains of the stages, estimates MSL, controls VOA and other slow tasks, slow
EDFA Transient Control Diagram
Analog Digital Feedback,

Self Optimization
of PI parameters
Input signal power Integration parameter clamping

Modified to help fast transient events
err
PI
Output signal power
Control
Integration parameter scaling to help
slow transient events
Pump Power = FF + U Correction U mW
Pump Feed
Powers Distribution of U into feed
Forward forward pump slope and offset
Correction correction
Interpolated, pre-calculated pump slope and offset values
Scaling is theoretically derived for operation throughout

the power mask, with automatic scaling.
Variation of Gain Excursion over the Power Mask for 16dB Drop
Transient Test Conditions:

Add/Drop Level: 16 dB
Add/Drop Time: 1 µs
Max Input Power: +7 dBm
Max Output Power: +20 dBm
Max 1st Stage Output Power: +15.3 dBm
Gain Undershoot:16 dB Drop, Surviving Blue Channel (average=0.15 dB)
Gain Overshoot:16 dB Drop, Surviving Blue Channel (average=0.52 dB) 20
20
19
19
Max Output Power Before Drop (dBm)

18
0.15
18
17
17
16
16
15
15
14
14
13
13
12
12 -14 -12 -10 -8 -6 -4 -2 0 2 4 6
-14 -12 -10 -8 -6 -4 -2 0 2 4 6
Max Input Power Before Drop (dBm)
Max Input Power Before Drop (dBm)
Simulations allow worst case wavelength, power and switch conditions to be

identified, to improve DVT and predict cascade performance.
Variation of Gain Excursion over the Power Mask for 16dB Add
Transient Test Conditions: Simulation Conditions:

Add/Drop Level: 16 dB Simulation Type: 3 Level (0.7/5e-6)
Add/Drop Time: 1 µs FF Time: 0.6 µs (equivalent to 1 µs in actual hardware)
Max Input Power: +7 dBm FB Time: 4.0 µs
Max Output Power: +20 dBm ddt Time: -0.1e-6
Max 1st Stage Output Power: +15.3 dBm AStart=[150, 2.5e6, 2.5e4, 150, 2.5e6, 2.5e4] * (8e-
6/FBDelay)/1.3
Gain Overshoot: 16 dB Add, Blue Channel Monitored (average=0.36 dB) Gain Undershoot: 16 dB Add, Blue Channel Monitored (average=0.28 dB)
17 17 0.7
0.6
16 16

15 15
0.2
14 14
13 0.35 13
12 12
11 11
10 10
9 9
-16 -14 -12 -10 -8 -6 -4 -2 0 2 4 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4
Max Input Power Before Drop (dBm) Max Input Power Before Drop (dBm)
Variation of Settling Time over the Power Mask for 16dB Add/Drop
Transient Test Conditions: Simulation Conditions:

Add/Drop Level: 16 dB Simulation Type: 3 Level (0.7/5e-6)
Add/Drop Time: 1 µs FF Time: 0.6 µs (equivalent to 1 µs in actual hardware)
Max Input Power: +7 dBm FB Time: 4.0 µs
Max Output Power: +20 dBm ddt Time: -0.1e-6
Max 1st Stage Output Power: +15.3 dBm AStart=[150, 2.5e6, 2.5e4, 150, 2.5e6, 2.5e4] * (8e-
6/FBDelay)/1.3
Settling Time: 16 dB Drop, Blue Channel Monitored (average=20.2 µs) Settling Time: 16 dB Add, Blue Channel Monitored (average=34.2 µs)
17 17
16 16
10

15 15
14 14
13 13
12 12
11 11
10 10
30
9 9 50
-16 -14 -12 -10 -8 -6 -4 -2 0 2 4 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4
Max Input Power Before Drop (dBm) Max Input Power Before Drop (dBm)
Raman System Benefits
 Raman gain generated in transmission fiber, power

transferred from pump to signal through fiber phonon
(vibrational energy) interactions.
 Fiber attenuation can be (partially) compensated through
distributed amplification.
 OSNR benefits over solely EDFA amplification as signal
power remains higher – negative effective NF from Raman.
1. EDFA
2. Hybrid counter-
propagating
Raman
3. Co- and hybrid
counter-
propagating
Raman
Raman Amplification
Transmission
Fiber Ch1 ChN
(0-150km)
Ch1 ChN
(1530-1610nm)
Signals
DWDM
EDFA
1530nm 1565nm 1530nm 1565nm
Raman Pump Propagation
 High bit rates with multi-level coding requires high OSNR.

– EDFAs spaced >100km apart are inadequate to maintain high OSNR
 Distributed Raman Amplification (DRA) is attained within the transmission fiber
through non-linear interaction between the Signal and Raman Pump
 Raman Pump typically operates ~100nm shorter than the Signal Wavelength to
be amplified.
 Raman Amplification is typically used in conjunction with EDFAs, not instead of.
– Raman/EDFA provides better OSNR performance than EDFA of similar complexity.
 Effectiveness of Distributed Raman Amplification is critically influenced by patch-
panel and connector losses between the Raman Pump source and the
transmission fiber; high losses reduce the efficiency of the DRA.
 Robust safety implementations are required due to extremely high optical power
levels (>1W) and eye-safety considerations.
Raman/EDFA NF conversion for total effective NF
Effective NF of EDFA/Raman Hybrid for various

fixed EDFA NF values
12
EDFA NF = 16
11 EDFA NF = 14
10
EDFA NF = 12
EDFA NF = 10 15
9
EDFA NF = 8
Effective NF (dB)
EDFA NF = 6
NF (dB)
8 10
7
EDFA NF = varied
5
6
5 0
4 DRS 0 5 10 15 20
G (dB)
3
1 For variable EDFA NF

0 example, sum of Raman
4 6 8 10 12 14 16 18
Gain and EDFA is 20dB
Raman Gain
 The figure above can be used to roughly estimate effective NF for

hybrid EDFA/Raman at first wavelength (typically worst NF
wavelength), for typical/good SMF fiber with small patch panel loss.
Typical Raman Amplifier Design & Gain Spectra
17
16
15
14
13
Raman gain (dB)
Sept. 22, 2000

12 LEAF meas. and measure-
ment. WMR0057 RPU.
11 Powers ~ (210,190,210) mW
Measurement
10 Sig in #1, Pmp in #4
Sig in #4, Pmp in #1
Simulation
9 Sig in #1, Pmp in #4
Sig in #4, Pmp in #1
8
5
1520 1530 1540 1550 1560 1570 1580 1590 1600 1610 1620
Wavelength (nm)
EDFA/Raman Product History between JDSU and Cisco
>10,000 units shipped
2005 2008 2010 2012
Barolo
Preamp and
Booster
(EDFA)
Ferrari Amp
Cannonau
(EDFA)
(Raman + EDFAs)
Fiano
(includes EDFAs) Teroldego
(Raman)
Future
2007 2009 2011
2003
>8,000 units shipped
Optical Amplifier (EDFA / Raman) Product Roadmap
Calendar Year 2011 2012 2013 2014 2015
C Hybrid Raman/EDFA • Fiber Characterization (OTDR, CD, Span)
Raman Amplification (40G)
Raman ctrl amps PR C Low dissipation Raman Fwd pumping Raman amp
Fixed Gain Amplification Cα 96 ch variant

C FGA-CR PR
Products
C VGA-CR PR SFF Gen VGA

Variable Gain Amplification C Pluggable VGA PR Next Gen VGA
α C OA Array Gen 1
Amplifier Arrays
OA Array Gen 2
40G/100G Optimized EDFAs Pwr Transient PR SFF-cooled SFF-uncooled
SHB compensation
Amplifier Technology Next gen control platform Fwd Raman ctrl platform
980 nm, 900 mW/25C 980 nm, 5mw~2W wide dyn range 650 mW Raman
Technology
Pump Technology Low Pdiss Raman (50% Pdiss, 450 mW) Low RIN Raman
WG amp components
WG Component Technology
Depolarizer FVOA Device FVOA Array
NG ES VOA Variable Pump Splitting
Component Technology
SFP FVOA
Passive Components (PD, VOA, TFF)

Cost reduction X3-CR control platform
Revision Date Jan-12
C = Program start α = Alpha availability β = Beta availability PR = Product release
Tunable Filters and PLC ROADMs
Tunable Filter Platform
Filter engine inTF-OCM can also be used for tunable filter applications
•Accurate, stable, precision wavelength tuning

• Rapid tuning
Single Tunable Filter
• Qualified and in production
Module (TFS)
• 104 x 52.5 x 16.5 mm
•Eight independent input and output

Tunable Filter Array ports
TFA (8-Port) • Qualified and in production
•160 x 120 x 17 mm
Design Considerations
Some design considerations that are important for OCMs are

applicable to tunable filters as well
 Frequency accuracy and stability
 Loss uniformity
 Scan speed
– Because the TFS is a settable filter, it can be rapidly moved from any one
frequency to any other frequency within the operating range
SJ-TFC-00036 SJ-TFS-00068
Wavelength Accuracy Peak IL Spec: <3.8dB
@ 0dBm input power Spec: <50pm
50.00 3.5
W avelength Accuracy (pm )
40.00
3
30.00
Initial
2.5
20.00 Post 168hrs DH
IL (d B)
Initial
10.00 2 Post 500hrs DH
Post 168hrs DH Post 1000hrs DH
0.00
Post 500hrs DH 1.5 Post 1500hrs DH
-10.00
Post 1000hrs DH Post 2000hrs DH
-20.00 1
-30.00
0.5
-40.00
0
-50.00
14 27 40 53 66 79 92 17 30 43 56 69 82 95 20 33 46 59 72 85 98
1 31 61 91 121 29 59 89 119 27 57 87 117
Channels over 3 temperatures
Channels over 3 temperatures
Tunable Filter Product Features
 Cascaded Mach-Zehnder interferometers

– Stable and reliable over lifetime and operating conditions
 50 or 100 GHz high resolution selectable filter
 Available in single port (TFS) or 8-port (TFA) versions
 TFA ports each operate independently
 Stable, precision wavelength tuning 0
-5
 SPI and RS232 interface -10
-15
-20
Description -25
-30
 Module footprint -35
– 104 x 52.5 x 16.5 mm (TFS) -40
-45
– 160 x 120 x 17 mm (TFA)
-50
193.6 193.7 193.8 193.9 194 194.1 194.2
 Selectable scan range over > 120 (50 GHz) C band channels
Tunable Filter Optical Specifications
Specification
Parameter Unit TFS TFA
Min Max Min Max
Channel Spacing GHz 50 50
Number of ITU Channels 50 GHz Up to 121
Frequency THz 191.0 197.0 191.0 197.0
Specification Passband nm -0.05 +0.05 -0.05 +0.05
Peak Insertion Loss ILMIN dB – 4.0 – 4.0
Bandwidth @ 1dB BW1 GHz 16 – 16 –
Bandwidth @ 3 dB BW3 GHz 28 – 28 –
Central Frequency Tuning
WD GHz – ±4 – ±5
Accuracy
Adjacent Channel Isolation ACI dB 25 – 24 –
Non-Adjacent Channel
NCI dB 30 – 28 –
Isolation
Total Crosstalk TXT dB 22 – 21 –
Polarization Dependent Loss PDL dB – 0.8 – 1.0
Polarization Dependent
PDW GHz – 4 – 5
Wavelength
Polarization Mode Dispersion PMD ps – 0.5 – 0.5
Optical Return Loss ORL dB 40 – 40 –
Response Time ms – 4 - 10
PLC ROADM Block Diagram
220 mm X 135 mm X 36 mm : DOUBLE SLOT MS A
PD 1 DROP
VPD 1
OUTP UT
COMMON
SPLITTER
INPUT
EXPRESS
VPD 2 OUTP UT
DEMUX AWG
MUX AWG
PD 4
COMMON EXPRESS
OUTP UT INPUT
PD 5 PD 2
PD 3
LEGEND
VOA
ADD INPUTS
SWITCH
TAP
DETECTOR
PD: Physical
VPD: Virtual
TV-MUX/DEMUX Assembly
MZ Driver Board
Integrated
Taps/VOA/Switch DEMUX
MUX
and PDs AWG
PD Log Amp
Board
AWG Board with

Add TAP Thru TAP DSP and ITC
TVOA chip for ROADM
INPUTS
• 2 x 20 Taps for PD monitors
• 2 x 20 VOAs
OUT
VOA-Add Switch VOA - Thru
• 20 pcs 1x2 switches
PLC Technology Map
Low loss
start coupler AWG flattop AWG
VOA
MZ int. Switch
TF
Two beam Coupler
Splitter Products:
Interleaver PIA
QPMZ
PLC Tap DWDM PON
ROADM
CoMixer
Coherent Mixer TDI
TDI TF
OCM
Delay line ….
Polarization Mux
Birefringence
management
Super Transport Blades:
Collaborative Development Model (CDM) for
Photonic Layer Linecards/Blades
Foundation: Vertical and Functional Integration
Convergence of technical building blocks & design capability
Wins… Integrated Line cards Wins…

 Intelligent Network-Aware  Ability to mine SW value from
ROADMs and EDFAs optical innovations
 Develop a trusted and reliable  Heightened awareness of
Integration Complexity & Value-Add
business and innovation partner transport -> more innovations

for all things related to transport  R&D efficiencies from
 + standardized HW platform
 +
Modules
 Superior Density/Cost  Innovation/leadership

 Simplified Supply Chain  Customer stickiness
 +  Bundling
 +
 Faster TTM  Increased component and

 Turnkey Mechancial, s/w, h/w module share
design including comms interface Components  Customer intimacy
 V&V, NEBS derisk, Safety  Pull through business
 +  +
Integrated
Optical chips
Wafers/Dies  Technology leadership
 Optical Innovation
 Innovation leadership
Overview of CDM Engagement
 JDSU’s blade design resources are shared across multiple blade development
projects to optimize utilization and level load.
 Partial development cost recovery through NRE and/or prototype and/or production pricing
 Terms established upfront through milestone-based Statement of Work or Development Agreement
 JDSU assumes complete responsibility for hardware (mechanical, electrical, and

optical) design, firmware (optical), integration, design validation test, verification,
and qualification of the blade.
 Customer provides JDSU with reference circuitry for common hardware features (power entry, microprocessor
complex) that is required to be populated on each linecard
 Customer provides equipment (shelf, controllers, fans) to JDSU to replicate the development/test environment.
 Customer retains exclusive access and control of the embedded SW (RTOS) on the linecard.
 JDSU assumes complete responsibility for setting up production at CM (BOMs,

Assembly Work Instructions, Test Code Development, Supply Chain) and
Product Lifecycle Management (Obsolescence, Cost Reduction, Yield Tracking,
Safety Stocking, RMA etc).
 Product is priced as a turnkey blade factoring in value-added services listed

above; there are no royalties charged separately on the sale of each unit for
design / mfg services.
Typical HW / FW / SW Design Partitioning & Demarcation in a CDM Engagement
circuitry; schematics
Customer-designed
provided to JDSU Customer Responsibility

(JDSU to layout components to maximize density)
• Blade <-> Shelf Controller

Integrated Printed Circuit Board Assembly with
Power Customer mP Communications

• Global control algorithms
Entry • SW upgrades
• OAM&P
Customer + JDSU circuitry
Integrated HW Partitioned SW/FW

Heavy reuse of
existing JDSU FW
code for optics JDSU mP JDSU Responsibility
control • Control and Management
JDSU-designed circuitry
of Optical functional
elements (EDFAs,
FPGA DSP WSS,OCM, etc)
• Open loop, closed loop
DRAM FLASH
control of EDFAs (AGC,
WSS + OCM Transient Suppression)
• Channel equalization
DSP FPGA DSP control WSS+OCM
DSP Preamp Booster • Monitoring of PDs, OCM
TFA for alarm/PM
• APR/Laser Safety
• Firmware/FPGA upgrade
Super Transport Blade of devices
Typical Verification/Validation Coverage Provided by JDSU in a CDM Engagement
 Optical-F/W Verification/Validation
– Optical Design Verification Test (ODVT), Optical functional test, Optical performance test. These
typically include power accuracy measurement and stability, operating wavelength range testing,
Noise figure measurement, return loss measurement, transient testing for amplifiers etc.
– F/W Command set functional verification, FW download, Reset and mask coverage tests, Alarm
and fault monitoring – Over temperature
 EDVT Validation (Extended Electrical Design Validation Test)
– Corner Stress Testing (Combination test coverage of Clock Rate, Digital Voltages and
Temperature ranges), uncovering F/W, H/W and Optical issues.
– Thermal characterization of blade in shelf
 Functional Verification
– User, Management and Debug Interface testing, Reset behaviors, Alarms & Diagnostics, Fault
Insertion testing, Data Comm, Equipment and facility behavior testing, Log Management,
Software/Firmware Download & Upgrade, Security, Led functionality, Traffic testing, Card
Removal/Insertions, Power Cycling, Embedded Manufacturing commands., etc.
 Characterization/Stress Testing
– Robustness (Memory Leaks, Flash Wear-Level Testing), System S/W Stability and Reliability,
System Performance requirement testing, Long-term customer usage profile system profile soak,
backplane messaging overload, multiple soft/hard reset of the blade, Repeated alarm toggling
(e.g. LOS Conditions), repeated power cycling, repeated upgrade scenarios, module stress
testing.
Typical Qualification Coverage Provided by JDSU in a CDM Engagement
 L1/L2 Qualification
– Fiber Integrity
• Straight-pull, Side Pull, Twist
– Mechanical + ESD + Mixed Flowing Gas
• Packaged Vibration, Transportation Vibration, Packaged Drop, Vibration, ESD,
Unpackahed Drop, Mixed Flowing Gas
– Short-term Environmental
• Low & High Temp Exposure and Thermal Shock, Non-operating Temp Cycle, High
Relative Humidity Exposure Test, Cyclic Moisture Resistance,
– Short-term Operating + Operating Damp Heat
• Operating Temp and Relative Humidity Test, Operating Temp Cycle, Operating Damp
Heat
– Damp Heat
• 2000 hrs Non-Operating Storage, High Temp Storage
– High Temperature Operating Life
• 2000 hrs Accelerated Aging
 Other
– EMI / EMC / Safety
– DFMEA / PFMEA analysis
– Calculation of FIT and MTBF estimates
Typical Manufacturing Services Provided by JDSU in a CDM Engagement
 JDSU assigns a dedicated Product Engineer and Test Engineer per CDM
project, with ownership of all assembly and test development and setup /
validation of production environment at the CM site.
 Assembly
– Work Instructions for each process step associated with building up the linecard. Typical
sequence:
• PCBA boot-up test (done at shelf level, replicating customer’s environment)
• Splicing / routing of passive components in a tray
• Soldering of active components (Pumps, PDs, VOAs) on PCBA
• Calibration and functional testing of optical amplifiers
• Merging with other optical components / modules (e.g. WSS, OCM, TFA)
• Calibration and functional testing of the fully-integrated linecard
• Environmental Stability Testing (temp soak and ramp)
• Load Customer-specified SW & EEPROM contents & Shelf-level test (replicating customer’s environment)
• Final Quality Control check.
 Test
– Development of manufacturing test plan and test code for the entire linecard
• Calibration process, functional test points, and pass/fail criteria
• Incorporates testing of customer-specific elements as needed
– Design of In-circuit test fixtures for all PCBAs used on linecard
Other Integral Services Provided by JDSU in a CDM Engagement
 Production Capacity Planning and Expansion

– Ordering and commissioning of equipment
– Alignment with CM on manpower and training requirements
 Tracking Production Yields

– Cpk data analysis and improvement plans
 Supply Chain Management

– Setting up AVL for entire BOM of the linecard
– Dual sourcing strategy and implementation for key and high-risk electronic components.
– Safety stocking strategy and implementation throughout the supply chain, including at the
Finished Goods level (Vendor Managed Inventory Program)
– Obsolescence and transition management
 Product Lifecycle Management

– Setup repair flow process (receiving test and trouble-shooting guidelines)
– Identifying and implementing value engineering and cost reduction opportunities
– Regulatory compliance (e.g. RoHS transitions)

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Overview of Photonic Layer

 Provide an overview of key photonic-layer functional elements

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 2

 Introduce and Define the Photonic Layer

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 3

Router / P-OTP Switch

(Routing & Signaling, Transmission, NE OAMP

Multirate DWDM Interfaces

OSC OSC OSC

Limited Use as ROADM

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 6

 Higher Data Rates (100G+)

 Colorless, Directionless & Contentionless (CDC) capability

 Coherent adoption >40G

 Broad range of other sub-systems that support the above

 Directionless: an added/dropped wavelength is freely provisionable

 Contentionless: Allows multiple channels of the same wavelength

CDC Mux/Demux CDC Mux/Demux

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 9

 Bandwidth currency denomination size is increasing.

?? ??? ??? ???

CH1 CH2 CH4

 Replace mux/demux AWGs with WSS’s

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 11

 Replace mux/demux AWGs with WSS’s

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 12

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 13

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 14

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 15

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 16

 Large number of WSS ports (≥16) to efficiently support:

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 17

Power Power Power Power Power Power Power Power

8:1 Space = 8x8

 Arrays of splitters and switches

Power Power Power Power Power Power Power Power

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 19

 Loss is low and does not scale with port count

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 21

Power Power Power Power Power Power Power Power

• Coherent Rx allows elimination of the tunable channel filtering.

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 22

 Optical Channel Monitors (OCM) provide in-situ real-time information primarily

Input Filtering element Detection/Analysis

 Filter may be scanning (series) or fixed (parallel)

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 25

 Dynamic Power Range

OCM power error versus signal input power

1 As input optical power

decreases, effect of noise

Adjacent channels with high

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 28

© 2012 JDS Uniphase Corporation | JDSU CONFIDENTIAL AND PROPRIETARY INFORMATION 29

448 Gb/s single carrier DP 16 QAM / 75 GHz Spacing

Cross-talk level depends on:

Filter width (FWHM)

From simulated crosstalk,

Filter shape is as important a factor as FWHM